1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
1A
1R
RE
2R
2A
2B
GND
VCC
1D
1Y
1Z
DE
2Z
2Y
2D
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
1A
1R
1DE
2R
2A
2B
GND
VCC
1D
1Y
1Z
2DE
2Z
2Y
2D
SN65C1167
SN75C1167, SN65C1168, SN75C1168
www.ti.com
SLLS159F MARCH 1993REVISED NOVEMBER 2009
DUAL DIFFERENTIAL DRIVERS AND RECEIVERS
Check for Samples: SN65C1167 SN75C1167 SN65C1168 SN75C1168
1FEATURES SN65C1167 . . . DB OR NS PACKAGE
Meet or Exceed Standards TIA/EIA-422-B and SN75C1167 . . . DB, N, OR NS PACKAGE
(TOP VIEW)
ITU Recommendation V.11
BiCMOS Process Technology
Low Supply-Current Requirements: 9 mA Max
Low Pulse Skew
Receiver Input Impedance . . . 17 kTyp
Receiver Input Sensitivity . . . ±200 mV
Receiver Common-Mode Input Voltage Range
of 7Vto7V
Operate From Single 5-V Power Supply
Glitch-Free Power-Up/Power-Down Protection SN65C1168 . . . N, NS, OR PW PACKAGE
Receiver 3-State Outputs Active-Low Enable SN75C1168 . . . DB, N, NS, OR PW PACKAGE
for SN65C1167 and SN75C1167 Only (TOP VIEW)
Improved Replacements for the MC34050 and
MC34051
DESCRIPTION
The SN65C1167, SN75C1167, SN65C1168, and SN75C1168 dual drivers and receivers are integrated circuits
designed for balanced transmission lines. The devices meet TIA/EIA-422-B and ITU recommendation V.11.
The SN65C1167 and SN75C1167 combine dual 3-state differential line drivers and 3-state differential line
receivers, both of which operate from a single 5-V power supply. The driver and receiver have active-high and
active-low enables, respectively, which can be connected together externally to function as direction control. The
SN65C1168 and SN75C1168 drivers have individual active-high enables.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1993–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN65C1167
SN75C1167, SN65C1168, SN75C1168
SLLS159F MARCH 1993REVISED NOVEMBER 2009
www.ti.com
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
SN75C1167N SN75C1167N
PDIP N Tube SN75C1168N SN75C1168N
SN75C1167NSR 75C1167
SOP NS Tape and reel SN75C1168NSR 75C1168
0°C to 70°C SN75C1167DBR CA1167
SSOP DB Tape and reel SN75C1168DBR CA1168
Tube SN75C1168PW
TSSOP PW CA1168
Tape and reel SN75C1168PWR
PDIP N Tube SN65C1168N SN65C1168N
SN65C1167NSR 65C1167
SOP NS Tape and reel SN65C1168NSR 65C1168
–40°C to 85°C SSOP DB Tape and reel SN65C1167DBR CB1167
Tube SN65C1168PW
TSSOP PW CB1168
Tape and reel SN65C1168PWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/sc/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
2Submit Documentation Feedback Copyright © 1993–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
2DE
12
1DE
4
14
13
2
1
10
11
6
7
1Y
1Z
1A
1B
2Y
2Z
2A
2B
15
3
9
5
1D
1R
2D
2R
2R
2D
1R
1D
RE
DE
5
9
3
15
4
12
2B
2A
2Z
2Y
1B
1A
1Z
1Y
7
6
11
10
1
2
13
14
SN65C1168, SN75C1168
SN65C1167/SN75C1167
SN65C1167
SN75C1167, SN65C1168, SN75C1168
www.ti.com
SLLS159F MARCH 1993REVISED NOVEMBER 2009
FUNCTION TABLES
ABC
Each Driver(1)
INPUT ENABLE OUTPUTS
D DE Y Z
H H H L
L H L H
X L Z Z
(1) H = high level, L = low level, X =
irrelevant, Z = high impedance
Each Receiver(1)
DIFFERENTIAL INPUTS ENABLE OUTPUT
AB RE R
VID 0.2 V L H
0.2 V < VID < 0.2 V L ?
VID 0.2 V L L
X H Z
Open L H
(1) H = high level, L = low level, ? = indeterminate, X = irrelevant,
Z = high impedance (off), Open = input disconnected or connected
driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
Copyright © 1993–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
EQUIVALENT OF A OR B INPUTEQUIVALENT OF DRIVER ENABLE INPUT
Input
VCC
VCC
Input
GND
GND
17 k
NOM
1.7 k
NOM
1.7 k
NOM
288 k
NOM
VCC (A)
or
GND (B)
TYPICAL OF EACH RECEIVER OUTPUTTYPICAL OF EACH DRIVER OUTPUT
GND
Output
VCC
GND
Output
VCC
SN65C1167
SN75C1167, SN65C1168, SN75C1168
SLLS159F MARCH 1993REVISED NOVEMBER 2009
www.ti.com
SCHEMATIC OF INPUTS
SCHEMATIC OF OUTPUTS
4Submit Documentation Feedback Copyright © 1993–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
SN65C1167
SN75C1167, SN65C1168, SN75C1168
www.ti.com
SLLS159F MARCH 1993REVISED NOVEMBER 2009
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range(2) –0.5 7 V
Driver –0.5 VCC + 0.5
VIInput voltage range V
A or B, Receiver –11 14
VID Differential input voltage range(3) Receiver –14 14 V
VOOutput voltage range Driver –0.5 7 V
IIK or IOK Clamp current range Driver ±20 mA
Driver ±150
IOOutput current range mA
Receiver ±25
ICC Supply current 200 mA
GND current 200 mA
TJOperating virtual junction temperature 150 °C
DB package 82
N package 67
θJA Package thermal impedance(4) (5) °C/W
NS package 64
PW package 108
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages values except differential input voltage are with respect to the network GND.
(3) Differential input voltage is measured at the noninverting terminal with respect to the inverting terminal.
(4) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIC Common-mode input voltage(1) Receiver ±7 V
VID Differential input voltage Receiver ±7 V
VIH High-level input voltage Except A, B 2 V
VIL Low-level input voltage Except A, B 0.8 V
Receiver 6
IOH High-level output current mA
Driver 20
Receiver 6
IOL Low-level output current mA
Driver 20
SN75C1167, SN75C1168 0 70
TAOperating free-air temperature °C
SN65C1167, SN65C1168 –40 85
(1) Refer to TIA/EIA-422-B for exact conditions.
Copyright © 1993–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
SN65C1167
SN75C1167, SN65C1168, SN75C1168
SLLS159F MARCH 1993REVISED NOVEMBER 2009
www.ti.com
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK Input clamp voltage II=18 mA 1.5 V
VIL = 0.8
VOH High-level output voltage VIH = 2 V, IOH =20 mA 2.4 3.4 V
V,
VIL = 0.8
VOL Low-level output voltage VIH = 2 V, IOL = 20 mA 0.2 0.4 V
V,
|VOD1| Differential output voltage IO= 0 mA 2 6 V
|VOD2| Differential output voltage (1) 2 3.1 V
Change in magnitude of differential
|VOD| ±0.4 V
output voltage RL= 100 , See Figure 1
VOC Common-mode output voltage ±3 V
Change in magnitude of common-mode
|VOC| ±0.4 V
output voltage VO= 6 V 100
IO(OFF) Output current with power off VCC = 0 V µA
VO=0.25 V 100
VO= 2.5 V 20
IOZ High-impedance-state output current µA
VO= 5 V 20
IIH High-level input current VI= VCC or VIH 1 µA
IIL Low-level input current VI= GND or VIL 1 µA
IOS Short-circuit output current(3) VO= VCC or GND, 30 150 mA
VI= VCC or GND 4 6
No load,
ICC Supply current (total package)(4) mA
Enabled VI= 2.4 or 0.5 V 5 3
CiInput capacitance 6 pF
(1) Refer to TIA/EIA-422-B for exact conditions.
