MC9S08PA16
MC9S08PA16 Series Data
Sheet
Supports: MC9S08PA16(A) and
MC9S08PA8(A)
Key features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 105 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 16 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
– Up to 2048 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable
clocks to unused modules, reducing currents;
allows clocks to remain enabled to specific
peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
– Internal clock source (ICS) - containing a
frequency-locked-loop (FLL) controlled by
internal or external reference; precision
trimming of internal reference allowing 1%
deviation across temperature range of 0 °C to
70 °C and 2% deviation across temperature
range of -40 °C to 105 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger
modes
• Peripherals
– ACMP - one analog comparator with both
positive and negative inputs; separately
selectable interrupt on rising and falling
comparator output; filtering
– ADC - 12-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function;
internal bandgap reference channel; operation
in stop mode; optional hardware trigger
– CRC - programmable cyclic redundancy check
module
– FTM - two flex timer modulators modules
including one 6-channel and one 2-channel
ones; 16-bit counter; each channel can be
configured for input capture, output compare,
edge- or center-aligned PWM mode
– IIC - One inter-integrated circuit module; up to
400 kbps; multi-master operation;
programmable slave address; supporting
broadcast mode and 10-bit addressing;
supporting SMBUS and PMBUS
– MTIM - One modulo timer with 8-bit prescaler
and overflow interrupt
– RTC - 16-bit real timer counter (RTC)
– SCI - two serial communication interface (SCI/
UART) modules optional 13-bit break; full
duplex non-return to zero (NRZ); LIN extension
support
– SPI - one 8-bit serial peripheral interface (SPI)
modules; full-duplex or single-wire bidirectional;
master or slave mode
Freescale Semiconductor Document Number MC9S08PA16
Data Sheet: Technical Data Rev 2, 09/2014
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2014 Freescale Semiconductor, Inc.
MC9S08PA16A and MC9S08PA8A
are recommended for new design
• Input/Output
– Up to 37 GPIOs including one output-only pin
– One 8-bit keyboard interrupt module (KBI)
– Two true open-drain output pins
– Four, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 44-pin LQFP
– 32-pin LQFP
– 20-pin SOIC; 20-pin TSSOP
– 16-pin TSSOP
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
2 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts........................................................................... 4
1.1 Determining valid orderable parts......................................4
2 Part identification...................................................................... 4
2.1 Description.........................................................................4
2.2 Format............................................................................... 4
2.3 Fields.................................................................................4
2.4 Example............................................................................ 5
3 Parameter Classification........................................................... 5
4 Ratings......................................................................................6
4.1 Thermal handling ratings...................................................6
4.2 Moisture handling ratings.................................................. 6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings............................... 6
5 General..................................................................................... 7
5.1 Nonswitching electrical specifications............................... 7
5.1.1 DC characteristics.................................................7
5.1.2 Supply current characteristics...............................14
5.1.3 EMC performance.................................................15
5.2 Switching specifications.....................................................16
5.2.1 Control timing........................................................16
5.2.2 Debug trace timing specifications......................... 17
5.2.3 FTM module timing............................................... 18
5.3 Thermal specifications.......................................................19
5.3.1 Thermal characteristics.........................................19
6 Peripheral operating requirements and behaviors.................... 20
6.1 External oscillator (XOSC) and ICS characteristics...........20
6.2 NVM specifications............................................................22
6.3 Analog............................................................................... 23
6.3.1 ADC characteristics...............................................23
6.3.2 Analog comparator (ACMP) electricals.................26
6.4 Communication interfaces.................................................26
6.4.1 SPI switching specifications..................................26
7 Dimensions............................................................................... 29
7.1 Obtaining package dimensions......................................... 29
8 Pinout........................................................................................30
8.1 Signal multiplexing and pin assignments...........................30
8.2 Device pin assignment...................................................... 32
9 Revision history.........................................................................34
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 3
Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to freescale.com and perform a part number search for the
following device numbers: PA16 and PA8.
Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
MC 9 S08 PA AA (V) B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field Description Values
MC Qualification status • MC = fully qualified, general market flow
9 Memory • 9 = flash based
S08 Core • S08 = 8-bit CPU
PA Device family • PA
AA Approximate flash size in KB • 16 = 16 KB
• 8 = 8 KB
(V) Mask set version • (blank) = Any version
• A = Rev. 2 or later version, this is
recommended for new design
Table continues on the next page...
1
2
Ordering parts
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
4 Freescale Semiconductor, Inc.
Field Description Values
B Operating temperature range (°C) • V = –40 to 105
CC Package designator • LD = 44-LQFP
• LC = 32-LQFP
• TJ = 20-TSSOP
• WJ = 20-SOIC
• TG = 16-TSSOP
2.4 Example
This is an example part number:
MC9S08PA16VLD
3Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P Those parameters are guaranteed during production testing on each individual device.
C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
T Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
Parameter Classification
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 5
Ratings
4.1 Thermal handling ratings
Symbol Description Min. Max. Unit Notes
TSTG Storage temperature –55 150 °C 1
TSDR Solder temperature, lead-free — 260 °C 2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol Description Min. Max. Unit Notes
MSL Moisture sensitivity level — 3 — 1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol Description Min. Max. Unit Notes
VHBM Electrostatic discharge voltage, human body model -6000 +6000 V 1
VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2
ILAT Latch-up current at ambient temperature of 105°C -100 +100 mA
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
4.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in below table may affect
device reliability or cause permanent damage to the device. For functional operating
conditions, refer to the remaining tables in this document.
4
Ratings
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
6 Freescale Semiconductor, Inc.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor
associated with the pin is enabled.
