BCX54TA - Diodes [Zetex] - Datasheet.Support

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Datasheet Number: DS35369 Rev. 4 – 2 1 of 7

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NPN SILICON PLANAR MEDIUM POWER TRANS I STORS IN SOT89

Features

• I

c = 1A Continuous Collector Current

• Low Saturation Voltage VCE(sat) < 500mV @ 0.5A

• Gain groups 10 and 16

• Epitaxial Planar Die Construction

• Complementary PNP types: BCX51, 52 and 53

• Lead-Free, RoHS Compliant (Note 1)

• Halogen and Antimony Free. “Green” Devices (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SOT89

• Case Material: Molded Plastic, “Green” Molding

Compound (Note 2)

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish

• Weight: 0.072 grams (Approximate)

Applications

• Medium Power Switching or Amplification Applications

• AF driver and output stages

Ordering Information (Note 3 & 4)

Product Grade Marking Reel size (inches) Tape width (mm) Quantity per reel

BCX54TA Commercial BA 7 12 1,000

BCX5410TA Commercial BC 7 12 1,000

BCX5416TA Commercial BD 7 12 1,000

BCX55TA Commercial BE 7 12 1,000

BCX5510TA Commercial BG 7 12 1,000

BCX5516TA Commercial BM 7 12 1,000

BCX56TA Commercial BH 7 12 1,000

BCX5610TA Commercial BK 7 12 1,000

BCX5616TA Commercial BL 7 12 1,000

BCX5616QTA Automotive BL 7 12 1,000

BCX5616TC Commercial BL 13 12 4,000

Notes: 1. No purposefully added lead.

2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com

3. For packaging d etails, go to our websit e h tt p : //www.diodes. com

4. Products with Q-suffix are automotive grade. Automotive products are electrical and thermal the same as the commercial, except where specified.

Marking Information

xx = Product Type Marking Code, as follows:

BCX54 = BA BCX55 = BE BCX56 = BH

BCX5410 = BC BCX5510 = BG BCX5610 = BK

BCX5416 = BD BCX5516 = BM BCX5616 = BL

Top View Device Symbol Top View

Pin-Out

SOT89

C

E

C

B

C

E

B

xx

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Datasheet Number: DS35369 Rev. 4 – 2 2 of 7

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Maximum Ratings @ TA = 25°C unless otherwise specified

Characteristic Symbol BCX54 BCX55 BCX56 Unit

Collector-Base Voltage VCBO 45 60 100 V

Collector-Emitter Voltage VCEO 45 60 80 V

Emitter-Base Voltage VEBO 5 V

Continuous Collector Current IC 1 A

Peak Pulse Collector Current ICM 1.5

Continuous Base Current IB 100 mA

Peak Pulse Base Current IBM 200

Thermal Characteristics @ TA = 25°C unless otherwise specified

Characteristic Symbol Value Unit

Power Dissipation (Note 4) PD1 W

Thermal Resistance, Junction to Ambient (Note 4) RθJA 124 °C/W

Thermal Resistance, Junction to Leads (Note 5) RθJL 10.0 °C/W

Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C

Notes: 4. For a device surface mounted on 25mm X 25mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the dev ice is measured

when operating in a steady-state condition.

5. Thermal resistance from junctio n to solder-point (on the exposed collector pad).

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Datasheet Number: DS35369 Rev. 4 – 2 3 of 7

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Thermal Characteristics

0 20 40 60 80 100 120 140 160

0.0

0.2

0.4

0.6

0.8

1.0 25mm x 25mm 1oz Cu

D era tin g Cu rve

Temperature (°C)

Max P ower Di ssipation (W)

100µ 1m 10m 100m 1 10 100 1k

0

20

40

60

80

100

120 25mm x 25mm 1oz Cu

Tamb = 25°C

Transient Thermal Imp ed anc e

D=0.5

D=0.2

D=0.1

Single Pulse

D=0.05

Th e rm al Resistance ( ° C/W)

Pu l se Width (s) 100µ 1m 10m 100m 1 10 100 1k

1

10

100 25mm x 25mm 1oz Cu

Tamb = 25°C

Single pulse

Pulse Power Dissipation

Pu lse Width (s)

Max Po wer Dissip at i on (W)

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Datasheet Number: DS35369 Rev. 4 – 2 4 of 7

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Electrical Characteristics @ TA = 25°C unless otherwise specified

Characteristic Symbol Min Typ Max Unit Test Condition

Collector-Base

Breakdown Voltage

BCX54 BVCBO 45 - - V

IC = 100µA

BCX55 60

BCX56 100

Collector-Emitter

Breakdown Voltage (Note 6)

