RP173x Series 11 V Input 150 mA LDO No. EA-256-171101 OUTLINE The RP173x is a voltage regulator featuring 150 mA output and low supply current of Typ. 2.0 A. It consists of a voltage reference unit, an error amplifier, a resistor-net for voltage setting, a current limit circuit, a chip enable circuit and a Reverse Current Protection Circuit. RP173x is suitable for the power source such as the equipment being in the standby-mode. The A version with CE input pin has reduced CE pull-up resistance to make its supply current ultra low. The RP173x has Max.11 V Input voltage and is applicable to the portable communication equipment that requires the 2-cell Li-ion battery. Also it is applicable to the non-portable communication equipments. As the RP173x includes Reverse Current Protection Circuit, there is little leakage current, if it is used as back-up circuit. Packages are available in SOT-23-5, SC-88A, and 1-mm square DFN(PLP)1010-4 packages. High density mounting of the ICs on boards is possible. FEATURES * * * * * * * * * * * * * Output Current ............................................................. Typ. 150 mA Supply Current ............................................................. Typ. 2.0 A Standby Current ........................................................... Typ. 0.2 A Dropout Voltage ........................................................... Typ. 0.13 V (IOUT = 30 mA, VOUT = 3.0 V) Typ. 0.90 V (IOUT = 150 mA, VOUT = 3.0 V) Output Voltage Accuracy.............................................. 1.0% (1.5 V < VOUT 5.5 V, Ta = 25C) Line Regulation ............................................................ Typ. 0.02%/V Packages ..................................................................... DFN(PLP)1010-4, SC-88A, SOT-23-5 Input Voltage Range .................................................... 2.5 V to Set VOUT + 6.5 V (Max. 11 V) Output Voltage Range .................................................. 1.2 V to 5.5 V (0.1 V step) Built-in Reverse Current Protection Circuit Short Current Limit ....................................................... Typ. 45 mA Built-in Peak Current Limit Circuit Output capacitors ......................................................... 0.1 F or more APPLICATIONS * * * * Power source for portable communication equipments. Power source for battery-powered equipments. Power source for electrical appliances such as cameras, VSRs and camcorders. Power source for digital home appliances. 1 RP173x No. EA-256-171101 SELECTION GUIDE The output voltage, the auto-discharge function(1), and the package for the ICs are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free DFN(PLP)1010-4 10,000 pcs Yes Yes RP173Qxx2-TR-FE SC-88A 3,000 pcs Yes Yes RP173Nxx1-TR-FE SOT-23-5 3,000 pcs Yes Yes RP173Kxx1-TR xx : The output voltage can be designated in the range of 1.2 V (12) to 5.5 V (55) in 0.1 V step. : The auto discharge function at off state are options as follows. (A) "L" active, without auto discharge function at off state (Pull-up resistance is not built-in) (B) "H" active, without auto discharge function at off state (D) "H" active, with auto discharge function at off state (1) Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. 