Symbol Description Min. Max. Unit
VDD Supply voltage –0.3 6.0 V
IDD Maximum current into VDD — 120 mA
VDIO Digital input voltage (except RESET, EXTAL, XTAL, or true
open drain pin PTA2 and PTA3)
–0.3 VDD + 0.3 V
Digital input voltage (true open drain pin PTA2 and PTA3) -0.3 6 V
VAIO Analog1, RESET, EXTAL, and XTAL input voltage –0.3 VDD + 0.3 V
IDInstantaneous maximum current single pin limit (applies to all
port pins)
–25 25 mA
VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V
1. All digital I/O pins, except open-drain pin PTA2 and PTA3, are internally clamped to VSS and VDD. PTA2 and PTA3 is only
clamped to VSS.
General
Nonswitching electrical specifications
5.1.1 DC characteristics
This section includes information about power supply requirements and I/O pin
characteristics.
Table 2. DC characteristics
Symbol C Descriptions Min Typical1Max Unit
— — Operating voltage — 2.7 — 5.5 V
VOH C Output high
voltage
All I/O pins, standard-
drive strength
5 V, Iload =
-5 mA
VDD - 0.8 — — V
C 3 V, Iload =
-2.5 mA
VDD - 0.8 — — V
C High current drive
pins, high-drive
strength2
5 V, Iload =
-20 mA
VDD - 0.8 — — V
C 3 V, Iload =
-10 mA
VDD - 0.8 — — V
Table continues on the next page...
5
5.1
General
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 7
Table 2. DC characteristics (continued)
Symbol C Descriptions Min Typical1Max Unit
IOHT D Output high
current
Max total IOH for all
ports
5 V — — -100 mA
3 V — — -50
VOL C Output low
voltage
All I/O pins, standard-
drive strength
5 V, Iload = 5
mA
— — 0.8 V
C 3 V, Iload =
2.5 mA
— — 0.8 V
C High current drive
pins, high-drive
strength2
5 V, Iload
=20 mA
— — 0.8 V
C 3 V, Iload =
10 mA
— — 0.8 V
IOLT D Output low
current
Max total IOL for all
ports
5 V — — 100 mA
3 V — — 50
VIH P Input high
voltage
All digital inputs VDD>4.5V 0.70 × VDD — — V
C VDD>2.7V 0.75 × VDD — —
VIL P Input low
voltage
All digital inputs VDD>4.5V — — 0.30 × VDD V
C VDD>2.7V — — 0.35 × VDD
Vhys C Input
hysteresis
All digital inputs — 0.06 × VDD — — mV
|IIn| P Input leakage
current
All input only pins
(per pin)
VIN = VDD or
VSS
— 0.1 1 µA
|IOZ| P Hi-Z (off-
state) leakage
current
All input/output (per
pin)
VIN = VDD or
VSS
— 0.1 1 µA
|IOZTOT| C Total leakage
combined for
all inputs and
Hi-Z pins
All input only and I/O VIN = VDD or
VSS
— — 2 µA
RPU P Pullup
resistors
All digital inputs,
when enabled (all I/O
pins other than PTA2
and PTA3)
— 30.0 — 50.0 kΩ
RPU3P Pullup
resistors
PTA2 and PTA3 pin — 30.0 — 60.0 kΩ
IIC D DC injection
current4, 5, 6Single pin limit VIN < VSS,
VIN > VDD
-0.2 — 2 mA
Total MCU limit,
includes sum of all
stressed pins
-5 — 25
CIn C Input capacitance, all pins — — — 7 pF
VRAM C RAM retention voltage — 2.0 — — V
1. Typical values are measured at 25 °C. Characterized, not tested.
2. Only PTB4, PTB5, PTD0, PTD1 support ultra high current output.
3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured
externally on the pin.
4. All functional non-supply pins, except for , are internally clamped to VSS and VDD.
5. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the large one.
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
8 Freescale Semiconductor, Inc.
6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than
maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is
very low (which would reduce overall power consumption).
Table 3. LVD and POR Specification
Symbol C Description Min Typ Max Unit
VPOR D POR re-arm voltage1, 21.5 1.75 2.0 V
VLVDH C Falling low-voltage detect
threshold - high range (LVDV
= 1)3
4.2 4.3 4.4 V
VLVW1H C Falling low-
voltage
warning
threshold -
high range
Level 1 falling
(LVWV = 00)
4.3 4.4 4.5 V
VLVW2H C Level 2 falling
(LVWV = 01)
4.5 4.5 4.6 V
VLVW3H C Level 3 falling
(LVWV = 10)
4.6 4.6 4.7 V
VLVW4H C Level 4 falling
(LVWV = 11)
4.7 4.7 4.8 V
VHYSH C High range low-voltage
detect/warning hysteresis
— 100 — mV
VLVDL C Falling low-voltage detect
threshold - low range (LVDV =
0)
2.56 2.61 2.66 V
VLVDW1L C Falling low-
voltage
warning
threshold -
low range
Level 1 falling
(LVWV = 00)
2.62 2.7 2.78 V
VLVDW2L C Level 2 falling
(LVWV = 01)
2.72 2.8 2.88 V
VLVDW3L C Level 3 falling
(LVWV = 10)
2.82 2.9 2.98 V
VLVDW4L C Level 4 falling
(LVWV = 11)
