STECTM Embedded USB Flash Module 1GB to 16GB Capacities SLUFMxxxU2TU(I)-y USB Solid-State Flash Disk General Description Capacity: 1GB - 16GB STECTM Embedded USB Flash Module provides non-volatile, solid-state storage in a compact design, making it perfectly suited for embedded applications. The standard USB 2.0 interface provides designers with a true plug-n-play storage device, allowing for short design cycles and fast time to market. USB 2.0 Compliant Form Factors: Horizontal Mount Standard 2x5 or Hirose 9-Pin Connector 2x Planar TSOP Flash or 2x Stacked TSOP Flash High Reliability: Advanced Wear-Leveling BCH ECC Engine corrects up to 16 bits errors per 1 Kbyte Automatic Bad Block Management Single Level Cell (SLC) NAND Flash Memory Unique Serial Number Commercial and Industrial Operating Temperatures Available The embedded USB flash module is manufactured with STEC`s state-of-the-art, USB 2.0 flash memory controller, providing high data reliability and endurance. Flash management software embedded in the controller emulates a hard disk, enabling read/write operations that are identical to a standard, sector-based hard disk. Sophisticated wear leveling algorithms ensures greater flash endurance, while automatic bad block management and a built-in ECC Engine ensure the highest data reliability. Based on a BCH error correct algorithm, the ECC engine can correct up to 16-bit errors per 1 Kbyte. The embedded USB flash module is available with a Standard 2x5 connector (2.54mm pitch) or a Hirose 9-pin connector. The embedded USB flash module with its high performance, high reliability and low cost per megabyte is the product of choice in embedded applications, such as Gaming, POS Workstations, Networking Equipment and Industrial PCs. STEC offers value-added services to OEM customers, such as customized form factors and test solutions, custom firmware, controlled Bill of Materials, customerspecific labeling and serialization. Ordering Information: Embedded USB Flash Module Part Number Flash Placement Capacity RoHS-6 Compliant SLUFM1GU2TU(I)-y 2x Planar TSOP Flash 1 GB www.stec-inc.com SLUFM2GU2TU(I)-y 2x Planar TSOP Flash 2 GB SLUFM4GU2TU(I)-y 2x Planar TSOP Flash 4 GB SLUFM8GU2TU(I)-y 2x Planar TSOP Flash 8 GB SLUFM16GU2TU(I)-A 2x Stacked TSOP Flash 16 GB Legend: SL = STEC standard finished product UFM = Embedded USB flash module form factor 1G/2G/4G/8G/16G = 1GB / 2GB/ 4GB/ 8GB / 16GB capacity U2T = STECs USB flash memory controller (2 Generation) U = RoHS-6 compliant Part numbers without (I) = Commercial temperature range (0C to 70C) I = Industrial temperature range (-40C to 85C) (y) = A for Standard 2x5 connector nd ( y) = C for Hirose 9-pin connector Note: The 16GB embedded USB flash module is available with standard connector only. SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module Table of Contents 1.0 Introduction .................................................................................................................... 3 2.0 Product Specifications................................................................................................... 4 2.1 2.2 2.3 2.4 2.5 3.0 Mechanical Dimensions .......................................................................................................... 4 2.1.1 Standard 2x5 Connector Form Factor .......................................................................... 4 2.1.2 Hirose 9-Pin Connector Form Factor ........................................................................... 5 Pin Assignment ....................................................................................................................... 6 2.2.1 Standard 2x5 Connector .............................................................................................. 6 2.2.2 Hirose 9-Pin Connector ................................................................................................ 6 Signal Description ................................................................................................................... 6 Performance ............................................................................................................................ 6 Power Consumption ................................................................................................................ 7 Theory of Operation ....................................................................................................... 7 3.1 3.2 Block Diagram ......................................................................................................................... 7 3.1.1 Controller Embedded Components .............................................................................. 7 3.1.2 Controller External Components .................................................................................. 8 Flash Management.................................................................................................................. 8 3.2.1 Bad Block Management ............................................................................................... 8 3.2.2 Wear Leveling .............................................................................................................. 8 3.3 3.4 4.0 Environmental Specifications ......................................................................................10 4.1 4.2 4.3 4.4 4.5 4.6 5.0 3.2.3 Error Correction ............................................................................................................ 9 OS and Boot Support .............................................................................................................. 9 3.3.1 Using USB Flash Module with XP Embedded.............................................................. 9 Unique Serial Number ........................................................................................................... 10 Recommended Operating Conditions ................................................................................... 