2 RP173x No. EA-256-171101 BLOCK DIAGRAMS RP173xxxxA RP173xxxxB VOUT VDD VDD Vref CE VOUT Vref Current Limit Current Limit Reverse Detector Reverse Detector GND CE GND (Pull-up resistance is not built-in.) RP173xxxxD VDD VOUT Vref Current Limit CE Reverse Detector GND 3 RP173x No. EA-256-171101 PIN DESCRIPTIONS Top View 4 3 Bottom View 3 5 4 (1) 1 2 2 (mark side) 1 DFN(PLP)1010-4 Pin Configuration 1 1 3 1 2 3 SOT-23-5 Pin Configuration Description 1 VOUT Output Pin 2 GND Ground Pin 3 CE /CE 4 VDD Chip Enable Pin Input Pin SC-88A Pin Descriptions Pin No. Symbol 2(2) 2 4 (mark side) SC-88A Pin Configuration DFN(PLP)1010-4 Pin Descriptions Pin No. Symbol 1 5 4 Description CE /CE Chip Enable Pin NC No Connection 3 GND Ground Pin 4 VOUT Output Pin 5 VDD Input Pin SOT-23-5 Pin Descriptions Pin No. Symbol Description 1 VDD Input Pin 2 GND 3 CE /CE Chip Enable Pin 4 NC No Connection 5 VOUT Ground Pin Output Pin (1) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. (2) Pin No. 2 is connected to the bottom of the IC. It is recommended that the pin be connected to the ground plane on the board, or otherwise be left floating so that there is no contact with other potentials. 4 RP173x No. EA-256-171101 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol Item Rating Unit VIN Input Voltage 12 V VCE Input Voltage (CE pin) 12 V VOUT Output Voltage -0.3 to 6.0 V IOUT Output Current 165 mA DFN(PLP)1010-4 PD Power Dissipation(1) SC-88A SOT-23-5 JEDEC STD. 51-7 Test Land Pattern Standard Test Land Pattern JEDEC STD. 51-7 Test Land Pattern 800 380 mW 660 Tj Junction Temperature Range -40 to 125 C Tstg Storage Temperature Range -55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Item VIN Input Voltage Ta Operating Temperature Range Rating Unit 2.5 to 11.0(2) V -40 to 85 C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) (2) Refer to POWER DISSIPATION for detailed information. VSET + 6.5 V 11.0 V 5 RP173x No. EA-256-171101 ELECTRICAL CHARACTERISTICS Unless otherwise noted, VIN = Set VOUT + 1.0 V, IOUT = 1 mA, CIN = COUT = 0.1 F. The specifications surrounded by are guaranteed by design engineering at -40C Ta 85C. RP173xxxxA Symbol Item Conditions Ta = 25C VOUT Output Voltage -40C Ta 85C IOUT Typ. VOUT > 1.5 V x0.99 x1.01 V VOUT 1.5 V -15 15 mV VOUT > 1.5 V x0.982 x1.018 V VOUT 1.5 V -28 27 mV Output Current VOUT/IOUT Load Regulation Min. (Ta = 25C) Max. Unit mA 150 0.1 mA IOUT 150 mA -30 -3 35 mV Refer to the PRODUCT-SPECIFIC ELECTRICAL CHARACTERISTICS VDIF Dropout Voltage ISS Supply Current IOUT = 0 mA 2.0 3.7 A Standby Current VIN = VIN (Max.) VCE = VIN 0.2 0.6 A 0.02 0.20 %/V Istandby VOUT/VIN Load Regulation RR Ripple Rejection VIN Input Voltage ISC Short Current Limit Circuit VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" Reverse Current IREV VREV_DET (1) VREV_REL(1) Set VOUT + 0.5 V VIN VIN (Max.) When VOUT 2.0 V, 2.5 V VIN VIN (Max.) f = 1 kHz, Ripple 0.2 Vp-p, IOUT = 10 mA *When VOUT < 2.0 V, VIN = 3.0 V 30 dB 1.2 VOUT < 4.5 2.5 Vset + 6.5 4.5 VOUT 5.5 2.5 11 VOUT = 0 V 45 mA V 1.7 0 VIN 11.0 V, VOUT 1.5 V Reverse Current Protection Mode 0 VIN 11.0 V, VOUT 1.5 V Detection Offset, VREV = VDD - VOUT Reverse Current Protection Mode 0 VIN 11.0 V, VOUT 1.5 V Release Offset V 0.8 V 0 0.16 A 55 100 mV 70 120 mV All of units are tested and specified under the pulse load conditions such that Tj Ta = 25C except for Ripple Rejection. (1) The operation coverage of the Reverse Current Protection Circuit is VOUT 1.5 V. However, under the condition of VIN = VOUT = 0 V, always the Reverse Current Protection Circuit is operating. 6 RP173x No. EA-256-171101 Unless otherwise noted, VIN = Set VOUT + 1.0 V, IOUT = 1 mA, CIN = COUT = 0.1 F. The specifications surrounded by are guaranteed by design engineering at -40C Ta 85C. RP173xxxxB/D Symbol Item Conditions Ta = 25C VOUT Output Voltage -40C Ta 85C IOUT Typ. VOUT > 1.5 V x0.99 x1.01 V VOUT 1.5 V -15 15 mV VOUT > 1.5 V x0.982 x1.018 V VOUT 1.5 V -28 27 mV Output Current VOUT/IOUT Load Regulation Min. (Ta = 25C) Max. Unit mA 150 0.1 mA IOUT 150 mA -30 -3 35 mV Refer to the PRODUCT-SPECIFIC ELECTRICAL CHARACTERISTICS VDIF Dropout Voltage ISS Supply Current IOUT = 0 mA 2.0 3.7 A Standby Current VIN = VIN (Max.) VCE = 0 V 0.2 0.6 A 0.02 0.20 %/V Istandby VOUT/VIN Load Regulation RR Ripple Rejection VIN Input Voltage ISC Short Current Limit Circuit IPD CE Pull-down Current VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" IREV Reverse Current VREV_DET (1) VREV_REL(1) RLOW Set VOUT + 0.5 V VIN VIN (Max.) When VOUT 2.0 V, 2.5 V VIN VIN (Max.) f = 1kHz, Ripple 0.2 Vp-p, IOUT = 10 mA *When VOUT < 2.0 V, VIN = 3.0 V 30 dB 1.2 VOUT < 4.5 2.5 Vset + 6.5 4.5 VOUT 5.5 2.5 11 VOUT = 0 V 45 0.30 mA 0.90 Reverse Current Protection Mode 0 VIN 11.0 V, VOUT 1.5 V Detection Offset, VREV = VDD - VOUT Reverse Current Protection Mode 0 VIN 11.0 V, VOUT 1.5 V Release Offset Auto-discharge Nch Tr. ON Resistance VIN = 7.0 V, VCE = 0 V (RP173xxxxD only) A V 1.7 0 VIN 11.0 V, VOUT 1.5 V V 0.8 V 0 0.16 A 55 100 mV 70 120 mV 380 All of units are tested and specified under the pulse load conditions such that Tj Ta = 25C except for Ripple Rejection. (1) The operation coverage of the Reverse Current Protection Circuit is VOUT 1.5 V. However, under the condition of VIN = VOUT = 0 V, always the Reverse Current Protection Circuit is operating. 7 RP173x No. EA-256-171101 PRODUCT-SPECIFIC ELECTRICAL CHARACTERISTICS RP173x Product-specific Electrical Characteristics VOUT Ta = 25C Product Name -40C Ta 85C Min. Typ. Max. Min. Typ. Max. RP173x12xx RP173x12xx5 RP173x13xx RP173x14xx RP173x15xx RP173x16xx RP173x17xx RP173x17xx5 RP173x18xx RP173x18xx5 RP173x19xx RP173x20xx RP173x21xx RP173x22xx RP173x23xx RP173x24xx RP173x25xx RP173x26xx RP173x27xx RP173x28xx RP173x28xx5 RP173x29xx RP173x30xx RP173x31xx RP173x32xx RP173x33xx RP173x34xx RP173x35xx RP173x36xx RP173x37xx RP173x38xx RP173x39xx RP173x40xx RP173x41xx RP173x42xx RP173x43xx RP173x44xx RP173x45xx RP173x46xx RP173x47xx RP173x48xx RP173x49xx RP173x50xx RP173x51xx RP173x52xx RP173x53xx RP173x54xx RP173x55xx 8 1.185 1.235 1.285 1.385 1.485 1.584 1.683 1.733 1.782 1.832 1.881 1.980 2.079 2.178 2.277 2.376 2.475 2.574 2.673 2.772 2.822 2.871 2.970 3.069 3.168 3.267 3.366 3.465 3.564 3.663 3.762 3.861 3.960 4.059 4.158 4.257 4.356 4.455 4.554 4.653 4.752 4.851 4.950 5.049 5.148 5.247 5.346 5.445 1.200 1.250 1.300 1.400 1.500 1.600 1.700 1.750 1.800 1.850 1.900 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.850 2.900 3.000 3.100 3.200 3.300 3.400 3.500 3.600 3.700 3.800 3.900 4.000 4.100 4.200 4.300 4.400 4.500 4.600 4.700 4.800 4.900 5.000 5.100 5.200 5.300 5.400 5.500 1.215 1.265 1.315 1.415 1.515 1.616 1.717 1.768 1.818 1.869 1.919 2.020 2.121 2.222 2.323 2.424 2.525 2.626 2.727 2.828 2.879 2.929 3.030 3.131 3.232 3.333 3.434 3.535 3.636 3.737 3.838 3.939 4.040 4.141 4.242 4.343 4.444 4.545 4.646 4.747 4.848 4.949 5.050 5.151 5.252 5.353 5.454 5.555 1.172 1.222 1.272 1.372 1.472 1.571 1.669 1.719 1.768 1.817 1.866 1.964 2.062 2.160 2.259 2.357 2.455 2.553 2.651 2.750 2.799 2.848 2.946 3.044 3.142 3.241 3.339 3.437 3.535 3.633 3.732 3.830 3.928 4.026 4.124 4.223 4.321 4.419 4.517 4.615 4.714 4.812 4.910 5.008 5.106 5.205 5.303 5.401 1.200 1.250 1.300 1.400 1.500 1.600 1.700 1.750 1.800 1.850 1.900 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.850 