2.92 3.0 3.08 V
VHYSDL C Low range low-voltage detect
hysteresis
— 40 — mV
VHYSWL C Low range low-voltage
warning hysteresis
— 80 — mV
VBG P Buffered bandgap output 41.14 1.16 1.18 V
1. Maximum is highest voltage that POR is guaranteed.
2. POR ramp time must be longer than 20us/V to get a stable startup.
3. Rising thresholds are falling threshold + hysteresis.
4. Voltage factory trimmed at VDD = 5.0 V, Temp = 25 °C
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 9
IOH(mA)
VDD-VOH(V)
Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V)
IOH(mA)
VDD-VOH(V)
Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V)
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
10 Freescale Semiconductor, Inc.
IOH(mA)
VDD-VOH(V)
Figure 3. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 5 V)
IOH(mA)
VDD-VOH(V)
Figure 4. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 3 V)
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 11
IOL(mA)
VOL(V)
Figure 5. Typical IOL Vs. VOL (standard drive strength) (VDD = 5 V)
IOL(mA)
VOL(V)
Figure 6. Typical IOL Vs. VOL (standard drive strength) (VDD = 3 V)
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
12 Freescale Semiconductor, Inc.
IOL(mA)
VOL(V)
Figure 7. Typical IOL Vs. VOL (high drive strength) (VDD = 5 V)
IOL(mA)
VOL(V)
Figure 8. Typical IOL Vs. VOL (high drive strength) (VDD = 3 V)
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 13
5.1.2 Supply current characteristics
This section includes information about power supply current in various operating modes.
Table 4. Supply current characteristics
Num C Parameter Symbol Bus Freq VDD (V) Typical1Max Unit Temp
1 C Run supply current FEI
mode, all modules on; run
from flash
RIDD 20 MHz 5 7.60 — mA -40 to 105 °C
C 10 MHz 4.65 —
1 MHz 1.90 —
C 20 MHz 3 7.05 —
C 10 MHz 4.40 —
1 MHz 1.85 —
2 C Run supply current FEI
mode, all modules off &
gated; run from flash
RIDD 20 MHz 5 5.88 — mA -40 to 105 °C
C 10 MHz 3.70 —
1 MHz 1.85 —
C 20 MHz 3 5.35 —
C 10 MHz 3.42 —
1 MHz 1.80 —
3 P Run supply current FBE
mode, all modules on; run
from RAM
RIDD 20 MHz 5 10.9 14.0 mA -40 to 105 °C
C 10 MHz 6.10 —
1 MHz 1.69 —
P 20 MHz 3 8.18 —
C 10 MHz 5.14 —
1 MHz 1.44 —
4 P Run supply current FBE
mode, all modules off &
gated; run from RAM
RIDD 20 MHz 5 8.50 13.0 mA -40 to 105 °C
C 10 MHz 5.07 —
1 MHz 1.59 —
P 20 MHz 3 6.11 —
C 10 MHz 4.10 —
1 MHz 1.34 —
5 P Wait mode current FEI
mode, all modules on
WIDD 20 MHz 5 5.95 — mA -40 to 105 °C
C 10 MHz 3.50 —
1 MHz 1.24 —
C 20 MHz 3 5.45 —
10 MHz 3.25 —
1 MHz 1.20 —
6 C Stop3 mode supply
current no clocks active
(except 1kHz LPO
clock)2, 3
S3IDD — 5 4.6 — µA -40 to 105 °C
C — 3 4.5 — -40 to 105 °C
7 C ADC adder to stop3 — — 5 40 — µA -40 to 105 °C
Table continues on the next page...
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
14 Freescale Semiconductor, Inc.
Table 4. Supply current characteristics (continued)
Num C Parameter Symbol Bus Freq VDD (V) Typical1Max Unit Temp
CADLPC = 1
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
3 39 —
8 C LVD adder to stop34— — 5 128 — µA -40 to 105 °C
C 3 124 —
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. RTC adder cause <1 µA IDD increase typically, RTC clock source is 1kHz LPO clock.
3. ACMP adder cause <10 µA IDD increase typically.
4. LVD is periodically woken up from stop3 by 5% duty cycle. The period is equal to or less than 2 ms.
5.1.3 EMC performance
Electromagnetic compatibility (EMC) performance is highly dependent on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components as well as MCU software
operation all play a significant role in EMC performance. The system designer should
consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764, and
AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
5.1.3.1 EMC radiated emissions operating behaviors
Table 5. EMC radiated emissions operating behaviors for 44-pin LQFP
package
Symbol Description Frequency
band (MHz)
Typ. Unit Notes
VRE1 Radiated emissions voltage, band 1 0.15–50 8 dBμV 1, 2
VRE2 Radiated emissions voltage, band 2 50–150 8 dBμV
VRE3 Radiated emissions voltage, band 3 150–500 8 dBμV
VRE4 Radiated emissions voltage, band 4 500–1000 5 dBμV
VRE_IEC IEC level 0.15–1000 N — 2, 3
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported
emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the
measured orientations in each frequency range.
2. VDD = 5.0 V, TA = 25 °C, fOSC = 10 MHz (crystal), fSYS = 20 MHz, fBUS = 20 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
Nonswitching electrical specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 15
Switching specifications
5.2.1 Control timing
Table 6. Control timing
Num C Rating Symbol Min Typical1Max Unit
1 P Bus frequency (tcyc = 1/fBus) fBus DC — 20 MHz
2 C Internal low power oscillator frequency fLPO — 1.0 — KHz
3 D External reset pulse width2textrst 1.5 ×
tSelf_reset
— — ns
4 D Reset low drive trstdrv 34 × tcyc — — ns
5 D BKGD/MS setup time after issuing background
debug force reset to enter user or BDM modes
tMSSU 500 — — ns
6 D BKGD/MS hold time after issuing background
debug force reset to enter user or BDM modes3tMSH 100 — — ns
7 D IRQ pulse width Asynchronous
path2tILIH 100 — — ns
D Synchronous path4tIHIL 1.5 × tcyc — — ns
8 D Keyboard interrupt pulse
width
Asynchronous
path2tILIH 100 — — ns
D Synchronous path tIHIL 1.5 × tcyc — — ns
9 C Port rise and fall time -
standard drive strength
(load = 50 pF)5
— tRise — 10.2 — ns
C tFall — 9.5 — ns
C Port rise and fall time -
high drive strength (load =
50 pF)5
— tRise — 5.4 — ns
C tFall — 4.6 — ns
1. Typical values are based on characterization data at VDD = 5.0 V, 25 °C unless otherwise stated.
2. This is the shortest pulse that is guaranteed to be recognized as a reset pin request.
3. To enter BDM mode following a POR, BKGD/MS must be held low during the powerup and for a hold time of tMSH after
VDD rises above VLVD.
4. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized.
5. Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range -40 °C to 105 °C.
textrst
RESET PIN
Figure 9. Reset timing
5.2
Switching specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
16 Freescale Semiconductor, Inc.
tIHIL
KBIPx
tILIH
IRQ/KBIPx
Figure 10. IRQ/KBIPx timing
5.2.2 Debug trace timing specifications
Table 7. Debug trace operating behaviors
Symbol Description Min. Max. Unit
tcyc Clock period Frequency dependent MHz
twl Low pulse width 2 — ns
twh High pulse width 2 — ns
trClock and data rise time — 3 ns
tfClock and data fall time — 3 ns
tsData setup 3 — ns
thData hold 2 — ns
TRACECLK
Tr
Twh
Tf
Tcyc
Twl
Figure 11. TRACE_CLKOUT specifications
Th
Ts Ts Th
TRACE_CLKOUT
TRACE_D[3:0]
Figure 12. Trace data specifications
Switching specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 17
5.2.3 FTM module timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the
fastest clock that can be used as the optional external source to the timer counter. These
synchronizers operate from the current bus rate clock.
Table 8. FTM input timing
No. C Function Symbol Min Max Unit
1 D External clock
frequency
fTCLK 0 fBus/4 Hz
2 D External clock
period
tTCLK 4 — tcyc
3 D External clock
high time
tclkh 1.5 — tcyc
4 D External clock
low time
tclkl 1.5 — tcyc
5 D Input capture
pulse width
tICPW 1.5 — tcyc
tTCLK
tclkh
tclkl
TCLK
Figure 13. Timer external clock
tICPW
FTMCHn
tICPW
FTMCHn
Figure 14. Timer input capture pulse
Switching specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
18 Freescale Semiconductor, Inc.
Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take PI/O into account in
power calculations, determine the difference between actual pin voltage and VSS or VDD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
Table 9. Thermal characteristics
Rating Symbol Value Unit
Operating temperature range
(packaged)
TATL to TH -40 to 105 °C
Junction temperature range TJ-40 to 150 °C
Thermal resistance single-layer board
44-pin LQFP θJA 76 °C/W
32-pin LQFP θJA 88 °C/W
20-pin SOIC θJA 82 °C/W
20-pin TSSOP θJA 116 °C/W
16-pin TSSOP θJA 130 °C/W
Thermal resistance four-layer board
44-pin LQFP θJA 54 °C/W
32-pin LQFP θJA 59 °C/W
20-pin SOIC θJA 54 °C/W
20-pin TSSOP θJA 76 °C/W
16-pin TSSOP θJA 87 °C/W
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
5.3
Thermal specifications
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 19
Pint = IDD × VDD, Watts - chip internal power
PI/O = Power dissipation on input and output pins - user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship
between PD and TJ (if PI/O is neglected) is:
PD = K ÷ (TJ + 273 °C)
Solving the equations above for K gives:
K = PD × (TA + 273 °C) + θJA × (PD)2
where K is a constant pertaining to the particular part. K can be determined by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be
obtained by solving the above equations iteratively for any value of TA.
6Peripheral operating requirements and behaviors
6.1 External oscillator (XOSC) and ICS characteristics
Table 10. XOSC and ICS specifications (temperature range = -40 to 105 °C ambient)
Num C Characteristic Symbol Min Typical1Max Unit
1 C Oscillator
crystal or
resonator
Low range (RANGE = 0) flo 31.25 32.768 39.0625 kHz
C High range (RANGE = 1)
FEE or FBE mode2fhi 4 — 20 MHz
C High range (RANGE = 1),
high gain (HGO = 1),
FBELP mode
fhi 4 — 20 MHz
C High range (RANGE = 1),
low power (HGO = 0),
FBELP mode
fhi 4 — 20 MHz
2 D Load capacitors C1, C2 See Note3
3 D Feedback
resistor
Low Frequency, Low-Power
Mode4RF— — — MΩ
Low Frequency, High-Gain
Mode
— 10 — MΩ
High Frequency, Low-
Power Mode
— 1 — MΩ
High Frequency, High-Gain
Mode
— 1 — MΩ
4 D Series resistor -
Low Frequency
Low-Power Mode 4RS— — — kΩ
High-Gain Mode — 200 — kΩ
5 D Series resistor -
High Frequency
Low-Power Mode4RS— — — kΩ
Table continues on the next page...
