E1SAA18-20.000M TR
E1S A A 18 -20.000M TR
Series
Quartz Crystal Resonator HC49/UP Short 2 Pad
Surface Mount (SMD) 3.2mm Height Metal Resistance
Weld Seal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over 0°C to +70°C
Mode of Operation
AT-Cut Fundamental
Packaging Options
Tape & Reel
Nominal Frequency
20.000MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 20.000MHz
Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over 0°C to +70°C
Aging at 25°C ±5ppm/year Maximum
Load Capacitance 18pF Parallel Resonant
Shunt Capacitance 7pF Maximum
Equivalent Series Resistance 50 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 1mWatt Maximum
Storage Temperature Range -40°C to +125°C
Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-202, Method 213, Condition C
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/08/2012 | Page 1 of 5
E1SAA18-20.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
MAX
13.30 MAX 4.85
MAX
4.88 ±0.20 0.50 MIN (x2)
11.60 MAX
0.80 ±0.30 (x2)
NOTE: Coplanarity 0.360 MAX
LINE MARKING
1E20.000M
E=Ecliptek Designator
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X2)
All Dimensions in Millimeters
4.0
2.0 (X2)
5.5 (X2)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/08/2012 | Page 2 of 5
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
Tape & Reel Dimensions
Direction of Unreeling
All Dimensions in Millimeters
Compliant to EIA-481
E1SAA18-20.000M TR
24.00 ±0.30
11.50 ±0.10
DIA 1.50 MIN
4.00 ±0.10
2.00 ±0.10
12.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
37.00 MAX
Quantity Per Reel: 1,000 units
360 MAX
24.00 +2.00/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/08/2012 | Page 3 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
E1SAA18-20.000M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/08/2012 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
E1SAA18-20.000M TR
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/08/2012 | Page 5 of 5
