© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 1 Publication Order Number:
BAS21TMR6/D
1
BAS21TMR6
High Voltage Switching
Diode
The BAS21TMR6T1G device houses three high−voltage switching
diodes in a SC−74 surface mount package. This device is ideal for
low−power surface mount applications where board space is at a
premium.
Features
Reduces Board Space
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (EACH DIODE)
Rating Symbol Value Unit
Reverse Voltage VR250 Vdc
Forward Current IF200 mAdc
Peak Forward Surge Current IFM(surge) 625 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation
FR−5 Board (Note 1) TA = 25°C
Derate above 25°C
PD311
2.5 mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RJA 402 °C/W
Total Device Dissipation
Alumina Substrate, (Note 2) TA = 25°C
Derate above 25°C
PD347
2.8 mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RJA 360 °C/W
Junction and Storage Temperature TJ, Tstg 55 to
+150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be af fected.
1. FR−4 @ 10 mm2, 2 oz copper traces
2. FR−4 @ 25 mm2, 2 oz copper traces
250 V
HIGH VOLTAGE
SWITCHING DIODE
www.onsemi.com
Device Package Shipping
ORDERING INFORMATION
SC−74
CASE 318F
12
4
3
5
6
MARKING DIAGRAM
BAS21TMR6T1G SC−74
(Pb−Free) 3000 /
Tape & Reel
RAA MG
G
RAA = Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
123
654
NSVBAS21TMR6T1G SC−74
(Pb−Free) 3000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NSVBAS21TMR6T2G SC−74
(Pb−Free) 3000 /
Tape & Reel
BAS21TMR6
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
Reverse Voltage Leakage Current
(VR = 200 Vdc)
(VR = 200 Vdc, TJ = 150°C)
IR
0.1
100
Adc
Reverse Breakdown Voltage (IBR = 100 Adc) V(BR) 250 Vdc
Forward Voltage
(IF = 100 mAdc)
(IF = 200 mAdc)
VF
1.0
1.25
Vdc
Diode Capacitance (VR = 0, f = 1.0 MHz) CD 5.0 pF
Reverse Recovery Time (IF = IR = 30 mAdc, IR(REC) = 3.0 mAdc, RL = 100) trr 50 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 30 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 30 mA.
Notes: 3. tp » trr
+10 V 2.0 k
820
0.1 F
D.U.T.
VR
100 H
0.1 F
50 OUTPUT
PULSE
GENERATOR
50 INPUT
SAMPLING
OSCILLOSCOPE
trtpt
10%
90%
IF
IR
trr t
IR(REC) = 3.0 mA
OUTPUT PULSE
(IF = IR = 30 mA; MEASURED
at IR(REC) = 3.0 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
BAS21TMR6
www.onsemi.com
3
TYPICAL CHARACTERISTICS
VF, FORWARD VOLTAGE (V)
0.1
10
20
VR, REVERSE VOLTAGE (V)
1.0
0.1
0.01
0.001
50 80 110 140 170
1.6
0
VR, REVERSE VOLTAGE (V)
1.4
1.0
0.6
0.4
CD, DIODE CAPACITANCE (pF)
246 8
IF, FORWARD CURRENT (mA)
Figure 2. VF vs. IFFigure 3. IR vs. VR
Figure 4. Capacitance
IR, REVERSE CURRENT (μA)
1.0
10
100
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
85°C
55°C
150°C
125°C
25°C
-55°C
200 230
0.8
1.2
1357
Cap
-40°C
260
150°C
125°C
85°C
55°C
25°C
BAS21TMR6
www.onsemi.com
4
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
23
456
D
1
eb
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03 OBSOLETE. NEW STANDARD 318F−04.
C
L
HE
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.37 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE
L
0°10°0°10°
q
q
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent− Marking.pdf . S CILLC reserves t he right to m ake changes wit hout further notice to any products h erein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all l iabilit y, including wit hout limitation special, consequential o r i ncident al d a mages. Typical” parameters which may be provided in S CI LLC d at a sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application b y c ust omer’s technical e xperts. SCILLC does not c onvey a ny license under its p atent r ights n or t he r ights o f o t hers. S CILLC p roducts a re n ot d esigned, i ntended,
or authorized for use as c omponent s i n s yst ems i nt ended f or s urgic al i m plant i nt o the body, or other applicat ions i nt ended t o s upport o r sustain life, or f or a ny o ther application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC an d it s officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and r easonable a ttorney f ees a rising o ut of, directly o r i ndirect ly, a ny c laim o f personal injury or d eath a ssociated wit h s uch u nintended o r u naut horized u se, e ven if such c laim
alleges that SCILLC was negligent regarding the d esign or manufacture of the p art. S CILLC i s a n E qual O pportunity/Af firmative Act ion Employer. T his literature is subject t o a ll applicable
copyright laws and is not for resale in any manner.
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
BAS21TMR6/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ON Semiconductor:
BAS21TMR6T1G NSVBAS21TMR6T1G