RP173x Series
11 V Input 15 0 mA LD O
No. EA-256-171101
1
OUTLINE
The RP173x is a voltage regulator featuring 150 mA output and low supply current of Typ. 2.0 µA. It consists
of a voltage reference unit, an error amplifier, a resistor-net for voltage setting, a current limit circuit, a chip
enable circuit and a Reverse Current Protection Circuit. RP173x is suitable for the power source such as the
equipment being in the standby-mode. The A version with CE input pin has reduced CE pull-up resistance to
make its supply current ultra low.
The RP173x has Max.11 V Input voltage and is applicable to the portable communication equipment that
requires the 2-cell Li-ion battery. Also it is applicable to the non-portable communication equipments. As the
RP173x includes Reverse Current Protection Circuit, there is little leakage current, if it is used as back-up
circuit.
Packages are available in SOT-23-5, SC-88A, and 1-mm square DFN(PLP)1010-4 packages. High density
mounting of the ICs on boards is possible.
FEATURES
• Output Current ............................................................. Typ. 150 mA
• Supply Current ............................................................. Typ. 2.0 µA
• Standby Current ........................................................... Typ. 0.2 µA
• Dropout Voltage ........................................................... Typ. 0.13 V (IOUT = 30 mA, VOUT = 3.0 V)
Typ. 0.90 V (IOUT = 150 mA, VOUT = 3.0 V)
• Output Voltage Accuracy .............................................. ±1.0% (1.5 V < VOUT ≤ 5.5 V, Ta = 25°C)
• Line Regulation ............................................................ Typ. 0.02%/V
• Packages ..................................................................... DFN(PLP)1010-4, SC-88A, SOT-23-5
• Input Voltage Range .................................................... 2.5 V to Set VOUT + 6.5 V (Max. 11 V)
• Output Voltage Range .................................................. 1.2 V to 5.5 V (0.1 V step)
• Built-in Reverse Current Protection Circuit
• Short Current Limit ....................................................... Typ. 45 mA
• Built-in Peak Current Limit Circuit
• Output capacitors ......................................................... 0.1 µF or more
APPLICATIONS
• Power source for portable communication equipments.
• Power source for battery-powered equipments.
• Power source for electrical appliances such as cameras, VSRs and camcorders.
• Power source for digital home appliances.
RP173x
No. EA-256-171101
2
SELECTION GUIDE
The output voltage, the auto-discharge function(1), and the package for the ICs are user-selectable options.
Selection Guide
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
RP173Kxx1
∗
-TR
DFN(PLP)1010-4 10,000 pcs Yes Yes
RP173Qxx2∗-TR-FE SC-88A 3,000 pcs Yes Yes
RP173Nxx1
∗
-TR-FE
SOT-23-5 3,000 pcs Yes Yes
∗ : The auto discharge function at off state are options as follows.
(A) "L" active, without auto discharge function at off state (Pull-up resistance is not built-in)
(B) "H" active, without auto discharge function at off state
(D) "H" active, with auto discharge function at off state
(1) Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the
active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor.
RP173x
No. EA-256-171101
3
BLOCK DIAGRAMS
RP173xxxxA RP173xxxxB
V
DD
GND
V
OUT
CE
Vref
Current Limit
Reverse
Detector
V
DD
GND
V
OUT
CE
Vref
Current Limit
Reverse
Detector
(Pull-up resistance is not built-in.)
RP173xxxxD
VDD
GND
VOUT
CE
Vref
Current Limit
Reverse
Detector
RP173x
No. EA-256-171101
4
PIN DESCRIPTIONS
Top View
2
1
3
4
Bottom View
1
2
4
3
(1)
1
5
4
1
3
2
(mark side)
1
2
3
4
5
(mark side)
DFN(PLP)1010-4 Pin Configuration SC-88A Pin Configuration SOT-23-5 Pin Configuration
DFN(PLP)1010-4 Pin Descriptions
Pin No.
Symbol
Description
1
V
OUT
Output Pin
2
GND
Ground Pin
3 CE /CE Chip Enable Pin
4
V
DD
Input Pin
SC-88A Pin Descriptions
Pin No.
Symbol
Description
1 CE /CE Chip Enable Pin
2(2)
NC
No Connection
3
GND
Ground Pin
4
V
OUT
Output Pin
5
V
DD
Input Pin
SOT-23-5 Pin Descriptions
Pin No.
Symbol
Description
1
VDD
Input Pin
2
GND
Ground Pin
3 CE /CE Chip Enable Pin
4
NC
No Connection
5
V
OUT
Output Pin
(1) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate
level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating.
(2) Pin No. 2 is connected to the bottom of the IC. It is recommended that the pin be connected to the ground plane on the
board, or otherwise be left floating so that there is no contact with other potentials.