2.900 3.000 3.100 3.200 3.300 3.400 3.500 3.600 3.700 3.800 3.900 4.000 4.100 4.200 4.300 4.400 4.500 4.600 4.700 4.800 4.900 5.000 5.100 5.200 5.300 5.400 5.500 1.227 1.277 1.327 1.427 1.527 1.629 1.731 1.782 1.832 1.883 1.934 2.036 2.138 2.240 2.341 2.443 2.545 2.647 2.749 2.850 2.901 2.952 3.054 3.156 3.258 3.359 3.461 3.563 3.665 3.767 3.868 3.970 4.072 4.174 4.276 4.377 4.479 4.581 4.683 4.785 4.886 4.988 5.090 5.192 5.294 5.395 5.497 5.599 VDIF Typ. Max. 1.680 1.680 1.630 1.630 1.480 1.480 1.480 1.480 1.160 1.160 1.160 1.160 1.160 1.160 0.900 0.900 0.900 0.900 0.900 0.900 0.900 0.900 0.610 0.610 0.610 0.610 0.610 0.610 0.610 0.610 0.610 0.610 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 0.390 2.590 2.590 2.490 2.490 2.230 2.230 2.230 2.230 2.190 2.190 2.190 2.190 2.190 2.190 1.470 1.470 1.470 1.470 1.470 1.470 1.470 1.470 1.050 1.050 1.050 1.050 1.050 1.050 1.050 1.050 1.050 1.050 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 0.760 RP173x No. EA-256-171101 THEORY OF OPERATION REVERSE CURRENT PROTECTION CIRCUIT The RP173 Series include a Reverse Current Protection Circuit, which stops the reverse current from VOUT pin to VDD pin or to GND pin when VOUT becomes higher than VIN. Usually, the LDO using Pch output transistor contains a parasitic diode between VDD pin and VOUT pin. Therefore, if VOUT is higher than VIN, the parasitic diode becomes forward direction. As a result, the current flows from VOUT pin to VDD pin. The ICs of this series switches the mode to the reverse current protection mode before VIN becomes lower than VOUT by connecting the parasitic diode of Pch output transistor to the backward direction, and connecting the gate to VOUT pin. As a result, the Pch output transistor is turned off and the all the current pathways from VOUT pin to GND pin are shut down to maintain the reverse current lower than [IREV] of the Electrical Characteristics. Switching to either the normal mode or to the reverse current protection mode is determined by the magnitude of VIN voltage and VOUT voltage. For the stable operation, offset and hysteresis are set as the threshold. The detection/ release thresholds of both normal and reverse current protection modes are specified by [VREV_DET] and [VREV_REL] of the Electrical Characteristics. Therefore, the minimum dropout voltage under the small load current condition is restricted by the value of [VREV_REL]. Fig.1 and Fig.2 show the diagrams of each mode, and Fig.3 shows the load characteristics of each mode. When giving the VOUT pin a constant-voltage and decreasing the VIN voltage, the dropout voltage will become lower than the [VREV_DET]. As a result, the reverse current protection starts to function to stop the load current. By increasing the dropout voltage higher than the [VREV_REL], the protection mode will be released to let the load current to flow. If the dropout voltage to be used is lower than [VREV_REL], the detection and the release may be repeated. The operation coverage of the Reverse Current Protection Circuit is VOUT 1.5V. However, under the condition of VIN=0V, always the reverse current protection mode is operating. VDD Reverse Detector VDD Reverse Detector IOUT VOUT VOUT Vref Vref CE GND Fig. 1 Normal Mode IREV GND CE Fig. 2 Reverse Current Protection Mode 9 RP173x VIN/VOUT [V] VIN VREV_ REL VREV_ DET VOUT IOUT IOUT/IREV Output/Reverse Current Input/Output Voltage No. EA-256-171101 Normal Mode Reverse Current Protection Mode Normal Mode 0 IREV Fig. 3 Reverse Current Protection