2
TechnischeInformation/TechnicalInformation
FS300R12OE4
IGBT-Module
IGBT-modules
preparedby:CU
approvedby:WR
dateofpublication:2013-11-05
revision:3.1
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1200 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 100°C, Tvj max = 175°C
TC = 25°C, Tvj max = 175°C
IC nom
IC300
460 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 600 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 1650 W
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
VCE sat
1,75
2,00
2,05
2,10
V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 11,5 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG2,25 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 2,5 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 18,5 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 1,05 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 3,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 300 A, VCE = 600 V
VGE = ±15 V
RGon = 0,75 Ω
td on
0,19
0,21
0,22
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 300 A, VCE = 600 V
VGE = ±15 V
RGon = 0,75 Ω
tr
0,05
0,06
0,06
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 300 A, VCE = 600 V
VGE = ±15 V
RGoff = 0,75 Ω
td off
0,40
0,51
0,54
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 300 A, VCE = 600 V
VGE = ±15 V
RGoff = 0,75 Ω
tf
0,06
0,10
0,11
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 300 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V, di/dt = 5200 A/µs (Tvj = 150°C)
RGon = 0,75 ΩEon 19,0
29,5
32,0
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 300 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V, du/dt = 3100 V/µs (Tvj = 150°C)
RGoff = 0,75 ΩEoff 24,5
38,0
42,5
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 800 V
VCEmax = VCES -LsCE ·di/dt ISC
1200
A
Tvj = 150°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 0,091 K/W
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 0,045 K/W
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 150 °C