Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Networks
E
1
X
2
B
3
E
4
1
5
0
6
C
7
1
8
0
9
3
10
J
11 12
Product Code
Thick Film
Resistor
Network
Number of
Terminals
10
16
Circuit Configuration
Code
C
Common Terminal Position The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance Value Resistance
Tolerance
J
Suffix for Special
Requirements
Dimension Code of
Chip Resistor Network
Type: inches
Dimensions
4.0 mm҂2.1 mm
6.4 mm҂3.1 mm
3.8 mm҂1.6 mm
P
P
E
Center common circuit
EXBD, EXBE
Diagonal common circuit
(Terminal 5 and Terminal 10)
EXBA10P
D:1206
E:1608
A:2512
Q:1506
3.2 mm҂1.6 mm
One side common circuit
(Terminal 16)
EXBQ16P
Diagonal common circuit
(Terminal 1 and Terminal 6)
EXBA10E
±5%
No through hole
Through holes
Pull up resistors
0.4 mm pitch 0.635 mm pitch
EXBE10C EXBA10P
Direct placement on the bus line
IC IC
VCC
IC IC
VCC
IC IC
VCC
■Features
● High density placing for digital signal circuits
·Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm 1.6 mm 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm 2.1 mm 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm 3.1 mm 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm 1.6 mm 0.45 mm, 0.5 mm pitch
·Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
● High speed mounting using conventional placing machine
<High density placing>
Chip Resistor Networks
Type: EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
■Explanation of Part Numbers
Feb. 2006
Chip Resistor Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
I03
0.3±0.2
0.5±0.2
f0.3+0.1
–0.2
0.3±0.2
0.25±0.20
0.5±0.2
0.8±0.1
4.0±0.2
0.25±0.20
0.35±0.20 0.4±0.2 0.35±0.20
0.4±0.2
0.5±0.2
0.4±0.2
2.1±0.2
0.55±0.10
f0.3+0.1
–0.2
0.7±0.2
0.3±0.2
0.3±0.2
6.4±0.2
1.27±0.10
0.5±0.2
0.5±0.2
0.5±0.2
3.1±0.2
0.55±0.10
I03
EXBA10E
I03
I03
EXBA10P
0.25±0.10
0.3±0.1 0.25±0.10
0.35±0.15
0.35
±
0.15
0.40±0.15
1.60±0.15
0.55±0.10
0.2±0.1
0.33±0.15 0.2±0.1
0.2±0.1
0.2
±
0.1
f0.2±0.1
3.20±0.15
0.635±0.10
0.40±0.15
0.15
+0.15
–0.05
0.15
+0.20
–0.05
0.15
+0.15
–0.05
0.3±0.1
0.2±0.1
0.25±0.15
3.8±0.2
0.5±0.1
0.30±0.15
1.6±0.2
0.45±0.10
472
10 9 8 7
2345
61
10 6
15
987
234
10 6
15
987
234
10
15
9
234 678
111213141516
Protective coating
Thick film
resistive element
Electrode (Inner)
Electrode (Between)
Electrode (Outer)
Alumina substrate
Alumina substrate
Protective coating
Electrode
(Inner)
Thick film
resistive element
0
20
40
60
80
100
–60 –40 –20
020406080
100120 140160 180
–55 °C70°C
125 °C
Rated Load (%)
Ambient Temperature (°C)
EXBD EXBE EXBA EXBQ
Mass (Weight)[1000 pcs.] : 10 g Mass (Weight)[1000 pcs.] : 16 g Mass (Weight)[1000 pcs.] : 40 g Mass (Weight)[1000 pcs.] : 9 g
EXBD, EXBE EXBA EXBQ
Item Specifi cations
Series EXBD EXBE EXBA EXBQ
Resistance Range 47 to 1 M (E12)
100 to 470 k (E6 series)
Resistance Tolerance ±5%
Number of Terminals 10 terminals 16 terminals
Number of Resistors 8 resistors 15 resistors
Power Rating at 70 °C 0.05 W/element 0.063 W/element 0.025 W/element
Limiting Element Voltage
(Maximum Rated Continuous Working Voltage)(1)
25V 50 V 25V
Maximum Overload Voltage(2) 50 V 100 V 50 V
T. C. R. ±200 10–6/ °C(ppm/ °C)
Category Temperature Range
(Operating Temperature Range) –55 °C to +125 °C
EXBA10P EXBA10E
■Construction (Example : EXBD)
■Dimensions in mm (not to scale)
■Circuit Confi guration
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Value, or Limiting Element Voltage
(maximum RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined
from SOTV=2.5 RCWV✽ or Maximum Overload Voltage list ed above which ev er less.
