HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002. 03.04
Page No. : 1/3
HTIP31C HSMC Produc t Specification
HTIP31C
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP31C is designed for use in general purpose amplifier and
switching applica tions.
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures
Storage Temper atur e............................................................................................ -55 ~ +150 °C
Junction Temper ature.................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 100 V
BVCEO Collector to Emitter Voltage.................................................................................. 100 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................... 3 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 100 - - V IC=1mA, IE= 0
BVCEO 100 - - V IC=30mA, IC=0
ICES - - 200 uA VCE=100V, IB=0
ICEO - - 300 uA VCE=60V, IB=0
IEBO - - 1 mA VEB=5V, IC=0
*VCE(sat) - - 1.2 V IC=3A, IB=375mA
*VBE(on) - - 1.8 V IC=3A, VCE=4V
*hFE1 25 - - IC=1A, VCE=4V
*hFE2 10 - 50 IC=3A, VCE=4V
fT 3 - - MHz IC=0.5A, VCE=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
TO-220
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002. 03.04
Page No. : 2/3
HTIP31C HSMC Produc t Specification
Characteristics Curve
Current Gai n & Collector Current
10
100
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
hFE
hFE @ V
CE
=4V
25
o
C75
o
C
125
o
C
Saturation Voltage & Collect or Current
10
100
1000
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
Sat u r ation Volt ag e (m V)
V
CE(sat)
@ I
C
=8I
B
25
o
C
75
o
C
125
o
C
ON Vol tage & Collector Cur rent
100
1000
10000
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
O N Voltage ( mV)
V
BE(ON)
@ V
CE
=4V
25
o
C
75
o
C125
o
C
Switching Time & Col lector Current
0.1
1.0
10.0
0.1 1.0 10.0
Collector Curren t (mA)
Switch ing Times (us)...
Tstg
Ton
Tf
V
CC
=30V, I
C
=10I
B1
=-10I
B2
Capacitance & R everse-Biased Volt age
1
10
100
0.1 1 10 100
R evers e- Biased Vol tage (V)
Capacita nce ( p F)
Cob
Safe Operating Area
1
10
100
1000
10000
100000
1 10 100
Forward Vol tage-V
CE
(V)
Collector Cirremt-I
C
(mA)
PT=1 ms
PT=100 ms
PT=1 s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002. 03.04
Page No. : 3/3
HTIP31C HSMC Produc t Specification
TO-220AB Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 A l l oy; solder pl ating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its produc ts without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any cons equence of cust om er product design, infringement of patents, or applicat ion assistance.
Head Office And Factory:
Head Office (Hi-Sincerit y Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Tai wan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Pa rk Hsi n-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax: 886-3-5982931
AB
E
G
IK
M
OP
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Pac k age
HSMC Package Code: E
Marking:
Date Code Control Code
H
3TIP
1C Rank