(2) All typical values are at VCC = 5 V, and TA= 25°C.
(3) Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
(4) This parameter is measured per input, while the other inputs are at VCC or GND.
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Propagation delay time, high- to low-level R1 = R2 = 50 , R3 = 500 ,
tPHL 7 12 ns
output C1 = C2 = C3 = 40 pF, S1 is open,
See Figure 2
Propagation delay time, low- to high-level
tPLH 7 12 ns
output
tsk(p) Pulse skew 0.5 4 ns
trRise time R1 = R2 = 50 , R3 = 500 , 5 10 ns
C1 = C2 = C3 = 40 pF, S1 is open,
tfFall time 5 10 ns
SeeFigure 3
tPZH Output enable time to high level R1 = R2 = 50 , R3 = 500 , 10 19 ns
C1 = C2 = C3 = 40 pF, S1 is closed,
tPZL Output enable time to low level 10 19 ns
See Figure 4
tPHZ Output disable time from low level R1 = R2 = 50 , R3 = 500 , 7 16 ns
C1 = C2 = C3 = 40 pF, S1 is closed,
tPLZ Output disable time from high level 7 16 ns
See Figure 4
(1) All typical values are at VCC = 5 V, and TA= 25°C.
6Submit Documentation Feedback Copyright © 1993–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
SN65C1167
SN75C1167, SN65C1168, SN75C1168
www.ti.com
SLLS159F MARCH 1993REVISED NOVEMBER 2009
RECEIVER SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Positive-going input threshold voltage, differential
VIT+ 0.2 V
input
Negative-going input threshold voltage, differential
VIT– 0.2(2) V
input
Vhys Input hysteresis (VIT+ VIT–) 60 mV
VIK Input clamp voltage, RE SN75C1167 II=18 mA 1.5 V
VOH High-level output voltage VID = 200 mV, IOH =6 mA 3.8 4.2 V
VOL Low-level output voltage VID =200 mV, IOL = 6 mA 0.1 0.3 V
High-impedance-state output
IOZ SN75C1167 VO = VCC or GND ±0.5 ±5 µA
current VI= 10 V 1.5
IILine input current Other input at 0 V mA
VI=10 V 2.5
IIEnable input current, RE SN75C1167 VI= VCC or GND ±1 µA
riInput resistance VIC =7 V to 7 V, Other input at 0 V 4 17 k
VI= VCC or GND 4 6
ICC Supply current (total package) No load, Enabled mA
VIH = 2.4 V or 0.5 V(3) 5 9
(1) All typical values are at VCC = 5 V and TA= 25°C.
(2) The algebraic convention, where the less positive (more negative) limit is designated as minimum, is used in this data sheet for
common-mode input voltage and threshold voltage levels only.
(3) Refer to TIA/EIA-422-B for exact conditions.
Switching Characteristics
over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
tPLH Propagation delay time, low- to high-level output 9 17 27 ns
See Figure 5
tPHL Propagation delay time, high- to low-level output 9 17 27 ns
tTLH Transition time, low- to high-level output 4 9 ns
VIC = 0 V, See Figure 5
tTHL Transition time, high- to low-level output 4 9 ns
tPZH Output enable time to high level 13 22 ns
tPZL Output enable time to low level 13 22 ns
RL= 1 kW, See Figure 6
tPHZ Output disable time from high level 13 22 ns
tPLZ Output disable time from low level 13 22 ns
(1) Measured per input while the other inputs are at VCC or GND
(2) All typical values are at VCC = 5 V and TA= 25°C.
