1
JANSR2N7440
Formerly Available as FSS913A0R4,
Radiation Hardened, SEGR Resistant,
P-Channel Power MOSFETs
The Discrete Products Operation of Intersil has developed a
series of Radiation Hardened MOSFETs specifically
designed for commercial and military space applications.
Enhanced Power MOSFET immunity to Single Event Effects
(SEE), Single Event Gate Rupture (SEGR) in particular, is
combined with 100K RADS of total dose hardness to provide
devices which are ideally suited to harsh space
environments. The dose rate and neutron tolerance
necessary for military applications have not been sacrificed.
The Intersil portfolio of SEGR resistant radiation hardened
MOSFETs includes N-Channel and P-Channel devices in a
variety of voltage, current and on-resistance ratings.
Numerous packaging options are also available.
This MOSFET is an enhancement-mode silicon-gate power
field-effect transistor of the vertical DMOS (VDMOS)
structure. It is specially designed and processed to be
radiation tolerant. The MOSFET is well suited for
applications exposed to radiation environments such as
switching regulation, switching converters, motor drives,
relay drivers and drivers for high-power bipolar switching
transistors requiring high speed and low gate drive power.
This type can be operated directly from integrated circuits.
Also available at other radiation and screening levels. See us
on the web, Intersil’s home page: http://www.intersil.com.
Contact your local Intersil Sales Office for additional
information.
Die Family TA17796.
MIL-PRF-19500/659.
Features
• 10A, -100V, rDS(ON) = 0.280Ω
• Total Dose
- Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
- Safe Operating Area Curve for Single Event Effects
- SEE Immunity for LET of 36MeV/mg/cm2 with
VDS up to 80% of Rated Breakdown and
VGS of 10V Off-Bias
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BVDSS
- Typically Survives 2E12 if Current Limited to IDM
• Photo Current
- 1.5nA Per-RAD(Si)/s Typically
• Neutron
- Maintain Pre-RAD Specifications
for 3E13 Neutrons/cm2
- Usable to 3E14 Neutrons/cm2
Symbol
Packaging TO-257AA
Ordering Information
PART NUMBER PACKAGE BRAND
JANSR2N7440 TO-257AA JANSR2N7440
G
D
S
CAUTION: Beryllia Warning per MIL-S-19500
refer to package specifications.
G
SD
Data Sheet November 1999 File Number 4803
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 |Copyright © Intersil Corporation 1999
2
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified JANSR2N7440 UNITS
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS -100 V
Drain to Gate Voltage (RGS = 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR -100 V
Continuous Drain Current
TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID10 A
TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID6A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 30 A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V
Maximum Power Dissipation
TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PT56 W
TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PT22 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.45 W/oC
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . IAS 30 A
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IS10 A
Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM 30 A
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 150 oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
(Distance >0.063in (1.6mm) from Case, 10s Max)
Weight (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
300
4.4
oC
g
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 1mA, VGS = 0V -100 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS,
ID = 1mA TC = -55oC - - -7.0 V
TC = 25oC -2.0 - -6.0 V
TC = 125oC -1.0 - - V
Zero Gate Voltage Drain Current IDSS VDS = -80V,
VGS = 0V TC = 25oC--25µA
TC = 125oC - - 250 µA
Gate to Source Leakage Current IGSS VGS = ±20V TC = 25oC - - 100 nA
TC = 125oC - - 200 nA
Drain to Source On-State Voltage VDS(ON) VGS = -12V, ID = 10A - - -3.10 V
Drain to Source On Resistance rDS(ON)12 ID = 6A,
VGS = -12V TC = 25oC - 0.190 0.280 Ω
TC = 125oC - - 0.500 Ω
Turn-On Delay Time td(ON) VDD = -50V, ID = 10A,
RL = 5.0Ω, VGS = -12V,
RGS = 7.5Ω
- - 20 ns
Rise Time tr- - 55 ns
Turn-Off Delay Time td(OFF) - - 45 ns
Fall Time tf- - 35 ns
Total Gate Charge (Not on slash sheet) Qg(TOT) VGS = 0V to -20V VDD = -50V,
ID = 10A - - 60 nC
Gate Charge at 12V Qg(12) VGS = 0V to -12V - 36 40 nC
Threshold Gate Charge (Not on slash sheet) Qg(TH) VGS = 0V to -2V - - 2.5 nC
Gate Charge Source Qgs - 6.6 7.4 nC
Gate Charge Drain Qgd -1719nC
Thermal Resistance Junction to Case RθJC - - 2.2 oC/W
Thermal Resistance Junction to Ambient RθJA --60
oC/W
JANSR2N7440
3
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Forward Voltage VSD ISD = 10A -0.6 - -1.8 V
Reverse Recovery Time trr ISD = 10A,dISD/dt = 100A/µs - - 160 ns
Electrical Specifications up to 100K RAD TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS
Drain to Source Breakdown Volts (Note 3) BVDSS VGS = 0, ID = 1mA -100 - V
Gate to Source Threshold Volts (Note 3) VGS(TH) VGS = VDS, ID = 1mA -2.0 -6.0 V
Gate to Body Leakage (Notes 2, 3) IGSS VGS = ±20V, VDS = 0V - 100 nA
Zero Gate Leakage (Note 3) IDSS VGS = 0, VDS = -80V - 25 µA
Drain to Source On-State Volts (Notes 1, 3) VDS(ON) VGS = -12V, ID = 10A - -3.10 V
Drain to Source On Resistance (Notes 1, 3) rDS(ON)12 VGS = -12V, ID = 6A - 0.280 Ω
NOTES:
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both VGS = -12V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS.