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
20 Freescale Semiconductor, Inc.
Table 10. XOSC and ICS specifications (temperature range = -40 to 105 °C ambient)
(continued)
Num C Characteristic Symbol Min Typical1Max Unit
D Series resistor -
High
Frequency,
High-Gain Mode
4 MHz — 0 — kΩ
D 8 MHz — 0 — kΩ
D 16 MHz — 0 — kΩ
6 C Crystal start-up
time Low range
= 32.768 kHz
crystal; High
range = 20 MHz
crystal5, 6
Low range, low power tCSTL — 1000 — ms
C Low range, high power — 800 — ms
C High range, low power tCSTH — 3 — ms
C High range, high power — 1.5 — ms
7 T Internal reference start-up time tIRST — 20 50 µs
8 D Square wave
input clock
frequency
FEE or FBE mode2fextal 0.03125 — 5 MHz
D FBELP mode 0 — 20 MHz
9 P Average internal reference frequency -
trimmed
fint_t — 31.25 — kHz
10 P DCO output frequency range - trimmed fdco_t 16 — 20 MHz
11 P Total deviation
of DCO output
from trimmed
frequency5
Over full voltage and
temperature range
Δfdco_t — — ±2.0 %fdco
C Over fixed voltage and
temperature range of 0 to
70 °C
±1.0
12 C FLL acquisition time5, 7tAcquire — — 2 ms
13 C Long term jitter of DCO output clock
(averaged over 2 ms interval)8CJitter — 0.02 0.2 %fdco
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. When ICS is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of 31.25
kHz to 39.0625 kHz.
3. See crystal or resonator manufacturer's recommendation.
4. Load capacitors (C1,C2), feedback resistor (RF) and series resistor (RS) are incorporated internally when RANGE = HGO =
0.
5. This parameter is characterized and not tested on each device.
6. Proper PC board layout procedures must be followed to achieve specifications.
7. This specification applies to any time the FLL reference source or reference divider is changed, trim value changed, or
changing from FLL disabled (FBELP, FBILP) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as
the reference, this specification assumes it is already running.
8. Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBus.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage
for a given interval.
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 21
XOSC
EXTAL XTAL
Crystal or Resonator
R
S
C2
RF
C1
Figure 15. Typical crystal or resonator circuit
6.2 NVM specifications
This section provides details about program/erase times and program/erase endurance for
the flash and EEPROM memories.
Table 11. Flash characteristics
C Characteristic Symbol Min1Typical2Max3Unit4
D Supply voltage for program/erase -40 °C
to 105 °C
Vprog/erase 2.7 — 5.5 V
D Supply voltage for read operation VRead 2.7 — 5.5 V
D NVM Bus frequency fNVMBUS 1 — 25 MHz
D NVM Operating frequency fNVMOP 0.8 1 1.05 MHz
D Erase Verify All Blocks tVFYALL — — 17338 tcyc
D Erase Verify Flash Block tRD1BLK — — 16913 tcyc
D Erase Verify EEPROM Block tRD1BLK — — 810 tcyc
D Erase Verify Flash Section tRD1SEC — — 484 tcyc
D Erase Verify EEPROM Section tDRD1SEC — — 555 tcyc
D Read Once tRDONCE — — 450 tcyc
D Program Flash (2 word) tPGM2 0.12 0.12 0.29 ms
D Program Flash (4 word) tPGM4 0.20 0.21 0.46 ms
D Program Once tPGMONCE 0.20 0.21 0.21 ms
D Program EEPROM (1 Byte) tDPGM1 0.10 0.10 0.27 ms
D Program EEPROM (2 Byte) tDPGM2 0.17 0.18 0.43 ms
D Program EEPROM (3 Byte) tDPGM3 0.25 0.26 0.60 ms
D Program EEPROM (4 Byte) tDPGM4 0.32 0.33 0.77 ms
D Erase All Blocks tERSALL 96.01 100.78 101.49 ms
D Erase Flash Block tERSBLK 95.98 100.75 101.44 ms
Table continues on the next page...
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
22 Freescale Semiconductor, Inc.
Table 11. Flash characteristics (continued)
C Characteristic Symbol Min1Typical2Max3Unit4
D Erase Flash Sector tERSPG 19.10 20.05 20.08 ms
D Erase EEPROM Sector tDERSPG 4.81 5.05 20.57 ms
D Unsecure Flash tUNSECU 96.01 100.78 101.48 ms
D Verify Backdoor Access Key tVFYKEY — — 464 tcyc
D Set User Margin Level tMLOADU — — 407 tcyc
C FLASH Program/erase endurance TL to
TH = -40 °C to 105 °C
nFLPE 10 k 100 k — Cycles
C EEPROM Program/erase endurance TL
to TH = -40 °C to 105 °C
nFLPE 50 k 500 k — Cycles
C Data retention at an average junction
temperature of TJavg = 85°C after up to
10,000 program/erase cycles
tD_ret 15 100 — years
1. Minimum times are based on maximum fNVMOP and maximum fNVMBUS
2. Typical times are based on typical fNVMOP and maximum fNVMBUS
3. Maximum times are based on typical fNVMOP and typical fNVMBUS plus aging
4. tcyc = 1 / fNVMBUS
Program and erase operations do not require any special power sources other than the
normal VDD supply. For more detailed information about program/erase operations, see
the Memory section.
6.3 Analog
6.3.1 ADC characteristics
Table 12. 5 V 12-bit ADC operating conditions
Characteri
stic
Conditions Symb Min Typ1Max Unit Comment
Supply
voltage
Absolute VDDA 2.7 — 5.5 V —
Delta to VDD (VDD-VDDAD)ΔVDDA -100 0 +100 mV
Ground
voltage
Delta to VSS (VSS-VSSA)2ΔVSSA -100 0 +100 mV
Input
voltage
VADIN VREFL — VREFH V
Input
capacitance
CADIN — 4.5 5.5 pF
Input
resistance
RADIN — 3 5 kΩ —
Analog
source
resistance
12-bit mode
• fADCK > 4 MHz
• fADCK < 4 MHz
RAS —
—
—
—
2
5
kΩ External to
MCU
Table continues on the next page...