BCX54 BVCEO 45 - - V

IC = 10mA

BCX55 60

BCX56 80

Emitter-Base Breakdown Voltage BVEBO 5 - - V

IE = 10µA

Collector Cut-off Current ICBO - -

0.1

20 µA VCB = 30V

VCB = 30V, TA = 150°C

Emitter Cut-off Current IEBO - - 20 nA

VEB = 4V

Static Forward Current Transfer

Ratio (Note 6)

All versions hFE

25

40

25

-

250

-

IC = 5mA, VCE = 2V

IC = 150mA, VCE = 2V

IC = 500mA, VCE = 2V

10 gain grp 63 - 160 IC = 150mA, VCE = 2V

16 gain grp 100 - 250 IC = 150mA, VCE = 2V

Collector-Emitter Saturation Voltage (Note 6) VCE

(

sat

)

- - 0.5 V

IC = 500mA, IB = 50mA

Base-Emitter Turn-On Voltage (Note 6) VBE(on) - - 1.0 V

IC = 500mA, VCE = 2V

Transition Frequency fT 150 - - MHz

IC = 50mA, VCE = 10V

f = 100MHz

Output Capacitance Cobo - - 25 pF

VCB = 10V, f = 1MHz

Notes: 6. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.

0

0.2

0.4

0.6

0.8

012345

V , COLLECTOR-EMITTER VOL TAGE (V)

CE

I,

C

O

LLE

C

T

O

R

C

U

R

E

N

T

(A)

C

Fig. 1 Typical Collector Current

vs. Collector-Emitter Vo lt age

h , DC CURRENT GAIN

FE

Fig. 2 Typical DC Current Gain vs. Collector Current

0

50

100

150

200

250

0.001 0.01 0.1 110

I , COLLECTOR CURRENT (A)

C

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Datasheet Number: DS35369 Rev. 4 – 2 5 of 7

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I , COLLECTOR CURRENT (A)

C

V , BASE- EM ITTE R TURN-ON VOLTA GE (V)

BE(ON)

Fig. 3 T y pical Base-Emitter Turn-On Voltage

vs. Col lector Current

0

0.2

0.4

0.6

0.8

1.2

0.0001 0.001 0.01 0.1 1 10

1.0

I , COLLECTOR CURRENT (A)

C

V , COLLECTOR-EMITTER

SATURATION

CE(SAT)

VOLTAGE (V)

Fig. 4 Typical Collector-Emitter Saturation Voltage

vs. Col lector Cu rre nt

0

0.1

0.2

0.3

0.4

0.0001 0.001 0.01 0.1 1 10

I , COLLECTOR CURRENT (A)

C

V , BASE-EMITTER SATURATION VOLTAGE (V)

BE(SAT)

Fig. 5 T y pical Base-Emitter Saturation Voltage

vs. Col lector Current

0

0.2

0.4

0.6

0.8

1.0

1.2

0.0001 0.001 0.01 0.1 1 10

CAPA CITANCE ( pF )

V , REVERSE VOL TAGE (V)

R

Fig. 6 Typical Capacitance Characteristics

0

20

40

60

80

100

120

140

0.1 1 10 100

I , COLLECTOR CURRENT (mA)

C

f , GAIN- B ANDW IDTH PRODUCT (MHz)

T

Fig . 7 Ty pical G ai n- B andwidth Product

vs. Collector Current

0

50

100

150

200

250

300

020406080100

V = 5V

f = 100MHz

CE

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Datasheet Number: DS35369 Rev. 4 – 2 6 of 7

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Package Outline Dimensions

Suggested Pad Layout

SOT89

Dim Min Max

A 1.40 1.60

B 0.44 0.62

B1 0.35 0.54

C 0.35 0.43

D 4.40 4.60

D1 1.52 1.83

E 2.29 2.60

E 1.50 Typ

e1 3.00 Typ

H 3.94 4.25

L 0.89 1.20

All Dimensions in mm

Dimensions Value (in mm)

X 0.900

X1 1.733

X2 0.416

Y 1.300

Y1 4.600

Y2 1.475

Y3 0.950

Y4 1.125

C 1.500

e

D

H

L

A

C

E

8° (4X)

B1

B

D1

R0.200

e1

Y1

X1

Y2

Y

C

X (3 x)

Y3 Y4

X2 (2x)

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Datasheet Number: DS35369 Rev. 4 – 2 7 of 7

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IMPORTANT NOTICE

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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

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Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and

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LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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