Single Event Effects (SEB, SEGR) Note 4
TEST SYMBOL
ENVIRONMENT (NOTE 5) APPLIED
VGS BIAS
(V)
(NOTE 6)
MAXIMUM
VDS BIAS (V)
ION
SPECIES TYPICAL LET
(MeV/mg/cm) TYPICAL
RANGE (µ)
Single Event Effects Safe Operating Area SEESOA Ni 26 43 20 -100
Br 37 36 10 -100
Br 37 36 15 -80
Br 37 36 20 -50
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
5. Fluence = 1E5 ions/cm2 (typical), TC = 25oC.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Performance Curves
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA FIGURE 2. TYPICAL DRAIN INDUCTANCE REQUIRED TO
LIMIT GAMMA DOT CURRENT TO IAS
-120
-100
-80
-60
-40
-20
00101520255
VDS (V)
LET = 37MeV/mg/cm2, RANGE = 36µ
FLUENCE = 1E5 IONS/cm2 (TYPICAL)
TEMP = 25oC
LET = 26MeV/mg/cm2, RANGE = 43µ
VGS (V) -300-100-10
LIMITING INDUCTANCE (HENRY)
DRAIN SUPPLY (V) -1000
ILM = 10A
300A
1E-4
1E-5
1E-6
-30
100A
30A
1E-3
1E-7
JANSR2N7440
4
FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. BASIC GATE CHARGE WAVEFORM FIGURE 6. TYPICAL NORMALIZED rDS(ON) vs JUNCTION
TEMPERATURE
FIGURE 7. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
Performance Curves (Continued)
ID, DRAIN (A)
TC, CASE TEMPERATURE (oC) 150
100
500-50
0
2
4
10
8
6
12
10
1
0.1
ID, DRAIN CURRENT (A)
-10 -100
100µs
10ms
100ms
1ms
-300
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
-1
TC = 25oC
100
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
CHARGE
QGD
QG
VG
QGS
-12V
2.5
2.0
1.5
1.0
0.5
0.0
-80 -40 0 40 80 120 160
TJ, JUNCTION TEMPERATURE (oC)
NORMALIZED rDS(ON)
PULSE DURATION = 250ms, VGS = -12V, ID = 6A
NORMALIZED
1
10-5 10-4 10-3 10-2 10-1 100101
t, RECTANGULAR PULSE DURATION (s)
0.001
0.01
0.1
10
THERMAL RESPONSE (ZθJC)
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC + TC
PDM
t1
t2
SINGLE PULSE
0.5
0.02
0.1
0.01
0.2
0.05
JANSR2N7440
5
FIGURE 8. UNCLAMPED INDUCTIVE SWITCHING
Performance Curves (Continued)
10
1110
40
0.1
IAS, AVALANCHE CURRENT (A)
tAV, TIME IN AVALANCHE (ms)
0.01
STARTING TJ = 25oC
IF R = 0
IF R ≠0
tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1]
tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD)
STARTING TJ = 150oC
Test Circuits and Waveforms
FIGURE 9. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 10. UNCLAMPED ENERGY WAVEFORMS
FIGURE 11. RESISTIVE SWITCHING TEST CIRCUIT FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
tP
VGS ≤ 20V
L
+
-
VDS
VDD
DUT
VARY tP TO OBTAIN
REQUIRED PEAK IAS
0V
50Ω
50Ω
50V-150V
IAS
+
-
ELECTRONIC SWITCH OPENS
WHEN IAS IS REACHED
CURRENT
TRANSFORMER
VDD
VDS
BVDSS
tP
IAS
tAV
VDD
RL
VDS
DUT
RGS
0V
VGS = -12V
td(ON)
tr
90%
10%
VDS 90%
10%
tf
td(OFF)
tOFF
90%
50%50%
10% PULSE WIDTH
VGS
tON
JANSR2N7440
6
Screening Information
Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table).
