HM62256B Series
256k SRAM (32-kword × 8-bit)
ADE-203-135F (Z)
Rev. 6.0
Nov. 13, 1997
Description
The Hitachi HM62256B Series is a CMOS static RAM organized 32,768-word × 8-bit. It realizes higher
performance and low power consumption by employing 0.8 µm Hi-CMOS process technology. The
device, packaged in 8 × 14 mm TSOP, 8 × 13.4 mm TSOP with thickness of 1.2 mm, 450 mil SOP (foot
print pitch width), 600 mil plastic DIP, or 300 mil plastic DIP, is available for high density mounting. It
offers low power standby power dissipation; therefore, it is suitable for battery backup systems.
Features
Single 5.0 V supply: 5.0 V ± 10%
Access time: 55 ns/70 ns/85 ns (max)
Power dissipation:
Active: 25 mW (typ) (f = 1 MHz)
Standby: 1.0 µW (typ)
Completely static memory
No clock or timing strobe required
Equal access and cycle times
Common data input and output
Three state output
Directly TTL compatible all inputs and outputs
Battery backup operation
HM62256B Series
2
Ordering Information
Type No. Access time Package
HM62256BLP-7 70 ns 600-mil 28-pin plastic DIP (DP-28)
HM62256BLP-7SL 70 ns
HM62256BLSP-7 70 ns 300-mil 28-pin plastic DIP (DP-28NA)
HM62256BLSP-7SL 70 ns
HM62256BLFP-7T 70 ns 450-mil 28-pin plastic SOP (FP-28DA)
HM62256BLFP-5SLT
HM62256BLFP-7SLT 55 ns
70 ns
HM62256BLFP-7ULT 70 ns
HM62256BLT-8 85 ns 8 mm × 14 mm 32-pin TSOP (TFP-32DA)
HM62256BLT-7SL 70 ns
HM62256BLTM-8 85 ns 8 mm × 13.4 mm 28-pin TSOP (TFP-28DA)
HM62256BLTM-5SL
HM62256BLTM-7SL 55 ns
70 ns
HM62256BLTM-7UL 70 ns
Pin Arrangement
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A14
A12
A7
A6
A5
A4
A3
A2 
A1
A0
I/O0 
I/O1
I/O2 
VSS
VCC
WE
A13
A8
A9
A11
OE
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
HM62256BLP/BLFP/BLSP Series
(Top view)
HM62256B Series
3
Pin Arrangement (cont.)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A10
CS
NC
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
NC
A1
A2
OE
A11
NC
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
NC
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
OE
A11
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
A4
A3
HM62256BLT Series
HM62256BLTM Series
(Top view)
(Top view)
Pin Description
Pin Name Function
A0 to A14 Address input
I/O0 to I/O7 Data input/output
CS Chip select
WE Write enable
OE Output enable
VCC Power supply
VSS Ground
NC No connection
HM62256B Series
4
Block Diagram
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A12
A5
A3
(MSB)
(LSB)
A14
A13
A4
A8
A7
A6
I/O0
I/O7
CS
WE
OE
A2 A1 A0 A10 A11
(LSB) (MSB)
A9
VCC
VSS
Row
Decoder
Memory Matrix
512 512
Column I/O
Column Decoder
Input
Data
Control
×
Timing Pulse Generator
Read/Write Control
HM62256B Series
5
Operation Table
WE CS OE Mode VCC current I/O pin Ref. cycle
×H×Standby ISB, ISB1 High-Z
H L H Output disable ICC High-Z
H L L Read ICC Dout Read cycle (1)to (3)
L L H Write ICC Din Write cycle (1)
L L L Write ICC Din Write cycle (2)
Note: ×: H or L
Absolute Maximum Ratings
Parameter Symbol Value Unit
Power supply voltage relative to VSS VCC –0.5 to +7.0 V
Terminal voltage on any pin relative to VSS VT–0.5*1 to VCC+0.3*2V
Power dissipation PT1.0 W
Operating temperature range Topr 0 to +70 °C
Storage temperature range Tstg –55 to +125 °C
Storage temperature range under bias Tbias –10 to +85 °C
Notes: 1. VT min: –3.0 V for pulse half-width 50 ns
2. Maximum voltage is 7.0 V
DC Operating Conditions (Ta = 0 to +70°C)
Parameter Symbol Min Typ Max Unit Notes
Supply voltage VCC 4.5 5.0 5.5 V
VSS 000V
Input high voltage VIH 2.2 VCC + 0.3 V
Input low voltage VIL –0.5*1 0.8 V
Note: 1. VIL min: –3.0 V for pulse half-width 50 ns
HM62256B Series
6
DC Characteristics (Ta = 0 to +70°C, VCC = 5 V ± 10%, VSS = 0 V)
Parameter Symbol Min Typ*1Max Unit Test conditions
Input leakage current |ILI|— 1 µA Vin = VSS to VCC
Output leakage current |ILO|— 1 µACS = VIH or OE = VIH or WE = VIL,
VI/O = VSS to VCC
Operating current ICC 6 15 mA CS = VIL, Others = VIH/VIL,
II/O = 0 mA
Average
operating
current
HM62256B-5 ICC1 60 mA Min cycle, duty = 100%,II/O = 0 mA,
CS = VIL, Others = VIH/VIL
HM62256B-7 ICC1 —3360mA
HM62256B-8 ICC1 —2950mA
I
CC2 5 15 mA Cycle time = 1 µs, II/O = 0 mA,
CS = VIL, VIH = VCC, VIL = 0
Standby current ISB 0.3 2 mA CS = VIH
ISB1 0.2 100 µA Vin 0 V, CS VCC – 0.2 V
ISB1 0.2*250*2µA
ISB1 0.2*310*3µA
Output low voltage VOL 0.4 V IOL = 2.1 mA
Output high voltage VOH 2.4 V IOH = –1.0 mA
Notes: 1. Typical values are at VCC = 5.0 V, Ta = +25°C and not guaranteed.
2. This characteristic is guaranteed only for L-SL version.
3. This characteristic is guaranteed only for L-UL version.
Capacitance (Ta = 25°C, f = 1.0 MHz)
Parameter Symbol Min Typ Max Unit Test Conditions
Input capacitance*1Cin 8 pF Vin = 0 V
Input/output capacitance*1CI/O 10 pF VI/O = 0 V
Note: 1. This parameter is sampled and not 100% tested.
HM62256B Series
7
AC Characteristics (Ta = 0 to +70°C, VCC = 5.0 V ± 10%)
Test Conditions
Input pulse levels: 0.8 V to 2.4 V
Input rise and fall time: 5 ns
Input and output timing reference levels: 1.5 V
Output load: 1 TTL Gate + CL (50 pF) (HM62256B-5)
1 TTL Gate + CL (100 pF) (HM62256B-7/8)
(Including scope & jig)
Read Cycle
HM62256B
-5 -7 -8
Parameter Symbol Min Max Min Max Min Max Unit Notes
Read cycle time tRC 55 70 85 ns
Address access time tAA 55 70 85 ns
Chip select to access time tACS 55 70 85 ns
Output enable to output valid tOE 35 40 45 ns
Chip select to output in low-Z tCLZ 5 10 10 ns 2
Output enable to output in low-Z tOLZ 5—5—5ns2
Chip deselect to output in high-Z tCHZ 0 20 0 25 0 30 ns 1, 2
Output disable to output in high-Z tOHZ 0 20 0 25 0 30 ns 1, 2
Output hold from address change tOH 5—5—5ns
HM62256B Series
8
Write Cycle
HM62256B
-5 -7 -8
Parameter Symbol Min Max Min Max Min Max Unit Notes
Write cycle time tWC 55 70 85 ns
Chip selection to end of write tCW 40 60 75 ns 5
Address setup time tAS 0—0—0ns6
Address valid to end of write tAW 40 60 75 ns
Write pulse width tWP 35 50 55 ns 4, 13
Write recovery time tWR 0—0—0ns7
Write to output in high-Z tWHZ 0 20 0 25 0 30 ns 1, 2, 8
Data to write time overlap tDW 25 30 35 ns
Data hold from write time tDH 0—0—0ns
Output active from end of write tOW 5—5—5ns2
Output disable to output in High-Z tOHZ 0 20 0 25 0 30 ns 1, 2, 8
Notes: 1. tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit conditions
and are not referred to output voltage levels.
2. This parameter is sampled and not 100% tested.
3. Address must be valid prior to or simultaneously with CS going low.
4. A write occurs during the overlap of a low CS and a low WE. A write begins at the latest
transition of CS going low or WE going low. A write ends at the earliest transition of CS going
high or WE going high. tWP is measured from the beginning of write to the end of write.
5. tCW is measured from CS going low to the end of write.
6. tAS is measured from the address valid to the beginning of write.
7. tWR is measured from the earliest of CS or WE going high to the end of write cycle.
8. During this period, I/O pins are in the output state; therefore, the input signals of the opposite
phase to the outputs must not be applied.
9. If CS goes low simultaneously with WE going low or after WE going low, the outputs remain in
the high impedance state.
10.Dout is the same phase of the latest written data in this write cycle.
11.Dout is the read data of next address.
12.If CS is low during this period, I/O pins are in the output state. Therefore, the input signals of the
opposite phase to the outputs must not be applied to them.
13.In the write cycle with OE low fixed, tWP must satisfy the following equation to avoid a problem of
data bus contention.
tWP tDW min + tWHZ max
HM62256B Series
9
Timing Waveform
Read Timing Waveform (1) (WE = VIH)
tAA
tACS
tRC
tOE
tOLZ
tOH
tOHZ
tCHZ
Valid data
Address
CS
OE
Dout High impedance
Valid address
Read Timing Waveform (2) (WE = VIH, CS = VIL, OE = VIL)
Address tAA
tRC
tOH
tOH
Valid data
Dout
Valid address
HM62256B Series
10
Read Timing Waveform (3) (WE = VIH, OE = VIL)*3
tACS
Dout Valid data
tCHZ
CS
tCLZ
High impedance
Write Timing Waveform (1) (OE Clock)
tWC
tCW
tWP
tAS
tOHZ
tDW tDH
tAW tWR
*9
Address
OE
CS
WE
Dout
Din Valid data
Valid address
High impedance
High impedance
HM62256B Series
11
Write Timing Waveform (2) (OE Low Fixed)
Address
WE
Dout
Din
tWC
tCW
tWP
tWHZ
tDW tDH
*9
tAS
CS
tAW
*10
*12
*11
tOH
tOW
tWR
Valid data
Valid address
High impedance
HM62256B Series
12
Low VCC Data Retention Characteristics (Ta = 0 to 70°C)
Parameter Symbol Min Typ*1Max Unit Test conditions*6
VCC for data retention VDR 2.0 5.5 V CS VCC – 0.2 V,
Vin 0V
Data retention current ICCDR 0.05 30*2µAV
CC = 3.0 V, Vin 0V
CS VCC – 0.2 V
ICCDR 0.05 10*3µA
ICCDR 0.05 3*4µA
Chip deselect to data
retention time tCDR 0 ns See retention Waveform
Operation recovery time tRtRC*5——ms
Notes: 1. Typical values are at VCC = 3.0 V, Ta = +25°C and not guaranteed.
2. 10 µA max. at Ta = 0 to +40°C.
3. This characteristic is guaranteed only for L-SL version, 3 µA max. at Ta = 0 to +40°C.
4. This characteristic is guaranteed only for L-UL version, 0.6 µA max. at Ta = 0 to +40°C.
5. tRC = Read cycle time.
6. CS controls address buffer, WE buffer, OE buffer, and Din buffer. If CS controls data retention
mode, Vin levels (address, WE, OE, I/O) can be in the high impedance state.
Low VCC Data Retention Timing Waveform
VCC
VDR
CS
Data retention mode
tR
4.5V
2.2V
0V CS VCC 0.2V
tCDR
HM62256B Series
13
Package Dimensions
HM62256BLP Series (DP-28)
0.51 Min
2.54 Min
0.25+ 0.11
– 0.05
2.54 ± 0.25 0.48 ± 0.10 0° – 15°
15.24
1.2
35.6
36.5 Max
13.4
14.6 Max
114
15
28
5.70 Max
1.9 Max
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
DP-28
Conforms
4.6 g
Unit: mm
HM62256B Series
14
Package Dimensions (cont.)
HM62256BLSP Series (DP-28NA)
2.54 Min 5.08 Max
2.54 ± 0.25 0.48 ± 0.10 0° – 15°
0.25+ 0.11
– 0.05
36.00
37.32 Max
1.30
7.10
7.40 Max
1
28 15
14
7.62
0.51 Min
2.20 Max
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
DP-28NA
Conforms
2.2 g
Unit: mm
HM62256B Series
15
Package Dimensions (cont.)
HM62256BLFP Series (FP-28DA)
0.17 ± 0.05
3.00 Max
8.40
18.00
18.75 Max
1.12 Max
28 15
114 11.80 ± 0.30
0° – 8°
1.00 ± 0.20
1.70
0.20
0.15
M
0.40 ± 0.08 Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-28DA
Conforms
Conforms
0.82 g
1.27
0.38 ± 0.06
+ 0.15
– 0.10
0.20
0.15 ± 0.04
Unit: mm
Dimension including the plating thickness
Base material dimension
HM62256B Series
16
Package Dimensions (cont.)
HM62256BLT Series (TFP-32DA)
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
TFP-32DA
Conforms
Conforms
0.26 g
0.10
0.08 M
0.50
8.00
0.22 ± 0.08
14.00 ± 0.20
1.20 Max
12.40
32
116
17
0.17 ± 0.05
0.13 ± 0.05
0° – 5°
8.20 Max
0.45 Max
0.50 ± 0.10
0.80
0.20 ± 0.06
0.125 ± 0.04
Unit: mm
Dimension including the plating thickness
Base material dimension
HM62256B Series
17
Package Dimensions (cont.)
