www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1VCC
8
1OE
27
1A 2OE
3 6
2Y 1Y
45
GND 2A
3 6 1Y2Y
8
1VCC
1OE
5
GND 42A
272OE1A
GND 5
42A
3 6 1Y2Y
272OE1A
8VCC
1
1OE
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G125
DUAL BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCES204M APRIL 1999 REVISED JANUARY 2007
Available in the Texas Instruments I
off
Supports Partial-Power-Down ModeNanoFree™ Package OperationSupports 5-V V
CC
Operation Latch-Up Performance Exceeds 100 mA PerJESD 78, Class IIInputs Accept Voltages to 5.5 V
ESD Protection Exceeds JESD 22Max t
pd
of 4.3 ns at 3.3 V
2000-V Human-Body Model (A114-A)Low Power Consumption, 10- µA Max I
CC
200-V Machine Model (A115-A) ± 24-mA Output Drive at 3.3 V
1000-V Charged-Device Model (C101)Typical V
OLP
(Output Ground Bounce)<0.8 V at V
CC
= 3.3 V, T
A
= 25 °CTypical V
OHV
(Output V
OH
Undershoot)>2 V at V
CC
= 3.3 V, T
A
= 25 °C
The SN74LVC2G125 is a dual bus buffer gate, designed for 1.65-V to 5.5-V V
CC
operation. This device featuresdual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable ( OE) input ishigh.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC2G125YZPR _ _ _CM_0.23-mm Large Bump YZP (Pb-free)SSOP DCT Reel of 3000 SN74LVC2G125DCTR C25_ _ _–40°C to 85°C
Reel of 3000 SN74LVC2G125DCURVSSOP DCU C25_Reel of 250 SN74LVC2G125DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.DCU: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
1A 1Y
1OE 1
2 6
2A 2Y
2OE 7
5 3
Absolute Maximum Ratings
(1)
SN74LVC2G125
DUAL BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCES204M APRIL 1999 REVISED JANUARY 2007
FUNCTION TABLE(EACH BUFFER)
INPUTS
OUTPUT
YOE A
L H HL L LH X Z
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADCT package 220θ
JA
Package thermal impedance
(4)
DCU package 227 °C/WYZP package 102T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
www.ti.com
Recommended Operating Conditions
(1)
SN74LVC2G125
DUAL BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCES204M APRIL 1999 REVISED JANUARY 2007
MIN MAX UNIT
Operating 1.65 5.5V
CC
Supply voltage VData retention only 1.5V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7V
IH
High-level input voltage VV
CC
= 3 V to 3.6 V 2V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7V
IL
Low-level input voltage VV
CC
= 3 V to 3.6 V 0.8V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 VHigh or low state 0 V
CCV
O
Output voltage V3-state 0 5.5V
CC
= 1.65 V –4V
CC
= 2.3 V –8I
OH
High-level output current –16 mAV
CC
= 3 V
–24V
CC
= 4.5 V –32V
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current 16 mAV
CC
= 3 V
24V
CC
= 4.5 V 32V
CC
= 1.8 V ±0.15 V, 2.5 V ±0.2 V 20t/ v Input transition rise or fall rate V
CC
= 3.3 V ±0.3 V 10 ns/VV
CC
= 5 V ±0.5 V 5T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3Submit Documentation Feedback
www.ti.com
Electrical Characteristics
Switching Characteristics
Operating Characteristics
SN74LVC2G125
DUAL BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCES204M APRIL 1999 REVISED JANUARY 2007
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
OH
= –100 µA 1.65 V to 5.5 V V
CC
0.1I
OH
= –4 mA 1.65 V 1.2I
OH
= –8 mA 2.3 V 1.9V
OH
VI
OH
= –16 mA 2.43 VI
OH
= –24 mA 2.3I
OH
= –32 mA 4.5 V 3.8I
OL
= 100 µA 1.65 V to 5.5 V 0.1I
OL
= 4 mA 1.65 V 0.45I
OL
= 8 mA 2.3 V 0.3V
OL
VI
OL
= 16 mA 0.43 VI
OL
= 24 mA 0.55I
OL
= 32 mA 4.5 V 0.55I
I
A or OE inputs V
I
= 5.5 V or GND 0 to 5.5 V ±5µAI
off
V
I
or V
O
= 5.5 V 0 ±10 µAI
OZ
V
O
= 0 to 5.5 V 3.6 V 10 µAI
CC
V
I
= 5.5 V or GND, I
O
= 0 1.65 V to 5.5 V 10 µAI
CC
One input at V
CC
0.6 V, Other inputs at V
CC
or GND 3 V to 5.5 V 500 µAData inputs 3.5C
i
V
I
= V
CC
or GND 3.3 V pFControl inputs 4C
o
V
O
= V
CC
or GND 3.3 V 6.5 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25°C.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
±0.15 V ±0.2 V ±0.3 V ±0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 3.3 9.1 1.5 4.8 1.4 4.3 1 3.7 nst
en
OE Y 4 9.9 1.9 5.6 1.2 4.7 1.2 3.8 nst
dis
OE Y 1.5 11.6 1 5.8 1.4 4.6 1 3.4 ns
T
A
= 25°
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VTESTPARAMETER UNITCONDITIONS
TYP TYP TYP TYP
Outputs enabled 19 19 20 22Power dissipationC
pd
f = 10 MHz pFcapacitance
Outputs disabled 2 2 2 3
4
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
th
tsu
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
VLOAD
Open
GND
RL
DataInput
TimingInput
0V
0V
0V
tW
Input
0V
Input
Output
Waveform1
S1atV
(seeNoteB)
LOAD
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Output
TEST S1
t /t
PLH PHL Open
Output
Control
VM
VMVM
VM
VM
1.8V 0.15V±
2.5V 0.2V±
3.3V 0.3V±
5V 0.5V±
1kW
500 W
500 W
500 W
VCC RL
2× VCC
2× VCC
6V
2× VCC
VLOAD CL
30pF
30pF
50pF
50pF
0.15V
0.15V
0.3V
0.3V
VD
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
£2ns
£2ns
£2.5ns
£2.5ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
VLOAD
t /t
PLZ PZL
GND
t /t
PHZ PZH
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V V
OH D
V +V
OL D
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
SN74LVC2G125
DUAL BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCES204M APRIL 1999 REVISED JANUARY 2007
Figure 1. Load Circuit and Voltage Waveforms
5Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74LVC2G125DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74LVC2G125DCTRE6 ACTIVE SM8 DCT 8 3000 Pb-Free
(RoHS) CU SNBI Level-1-260C-UNLIM
74LVC2G125DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74LVC2G125DCURE4 ACTIVE US8 DCU 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74LVC2G125DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74LVC2G125DCUTE4 ACTIVE US8 DCU 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74LVC2G125DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G125DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G125DCUR ACTIVE US8 DCU 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G125DCUT ACTIVE US8 DCU 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G125YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com 6-Jan-2010
Addendum-Page 1
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G125 :
Automotive: SN74LVC2G125-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 6-Jan-2010
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G125DCUR US8 DCU 8 3000 180.0 9.2 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC2G125YZPR DSBGA YZP 8 3000 178.0 8.4 1.02 2.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Jan-2010
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G125DCUR US8 DCU 8 3000 202.0 201.0 28.0
SN74LVC2G125YZPR DSBGA YZP 8 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Jan-2010
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated