MCA1206-150.1%ATP5142R - Vishay Presicion Group

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28785

1Revision: 19-Nov-09

Automotive-Grade MC AT Precision Thin Film Chip

Resistors are the perfect choice for most fields of modern

precision electronics where reliability and stability is of major

concern. Typical applications include automotive,

telecommunication, industrial, medical equipment, precision

test and measuring equipment.

FEATURES

• Superior moisture resistivity, |ΔR/R| < 0.5 %

(85 °C; 85 % RH; 1000 h)

• Rated dissipation P70 up to 0.4 W for size 1206

• AEC-Q200 qualified

• Approved according to EN 140401-801

• Lead (Pb)-free solder contacts

• Compliant to RoHS directive 2002/95/EC

APPLICATIONS

• Automotive

• Telecommunication

• Medical equipment

• Industrial equipment

Note

(1) Please refer to APPLICATION INFORMATION below

METRIC SIZE

INCH: 0402 0603 0805 1206

METRIC: RR 1005M RR 1608M RR 2012M RR 3216M

TECHNICAL SPECIFICATIONS

DESCRIPTION MCS 0402 AT MCT 0603 AT MCU 0805 AT MCA 1206 AT

Metric size RR 1005M RR 1608M RR 2012M RR 3216M

Resistance range 47 Ωto 47 kΩ47 Ωto 100 kΩ47 Ωto 100 kΩ47 Ωto 100 kΩ

Resistance tolerance ± 0.1 %

Temperature coefficient ± 25 ppm/K; ± 15 ppm/K

Rated dissipation P70 (1) 0.063 W 0.125 W 0.200 W 0.400 W

Operating voltage, Umax. AC/DC 50 V 75 V 150 V 200 V

Permissible film temperature (1) 155 °C

Insulation voltage

1 min; Uins 75 V 100 V 200 V 300 V

Continuous 75 V 75 V 75 V 75 V

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Superior Moisture Resistivity Vishay Beyschlag

Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com

Revision: 19-Nov-09 2

APPLICATION INFORMATION

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support

of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not

exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint,

hence special solder alloys or board materials may be required to maintain the reliability of the assembly.

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift

increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a

functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and

temperature limits in order to maintain a desired stability.

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

Operation mode Standard Power

Rated dissipation P70 P70

MCS 0402 AT 0.063 W 0.100 W

MCT 0603 AT 0.100 W 0.125 W

MCU 0805 AT 0.125 W 0.200 W

MCA 1206 AT 0.250 W 0.400 W

Film temperature 125 °C 155 °C

Max. resistance change at rated dissipation for

resistance range:

MCS 0402 AT 47 Ω to 47 kΩ47 Ω to 47 kΩ

MCT 0603 AT 47 Ω to 100 kΩ47 Ω to 100 kΩ

MCU 0805 AT 47 Ω to 100 kΩ47 Ω to 100 kΩ

MCA 1206 AT 47 Ω to 100 kΩ47 Ω to 100 kΩ

|ΔR/R| max., after:

1000 h ≤ 0.1 % ≤ 0.2 %

8000 h ≤ 0.2 % ≤ 0.4 %

225 000 h ≤ 0.6 % -

www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28785

3Revision: 19-Nov-09

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag Precision Thin Film Chip Resistor

Superior Moisture Resistivity

Note

(1) Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION

Note

(2) Resistance values to be selected from E96 and E192

PART NUMBER AND PRODUCT DESCRIPTION (1)

PART NUMBER: MCT0603MD4641BPW00

MODEL/SIZE VERSION TCR VALUE TOLERANCE PACKAGING SPECIAL

MCS0402

MCT0603

MCU0805

MCA1206

M = AT

(Automotive)