■Ratings
Feb. 2006
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Networks
fB
W
T
fA
fC
TTA
P0
P2
P1
fD0
B
F
W
E
fD1(Only Emboss)
■Packaging Methods (Taping)
● Standard Quantity
● Taping Reel
● Carrier Tape (Unit : mm)
(Unit : mm)
Punched Carrier Embossed Carrier
Type Kind of Taping Pitch (P1)Quantity
EXBD
Punched Carrier Taping 4 mm
5000 pcs./reel
EXBQ
EXBE 4000 pcs./reel
EXBA Embossed Carrier Taping
Type A B W F E P1P2P0fD0TfD1
EXBD 2.00±0.20 3.60±0.20
8.00±0.20 3.50±0.05 1.75±0.10
4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10
0.84±0.10 –
EXBQ 1.90±0.20 4.10±0.20 0.64±0.05 –
EXBE 2.50±0.20 4.40±0.20
12.00±0.30 5.50±0.20 1.75±0.20 1.10±0.20 1.50+0.10
EXBA 3.50±0.20 6.80±0.20 –0
–0
Type fAfBfCWT
EXBD
180.0+0 60 min. 13.0±1.0
9.0±1.0 11.4 ±1.0
EXBQ
EXBE 13.0±1.0 15.4±2.0
EXBA
–3.0
Feb. 2006
Chip Resistor Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
4.4
2.2
0.2
0.4 to 0.5
1.27
4.4
2.2
0.2
1.27
EXBA10P EXBA10E
1.27 0.635 1.27 0.635
0.4 to 0.5
0.8
0.4 to 0.5
3.3 to 3.4
5.0 to 5.4
0.35 to 0.4
1.4 to1.5
3.1 to 3.5
2.1 to2.5
4.3 to 4.7
1.27 0.4 to 0.6
3.4
1.4
5.2
3.3
0.5
0.8 0.4 0.35 to 0.4
0.1 to 0.15
0.635
0.9 to 1.1
2.0 to 2.6
0.3 to 0.4
0.2 to 0.3
2.6 to 2.8
3.6 to 4.2
0.50
0.9 to1.1
2.0 to 2.6
0.20 to 0.25
■Recommended Land Pat tern (mm)
✽ When designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip re-
sistor networks.
EXBD EXBE
For
popular
pattern
Pitch 0.635 mm
Pitch 0.8 mm
For high
density
pattern
✽
Pitch 0.4 mm···
Through-hole less
EXBA EXBQ
For
popular
pattern
Pitch 1.27 mm
Pitch 0.5 mm
For high
density
pattern
✽
Pitch 0.635 mm···
Through-hole less
Feb. 2006
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Networks
Preheating
Peak
Heating
Temperature
Time
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Safety Precautions
● Flow soldering
Please contact us regarding fl ow sol der ing of EXBA se ries. We do not recommend fl ow soldering to the
Chip Resistor Networks: EXBD/EXBE/EXBQ, because sol der bridging may occur due to the narrow 0.635 mm/
0.8 mm/0.5 mm pitch of EXBD/EXBE/EXBQ type.
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Networks (hereafter called the
resistors) so as not to damage their electrodes and pro tec tive coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and eval u ate the op er a tions
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Av oid excessi ve bending of printed circuit boards in order to protect the resistors from abnormal stress.
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealin g o r coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non -cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