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 23
Table 12. 5 V 12-bit ADC operating conditions (continued)
Characteri
stic
Conditions Symb Min Typ1Max Unit Comment
10-bit mode
• fADCK > 4 MHz
• fADCK < 4 MHz
—
—
—
—
5
10
8-bit mode
(all valid fADCK)
— — 10
ADC
conversion
clock
frequency
High speed (ADLPC=0) fADCK 0.4 — 8.0 MHz —
Low power (ADLPC=1) 0.4 — 4.0
1. Typical values assume VDDA = 5.0 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. DC potential difference.
ADC SAR
ENGINE
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Pad
leakage
due to
input
protection
ZAS
R AS
C AS
v ADIN
v AS
z ADIN
R ADIN
R ADIN
R ADIN
R ADIN
INPUT PIN
INPUT PIN
INPUT PIN
C ADIN
Figure 16. ADC input impedance equivalency diagram
Table 13. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA)
Characteristic Conditions C Symb Min Typ1Max Unit
Supply current
ADLPC = 1
ADLSMP = 1
ADCO = 1
T IDDA — 133 — µA
Supply current T IDDA — 218 — µA
Table continues on the next page...
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
24 Freescale Semiconductor, Inc.
Table 13. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Characteristic Conditions C Symb Min Typ1Max Unit
ADLPC = 1
ADLSMP = 0
ADCO = 1
Supply current
ADLPC = 0
ADLSMP = 1
ADCO = 1
T IDDA — 327 — µA
Supply current
ADLPC = 0
ADLSMP = 0
ADCO = 1
T IDDAD — 582 990 µA
Supply current Stop, reset, module
off
T IDDA — 0.011 1 µA
ADC asynchronous
clock source
High speed (ADLPC
= 0)
P fADACK 2 3.3 5 MHz
Low power (ADLPC
= 1)
1.25 2 3.3
Conversion time
(including sample
time)
Short sample
(ADLSMP = 0)
T tADC — 20 — ADCK
cycles
Long sample
(ADLSMP = 1)
— 40 —
Sample time Short sample
(ADLSMP = 0)
T tADS — 3.5 — ADCK
cycles
Long sample
(ADLSMP = 1)
— 23.5 —
Total unadjusted
Error212-bit mode T ETUE — ±5.0 — LSB3
10-bit mode P — ±1.5 ±2.0
8-bit mode P — ±0.7 ±1.0
Differential Non-
Linearity
12-bit mode T DNL — ±1.0 — LSB3
10-bit mode4P — ±0.25 ±0.5
8-bit mode4P — ±0.15 ±0.25
Integral Non-Linearity 12-bit mode T INL — ±1.0 — LSB3
10-bit mode T — ±0.3 ±0.5
8-bit mode T — ±0.15 ±0.25
Zero-scale error512-bit mode C EZS — ±2.0 — LSB3
10-bit mode P — ±0.25 ±1.0
8-bit mode P — ±0.65 ±1.0
Full-scale error612-bit mode T EFS — ±2.5 — LSB3
10-bit mode T — ±0.5 ±1.0
8-bit mode T — ±0.5 ±1.0
Quantization error ≤12 bit modes D EQ— — ±0.5 LSB3
Table continues on the next page...
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 25
Table 13. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Characteristic Conditions C Symb Min Typ1Max Unit
Input leakage error7all modes D EIL IIn * RAS mV
Temp sensor slope -40°C– 25°C D m — 3.266 — mV/°C
25°C– 125°C — 3.638 —
Temp sensor voltage 25°C D VTEMP25 — 1.396 — V
1. Typical values assume VDDA = 5.0 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. Includes quantization.
3. 1 LSB = (VREFH - VREFL)/2N
4. Monotonicity and no-missing-codes guaranteed in 10-bit and 8-bit modes
5. VADIN = VSSA
6. VADIN = VDDA
7. IIn = leakage current (refer to DC characteristics)
6.3.2 Analog comparator (ACMP) electricals
Table 14. Comparator electrical specifications
C Characteristic Symbol Min Typical Max Unit
D Supply voltage VDDA 2.7 — 5.5 V
T Supply current (Operation mode) IDDA — 10 20 µA
D Analog input voltage VAIN VSS - 0.3 — VDDA V
P Analog input offset voltage VAIO — — 40 mV
C Analog comparator hysteresis (HYST=0) VH— 15 20 mV
C Analog comparator hysteresis (HYST=1) VH— 20 30 mV
T Supply current (Off mode) IDDAOFF — 60 — nA
C Propagation Delay tD— 0.4 1 µs
6.4 Communication interfaces
6.4.1 SPI switching specifications
The serial peripheral interface (SPI) provides a synchronous serial bus with master and
slave operations. Many of the transfer attributes are programmable. The following tables
provide timing characteristics for classic SPI timing modes. Refer to the SPI chapter of
the chip's reference manual for information about the modified transfer formats used for
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
26 Freescale Semiconductor, Inc.
communicating with slower peripheral devices. All timing is shown with respect to 20%
VDD and 70% VDD, unless noted, and 100 pF load on all SPI pins. All timing assumes
high drive strength is enabled for SPI output pins.
Table 15. SPI master mode timing
Nu
m.