Mode Detection/ Release & Reverse Current/ Output Current Characteristics 10 RP173x No. EA-256-171101 APPLICATION INFORMATION TYPICAL APPLICATIONS VDD C1 CE Control VOUT VOUT RP173x CE C2 GND Recommended External Components Symbol C2 (COUT) Description 0.1 F, GRM155B31C104KA87D, MURATA NOTES ON SELECTING EXTERNAL COMPONENTS Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a 0.1F or more capacitor C2. In case of using a tantalum capacitor, the output may be unstable due to inappropriate ESR. Therefore, the full range of operating conditions for the capacitor in the application should be considered. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C1 with a capacitance value as much as 0.1F or more between VDD and GND pin, and as close as possible to the pins. Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring as short as possible. TECHNICAL NOTES POWER ACTIVATION If the ICs are started up with VIN and VCE under the no-load condition, the both pin voltages have to be started up with faster than 2.0V/s. If the IC is started up with slower than 2.0V/s under the no-load condition, start up the IC only with VCE. 11 RP173x No. EA-256-171101 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x12xx RP173x18xx 2.0 1.8 1.2 Output Voltage VOUT (V) Output Voltage VOUT (V) 1.4 1.0 0.8 0.6 Vdd=2.5V Vdd=3.2V Vdd=4.2V Vdd=5.5V Vdd=7.7V 0.4 0.2 0 0.0 0 100 200 300 1.6 1.4 1.2 Vdd=2.8V Vdd=3.8V Vdd=5.5V Vdd=8.3V 1.0 0.8 0.6 0.4 0.2 0 0.0 400 0 Output Current IOUT (mA) 3.0 5 Output Voltage VOUT (V) Output Voltage VOUT (V) 6 2.5 2.0 Vdd=4V Vdd=5.5V Vdd=9.5V 0.5 0 0.0 0 100 200 300 400 RP173x55xx 3.5 1.0 200 Output Current IOUT (mA) RP173x30xx 1.5 100 300 4 3 Vdd=6.5V Vdd=11V 2 1 00 400 0 Output Current IOUT (mA) 100 200 300 400 Output Current IOUT (mA) 2) Output Voltage vs. Input Voltage (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x12xx RP173x18xx 2.0 1.8 1.2 1.0 0.8 0.6 IOUT= 1mA 0.4 IOUT=30mA IOUT=50mA 0.2 1.6 1.4 1.2 1.0 0.8 IOUT= 1mA 0.6 IOUT=30mA 0.4 IOUT=50mA 0.2 0 0.0 0 0.0 0 2 4 Input Voltage VIN (V) 12 Output Voltage VOUT (V) Output Voltage VOUT (V) 1.4 6 0 2 4 6 Input Voltage VIN (V) 8 RP173x No. EA-256-171101 RP173x55xx 3.5 6 3.0 5 Output Voltage VOUT (V) Output Voltage VOUT (V) RP173x30xx 2.5 2.0 1.5 IOUT= 1mA 1.0 IOUT=30mA IOUT=50mA 0.5 0 0.0 4 3 IOUT= 1mA 2 IOUT=30mA 1 IOUT=50mA 0 0 2 4 6 8 0 2 Input Voltage VIN (V) 4 6 8 10 Input Voltage VIN (V) 3) Supply Current vs. Input Voltage (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x18xx 2.5 2.5 2.0 2.0 Supply Current I SS (A) Supply Current I SS (A) RP173x12xx 1.5 1.0 0.5 0 0.0 0 2 4 1.5 1.0 0.5 0.00 6 0 2 Input Voltage VOUT (V) 6 8 Input Voltage VOUT (V) RP173x30xx RP173x55xx 2.5 2.5 2.0 2.0 Supply Current I SS (A) Supply Current I SS (A) 4 1.5 1.0 0.5 1.5 1.0 0.5 0.00 0.00 0 2 4 6 Input Voltage VOUT (V) 8 0 2 4 6 8 10 Input Voltage VOUT (V) 13 RP173x No. EA-256-171101 4) Output Voltage vs. Temperature (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, IOUT = 1 mA) RP173x18xx 1.24 1.84 1.23 1.83 Output Voltage VOUT (V) Output Voltage VOUT (V) RP173x12xx 1.22 1.21 1.20 1.19 1.18 1.17 1.82 1.81 1.80 1.79 1.78 1.77 -50 -25 0 25 50 75 100 -50 -25 Temperature Topt (C) 25 50 75 100 75 100 Temperature Topt (C) RP173x30xx RP173x55xx 3.03 5.56 3.02 5.54 Output Voltage VOUT (V) Output Voltage VOUT (V) 0 3.01 3.00 2.99 2.98 2.97 2.96 5.52 5.50 5.48 5.46 5.44 5.42 -50 -25 0 25 50 75 100 -50 -25 Temperature Topt (C) 0 25 50 Temperature Topt (C) 5) Dropout Voltage vs. Output Current (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F) RP173x30xx 2000 800 1800 700 Dropout Voltage VDIF (mV) Dropout Voltage VDIF (mV) RP173x12xx 1600 1400 1200 1000 800 85 600 25 400 -40 200 0 0 25 50 75 100 125 Output Current IOUT (mA) 14 150 600 85 500 25 400 -40 300 200 100 0 0 25 50 75 100 Output Current IOUT (mA) 125 150 RP173x No. EA-256-171101 RP173x55xx 500 Dropout Voltage VDIF (mV) 450 85 400 25 350 -40 300 250 200 150 100 50 0 0 25 50 75 100 125 150 Output Current IOUT (mA) 6) Dropout Voltage vs. Set Output Voltage (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x Dropout Voltage VDIF (mV) 1800 1600 1400 1200 Iout=150mA 1000 Iout=50mA 800 Iout=30mA 600 400 200 0 0 1 2 3 4 5 6 Set Output Voltage VREG (V) 7) Minimum Operating Voltage (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = -40 to 85C) Input Voltage VIN (V) 4.0 3.5 3.0 2.5 2.0 0 25 50 75 100 125 150 Output Current IOUT (mA) 15 RP173x No. EA-256-171101 8) Ripple Rejection vs. Input Bias Voltage (C1 = none, C2 = Ceramic 0.1 F, Ripple = 0.2 Vp-p, Ta = 25C RP173x28xx RP173x28xx IOUT=1mA 50 40 30 20 100Hz 1kHz 10kHz 100kHz 10 0 2 4 6 8 IOUT=30mA 60 Ripple Rejection RR (dB) Ripple Rejection RR (dB) 60 50 100Hz 1kHz 10kHz 100kHz 40 30 20 10 0 10 2 Input Bias Voltage VIN (V) 4 6 8 10 Input Bias Voltage VIN (V) RP173x28xx IOUT=50mA Ripple Rejection RR (dB) 60 50 100Hz 1kHz 10kHz 100kHz 40 30 20 10 0 2 4 6 8 10 Input Bias Voltage VIN (V) 9) Ripple Rejection vs. Temperature (C1 = none, C2 = Ceramic 0.1 F, Ripple = 0.2 Vp-p, Ta = 25C) RP173x12xx VIN=2.5V 70 60 Iout=1mA 50 Iout=30mA 40 Iout=50mA 30 20 10 0 0.1 1 10 100 Frequency f (kHz) 16 VIN=2.8V 70 Ripple Rejection RR (dB) Ripple Rejection RR (dB) RP173x18xx 1000 60 Iout=1mA 50 Iout=30mA 40 Iout=50mA 30 20 10 0 0.1 1 10 100 Frequency f (kHz) 1000 RP173x No. EA-256-171101 RP173x30xx RP173x55xx VIN=4.0V 60 Iout=1mA Iout=30mA 50 Iout=50mA 40 VIN=6.5V 70 Ripple Rejection RR (dB) Ripple Rejection RR (dB) 70 30 20 10 0 60 Iout=1mA 50 Iout=30mA Iout=50mA 40 30 20 10 0 0.1 1 10 100 1000 0.1 1 Frequency f (kHz) 10 100 1000 Frequency f (kHz) 10) Input Transient Response (C1 = none, C2 = Ceramic 0.1 F, tr = tf = 5.0 s, Ta = 25C) RP173x18xx IOUT=1mA Input Voltage 3.0 2.5 1.6 1.4 1.2 Output Voltage 0.6 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 2.5 2.0 1.8 Output Voltage 1.6 1.4 0 0.1 0.2 RP173x30xx 4.0 3.2 3.0 Output Voltage 2.6 0.3 0.4 Time t (ms) 0.5 0.6 0.7 0.8 Output Voltage VOUT (V) 4.5 3.4 0.2 0.6 0.7 0.8 IOUT=1mA Input Voltage VIN (V) Output Voltage VOUT (V) Input Voltage 0.1 0.5 5.5 5.0 0 0.4 RP173x55xx IOUT=1mA 2.4 -0.1 0.3 Time t (ms) Time t (ms) 2.8 3.0 2.2 1.2 -0.1 0.8 3.5 Input Voltage 8.0 7.5 Input Voltage 7.0 6.5 5.9 5.7 5.5 Output Voltage 5.3 Input Voltage VIN (V) 0.8 Output Voltage VOUT (V) 3.5 1.0 4.0 4.0 Input Voltage VIN (V) Output Voltage VOUT (V) IOUT=1mA Input Voltage VIN (V) RP173x12xx 5.1 4.9 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Time t (ms) 17 RP173x No. EA-256-171101 RP173x18xx IOUT=30mA IOUT=30mA 3.0 2.5 1.6 1.4 1.2 Output Voltage 0.8 0.6 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 2.5 2.0 1.8 Output Voltage 1.6 1.4 0 0.1 0.2 4.0 3.4 3.2 3.0 Output Voltage 2.6 0.3 0.4 0.5 0.6 0.7 Output Voltage VOUT (V) 4.5 Input Voltage VIN (V) Output Voltage VOUT (V) Input Voltage 0.2 0.5 0.6 0.7 0.8 IOUT=30mA 5.5 5.0 0.1 0.4 RP173x55xx IOUT=30mA 0 0.3 Time t (ms) RP173x30xx 2.4 -0.1 3.0 2.2 Time t (ms) 2.8 3.5 Input Voltage 1.2 -0.1 0.8 4.0 7.5 Input Voltage 7.0 6.5 5.9 5.7 5.5 5.3 Output Voltage 5.1 4.9 -0.1 0.8 8.0 Input