RP173x
No. EA-256-171101
5
ABSOLUTE MAXIMUM R ATINGS
Absolute Maximum Ratings
Symbol
Item
Rating
Unit
V
IN
Input Voltage
12
V
V
CE
Input Voltage (CE pin)
12
V
V
OUT
Output Voltage
−
0.3 to 6.0
V
I
OUT
Output Current
165
mA
PD Power Dissipation(1)
DFN(PLP)1010-4
JEDEC STD. 51-7
Test Land Pattern
800
mW
SC-88A
Standard Test Land
Pattern
380
SOT-23-5
JEDEC STD. 51-7
Test Land Pattern
660
Tj
Junction Temperature Range
−
40 to 125
°C
Tstg
Storage Temperature Range
−
55 to 125
°
C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum
ratings may cause the permanent
damages and may degrade the lifetime and safety for both device and system using the device in the field. The
functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
Rating
Unit
VIN Input Voltage 2.5 to 11.0(2) V
Ta
Operating Temperature Range
−40 to 85
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor
devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the
semico
nductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1) Refer to POWER DISSIPATION for detailed information.
(2) VSET + 6.5 V ≤ 11.0 V
RP173x
No. EA-256-171101
6
ELEC TRICAL CHARACTERISTICS
Unless otherwise noted, VIN = Set VOUT + 1.0 V, I OUT = 1 mA, CIN = COUT = 0.1 µF.
The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP173xxxxA (Ta = 25°C)
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VOUT Output Voltage
Ta = 25°C
V
OUT
> 1.5 V
x0.99
x1.01
V
VOUT ≤ 1.5 V
−15
15
mV
−40°C ≤ Ta ≤ 85°C VOUT > 1.5 V x0.982
x1.018 V
V
OUT
≤ 1.5 V
−28
27
mV
I
OUT
Output Current
150
mA
∆
VOUT/
∆
IOUT
Load Regulation
0.1 mA ≤ I
OUT
≤ 150 mA
−
30
−
3
35
mV
VDIF Dropout Voltage
Refer to the PRODUCT-S P EC IF IC ELECTRI C AL
CHARACTERISTICS
I
SS
Supply Current
I
OUT
= 0 mA
2.0
3.7
µ
A
Istandby Standby Current
V
IN
= V
IN
(Max.)
V
CE
= V
IN
0.2 0.6 µA
∆VOUT/∆VIN Load Regulation
Set V
OUT
+ 0.5 V ≤ V
IN
≤ V
IN
(Max.)
When VOUT ≤ 2.0 V,
2.5 V ≤ VIN ≤ VIN (Max.)
0.02 0.20 %/V
RR Ripple Rejection
f = 1 kHz,
Ripple 0.2 Vp−p, IOUT = 10 mA
*When VOUT < 2.0 V, VIN = 3.0 V
30 dB
VIN Input Voltage
1.2 ≤ VOUT < 4.5
2.5
Vset + 6.5
V
4.5 ≤ V
OUT
≤ 5.5
2.5
11
ISC
Short Current Limit
Circuit
VOUT = 0 V 45 mA
VCEH CE Input Voltage "H" 1.7 V
VCEL CE Input Voltage "L" 0.8 V
I
REV
Reverse Current
0 ≤ V
IN
≤ 11.0 V, V
OUT
≥
1.5 V
0
0.16
µ
A
VREV_DET(1)
Reverse Current
Protection Mode
Detection Offset, VREV
= VDD - VOUT
0 ≤ VIN ≤ 11.0 V, VOUT ≥ 1.5 V 55 100 mV
VREV_REL(1)
Reverse Current
Protection Mode
Release Offset
0 ≤ VIN ≤ 11.0 V, VOUT ≥ 1.5 V 70 120 mV
All of units are tested and specified under the pulse load conditions such that Tj ≈ Ta = 25°C except for Ripple Rejection.
(1) The operation coverage of the Reverse Current Protection Circuit is VOUT ≥ 1.5 V. However, under the condition of VIN
= VOUT = 0 V, always the Reverse Current Protection Circuit is operating.
RP173x
No. EA-256-171101
7
Unless otherwise noted, VIN = Set VOUT + 1.0 V, I OUT = 1 mA, CIN = COUT = 0.1 µF.
The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP173xxxxB/D (Ta = 25°C)
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VOUT Output Voltage
Ta = 25°C
VOUT > 1.5 V
x0.99
x1.01
V
V
OUT
≤ 1.5 V
−15
15
mV
−40°C ≤ Ta ≤ 85°C VOUT > 1.5 V x0.982
x1.018 V
V
OUT
≤ 1.5 V
−28
27
mV
I
OUT
Output Current
150
mA
∆
VOUT/
∆
IOUT
Load Regulation
0.1 mA ≤ I
OUT
≤ 150 mA
−
30
−
3
35
mV
VDIF Dropout Voltage
Refer to the PRODUCT-S P EC IF IC ELECTRI C AL
CHARACTERISTICS
I
SS
Supply Current
I
OUT
= 0 mA
2.0
3.7
µ
A
Istandby Standby Current
V
IN
= V
IN
(Max.)