Delta Tests and Limits (JANS) TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MAX UNITS
Gate to Source Leakage Current IGSS VGS = ±20V ±20 (Note 7) nA
Zero Gate Voltage Drain Current IDSS VDS = 80% Rated Value ±25 (Note 7) µA
Drain to Source On Resistance rDS(ON) TC = 25oC at Rated ID±20% (Note 8) Ω
Gate Threshold Voltage VGS(TH) ID = 1.0mA ±20% (Note 8) V
NOTES:
7. Or 100% of Initial Reading (whichever is greater).
8. Of Initial Reading.
Screening Information
TEST JANS
Unclamped Inductive Switching VGS(PEAK) = -15V, L = 0.1mH; Limit = 30A
Thermal Response tH = 100ms; VH = -25V; IH = 1A; Limit = 85mV
Gate Stress VGS = -30V, t = 250µs
Pind Required
Pre Burn-In Tests (Note 9) MIL-S-19500 Group A,
Subgroup 2 (All Static Tests at 25oC)
Steady State Gate
Bias (Gate Stress) MIL-STD-750, Method 1042, Condition B
VGS = 80% of Rated Value,
TA = 150oC, Time = 48 hours
Interim Electrical Tests (Note 9) All Delta Parameters Listed in the Delta Tests and Limits Table
Steady State Reverse
Bias (Drain Stress) MIL-STD-750, Method 1042, Condition A
VDS = 80% of Rated Value,
TA = 150oC, Time = 240 hours
PDA 5%
Final Electrical Tests (Note 9) MIL-S-19500, Group A,
Subgroups 2 and 3
NOTE:
9. Test limits are identical pre and post burn-in.
Additional Screening Tests
PARAMETER SYMBOL TEST CONDITIONS MAX UNITS
Safe Operating Area SOA VDS = -80V, t = 10ms 1.9 A
Thermal Impedance ∆VSD tH = 500ms; VH = -25V; IH = 1A 125 mV
JANSR2N7440
7
Rad Hard Data Packages - Intersil Power Transistors
1. JANS Rad Hard - Standard Data Package
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
E. Preconditioning - Attributes Data Sheet
- Hi-Rel Lot Traveler
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
F. Group A - Attributes Data Sheet
G. Group B - Attributes Data Sheet
H. Group C - Attributes Data Sheet
I. Group D - Attributes Data Sheet
2. JANS Rad Hard - Optional Data Package
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
E. Preconditioning - Attributes Data Sheet
- Hi-Rel Lot Traveler
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
- X-Ray and X-Ray Report
F. Group A - Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups A2, A3, A4, A5 and A7 Data
G. Group B - Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups B1, B3, B4, B5 and B6 Data
H. Group C - Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups C1, C2, C3 and C6 Data
I. Group D - Attributes Data Sheet
- Hi-Rel Lot Traveler
- Pre and Post Radiation Data
JANSR2N7440
8
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
JANSR2N7440
TO-257AA
3 LEAD JEDEC TO-257AA HERMETIC METAL PACKAGE
WARNING!
BERYLLIA WARNING PER MIL-S-19500
Packages containing beryllium oxide (BeO) shall not be ground, machined, sandblasted, or subject to any mechanical operation
which will produce dust containing any beryllium compound. Packages containing any beryllium compound shall not be
subjected to any chemical process (etching, etc.) which will produce fumes containing beryllium or its’ compounds.
Q
D
L
H1
Øb
e
e1
A1
EA
J1
0.065 R TYP.
ØP
L1Øb1
123
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.190 0.200 4.83 5.08 -
A10.035 0.045 0.89 1.14 -
Øb 0.025 0.035 0.64 0.88 2, 3
Øb10.060 0.090 1.53 2.28 -
D 0.645 0.665 16.39 16.89 -
E 0.410 0.420 10.42 10.66 -
e 0.100 TYP 2.54 TYP 4
e10.200 BSC 5.08 BSC 4
H10.230 0.250 5.85 6.35 -
J10.110 0.130 2.80 3.30 4
L 0.600 0.650 15.24 16.51 -
L1- 0.035 - 0.88 -
ØP 0.140 0.150 3.56 3.81 -
Q 0.113 0.133 2.88 3.37 -
NOTES:
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-257AA dated 9-88.
2. Add typically 0.002 inches (0.05mm) for solder coating.
3. Lead dimension (without solder).
4. Positionofleadtobemeasured0.150inches(3.81mm)frombottom
of dimension D.
5. Die to base BeO isolated, terminals to case ceramic isolated.
6. Controlling dimension: Inch.
7. Revision 1 dated 1-93.