Voltage VIN (V) 1.0 Input Voltage VIN (V) Output Voltage VOUT (V) 3.5 Input Voltage Output Voltage VOUT (V) 4.0 Input Voltage VIN (V) RP173x12xx 0 0.1 0.2 Time t (ms) 0.3 0.4 0.5 0.6 0.7 0.8 Time t (ms) 11) Load Transient Response (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, tr = tf = 0.5 s, Ta = 25C) RP173x18xx 1.4 1.2 1.0 Output Voltage 0.8 0.6 -0.1 0 0.1 0.2 0.3 0.4 Time t (ms) 18 0 0.5 0.6 0.7 0.8 Output Voltage VOUT (V) 10 Output Current 1mA10mA 1.6 VIN=2.8V 20 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=2.5V 20 10 0 Output Current 1mA10mA 2.2 2.0 1.8 1.6 Output Voltage 1.4 1.2 -0.1 0 0.1 0.2 0.3 0.4 Time t (ms) 0.5 0.6 0.7 0.8 Output Current IOUT (mA) RP173x12xx RP173x No. EA-256-171101 RP173x55xx 0 3.2 3.0 Output Voltage 2.4 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 10 5.9 5.7 5.5 5.3 Output Voltage 5.1 4.9 -0.1 0.8 0 0.1 Time t (ms) 0 1.2 Output Voltage 0 0.1 0.2 0.3 1.8 1.5 Output Voltage 1.2 0 3.0 Output Voltage 0.4 0.5 0.6 0.7 0.8 Time t (ms) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VIN=6.5V 150 50 0 Output Voltage VOUT (V) 3.3 0.1 0.2 0.3 0 RP173x55xx Output Current IOUT (mA) Output Voltage VOUT (V) Output Current 50mA100mA 0 50 Time t (ms) 100 2.1 -0.1 150 2.1 0.9 -0.1 0.4 0.5 0.6 0.7 0.8 VIN=4.0V 2.4 0.8 Output Current 50mA100mA 2.4 RP173x30xx 2.7 0.7 100 Time t (ms) 3.6 0.6 VIN=4.0V Output Voltage VOUT (V) 50 Output Current 50mA100mA 1.5 0.3 -0.1 0.5 150 100 0.6 0.3 0.4 RP173x18xx Output Current IOUT (mA) Output Voltage VOUT (V) VIN=4.0V 0.9 0.2 Time t (ms) RP173x12xx 1.8 0 Output Current 1mA10mA Output Current IOUT (mA) 2.6 20 150 100 Output Current 50mA100mA 5.8 5.5 5.2 Output Voltage 4.9 4.6 -0.1 0 0.1 0.2 0.3 50 0 Output Current IOUT (mA) 2.8 Output Voltage VOUT (V) 10 Output Current 1mA10mA 3.4 VIN=6.5V 20 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=4.0V Output Current IOUT (mA) RP173x30xx 0.4 0.5 0.6 0.7 0.8 Time t (ms) 19 RP173x No. EA-256-171101 12) Turn on Speed (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x18xx 0.5 0 Iout=0mA Iout=1mA Iout=30mA Output Voltage Iout=100mA 0 0.0 -100 -50 0 Iout=1mA 2.0 Iout=30mA Iout=100mA 1.0 0 50 100 150 200 250 300 350 400 Time t (s) 0 Iout=1mA Output Voltage 0 0.0 -100 -50 0 Output Voltage VOUT (V) 2 Iout=0mA 1.0 VIN=6.5V CE Input Voltage VCE (V) Output Voltage VOUT (V) CE Input Voltage 0V 4.0V Iout=100mA Output Voltage 6 4 Iout=30mA 0 RP173x55xx VIN=4.0V 2.0 2 Iout=0mA 0 0.0 -100 -50 50 100 150 200 250 300 350 400 Time t (s) 4 CE Input Voltage 0V 2.8V RP173x30xx 3.0 6 CE Input Voltage 0V 4.0V CE Input Voltage 0V 6.5V 5 3 0 Iout=0mA 6.0 Iout=1mA 4.0 Iout=30mA Output Voltage Iout=100mA 2.0 0 0.0 -100 -50 50 100 150 200 250 300 350 400 Time t (s) 8 0 CE Input Voltage VCE (V) 1.0 4 2 CE Input Voltage 0V 2.5V 1.5 6 Output Voltage VOUT (V) Output Voltage VOUT (V) CE Input Voltage 0V 4.0V VIN=2.8V (IOUT=0,1,30mA) VIN=4.0V (IOUT=100mA) CE Input Voltage VCE (V) VIN=2.5V (IOUT=0,1,30mA) VIN=4.0V (IOUT=100mA) CE Input Voltage VCE (V) RP173x12xx 50 100 150 200 250 300 350 400 Time t (s) 13) Turn off Speed with CE pin (C1 = Ceramic 0.1 F, C2 = Ceramic 0.1 F, Ta = 25C) RP173x12xx RP173x18xx 0 CE Input Voltage 2.5V 0V Iout=0mA Output Voltage 1.0 0 50 100 150 200 250 300 350 400 Times t (s) 20 Iout=30mA Iout=100mA 0.5 0.0 0 -100 -50 Iout=1mA 6 4 CE Input Voltage 4.0V 0V CE Input Voltage VCE (V) 1.5 2 Output Voltage VOUT (V) 4 CE Input Voltage 4.0V 0V VIN=2.8V(IOUT=0,1,30mA) VIN=4.0V(IOUT=100mA) 6 CE Input Voltage VCE (V) Output Voltage VOUT (V) VIN=2.5V(IOUT=0,1,30mA) VIN=4.0V(IOUT=100mA) 2 0 Iout=0mA CE Input Voltage 2.8V 0V 2.0 Iout=1mA Output Voltage 1.0 0 0.0 -100 -50 0 50 Iout=30mA Iout=100mA 100 150 200 250 300 350 400 Times t (s) RP173x No. EA-256-171101 RP173x30xx RP173x55xx Iout=0mA 3.0 Output Voltage 1.5 0.0 0 -100 -50 0 Iout=1mA Iout=30mA Iout=100mA 0 50 100 150 200 250 300 350 400 Times t (s) 7.5 5.0 CE Input Voltage 6.5V 0V CE Input Voltage VCE (V) 4.5 2 Output Voltage VOUT (V) 4 CE Input Voltage 4.0V 0V VIN=6.5V 6 CE Input Voltage VCE (V) Output Voltage VOUT (V) VIN=4.0V 2.5 0.0 Iout=0mA 6.0 Output Voltage 4.0 Iout=30mA Iout=100mA 2.0 0 0.0 -100 -50 Iout=1mA 0 50 100 150 200 250 300 350 400 Times t (s) 21 RP173x No. EA-256-171101 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 40 V (Avg.) are marked as the hatched area in the graph. Measurement Conditions Frequency Band: 10 Hz to 2 MHz Temperature : -40C to 85C C1, C2 : 0.1 F RP173x0121x RP173x301x V IN=2.5V7.7V 100 10 ESR () ESR () 10 1 0.01 0.01 0 25 50 75 100 125 150 RP173x551x V IN=5.5V11V 100 10 1 0.1 0.01 0 25 50 75 100 Output Current (mA) 0 25 50 75 100 Output Current (mA) Output Current (mA) ESR () 1 0.1 0.1 22 V IN=3.0V9.5V 100 125 150 125 150 POWER DISSIPATION DFN(PLP)1010-4 Ver. B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Copper Ratio Through-holes 0.2 mm x 11 pcs (Ta = 25C, Tjmax = 125C) Measurement Result Item Measurement Result Power Dissipation 800 mW Thermal Resistance (ja) ja = 125C/W Thermal Characterization Parameter (jt) jt = 58C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 1000 900 800 Power Dissipation (mW) 800 700 600 500 400 300 200 100 0 0 25 50 75 85 100 125 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i DFN(PLP)1010-4 PACKAGE DIMENSIONS Ver. A DFN(PLP)1010-4 Package Dimensions (Unit: mm) * The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane on the board but it is possible to leave the tab floating. i POWER DISSIPATION SC-88A Ver. B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Item Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm x 40 mm x 1.6 mm Top Side: Approx. 50% Copper Ratio Bottom Side: Approx. 50% Through-holes 0.5 mm x 44 pcs (Ta = 25C, Tjmax = 125C) Measurement Result Item Standard Test Land Pattern Power Dissipation 380 mW Thermal Resistance (ja) ja = 263C/W Thermal Characterization Parameter (jt) jt = 75C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 500 40 380 300 200 40 Power Dissipation (mW) 400 100 0 0 25 50 75 85 100 125 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS SC-88A Ver. A SC-88A Package Dimensions i POWER DISSIPATION SOT-23-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm x 114.3 mm x 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes 0.3 mm x 7 pcs (Ta = 25C, Tjmax = 125C) Measurement Result Item Measurement Result Power Dissipation 660 mW Thermal Resistance (ja) ja = 150C/W Thermal Characterization Parameter (jt) jt = 51C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern i SOT-23-5 PACKAGE DIMENSIONS Ver. A 2.90.2 1.10.1 1.90.2 0.80.1 (0.95) 4 1 2 00.1 0.2min. +0.2 1.6-0.1 5 2.80.3 (0.95) 3 0.40.1 +0.1 0.15-0.05 SOT-23-5 Package Dimensions i 1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to Ricoh sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of Ricoh. 3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein. 4. The technical information described in this document shows typical characteristics of and example application circuits for the products. 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