= ± 15 ppm/K

= ± 25 ppm/K

3 digit value

1 digit

multiplier

MULTIPLIER

9 = *10-1

0 = *100

1 = *101

2 = *102

3 = *103

B = ± 0.1 % E1

Up to 2 digits

00 = Standard

PRODUCT DESCRIPTION: MCT 0603 - 25 0.1 % AT PW 4K64

MCT 0603 - 25 0.1 % AT PW 4K64

MODEL SIZE TCR TOLERANCE

VALUE VERSION PACKAGING RESISTANCE

VALUE

MCS

MCT

MCU

MCA

0402

0603

0805

1206

± 15 ppm/K

± 25 ppm/K

± 0.1 % AT = Automotive E1

47K = 47 kΩ

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

DESCRIPTION RESISTANCE VALUE (2)

TCR TOLERANCE MCS 0402 AT MCT 0603 AT MCU 0805 AT MCA 1206 AT

± 25 ppm/K ± 0.1 % 47 Ωto 47 kΩ47 Ωto 100 kΩ47 Ωto 100 kΩ47 Ωto 100 kΩ

± 15 ppm/K

PACKAGING

MODEL

REEL

PIECES/

PAPER TAPE ON REEL CODE

MCS 0402 AT 1000 E1

10 000 E0

MCT 0603 AT

1000 P1

5000 P5

20 000 PW

MCU 0805 AT

1000 P1

5000 P5

20 000 PW

MCA 1206 AT 1000 P1

5000 P5

CT0603MD4M41BPW006

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Superior Moisture Resistivity Vishay Beyschlag

Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com

Revision: 19-Nov-09 4

DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of

power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the

reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in

publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other

parameters.

Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.

Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent

conductor areas.

DIMENSIONS AND MASS

TYPE H

(mm)

MASS

(mg)

MCS 0402 AT

0.32 ± 0.05

1.0 ± 0.05 0.5 ± 0.05 > 75 % of W

0.2 + 0.1/- 0.15 0.2 ± 0.1

0.6

MCT 0603 AT

0.45 + 0.1/- 0.05

1.55 ± 0.05 0.85 ± 0.1 > 75 % of W

0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2

1.9

MCU 0805 AT

0.52 ± 0.1

2.0 ± 0.1 1.25 ± 0.15 > 75 % of W

0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2

4.6

MCA 1206 AT

0.55 ± 0.1

3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W

0.5 ± 0.25 0.5 ± 0.25

9.2

WWT

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

WAVE SOLDERING REFLOW SOLDERING

(mm)

MCS 0402 AT - - - - 0.35 0.55 0.55 1.45

MCT 0603 AT 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05

MCU 0805 AT 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70

MCA 1206 AT 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80

www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28785

5Revision: 19-Nov-09

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag Precision Thin Film Chip Resistor

Superior Moisture Resistivity

DESCRIPTION

Production is strictly controlled and follows an extensive

set of instructions established for reproducibility. A

homogeneous film of special metal alloy is deposited on a

high grade (Al2O3) ceramic substrate and conditioned to

achieve the desired temperature coefficient. Specially

designed inner contacts are deposited on both sides. A

special laser is used to achieve the target value by smoothly

cutting a meander groove in the resistive layer without

damaging the ceramics. The resistor elements are covered

by a unique protective coating designed for electrical,

mechanical and climatic protection. The terminations receive

a final pure tin on nickel plating.

The result of the determined production is verified by an

extensive testing procedure and optical inspection

performed on 100 % of the individual chip resistors. Only

accepted products are laid directly into the paper tape in

accordance with IEC 60286-3 (3).

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic soldering

using wave, reflow or vapour phase as shown in

IEC 61760-1 (3). The encapsulation is resistant to all cleaning

solvents commonly used in the electronics industry,

including alcohols, esters and aqueous solutions. The

suitability of conformal coatings, if applied, shall be qualified

by appropriate means to ensure the long-term stability of the

whole system.

The resistors are RoHS compliant; the pure tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. Solderability is

specified for 2 years after production or requalification. The

permitted storage time is 20 years. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

All products comply with the GADSL (1) and the

CEFIC-EECA-EICTA (2) list of legal restrictions on

hazardous substances. This includes full compliance with

the following directives:

• 2000/53/EC End of Vehicle life Directive (ELV) and

Annex II (ELV II)

• 2002/95/EC Restriction of the use of Hazardous

Substances directive (RoHS)

• 2002/96/EC Waste Electrical and Electronic Equipment

Directive (WEEE)

APPROVALS

The resistors are approved within the IECQ-CECC Quality

Assessment System for Electronic Components to the detail

specification EN 140401-801 which refers to EN 60115-1,

EN 140400 and the variety of environmental test procedures

of the IEC 60068 (3) series. The detail specification refers to

the climatic categories 55/125/56, which relates to the

“standard operation mode” of this datasheet.

Conformity is attested by the use of the CECC Logo ( ) as

the Mark of Conformity on the package label. For

MCS 0402 AT and products with TCR 15 ppm/K the

certification according to DIN EN 140401-801:2008-05 is

pending.

Vishay BEYSCHLAG has achieved “Approval of

Manufacturer” in accordance with IEC QC 001002-3,

clause 2. The release certificate for “Technology Approval

Schedule” in accordance with CECC 240001 based on

IEC QC 001002-3, clause 6 is granted for the

Vishay BEYSCHLAG manufacturing process.

The resistors are qualified according to AEC-Q200.

RELATED PRODUCTS

For more information about products with higher operation

temperature please refer to the professional datasheet

document no. 28760.

Chip resistor arrays may be used in sensing applications or

precision amplifiers where close matching between multiple

resistors is necessary. Please refer to the

ACAS AT - Precision datasheet document no. 28770.

Notes

(1) Global Automotive Declarable Substance List, see www.gadsl.org

(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade

organisation representing the information and communications technology and consumer electronics), see www.eicta.org/index.php?id=995

→ issues → environment policy → chemicals → chemicals for electronics

(3) The quoted IEC standards are also released as EN standards with the same number and identical contents

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Superior Moisture Resistivity Vishay Beyschlag

Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com

Revision: 19-Nov-09 6

FUNCTIONAL PERFORMANCE

TESTS AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, generic specification

EN 140400, sectional specification

EN 140401-801, detail specification

The components are approved in accordance with the

IECQ-CECC-system, where applicable. The following table

contains only the most important tests. For the full test

schedule refer to the documents listed above. The testing

also covers most of the requirements specified by

EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068 and

under standard atmospheric conditions in accordance with

IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower category temperature, upper

category temperature; damp heat, long term, 56 days) is

valid (LCT = - 55 °C/UCT = 125 °C).

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on boards in

accordance with EN 140400, 2.3.3 unless otherwise

specified.

The requirements stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140401-801. However, some

additional tests and a number of improvements against those

minimum requirements have been included.

Derating

For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above

100

100- 55

Ambient Temperature in °C

180

Standard Mode

Power Mode

155

125050

Rated Power in %

Resistance Value

Current Noise

0.01

1 M

0.1

µV/V

100 k

10 k

1 k

MCS 0402 AT

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

100

Current noise A1 in accordance with IEC 60195

Current Noise

www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28785

7Revision: 19-Nov-09

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag Precision Thin Film Chip Resistor

Superior Moisture Resistivity

TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

STABILITY CLASS 0.25 OR BETTER (1)

Stability for product types:

MCS 0402 AT 47 Ωto 47 kΩ

MCT 0603 AT 47 Ωto 100 kΩ

MCU 0805 AT 47 Ωto 100 kΩ

MCA 1206 AT 47 Ωto 100 kΩ

4.5 - Resistance ± 0.1 % R

4.8.4.2 - Temperature

coefficient

At (20/- 55/20) °C and

(20/155/20) °C± 25 ppm/K; ± 15 ppm/K

4.25.1 -

Endurance at 70 °C:

Standard operation mode

U= or U = Umax.;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h

70 °C; 8000 h

± (0.1 % R +0.02Ω)

± (0.2 % R +0.02Ω)

Endurance at 70 °C:

Power operation mode

U= or U = Umax.;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h

70 °C; 8000 h

± (0.2 % R +0.02Ω)

