HLMP-331x Series HLMP-341x Series HLMP-351x Series T-13/4 (5 mm) High Intensity LED Lamps Data Sheet Description Features This family of T-13/4 nondiffused LED lamps is specially designed for applications requiring higher on-axis intensity than is achievable with a standard lamp. The light generated is focused to a narrow beam to achieve this effect. * High intensity * Choice of 3 bright colors - High Efficiency Red - Yellow - High Performance Green * Popular T-13/4 diameter package * Selected minimum intensities * Narrow viewing angle * General purpose leads * Reliable and rugged * Available on tape and reel Selection Guide Color Part Number Luminous Intensity Iv (mcd) @ 10 mA Min. Max. Red HLMP-3316 22.00 - HLMP-3316-I00xx 22.0 - HLMP-3416 14.7 - HLMP-3416-G00xx 14.7 - HLMP-3416-IJ0xx 37.6 120.2 HLMP-3519 10.6 - HLMP-3519-F00xx 10.6 - Yellow Green Part Numbering System HLMP - 3 x 1 x - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B1: Right Angle Housing, Uneven Leads B2: Right Angle Housing, Even Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Brightness Level 5, 7: Less Brightness 6, 9: Higher Brightness Color Options 3: GaP HER 4: GaP Yellow 5: GaP Green Package Dimensions Electrical Characteristics at TA = 25C Symbol Description Device HLMP- Min. Typ. IV 3316 22 3416 3519 2q1/2 Luminous Intensity Including Angle Between Half Luminous Intensity Points Max. Units Test Conditions 60.0 mcd IF = 10 mA (Figure 3) 14.7 50.0 mcd IF = 10 mA (Figure 8) 10.6 70.0 mcd IF = 10 mA (Figure 13) 3316 35 Deg. IF = 10 mA See Note 1 (Figure 6) 3416 35 Deg. IF = 10 mA See Note 1 (Figure 11) 3519 24 Deg. IF = 10 mA See Note 1 (Figure 16) Measurement at Peak (Figure 1) lPEAK Peak Wavelength 331X 341X 351X 635 583 565 nm Dl1/2 Spectral Line Halfwidth 331X 341X 351X 40 36 28 nm ld Dominant Wavelength 331X 341X 351X 626 585 569 nm ts Speed of Response 331X 341X 351X 90 90 500 ns C Capacitance 331X 341X 351X 11 15 18 pF VF = 0; f = 1 MHz RqJ-PIN Thermal Resistance 331X 341X 351X 260 C/W Junction to Cathode Lead VF Forward Voltage 331X 341X 351X 1.9 2.0 2.1 V IF = 10 mA (Figure 2) IF = 10 mA (Figure 7) IF = 10 mA (Figure 12) VR Reverse Breakdown Volt. All V IR = 100 A hV Luminous Efficacy 331X 341X 351X lumens Watt See Note 3 5.0 145 500 595 2.4 2.4 2.7 See Note 2 (Figure 1) Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. Absolute Maximum Ratings at TA = 25C Parameter 331X Series 341X Series 351X Series Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 mA Power Dissipation[3] 135 85 135 mW Reverse Voltage (IR = 100 A) 5 5 5 V Transient Forward Current[4] (10 sec Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 C Notes: 1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50C at 0.5 mA/C. For Yellow series derate linearly from 50C at 0.2 mA/C. 3. For Red and Green series derate power linearly from 25C at 1.8 mW/C. For Yellow series derate power linearly from 50C at 1.6 mW/C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. Figure 1. Relative intensity vs. wavelength. High Efficiency Red HLMP-331X Series Figure 2. Forward current vs. forward voltage characteristics. Figure 5. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). Figure 3. Relative luminous intensity vs. DC forward current. Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Figure 6. Relative luminous intensity vs. angular displacement. Yellow HLMP-341X Series Figure 7. Forward current vs. forward voltage characteristics. Figure 10. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). Figure 8. Relative luminous intensity vs. DC forward current. Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current. Figure 11. Relative luminous intensity vs. angular displacement. Green HLMP-351X Series Figure 12. Forward current vs. forward voltage characteristics. Figure 15. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). Figure 13. Relative luminous intensity vs. DC forward current. Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp. Table 2. Intensity Bin Limit Table 2. (Cont'd) Intensity Range (mcd) Intensity Range (mcd) Intensity Range (mcd) Color Bin Min. Max. Color Bin Min. Max. Color Bin Min. Max. H 15.5 24.8 G 16.6 26.5 E 7.6 12.0 I 24.8 39.6 H 26.5 42.3 F 12.0 19.1 J 39.6 63.4 I 42.3 67.7 G 19.1 30.7 K 63.4 101.5 J 67.7 108.2 H 30.7 49.1 L 101.5 162.4 K 108.2 173.2 I 49.1 78.5 M 162.4 234.6 L 173.2 250.0 J 78.5 125.7 N 234.6 340.0 M 250.0 360.0 K 125.7 201.1 O 340.0 540.0 N 360.0 510.0 L 201.1 289.0 P 540.0 850.0 O 510.0 800.0 M 289.0 417.0 Q 850.0 1200.0 P 800.0 1250.0 N 417.0 680.0 R 1200.0 1700.0 Q 1250.0 1800.0 O 680.0 1100.0 S 1700.0 2400.0 R 1800.0 2900.0 P 1100.0 1800.0 T 2400.0 3400.0 S 2900.0 4700.0 Q 1800.0 2700.0 U 3400.0 4900.0 T 4700.0 7200.0 R 2700.0 4300.0 V 4900.0 7100.0 U 7200.0 11700.0 S 4300.0 6800.0 W 7100.0 10200.0 V 11700.0 18000.0 T 6800.0 10800.0 X 10200.0 14800.0 W 18000.0 27000.0 U 10800.0 16000.0 Y 14800.0 21400.0 V 16000.0 25000.0 Z 21400.0 30900.0 W 25000.0 40000.0 Red Maximum tolerance for each bin limit is 18%. Yellow Table 2. (Cont'd) Green Color Categories Color Green Yellow Lambda (nm) Cat # Min. Max. 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag Note: All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through Hole Diameter Wave Soldering Manual Solder Dipping 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) Pre-heat Temperature 105 C Max. - Pre-heat Time 30 sec Max. - 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Peak Temperature 250 C Max. 260 C Max. Dwell Time 3 sec Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE - C 250 Note: Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 90 100 TIME - SECONDS Figure 17. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN AV02-1023EN - October 13, 2008