Copyright © 1993–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
VOC
VOD2
RL
2
RL
2
50% 50%
50%
50%
tPLH
tPHL
tPHL
tPLH
VOLTAGE WAVEFORMS
Input
(see Note B) 1.3 V
1.3 V
C1
C2
C3
R3
R1
R2
Input 1.5 V
S1
See Note A
TEST CIRCUIT
1.3 V
1.3 V
tsk(p)
tsk(p)
Y
Z1.3 V
1.3 V
Y
ZVOH
VOL
3 V
0 V
VOH
VOL
C2
VOLTAGE WAVEFORMS
trtf
0 V
3 V
10%
90%
C1
C3
R3
R1
R2
Input 1.5 V
S1
See Note A
TEST CIRCUIT
10%
90%
Input
(see Note B)
Differential
Output
V
OD
SN65C1167
SN75C1167, SN65C1168, SN75C1168
SLLS159F MARCH 1993REVISED NOVEMBER 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Test Circuit, VOD and VOC
A. C1, C2, and C3 include probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, 50% duty cycle, tr= tf
6 ns.
Figure 2. Driver Test Circuit and Voltage Waveforms
C. C1, C2, and C3 include probe and jig capacitance.
D. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, 50% duty cycle, tr= tf
6 ns.
Figure 3. Driver Test Circuit and Voltage Waveforms
E. C1, C2, and C3 include probe and jig capacitance.
F. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, 50% duty cycle, tr= tf
6 ns.
8Submit Documentation Feedback Copyright © 1993–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
1.5 V
VOH
VOL
1.5 V
2 V
0.8 VVOL + 0.3 V
tPZH
tPHZ
tPZL
tPLZ
VOLTAGE WAVEFORMS
Input DE
3 V
0 V
1.5 V1.3 V
C1
C2
C3
R3
R1
R2
0 V
or
3 V
1.5 V
S1
See Note A
TEST CIRCUIT
VOL 0.3 V
Pulse
Generator
50
See Note B
DE
Output
Output
SN65C1167
SN75C1167, SN65C1168, SN75C1168
www.ti.com
SLLS159F MARCH 1993REVISED NOVEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 4. Driver Test Circuit and Voltage Waveforms
G. CLincludes probe and jig capacitance.
H. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, 50% duty cycle, tr= tf
6 ns.
Figure 5. Receiver Test Circuit and Voltage Waveforms
I. CLincludes probe and jig capacitance.
J. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, 50% duty cycle, tr= tf
6 ns.
Figure 6. Receiver Test Circuit and Voltage Waveforms
Copyright © 1993–2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): SN65C1167 SN75C1167 SN65C1168 SN75C1168
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN65C1167NSLE OBSOLETE SO NS 16 TBD Call TI Call TI
SN65C1167NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1167NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1167NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN65C1168NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN65C1168NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65C1168PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1167DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1167DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1167DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1167N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN75C1167NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN75C1167NSLE OBSOLETE SO NS 16 TBD Call TI Call TI
SN75C1167NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1167NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168N ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 10-Nov-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
(RoHS)
SN75C1168NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN75C1168NSLE OBSOLETE SO NS 16 TBD Call TI Call TI
SN75C1168NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75C1168PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Nov-2009
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 10-Nov-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN65C1167NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN65C1168NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN65C1168PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN75C1167DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN75C1167NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN75C1168DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN75C1168NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN75C1168PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65C1167NSR SO NS 16 2000 367.0 367.0 38.0
SN65C1168NSR SO NS 16 2000 367.0 367.0 38.0
SN65C1168PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN75C1167DBR SSOP DB 16 2000 367.0 367.0 38.0
SN75C1167NSR SO NS 16 2000 367.0 367.0 38.0
SN75C1168DBR SSOP DB 16 2000 367.0 367.0 38.0
SN75C1168NSR SO NS 16 2000 367.0 367.0 38.0
SN75C1168PWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated