Selection Guide
Luminous Intensity Iv (mcd) @ 10 mA
Color Part Number Min. Max.
Red HLMP-3316 22.00 -
HLMP-3316-I00xx 22.0 -
HLMP-3416 14.7 -
Yellow HLMP-3416-G00xx 14.7 -
HLMP-3416-IJ0xx 37.6 120.2
Green HLMP-3519 10.6 -
HLMP-3519-F00xx 10.6 -
Description
This family of T-13/4 nondiused LED lamps is
specially designed for applications requiring higher
on-axis intensity than is achievable with a standard
lamp. The light generated is focused to a narrow
beam to achieve this eect.
Features
• High intensity
• Choice of 3 bright colors
– High Eciency Red
– Yellow
– High Performance Green
• Popular T-13/4 diameter package
• Selected minimum intensities
• Narrow viewing angle
• General purpose leads
• Reliable and rugged
• Available on tape and reel
HLMP-331x Series
HLMP-341x Series
HLMP-351x Series
T-13/4 (5 mm) High Intensity LED Lamps
Data Sheet
2
Package Dimensions
Part Numbering System
HLMP - 3 x 1 x - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B1: Right Angle Housing, Uneven Leads
B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
5, 7: Less Brightness
6, 9: Higher Brightness
Color Options
3: GaP HER
4: GaP Yellow
5: GaP Green
3
Notes:
1. q1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of
the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/watt.
Electrical Characteristics at TA = 25°C
Device
Symbol Description HLMP- Min. Typ. Max. Units Test Conditions
IV Luminous Intensity 3316 22 60.0 mcd IF = 10 mA (Figure 3)
3416 14.7 50.0 mcd IF = 10 mA (Figure 8)
3519 10.6 70.0 mcd IF = 10 mA (Figure 13)
2q1/2 Including Angle Between Half 3316 35 Deg. IF = 10 mA
Luminous Intensity Points See Note 1 (Figure 6)
3416 35 Deg. IF = 10 mA
See Note 1 (Figure 11)
3519 24 Deg. IF = 10 mA
See Note 1 (Figure 16)
lPEAK Peak Wavelength 331X 635 nm Measurement at Peak
341X 583 (Figure 1)
351X 565
Dl1/2 Spectral Line Halfwidth 331X 40 nm
341X 36
351X 28
ld Dominant Wavelength 331X 626 nm See Note 2 (Figure 1)
341X 585
351X 569
ts Speed of Response 331X 90 ns
341X 90
351X 500
C Capacitance 331X 11 pF VF = 0; f = 1 MHz
341X 15
351X 18
RqJ-PIN Thermal Resistance 331X 260 °C/W Junction to Cathode
341X Lead
351X
VF Forward Voltage 331X 1.9 2.4 V IF = 10 mA (Figure 2)
341X 2.0 2.4 IF = 10 mA (Figure 7)
351X 2.1 2.7 IF = 10 mA (Figure 12)
VR Reverse Breakdown Volt. All 5.0 V IR = 100 µA
hV Luminous Ecacy 331X 145 lumens See Note 3
341X 500 Watt
351X 595
4
Figure 1. Relative intensity vs. wavelength.
Absolute Maximum Ratings at TA = 25°C
Parameter 331X Series 341X Series 351X Series Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 mA
Power Dissipation[3] 135 85 135 mW
Reverse Voltage (IR = 100 µA) 5 5 5 V
Transient Forward Current[4] 500 500 500 mA
(10 µsec Pulse)
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C
Notes:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maxi-
mum Ratings.
5
High Eciency Red HLMP-331X Series
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 4. Relative eciency (luminous intensity
per unit current) vs. peak LED current.
Figure 5. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 6. Relative luminous intensity vs. angular displacement.
6
Yellow HLMP-341X Series
Figure 8. Relative luminous intensity vs. DC
forward current.
Figure 7. Forward current vs. forward voltage
characteristics.
Figure 9. Relative eciency (luminous intensity
per unit current) vs. peak current.
Figure 10. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 11. Relative luminous intensity vs. angular displacement.
7
Green HLMP-351X Series
Figure 13. Relative luminous intensity vs. DC
forward current.
Figure 12. Forward current vs. forward voltage
characteristics.
Figure 14. Relative eciency (luminous inten-
sity per unit current) vs. peak LED current.
Figure 15. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp.
8
Table 2. Intensity Bin Limit
Intensity Range
(mcd)
Color Bin Min. Max.
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
Red P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Table 2. (Cont'd) Table 2. (Cont'd)
Maximum tolerance for each bin limit is ±18%.
Intensity Range
(mcd)
Color Bin Min. Max.
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
Yellow N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Intensity Range
(mcd)
Color Bin Min. Max.
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
Green M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
9
Color Categories
Lambda (nm)
Color Cat # Min. Max.
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
Note:
All Categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago repre-
sentative for further clarication/information.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes
for LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
Figure 17. Recommended wave soldering prole.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN
AV02-1023EN - October 13, 2008
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.