± (0.4 % R +0.05Ω)

4.25.3 -

Endurance at

upper category

temperature

125 °C; 1000 h

155 °C; 1000 h

± (0.15 % R + 0.02 Ω)

± (0.3 % R + 0.02 Ω)

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C; 56 days;

(93 ± 3) % RH ± (0.1 % R +0.02Ω)

4.39 67 (Cy)

Damp heat,

steady state,

accelerated

(85 ± 2) °C

(85 ± 5) % RH

U= 0.1 x

≤ 100 V;

1000 h

± (0.5 % R + 0.05 Ω)

4.23 Climatic sequence:

± (0.25 % R +0.02 Ω)

4.23.2 2 (Ba) dry heat 125 °C; 16 h

4.23.3 30 (Db) damp heat, cyclic 55 °C; 24 h; > 90 % RH;

1 cycle

4.23.4 1 (Aa) cold - 55 °C; 2 h

4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C

4.23.6 30 (Db) damp heat, cyclic 55 °C; 5 days > 90 % RH;

5 cycles

4.23.7 - DC load U= ≤ Umax.; 1 min

-1 (Aa)

Storage at low

temperature - 55 °C; 2 h ± (0.05 % R +0.01Ω)

4.19 14 (Na) Rapid change of

temperature

30 min at - 55 °C and

30 min at 125 °C;

1000 cycles

± (0.25 % R +0.02 Ω)

4.13 - Short time overload;

standard operation mode

U= 2.5 x

≤ 2 × Umax.; 5 s ± (0.05 % R +0.01Ω)

4.27 -

Single pulse high

voltage overload;

standard operation mode

Severity no. 4:

U= 10 x

≤ 2 x Umax.;

10 pulses

± (0.25 % R +0.05Ω)

Note

(1) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their

respective test conditions.

P70 x R

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Superior Moisture Resistivity Vishay Beyschlag

Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com

Revision: 19-Nov-09 8

4.37 -

Periodic electric

overload;

standard operation mode

≤ 2 x Umax.;

0.1 s on; 2.5 s off;

1000 cycles

± (0.5 % R +0.05Ω)

4.40 - ESD

(Electro Static Discharge)

IEC 61340-3-1;

3 pos. + 3 neg.

(equivalent to MIL-STD-883,

Method 3015)

MCS 0402 AT: 500 V

MCT 0603 AT: 1000 V

MCU 0805 AT: 1500 V

MCA 1206 AT: 2000 V

± (0.5 % R +0.05Ω)

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude ≤ 1.5 mm or

≤ 200 m/s2; 6 h

± (0.05 % R +0.01Ω)

no visible damage

4.17.2 58 (Td) Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (≥ 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning (≥ 95 % covered);

no visible damage

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.05 % R +0.01Ω)

no visible damage

4.29 45 (XA) Component solvent

resistance

Isopropyl alcohol + 50 °C;

method 2 No visible damage

4.32 21 (Ue3) Shear (adhesion)

RR 1005M and

RR 1608M; 9 N No visible damage

RR 2012M and

RR 3216M; 45 N

4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R +0.01Ω)

no visible damage; no open circuit in bent position

4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown

4.35 - Flammability Needle flame test; 10 s No burning after 30 s

TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

STABILITY CLASS 0.25 OR BETTER (1)

Stability for product types:

MCS 0402 AT 47 Ωto 47 kΩ

MCT 0603 AT 47 Ωto 100 kΩ

MCU 0805 AT 47 Ωto 100 kΩ

MCA 1206 AT 47 Ωto 100 kΩ

15 x P70 x R

Document Number: 91000 www.vishay.com

Revision: 18-Jul-08 1

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Legal Disclaimer Notice

Vishay

All product specifications and data are subject to change without notice.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf

(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein

or in any other disclosure relating to any product.

Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any

information provided herein to the maximum extent permitted by law. The product specifications do not expand or

otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed

therein, which apply to these products.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this

document or by any conduct of Vishay.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless

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