Symbol Description Min. Max. Unit Comment
1 fop Frequency of operation fBus/2048 fBus/2 Hz fBus is the bus
clock
2 tSPSCK SPSCK period 2 x tBus 2048 x tBus ns tBus = 1/fBus
3 tLead Enable lead time 1/2 — tSPSCK —
4 tLag Enable lag time 1/2 — tSPSCK —
5 tWSPSCK Clock (SPSCK) high or low time tBus - 30 1024 x tBus ns —
6 tSU Data setup time (inputs) 15 — ns —
7 tHI Data hold time (inputs) 0 — ns —
8 tvData valid (after SPSCK edge) — 25 ns —
9 tHO Data hold time (outputs) 0 — ns —
10 tRI Rise time input — tBus - 25 ns —
tFI Fall time input
11 tRO Rise time output — 25 ns —
tFO Fall time output
(OUTPUT)
2
8
6 7
MSB IN2
LSB IN
MSB OUT2 LSB OUT
9
5
5
3
(CPOL=0)
4
11
11
10
10
SPSCK
SPSCK
(CPOL=1)
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
1. If configured as an output.
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) BIT 6 . . . 1
BIT 6 . . . 1
Figure 17. SPI master mode timing (CPHA=0)
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 27
<<CLASSIFICATION>>
<<NDA MESSAGE>>
38
2
6 7
MSB IN2
BIT 6 . . . 1
MASTER MSB OUT2 MASTER LSB OUT
5
5
8
10 11
PORT DATA PORT DATA
310 11 4
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
9
(OUTPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) LSB IN
BIT 6 . . . 1
Figure 18. SPI master mode timing (CPHA=1)
Table 16. SPI slave mode timing
Nu
m.
Symbol Description Min. Max. Unit Comment
1 fop Frequency of operation 0 fBus/4 Hz fBus is the bus clock as
defined in .
2 tSPSCK SPSCK period 4 x tBus — ns tBus = 1/fBus
3 tLead Enable lead time 1 — tBus —
4 tLag Enable lag time 1 — tBus —
5 tWSPSCK Clock (SPSCK) high or low time tBus - 30 — ns —
6 tSU Data setup time (inputs) 15 — ns —
7 tHI Data hold time (inputs) 25 — ns —
8 taSlave access time — tBus ns Time to data active from
high-impedance state
9 tdis Slave MISO disable time — tBus ns Hold time to high-
impedance state
10 tvData valid (after SPSCK edge) — 25 ns —
11 tHO Data hold time (outputs) 0 — ns —
12 tRI Rise time input — tBus - 25 ns —
tFI Fall time input
13 tRO Rise time output — 25 ns —
tFO Fall time output
Peripheral operating requirements and behaviors
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
28 Freescale Semiconductor, Inc.
2
10
6 7
MSB IN
BIT 6 . . . 1
SLAVE MSB SLAVE LSB OUT
11
5
5
3
8
4
13
NOTE: Not defined
12
12
11
SEE
NOTE
13
9
see
note
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
LSB IN
BIT 6 . . . 1
Figure 19. SPI slave mode timing (CPHA = 0)
2
6 7
MSB IN
BIT 6 . . . 1
MSB OUT SLAVE LSB OUT
5
5
10
12 13
312 13
4
SLAVE
8
9
see
note
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
NOTE: Not defined
11
LSB IN
BIT 6 . . . 1
Figure 20. SPI slave mode timing (CPHA=1)
Dimensions
7.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
7
Dimensions
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 29
To find a package drawing, go to freescale.com and perform a keyword search for the
drawing’s document number:
If you want the drawing for this package Then use this document number
16-pin TSSOP 98ASH70247A
20-pin SOIC 98ASB42343B
20-pin TSSOP 98ASH70169A
32-pin LQFP 98ASH70029A
44-pin LQFP 98ASS23225W
Pinout
8.1 Signal multiplexing and pin assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The Port Control Module is responsible
for selecting which ALT functionality is available on each pin.
Table 17. Pin availability by package pin-count
Pin Number Lowest Priority <-- --> Highest
44-LQFP 32-LQFP 20-TSSOP 16-TSSOP Port Pin Alt 1 Alt 2 Alt 3 Alt 4
1 1 — — PTD11— FTM2CH3 — —
2 2 — — PTD01— FTM2CH2 — —
3 — — — PTE4 — TCLK2 — —
4 — — — PTE3 — BUSOUT — —
5 3 3 3 — — — — VDD
6 4 — — — — — VDDA VREFH
7 5 — — — — — VSSA VREFL
8 6 4 4 — — — — VSS
9 7 5 5 PTB7 — — SCL EXTAL
10 8 6 6 PTB6 — — SDA XTAL
11 — — — — — — — Vss
12 9 7 7 PTB51— FTM2CH5 SS0 —
13 10 8 8 PTB41— FTM2CH4 MISO0 —
14 11 9 — PTC3 — FTM2CH3 ADP11 —
15 12 10 — PTC2 — FTM2CH2 ADP10 —
16 — — — PTD7 — — — —
17 — — — PTD6 — — — —
Table continues on the next page...
8
Pinout
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
30 Freescale Semiconductor, Inc.
Table 17. Pin availability by package pin-count (continued)
Pin Number Lowest Priority <-- --> Highest
44-LQFP 32-LQFP 20-TSSOP 16-TSSOP Port Pin Alt 1 Alt 2 Alt 3 Alt 4
18 — — — PTD5 — — — —
19 13 11 — PTC1 — FTM2CH1 ADP9 —
20 14 12 — PTC0 — FTM2CH0 ADP8 —
21 15 13 9 PTB3 KBI0P7 MOSI0 ADP7 —
22 16 14 10 PTB2 KBI0P6 SPSCK0 ADP6 —
23 17 15 11 PTB1 KBI0P5 TXD0 ADP5 —
24 18 16 12 PTB0 KBI0P4 RXD0 ADP4 —
25 19 — — PTA7 — FTM2FAULT2 ADP3 —
26 20 — — PTA6 — FTM2FAULT1 ADP2 —
27 — — — — — — — Vss
28 — — — — — — — VDD
29 — — — PTD4 — — — —
30 21 — — PTD3 — — — —
31 22 — — PTD2 — — — —
32 23 17 13 PTA32KBI0P3 TXD0 SCL —
33 24 18 14 PTA22KBI0P2 RXD0 SDA —
34 25 19 15 PTA1 KBI0P1 FTM0CH1 ACMP1 ADP1
35 26 20 16 PTA0 KBI0P0 FTM0CH0 ACMP0 ADP0
36 27 — — PTC7 — TxD1 — —
37 28 — — PTC6 — RxD1 — —
38 — — — PTE2 — MISO0 — —
39 — — — PTE1 — MOSI0 — —
40 — — — PTE0 — SPSCK0 — —
41 29 — — PTC5 — FTM0CH1 — —
42 30 — — PTC4 — FTM0CH0 — —
43 31 1 1 PTA5 IRQ TCLK0 — RESET
44 32 2 2 PTA4 — ACMPO BKGD MS
1. This is a high current drive pin when operated as output.
2. This is a true open-drain pin when operated as output.
Note
When an alternative function is first enabled, it is possible to
get a spurious edge to the module. User software must clear any
associated flags before interrupts are enabled. The table above
illustrates the priority if multiple modules are enabled. The
highest priority module will have control over the pin. Selecting
a higher priority pin function with a lower priority function
Pinout
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 31
already enabled can cause spurious edges to the lower priority
module. Disable all modules that share a pin before enabling
another module.
8.2 Device pin assignment
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
1
2
3
4
5
6
7
8
9
10
11
PTD1/FTM2CH31
PTD0/FTM2CH21
PTE4/TCLK2
PTE3/BUSOUT
VDD
VDDA /VREFH
VSSA /VREFL
VSS
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
VSS
PTB5/FTM2CH5/SS01
PTB4/FTM2CH4/MISO01
PTC3/FTM2CH3/ADP11
PTC2/FTM2CH2/ADP10
PTD7
PTD6
PTD5
PTC1/FTM2CH1/ADP9
PTC0/FTM2CH0/ADP8
2
2
PTD4
PTD2
PTD3
VDD
VSS
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTA4/ACMPO/BKGD/MS
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTC6/RxD1
PTC7/TxD1
Pins in bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
PTB1/KBI0P5/TxD0/ADP5
PTB0/KBI0P4/RxD0/ADP4
PTA3/KBI0P3/TxD0/SCL
PTA2/KBI0P2/RxD0/SDA
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTC5/FTM0CH1
PTC4/FTM0CH0
PTA5/IRQ/TCLK0/RESET
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
Figure 21. MC9S08PA16 44-pin LQFP package
Pinout
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
32 Freescale Semiconductor, Inc.
PTD1/FTM2CH3
PTD0/FTM2CH2
VDD
VDDA/VREFH
VSSA/VREFL
VSS
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
PTB5/FTM2CH5/SS01
PTB4/FTM2CH4/MISO01
PTC1/FTM2CH1/ADP9
PTC0/FTM2CH0/ADP8
PTA2/KBI0P2/RxD0/SDA2
PTA3/KBI0P3/TxD0/SCL2
PTD2
PTD3
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTB0/KBI0P4/RxD0/ADP4
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
PTB1/KBI0P5/TxD0/ADP5
PTA4/ACMPO/BKGD/MS
PTA5/IRQ/TCLK1/RESET
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
bold
1. High source/sink current pins
2. True open drain pins
PTC3/FTM2CH3/ADP11
PTC2/FTM2CH2/ADP10
PTB3/KBI0P7/MOSI0/ADP7
PTB2/KBI0P6/SPSCK0/ADP6
1
1
Pins in are not available on less pin-count packages.
Figure 22. MC9S08PA16 32-pin LQFP package
20
19
18
17
9
10 11
12
13
14
15
16
1
2
3
4
5
6
7
8
VDD
VSS
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
1
PTB4/FTM2CH4/MISO01
PTC1/FTM2CH1/ADP9
PTC0/FTM2CH0/ADP8
PTB3/KBI0P7/MOSI0/ADP7
PTB2/KBI0P6/SPSCK0/ADP6
PTA2/KBI0P2/RxD0/SDA2
PTA3/KBI0P3/TxD0/SCL
2
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTA4/ACMPO/BKGD/MS PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Pins in
PTA5/IRQ/TCLK0/RESET
PTB5/FTM2CH5/SS0
PTC3/FTM2CH3/ADP11
PTC2/FTM2CH2/ADP10
Figure 23. MC9S08PA16 20-pin SOIC and TSSOP package
Pinout
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc. 33
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
VDD
VSS
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
1
PTB4/FTM2CH4/MISO01PTB3/KBI0P7/MOSI0/ADP7
PTB2/KBI0P6/SPSCK0/ADP6
PTA2/KBI0P2/RxD0/SDA2
PTA3/KBI0P3/TxD0/SCL
2
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTA4/ACMPO/BKGD/MS PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Pins in
PTA5/IRQ/TCLK0/RESET
PTB5/FTM2CH5/SS0
Figure 24. MC9S08PA16 16-pin TSSOP package
9Revision history
The following table provides a revision history for this document.
Table 18. Revision history
Rev. No. Date Substantial Changes
1 10/2012 Initial public release
2 09/2014 • Updated VOH and VOL in DC characteristics
• Updated footnote on the S3IDD in Supply current characteristics
• Added EMC radiated emissions operating behaviors
• Updated the typical of fint_t to 31.25 kHz and updated footnote to
tAcquire in External oscillator (XOSC) and ICS characteristics
• Updated the assumption for all the timing values in SPI switching
specifications
• Updated the rating descriptions for tRise and tFall in Control timing
• Updated the part number format to add new field for new part
numbers in Fields
Revision history
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
34 Freescale Semiconductor, Inc.
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Document Number MC9S08PA16
Revision 2, 09/2014