HM62256BLTM Series (TFP-28DA)
0.10 M
0.55
8.00
0.22 ± 0.05
13.40 ± 0.30
0.05
1.20 Max
11.80
0° – 5°
21
22 7
8
8.20 Max
0.10
+0.10
–0.05
0.50 ± 0.10
0.80
0.63 Max
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
TFP-28DA
—
—
0.22 g
128
0.20 ± 0.04
0.125 ± 0.04
0.145 ± 0.05
Unit: mm
Dimension including the plating thickness
Base material dimension
HM62256B Series
18
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
U S A
Tel: 415-589-8300
Fax: 415-583-4207
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
HM62256B Series
19
Revision Record
Rev. Date Contents of Modification Drawn by Approved by
0.0 Sep. 10, 1993 Initial Issue Y. Saito K. Yoshizaki
1.0 Mar. 23, 1994 DC Characteristics
ICC1 Typ: —/—/—/— mA to 33/29/26/24 mA Y. Saito K. Yoshizaki
2.0 Oct. 31, 1994 Deletion of HM62256BLT-7/10SL/12SL
Addition of HM62256BLTM-8/7SL/8SL(TFP-28DA)
AC Characteristics
Addition of note 12
Low VCC data retention characteristics
VDR max: — to 5.5 V
Note 2: 20 µA max at Ta = 0 to +40°C
to 10 µA max at Ta = 0 to +40°C
Deletion of description; (only for L-version)
Y. Saito K. Yoshizaki
3.0 Jun. 19, 1995 Change of format
Deletion of HM62256BLP-8/10/12/8SL/10SL/12SL
Deletion of HM62256BLSP-8/10/12/8SL/10SL/12SL
Deletion of HM62256BLFP-8T/10T/12T
Deletion of HM62256BLFP-8SLT/10SLT/12SLT
Deletion of HM62256BLT-10/12/8SL
Deletion of HM62256BLTM-8SL
Addition of HM62256BLFP-4SLT/5SLT/7ULT
Addition of HM62256BLTM-4SLT/5SLT/7ULT
Features
Fast access time: 70/85/100/120 ns
to 45/55/70/85 ns
DC Characteristics
ICC1 typ: 33/29/26/24 mA to —/—/33/29 mA
max: 60/50/50/45 mA to 70/60/60/50 mA
ISB1 typ: 0.3/0.3 µA to 0.2/0.2/0.2 µA
max: 100/50 µA to 100/50/10 µA
Addition of note 3
AC Characteristics
Change order of notes.
Test Condition
Addition of HM62256B-4: 1TTL Gate + CL (100pF)
(Including scope & jig)
tRC min: 70/85/100/120 ns to 45/55/70/85 ns
tAA max: 70/85/100/120 ns to 45/55/70/85 ns
tACS max: 70/85/100/120 ns to 45/55/70/85 ns
tOE max: 40/45/50/60 ns to 30/35/40/45 ns
tCLZ min: 10/10/10/10 ns to 5/5/10/10 ns
tOHZ max: 25/30/35/40 ns to 20/20/25/30 ns
tOH min: 5/5/10/10 ns 5/5/5/5 ns
tWC min: 70/85/100/120 ns to 45/55/70/85 ns
tCW min: 60/75/80/85 ns to 35/40/60/75 ns
tAW min: 60/75/80/85 ns to 35/40/60/75 ns
tWP min: 50/55/60/70 ns to 30/35/50/55 ns
tWHZ max: 25/30/35/40 ns to 20/20/25/30 ns
M. Higuchi K. Yoshizaki
HM62256B Series
20
Revision Record (cont.)
Rev. Date Contents of Modification Drawn by Approved by
3.0 Jun. 19, 1995 AC Characteristics
tPW min: 30/35/40/50 ns to 20/25/30/35 ns
tOHZ max: 25/30/35/40 ns to 20/20/25/30 ns
Low VCC Data Retention Characteristics
Addition of note 4.
tCCDR typ: 0.2/0.2 µA to 0.05/0.05/0.05 µA
max: 30/10 µA to 30/10/3 µA
M. Higuchi K. Yoshizaki
4.0 Nov. 29, 1995 Ordering Information (HM62256BLFP-4 Series)
Addition of note (Under development)
AC Characteristics
Test Conditions
HM62256-5/7/8:1TTL Gate + CL (100pF) to
HM62256-5:1TTL Gate + CL (50pF) and
HM62256-7/8:1TTL Gate + CL (100pF)
M. Higuchi K. Yoshizaki
5.0 Jul. 9, 1997 Change of format
Deletion of HM62256B-4 Series M. Higuchi K. Imato
6.0 Nov. 13,1997 Operation Table
Correct Error
DC Operating Conditions
Correct Error
DC Characteristics
Correct Error