Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 Features High density placing for digital signal circuits * Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm 1.6 mm 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm 2.1 mm 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm 3.1 mm 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm 1.6 mm 0.45 mm, 0.5 mm pitch * Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB ("High density placing" is shown below) High speed mounting using conventional placing machine <High density placing> Pull up resistors Direct placement on the bus line VCC EXBE10C EXBA10P VCC VCC IC IC IC IC IC IC No through hole Through holes 0.4 mm pitch 0.635 mm pitch Explanation of Part Numbers Product Code Thick Film Resistor Network 1 2 3 4 5 6 7 8 9 10 11 E X B E 1 0 C 1 0 3 J Circuit Configuration Dimension Code of Chip Resistor Network Type: inches D : 1206 E : 1608 A : 2512 Q : 1506 Code Common Terminal Position Dimensions 3.2 mm1.6 mm 4.0 mm2.1 mm 6.4 mm3.1 mm 3.8 mm1.6 mm Number of Terminals 10 16 C P P E Center common circuit EXBD, EXBE Diagonal common circuit (Terminal 5 and Terminal 10) EXBA10P One side common circuit (Terminal 16) EXBQ16P Diagonal common circuit (Terminal 1 and Terminal 6) EXBA10E Resistance Value The first two digits are significant figures of resistance value and the third one denotes the number of zeros following. Resistance Tolerance 5 % J Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 12 Suffix for Special Requirements Feb. 2006 Chip Resistor Networks Construction (Example : EXBD) Protective coating Protective coating Electrode (Inner) Alumina substrate Electrode (Outer) Thick film resistive element Electrode (Between) Electrode (Inner) Thick film resistive element Alumina substrate Dimensions in mm (not to scale) 0.50.2 0.350.20 Mass (Weight)[1000 pcs.] : 16 g 472 1.60.2 3.10.2 I03 0.50.1 0.550.10 0.40.2 0.40.2 0.350.15 0.350.15 Mass (Weight)[1000 pcs.] : 10 g 1.270.10 6.40.2 0.450.10 3.80.2 EXBA10E 0.300.15 0.40.2 0.350.20 0.550.10 EXBA10P 0.15 +0.15 -0.05 0.80.1 4.00.2 I03 0.15 +0.15 -0.05 0.30.1 0.30.2 0.30.2 0.50.2 I03 0.20.1 0.70.2 f0.3 +0.1 -0.2 0.30.2 EXBQ 0.50.2 0.50.2 0.250.10 0.400.15 0.30.1 0.250.10 0.550.10 0.50.2 f0.3 +0.1 -0.2 0.50.2 0.6350.10 3.200.15 0.20.1 0.400.15 0.20.1 1.600.15 0.30.2 0.250.20 0.250.20 0.330.15 f0.20.1 0.20.1 0.20.1 EXBA 0.250.15 EXBE 2.10.2 EXBD 0.15 +0.20 -0.05 I03 Mass (Weight)[1000 pcs.] : 40 g Mass (Weight)[1000 pcs.] : 9 g Circuit Configuration EXBD, EXBE EXBA 10 9 8 7 1 EXBQ EXBA10E EXBA10P 10 9 8 7 6 10 9 8 7 6 16 15 14 13 12 11 10 9 1 2 3 4 5 1 2 3 4 5 1 6 2 3 4 5 2 3 4 5 6 7 8 Ratings Item Series Resistance Range Resistance Tolerance Number of Terminals Number of Resistors Power Rating at 70 C Limiting Element Voltage (Maximum Rated Continuous Working Voltage)(1) Maximum Overload Voltage (2) T. C. R. Specifications EXBE EXBA 47 to 1 M (E12) 5% 10 terminals 8 resistors 0.063 W/element EXBD 0.05 W/element EXBQ 100 to 470 k (E6 series) 16 terminals 15 resistors 0.025 W/element 25V 50 V 25V 50 V 100 V 200 10 -6 / C(ppm/ C) 50 V Category Temperature Range (Operating Temperature Range) -55 C to +125 C Power Derating Curve For resistors operated in ambient temperature above 70 C, power rating shall be derated in accordance with the figure on the right. Rated Load (%) (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Value, or Limiting Element Voltage (maximum RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 RCWV or Maximum Overload Voltage listed above whichever less. 100 -55 C 70 C 80 60 40 20 125 C 0 -60 -40 -20 0 20 40 60 80 100120140160180 Ambient Temperature (C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Resistor Networks Packaging Methods (Taping) Standard Quantity Type Kind of Taping Pitch (P1) Quantity EXBD 5000 pcs./reel Punched Carrier Taping EXBQ 4 mm EXBE 4000 pcs./reel Embossed Carrier Taping EXBA Carrier Tape (Unit : mm) Punched Carrier Embossed Carrier P1 P2 P0 B W F E fD0 A T T fD1 (Only Emboss) Type A B EXBD 2.00 0.20 3.60 0.20 EXBQ 1.90 0.20 0.20 EXBE 2.50 0.20 4.40 0.20 EXBA 3.50 0.20 6.80 0.20 4.10 W F 8.00 0.20 E 3.50 0.05 1.75 0.10 0.20 0.20 P1 4.00 0.10 12.00 0.30 5.50 1.75 P2 fD 0 P0 2.00 0.05 4.00 0.10 T fD1 0.840.10 - 0.05 - 0.20 1.50 +0.10 -0 0.64 1.50 +0.10 -0 1.10 Taping Reel (Unit : mm) Type EXBD EXBQ EXBE EXBA T fB fC W 9.0 180.0 +0 -3.0 60 min. 13.0 1.0 T 11.41.0 1.0 13.0 1.0 15.42.0 fB fC fA fA W Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Resistor Networks Recommended Land Pattern (mm) EXBD EXBE Pitch 0.8 mm Pitch 0.635 mm 0.635 1.4 to 1.5 0.4 to 0.5 For popular pattern 3.1 to 3.5 0.35 to 0.4 0.8 0.2 to 0.3 2.0 to 2.6 0.9 to 1.1 0.3 to 0.4 3.3 to 3.4 5.0 to 5.4 Pitch 0.4 mm***Through-hole less 0.8 0.4 0.35 to 0.4 2.6 to 2.8 0.1 to 0.15 0.5 1.4 3.4 3.6 to 4.2 For high density pattern 3.3 5.2 EXBA EXBQ 2.1 to 2.5 For popular pattern Pitch 0.5 mm 0.4 to 0.6 2.0 to 2.6 0.9 to 1.1 1.27 4.3 to 4.7 Pitch 1.27 mm Pitch 0.635 mm***Through-hole less EXBA10P EXBA10E 0.635 0.2 1.27 2.2 4.4 For high density pattern 1.27 1.27 0.4 to 0.5 0.20 to 0.25 0.50 0.635 2.2 4.4 0.2 1.27 0.4 to 0.5 When designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip resistor networks. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Resistor Networks Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 5 C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 C to 180 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s Time Flow soldering Please contact us regarding fl ow soldering of EXBA series. We do not recommend fl ow soldering to the Chip Resistor Networks: EXBD/EXBE/EXBQ, because solder bridging may occur due to the narrow 0.635 mm/ 0.8 mm/0.5 mm pitch of EXBD/EXBE/EXBQ type. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Chip Resistor Networks (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for Fixed Resistors) * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . * Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. * Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 - ER3 -