V
CE
= 0 V
0.2 0.6 µA
∆VOUT/∆VIN Load Regulation
Set V
OUT
+ 0.5 V ≤ V
IN
≤ V
IN
(Max.)
When VOUT ≤ 2.0 V,
2.5 V ≤ VIN ≤ VIN (Max.)
0.02 0.20 %/V
RR Ripple Rejection
f = 1kHz,
Ripple 0.2 Vp-p, IOUT = 10 mA
*When VOUT < 2.0 V, VIN = 3.0 V
30 dB
VIN Input Voltage
1.2 ≤ V
OUT
< 4.5
2.5
Vset + 6.5
V
4.5 ≤ V
OUT
≤ 5.5
2.5
11
ISC
Short Current Limit
Circuit
VOUT = 0 V 45 mA
I
PD
CE Pull-down Current
0.30
0.90
µ
A
V
CEH
CE Input Voltage "H"
1.7
V
V
CEL
CE Input Voltage "L"
0.8
V
I
REV
Reverse Current
0 ≤ V
IN
≤ 11.0 V, V
OUT
≥ 1.5 V
0
0.16
µ
A
VREV_DET(1)
Reverse Current
Protection Mode
Detection Offset, VREV
= VDD - VOUT
0 ≤ VIN ≤ 11.0 V, VOUT ≥ 1.5 V 55 100 mV
VREV_REL(1)
Reverse Current
Protection Mode
Release Offset
0 ≤ VIN ≤ 11.0 V, VOUT ≥ 1.5 V 70 120 mV
RLOW
Auto-discharge Nch Tr.
ON Resistance
(RP173xxxxD only)
VIN = 7.0 V, VCE = 0 V 380 Ω
All of units are tested and specified under the pulse load conditions such that Tj ≈ Ta = 25°C except for Ripple Rejection.
(1) The operation coverage of the Reverse Current Protection Circuit is VOUT ≥ 1.5 V. However, under the condition of VIN
= VOUT = 0 V, always the Reverse Current Protection Circuit is operating.
RP173x
No. EA-256-171101
8
PRODUCT-SPECIFIC ELECTRICAL CHARACTERISTICS
RP173x Product-specific Electrical Characteristics
Product Name
V
OUT
VDIF
Ta = 25°C
−40°C ≤ Ta ≤ 85°C
Min.
Typ.
Max.
Min.
Typ.
Max.
Typ.
Max.
RP173x12xx
1.185
1.200
1.215
1.172
1.200
1.227
1.680
2.590
RP173x12xx5
1.235
1.250
1.265
1.222
1.250
1.277
1.680
2.590
RP173x13xx
1.285
1.300
1.315
1.272
1.300
1.327
1.630
2.490
RP173x14xx
1.385
1.400
1.415
1.372
1.400
1.427
1.630
2.490
RP173x15xx
1.485
1.500
1.515
1.472
1.500
1.527
1.480
2.230
RP173x16xx
1.584
1.600
1.616
1.571
1.600
1.629
1.480
2.230
RP173x17xx
1.683
1.700
1.717
1.669
1.700
1.731
1.480
2.230
RP173x17xx5
1.733
1.750
1.768
1.719
1.750
1.782
1.480
2.230
RP173x18xx
1.782
1.800
1.818
1.768
1.800
1.832
1.160
2.190
RP173x18xx5
1.832
1.850
1.869
1.817
1.850
1.883
1.160
2.190
RP173x19xx
1.881
1.900
1.919
1.866
1.900
1.934
1.160
2.190
RP173x20xx
1.980
2.000
2.020
1.964
2.000
2.036
1.160
2.190
RP173x21xx
2.079
2.100
2.121
2.062
2.100
2.138
1.160
2.190
RP173x22xx
2.178
2.200
2.222
2.160
2.200
2.240
1.160
2.190
RP173x23xx
2.277
2.300
2.323
2.259
2.300
2.341
0.900
1.470
RP173x24xx
2.376
2.400
2.424
2.357
2.400
2.443
0.900
1.470
RP173x25xx
2.475
2.500
2.525
2.455
2.500
2.545
0.900
1.470
RP173x26xx
2.574
2.600
2.626
2.553
2.600
2.647
0.900
1.470
RP173x27xx
2.673
2.700
2.727
2.651
2.700
2.749
0.900
1.470
RP173x28xx
2.772
2.800
2.828
2.750
2.800
2.850
0.900
1.470
RP173x28xx5
2.822
2.850
2.879
2.799
2.850
2.901
0.900
1.470
RP173x29xx
2.871
2.900
2.929
2.848
2.900
2.952
0.900
1.470
RP173x30xx
2.970
3.000
3.030
2.946
3.000
3.054
0.610
1.050
RP173x31xx
3.069
3.100
3.131
3.044
3.100
3.156
0.610
1.050
RP173x32xx
3.168
3.200
3.232
3.142
3.200
3.258
0.610
1.050
RP173x33xx
3.267
3.300
3.333
3.241
3.300
3.359
0.610
1.050
RP173x34xx
3.366
3.400
3.434
3.339
3.400
3.461
0.610
1.050
RP173x35xx
3.465
3.500
3.535
3.437
3.500
3.563
0.610
1.050
RP173x36xx
3.564
3.600
3.636
3.535
3.600
3.665
0.610
1.050
RP173x37xx
3.663
3.700
3.737
3.633
3.700
3.767
0.610
1.050
RP173x38xx
3.762
3.800
3.838
3.732
3.800
3.868
0.610
1.050
RP173x39xx
3.861
3.900
3.939
3.830
3.900
3.970
0.610
1.050
RP173x40xx
3.960
4.000
4.040
3.928
4.000
4.072
0.390
0.760
RP173x41xx
4.059
4.100
4.141
4.026
4.100
4.174
0.390
0.760
RP173x42xx
4.158
4.200
4.242
4.124
4.200
4.276
0.390
0.760
RP173x43xx
4.257
4.300
4.343
4.223
4.300
4.377
0.390
0.760
RP173x44xx
4.356
4.400
4.444
4.321
4.400
4.479
0.390
0.760
RP173x45xx
4.455
4.500
4.545
4.419
4.500
4.581
0.390
0.760
RP173x46xx
4.554
4.600
4.646
4.517
4.600
4.683
0.390
0.760
RP173x47xx
4.653
4.700
4.747
4.615
4.700
4.785
0.390
0.760
RP173x48xx
4.752
4.800
4.848
4.714
4.800
4.886
0.390
0.760
RP173x49xx
4.851
4.900
4.949
4.812
4.900
4.988
0.390
0.760
RP173x50xx
4.950
5.000
5.050
4.910
5.000
5.090
0.390
0.760
RP173x51xx
5.049
5.100
5.151
5.008
5.100
5.192
0.390
0.760
RP173x52xx
5.148
5.200
5.252
5.106
5.200
5.294
0.390
0.760
RP173x53xx
5.247
5.300
5.353
5.205
5.300
5.395
0.390
0.760
RP173x54xx
5.346
5.400
5.454
5.303
5.400
5.497
0.390
0.760
RP173x55xx
5.445
5.500
5.555
5.401
5.500
5.599
0.390
0.760
RP173x
No. EA-256-171101
9
THEORY OF OPER ATION
REVERSE CURRENT PROTECTION CIRCUIT
The RP173 Series include a Reverse Current Protection Circuit, which stops the reverse current from VOUT
pin to VDD pin or to GND pin when VOUT becomes higher than VIN.
Usually, the LDO using Pch output transistor contains a parasitic diode between VDD pin and VOUT pin.
Therefore, if VOUT is higher than VIN, the parasitic diode becomes forward direction. As a result, the current
flows from VOUT pin to VDD pin.
The ICs of this series switches the mode to the reverse current protection mode before VIN becomes lower
than VOUT by connecting the parasitic diode of Pch output transistor to the backward direction, and connecting
the gate to VOUT pin. As a result, the Pch output transistor is turned off and the all the current pathways from
VOUT pin to GND pin are shut down to maintain the reverse current lower than [IREV] of the Electrical
Characteristics.
Switching to either the normal mode or to the reverse current protection mode is determined by the
magnitude of VIN voltage and VOUT voltage. For the stable operation, offset and hysteresis are set as the
threshold. The detection/ release thresholds of both normal and reverse current protection modes are specified
by [VREV_DET] and [VREV_REL] of the Electrical Characteristics. Therefore, the minimum dropout voltage under the
small load current condition is restricted by the value of [VREV_REL].
Fig.1 and Fig.2 show the diagrams of each mode, and Fig.3 shows the load characteristics of each mode.
When giving the VOUT pin a constant-voltage and decreasing the VIN voltage, the dropout voltage will become
lower than the [VREV_DET]. As a result, the reverse current protection starts to function to stop the load current.
By increasing the dropout voltage higher than the [VREV_REL], the protection mode will be released to let the load
current to flow. If the dropout voltage to be used is lower than [VREV_REL], the detection and the release may be
repeated.
The operation coverage of the Reverse Current Protection Circuit is VOUT ≥ 1.5V. However, under the
condition of VIN=0V, always the reverse current protection mode is operating.
VDD
GND
VOUT
CE
Vref
IOUT
Reverse
Detector
V
DD
GND
V
OUT
CE
Vref
I
REV
Reverse
Detector
Fig. 1 Normal Mode Fig. 2 Reverse Current Protection Mode
RP173x
No. EA-256-171101
10
Fig. 3 Reverse Current Protection Mode Detection/ Release &
Output/Reverse Current Input/Output Voltage
V
REV_DET
V
REV_REL
V
OUT
V
IN
0
Reverse Current Protection ModeNormal Mode Normal Mode
V
IN
/V
OUT
[V]I
OUT
/I
REV
I
OUT
I
REV
Reverse Current/ Output Current Characteristics
RP173x
No. EA-256-171101
11
APPLICATION INFORMATION
TYPICAL APPLICATIONS
C1
RP173x
VDD
VOUT
CE
GND
C2
VOUT
CE Control
Recommended External Components
Symbol
Description
C2 (C
OUT
)
0.1
µ
F, GRM155B31C104KA87D, MURATA
NOTES ON SELECTING EXTERNAL COMPONENTS
Phase Compe nsation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied.
For this purpose, use a 0.1µF or more capacitor C2.
In case of using a tantalum capacitor, the output may be unstable due to inappropriate ESR. Therefore, the
full range of operating conditions for the capacitor in the application should be considered.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 0.1µF or more between VDD and GND pin, and
as close as possible to the pins.
Set external components, especially the output capacitor C2, as close as possible to the ICs, and make
wiring as short as possible.
TECHNICAL NOTES
POWER ACTIVATION
If the ICs are started up with VIN and VCE under the no-load condition, the both pin voltages have to be started
up with faster than 2.0V/s. If the IC is started up with slower than 2.0V/s under the no-load condition, start up
the IC only with VCE.
RP173x
No. EA-256-171101
12
TYP ICAL C HARAC TE R I STIC S
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (C1 = Ceramic 0.1
µ
F, C2 = C er ami c 0.1
µ
F, Ta = 25
°
C)
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
2) Output Voltage vs. Input Voltage (C1 = Cer amic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = 25
°
C)
RP173x12xx RP173x18xx
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0100 200 300 400
Output Current I
OUT
(mA)
Output Voltage V
OUT
(V)
Vdd=2.5V
Vdd=3.2V
Vdd=4.2V
Vdd=5.5V
Vdd=7.7V
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0100 200 300 400
Output Current I
OUT
(mA)
Output Voltage V
OUT
(V)
Vdd=2.8V
Vdd=3.8V
Vdd=5.5V
Vdd=8.3V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0100 200 300 400
Output Current I
OUT
(mA)
Output Voltage V
OUT
(V)
Vdd=4V
Vdd=5.5V
Vdd=9.5V
0
0
1
2
3
4
5
6
0100 200 300 400
Output Current I
OUT
(mA)
Output Voltage V
OUT
(V)
Vdd=6.5V
Vdd=11V
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 2 4 6
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
IOUT=1mA
IOUT=30mA
IOUT=50mA
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 2 4 6 8
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
IOUT=1mA
IOUT=30mA
IOUT=50mA
0
RP173x
No. EA-256-171101
13
RP173x30xx RP173x55xx
3) Supply Current vs. Input Voltage (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = 25
°
C)
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
02468
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
IOUT=1mA
IOUT=30mA
IOUT=50mA
0
0
1
2
3
4
5
6
0246810
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
IOUT=1mA
IOUT=30mA
IOUT=50mA
0.0
0.5
1.0
1.5
2.0
2.5
0246
Input Voltage VOUT (V)
Supply Current I
SS (µA)
0
0.0
0.5
1.0
1.5
2.0
2.5
02468
Input Voltage V
OUT
(V)
Supply Current I
SS
(µA)
0
0.0
0.5
1.0
1.5
2.0
2.5
02468
Input Voltage V
OUT
(V)
Supply Current I
SS
(µA)
0
0.0
0.5
1.0
1.5
2.0
2.5
0246810
Input Voltage V
OUT
(V)
Supply Current I
SS
(µA)
0
RP173x
No. EA-256-171101
14
4) Output Voltage vs. Temperature
(C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, IOUT = 1 mA)
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
5) Dropout Vol tage vs. Output Curren t (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F)
RP173x12xx RP173x30xx
1.17
1.18
1.19
1.20
1.21
1.22
1.23
1.24
-50 -25 025 50 75 100
Temperature Topt (°C)
Output Voltage V
OUT
(V)
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
-50 -25 025 50 75 100
Temperature Topt (°C)
Output Voltage V
OUT
(V)
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
-50 -25 025 50 75 100
Temperature Topt (°C)
Output Voltage V
OUT
(V)
5.42
5.44
5.46
5.48
5.50
5.52
5.54
5.56
-50 -25 025 50 75 100
Temperature Topt (°C)
Output Voltage V
OUT
(V)
0
200
400
600
800
1000
1200
1400
1600
1800
2000
025 50 75 100 125 150
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(mV)
85℃
25℃
-40℃
0
100
200
300
400
500
600
700
800
025 50 75 100 125 150
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(mV)
85℃
25℃
-40℃
RP173x
No. EA-256-171101
15
RP173x55xx
6) Dropout Vol tage vs. Set Output Voltage (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = 25
°
C)
RP173x
7) Minimum Operating Voltage (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = −40 to 85
°
C)
0
50
100
150
200
250
300
350
400
450
500
025 50 75 100 125 150
Output Current IOUT (mA)
Dropout Voltage VDIF (mV)
85℃
25℃
-40℃
0
200
400
600
800
1000
1200
1400
1600
1800
0123456
Set Output Voltage VREG (V)
Dropout Voltage VDIF (mV)
Iout=150mA
Iout=50mA
Iout=30mA
2.0
2.5
3.0
3.5
4.0
025 50 75 100 125 150
Output Current IOUT (mA)
Input Voltage VIN (V)
RP173x
No. EA-256-171101
16
8) Ripple Rejection vs. Input Bias Voltag e (
C1
=
none, C2
=
Ceramic 0.1
µ
F, Ripple
=
0.2 Vp-p, Ta
=
25
°
C
）
RP173x28xx RP173x28xx
RP173x28xx
9) Ripple Rejection vs. Temperature (C1 = none, C2 = Ceramic 0.1
µ
F, Ripple = 0.2 Vp-p, Ta = 25
°
C)
RP173x12xx RP173x18xx
0
10
20
30
40
50
60
2 4 6 8 10
Input Bias Voltage V
IN
(V)
Ripple Rejection RR (dB)
100Hz
1kHz
10kHz
100kHz
I
OUT
=1mA
0
10
20
30
40
50
60
2 4 6 8 10
Input Bias Voltage V
IN
(V)
Ripple Rejection RR (dB)
100Hz
1kHz
10kHz
100kHz
I
OUT
=30mA
0
10
20
30
40
50
60
2 4 6 8 10
Input Bias Voltage V
IN
(V)
Ripple Rejection RR (dB)
100Hz
1kHz
10kHz
100kHz
I
OUT
=50mA
0
10
20
30
40
50
60
70
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejection RR (dB)
Iout=1mA
Iout=30mA
Iout=50mA
V
IN
=2.5V
0
10
20
30
40
50
60
70
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejection RR (dB)
Iout=1mA
Iout=30mA
Iout=50mA
V
IN
=2.8V
RP173x
No. EA-256-171101
17
RP173x30xx RP173x55xx
10) Input Transient Response (C1 = none, C2 = Ceramic 0.1
µ
F, tr = tf = 5.0
µ
s, Ta = 25
°
C)
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
0
10
20
30
40
50
60
70
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejection RR (dB)
Iout=1mA
Iout=30mA
Iout=50mA
V
IN
=4.0V
0
10
20
30
40
50
60
70
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejection RR (dB)
Iout=1mA
Iout=30mA
Iout=50mA
V
IN
=6.5V
0.6
0.8
1.0
1.2
1.4
1.6
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
2.5
3.0
3.5
4.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=1mA
1.2
1.4
1.6
1.8
2.0
2.2
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
2.5
3.0
3.5
4.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=1mA
2.4
2.6
2.8
3.0
3.2
3.4
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
4.0
4.5
5.0
5.5
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=1mA
4.9
5.1
5.3
5.5
5.7
5.9
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
6.5
7.0
7.5
8.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=1mA
RP173x
No. EA-256-171101
18
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
11) Load Transient Res ponse (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, tr = tf = 0.5
µ
s, Ta = 25
°
C)
RP173x12xx RP173x18xx
0.6
0.8
1.0
1.2
1.4
1.6
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
2.5
3.0
3.5
4.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=30mA
1.2
1.4
1.6
1.8
2.0
2.2
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
2.5
3.0
3.5
4.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=30mA
2.4
2.6
2.8
3.0
3.2
3.4
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
4.0
4.5
5.0
5.5
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=30mA
4.9
5.1
5.3
5.5
5.7
5.9
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
6.5
7.0
7.5
8.0
Input Voltage V
IN
(V)
Input Voltage
Output Voltage
I
OUT
=30mA
0.6
0.8
1.0
1.2
1.4
1.6
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
10
20
Output Current I
OUT
(mA)
Output Current
1mA⇔10mA
Output Voltage
V
IN
=2.5V
1.2
1.4
1.6
1.8
2.0
2.2
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
10
20
Output Current I
OUT
(mA)
Output Current
1mA⇔10mA
Output Voltage
V
IN
=2.8V
RP173x
No. EA-256-171101
19
RP173x30xx RP173x55xx
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
2.4
2.6
2.8
3.0
3.2
3.4
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
10
20
Output Current I
OUT
(mA)
Output Current
1mA⇔10mA
Output Voltage
V
IN
=4.0V
4.9
5.1
5.3
5.5
5.7
5.9
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
10
20
Output Current I
OUT
(mA)
Output Current
1mA⇔10mA
Output Voltage
V
IN
=6.5V
0.3
0.6
0.9
1.2
1.5
1.8
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
50
100
150
Output Current I
OUT
(mA)
Output Current
50mA⇔100mA
Output Voltage
V
IN
=4.0V
0.9
1.2
1.5
1.8
2.1
2.4
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
50
100
150
Output Current I
OUT
(mA)
Output Current
50mA⇔100mA
Output Voltage
V
IN
=4.0V
2.1
2.4
2.7
3.0
3.3
3.6
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
50
100
150
Output Current I
OUT
(mA)
Output Current
50mA⇔100mA
Output Voltage
V
IN
=4.0V
4.6
4.9
5.2
5.5
5.8
-0.1 00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Time t (ms)
Output Voltage V
OUT
(V)
0
50
100
150
Output Current I
OUT
(mA)
Output Current
50mA⇔100mA
Output Voltage
V
IN
=6.5V
RP173x
No. EA-256-171101
20
12) Turn on Speed (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = 25
°
C)
RP173x12xx RP173x18xx
RP173x30xx RP173x55xx
13) Turn off Speed with CE pin (C1 = Ceramic 0.1
µ
F, C2 = Ceramic 0.1
µ
F, Ta = 25
°
C)
RP173x12xx RP173x18xx
0.0
0.5
1.0
1.5
-100 -50 050 100 150 200 250 300 350 400
Time t (µs )
Output Voltage V
OUT
(V)
0
2
4
6
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
CE Input Voltage
0V ⇒2.5V
Output Voltage
CE Input Voltage 0V ⇒4.0V
V
IN
=2.5V (I
OUT
=0,1,30mA)
V
IN
=4.0V (I
OUT
=100mA)
0
0.0
1.0
2.0
-100 -50 050 100 150 200 250 300 350 400
Time t (µs )
Output Voltage V
OUT
(V)
0
2
4
6
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
CE Input Voltage
0V ⇒2.8V
Output Voltage
CE Input Voltage 0V ⇒4.0V
V
IN
=2.8V (I
OUT
=0,1,30mA)
V
IN
=4.0V (I
OUT
=100mA)
0
0.0
1.0
2.0
3.0
-100 -50 050 100 150 200 250 300 350 400
Time t (µs)
Output Voltage V
OUT
(V)
0
2
4
6
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
Output Voltage
CE Input Voltage
0V ⇒ 4.0V
V
IN
=4.0V
0
0.0
2.0
4.0
6.0
-100 -50 050 100 150 200 250 300 350 400
Time t (µs)
Output Voltage V
OUT
(V)
0
3
5
8
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
Output Voltage
CE Input Voltage
0V ⇒6.5V
V
IN
=6.5V
0
0.0
0.5
1.0
1.5
-100 -50 050 100 150 200 250 300 350 400
Times t (µs)
Output Voltage VOUT (V)
0
2
4
6
CE Input Voltage VCE (V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
Output Voltage
CE Input Voltage
2.5V ⇒0V
CE Input Voltage
4.0V ⇒0V
VIN=2.5V(IOUT=0,1,30mA)
VIN=4.0V(IOUT=100mA)
0
0.0
1.0
2.0
-100 -50 050 100 150 200 250 300 350 400
Times t (µs)
Output Voltage VOUT (V)
0
2
4
6
CE Input Voltage VCE (V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
Output Voltage
CE Input Voltage
2.8V ⇒0V
CE Input Voltage
4.0V ⇒0V
VIN=2.8V(IOUT=0,1,30mA)
VIN=4.0V(IOUT=100mA)
0
RP173x
No. EA-256-171101
21
RP173x30xx RP173x55xx
0.0
1.5
3.0
4.5
-100 -50 050 100 150 200 250 300 350 400
Times t (µs)
Output Voltage V
OUT
(V)
0
2
4
6
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
CE Input Voltage
4.0V ⇒0V
Output Voltage
V
IN
=4.0V
0
0.0
2.0
4.0
6.0
-100 -50 050 100 150 200 250 300 350 400
Times t (µs)
Output Voltage V
OUT
(V)
0.0
2.5
5.0
7.5
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=1mA
Iout=30mA
Iout=100mA
CE Input Voltage
6.5V ⇒0V
Output Voltage
V
IN
=6.5V
0
RP173x
No. EA-256-171101
22
ESR vs. Output Curr e nt
When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR
of an output capacitor are shown below. The conditions when the white noise level is under 40 μV (Avg.) are
marked as the hatched area in the graph.
Measurement Conditions
Frequency Band: 10 Hz to 2 MHz
Temperature : −40°C to 85°C
C1, C2 : 0.1 µF
RP173x0121x RP173x301x
RP173x551x
0.01
0.1
1
10
100
025 50 75 100 125 150
Output Current (mA)
ESR (Ω)
V
IN
=2.5V～7.7V
0.01
0.1
1
10
100
025 50 75 100 125 150
Output Current (mA)
ESR (Ω)
V
IN
=3.0V～9.5V
0.01
0.1
1
10
100
025 50 75 100 125 150
Output Current (mA)
ESR (Ω)
V
IN
=5.5V～11V
POWER DISSIPATION DFN(PLP)1010-4
Ver. B
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes φ 0.2 mm × 11 pcs
Measurement Resu lt (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 800 mW
Thermal Resistance (θja) θja = 125°C/W
Thermal Characterization Parameter (ψjt) ψjt = 58°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
0
100
200
300
400
500
600
700
800
900
1000
0 25 50 75 100 125
Power Dissipation (mW)
Ambient Temperature (°C)
85
800
PACK AGE DIMENSIONS
DFN(PLP)1010-4
Ver. A
i
DFN(PLP)1010-4 Package Dimensions (Unit: mm)
*
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
∗
POWER DISSIPATION SC-88A
Ver. B
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Item
Standard Test Land Pattern
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions 40 mm × 40 mm × 1.6 mm
Copper Ratio Top Side: Approx. 50%
Bottom Side: Approx. 50%
Through-holes φ 0.5 mm × 44 pcs
Measurement Resu lt (Ta = 25°C, Tjmax = 125°C)
Item Standard Test Land Pattern
Power Dissipation 380 mW
Thermal Resistance (θja) θja = 263°C/W
Thermal Characterization Parameter (ψjt) ψjt = 75°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
40
40
Power Dissipation vs. Ambient Temperat ure
Measurement Board Pattern
0
100
200
300
400
500
0 25 50 75 100 125
Power Dissipation (mW)
Ambient Temperature (°C)
380
85
PACK AGE DIMENSIONS SC-88A
Ver. A
i
SC-88A Package Dimensions
POWER DISSIPATION SOT-23-5
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 7 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (ja)
ja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
PACK AGE DIMENSIONS
SOT-23-5
Ver. A
i
SOT-23-5 Package Dimensions
2.9±0.2
1.9±0.2
(0.95) (0.95)
5 4
1 2 3
1.6
-
0.1
+0.2
2.8±0.3
0.4±0.1
0.8±0.1
1.1±0.1
0～0.1
0.15
-
0.05
+0.1
0.2min.
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
Halogen Free
https://www.e-devices.ricoh.co.jp/en/
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1.Theproductsand theproduct specificationsdescribed in thisdocument aresubject tochangeor discontinuationof
productionwithout noticefor reasons
suchas improvement.Therefore, before decidingto usethe products,please
refertoRicohsalesrepresentativesforthelatestinformationthereon.
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takingoutofyourcountrytheproductsorthetechnicalinformationdescribedherein.
4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofandexampleapplicationcircuits
fortheproducts.Thereleaseofsuchinformationisnottobeconstruedasawarrantyoforagrantoflicenseunder
Ricoh'soranythirdparty'sintellectualpropertyrightsoranyotherrights.
5.Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectroniccomponentsinstandard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusementequipment etc.). Thosecustomers intendingto useaproduct inan applicationrequiring extremequality
andreliability,forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproductcouldresult
inhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,trafficcontrolsystem,automotiveand
transportationequipment,combustionequipment,safetydevices,lifesupportsystemetc.)shouldfirstcontactus.
6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,butsemiconductorproducts
arelikelytofailwithcertainprobability.Inordertopreventanyinjurytopersonsordamagestopropertyresultingfrom
suchfailure,customersshouldbecarefulenoughtoincorporatesafetymeasuresintheirdesign,suchasredundancy
feature,firecontainmentfeatureandfail-safefeature.Wedonotassumeanyliability
orresponsibilityforanylossor
damagearisingfrommisuseorinappropriateuseoftheproducts.
7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument.
8.The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristicsintheevaluationstage.
9.WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristicsoftheproductsunderoperationorstorage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
caseofrecognizingthemarkingcharacteristicwithAOI,pleasecontactRicohsalesorourdistributorbeforeattempting
touseAOI.
11.
PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcommentsconcerningtheproductsor
thetechnicalinformation.