10 Reliability ............................................................................................................................... 10 Shock, Vibration, and Humidity ............................................................................................. 10 Electrostatic Discharge (ESD) ............................................................................................... 11 Mean Time Between Failure (MTBF) .................................................................................... 11 Standards Compliance .......................................................................................................... 11 Electrical Specifications ...............................................................................................12 5.1 5.2 5.3 Absolute Maximum Ratings .................................................................................................. 12 DC Characteristics ................................................................................................................ 12 AC Characteristics................................................................................................................. 13 6.0 SCSI Command List ......................................................................................................13 7.0 Evaluating USB Flash Module ......................................................................................14 8.0 Product Marking ............................................................................................................15 9.0 Programmed Vendor and Product Names ...................................................................17 10.0 STEC's Contact Information .........................................................................................18 10.1 10.2 Worldwide Headquarters ....................................................................................................... 18 Worldwide Locations ............................................................................................................. 18 11.0 Revision History ............................................................................................................19 61000-07022-108, September 2012 2 SLUFMxxxU2TU(I)-y Data Sheet 1.0 STECTM Embedded USB Flash Module Introduction This datasheet includes the following sections: Product Specifications covers the most referenced specifications, such as mechanical dimensions, ball assignment, signal description, and performance. Theory of Operation explains the embedded USB flash module block diagram, and flash management features. Environmental Specifications characterizes the recommended operating conditions, reliability parameters and shock, vibration and humidity parameters. Electrical Specifications describes the absolute maximum ratings and AC/DC characteristics. Evaluating USB Flash Module describes how designers can evaluate the embedded USB flash module if there is no Standard 2x5 or Hirose 9-pin connector yet available on the hardware design. Product Marking describes the marking on the embedded USB flash module. Figure 1: USB Flash Module 61000-07022-108, September 2012 3 SLUFMxxxU2TU(I)-y Data Sheet 2.0 Product Specifications 2.1 Mechanical Dimensions STECTM Embedded USB Flash Module 2.1.1 Standard 2x5 Connector Form Factor Table 1 and Figure 2 show the mechanical dimensions of the embedded USB flash module with Standard 2x5 connector. Table 1: Mechanical Dimensions, Standard 2x5 Connector Height Parameter Value Length 38.00 0.15 mm (1.496 . 0.006 in) Width 23.00 0.15 mm (0.906 0.006 in) 2x Planar TSOP Flash 10.27 mm (0.404 in) max 2x Stacked TSOP Flash 11.16 mm (0.439 in) max Units: mm (inches) Figure 2: Mechanical Dimensions, Standard 2x5 Connector 61000-07022-108, September 2012 4 SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module 2.1.2 Hirose 9-Pin Connector Form Factor Table 2 and Figure 3 show the mechanical dimensions of the USB Flash Module with Hirose 9-pin connector. Table 2: Mechanical Dimensions, Hirose 9-pin Connector Parameter Value Length 38.00 0.15 mm (1.496 . 0.006 in) Width 23.00 0.15 mm (0.906 0.006 in) Height 5.97 mm (0.235 in) max Units: mm (inches) Figure 3: Mechanical Dimensions, Hirose 9-pin Connector 61000-07022-108, September 2012 5 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 2.2 Pin Assignment 2.2.1 Standard 2x5 Connector Table 3: Standard 2x5 Pin Assignment Pin Number Signal Name Pin Type Pin Number Signal Name Pin Type 1 VBUS Power 6 NC I/O 2 NC -- 7 GND Ground 3 D- I/O 8 NC -- 4 NC -- 9 Key Blocked Pin 5 D+ I/O 10 Reserved -- 2.2.2 Hirose 9-Pin Connector Table 4: Hirose 9-Pin Assignment Pin Number Signal Name Pin Type Pin Number Signal Name Pin Type 1 NC -- 6 GND Ground 2 NC -- 7 D+ I/O 3 Reserved -- 8 D- I/O 4 NC -- 9 GND Ground 5 VBUS Power -- 2.3 Signal Description Table 5: Signal Description Signal Name Type Pin Number (Standard 2x5) Pin Number (Hirose 9-pin) VBUS Power 1 5 Bus voltage supply from source 2.4 Description D- I/O 3 8 Data line - D+ I/O 5 7 Data line + GND Ground 7 6, 9 NC Open 2, 4, 6, 8, 1, 2, 4 Key Open 9 -- Alignment pin Reserved -- 10 3 Host should leave Not Connected Ground No Connect Performance The Industrial Grade embedded USB flash module is USB 2.0 high-speed (480Mb/sec) and USB 1.1 fullspeed (12Mb/sec) compliant. Measured performance for high-speed can be found in Table 6. Table 6: Read/Write Performance Parameter Value Sustained Read up to 30 MB/sec Sustained Write up to 20 MB/sec 61000-07022-108, September 2012 6 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 2.5 Power Consumption The power consumption currents listed in Table 7 are for reference only. Power consumption may change according to flash memory used. Table 7: Power Consumption Power State Symbol Power Consumption for 1GB-8GB Capacities (Typical) Power Consumption for 16GB Capacity (Typical) Unit Normal INORMAL 70.6 70.8 mA Suspend ISUSPEND 0.8 0.9 mA Sleep ISLEEP 0.8 0.9 mA Read IREAD 108.3 114.5 mA Write IWRITE 160.9 167.3 mA 3.0 Theory of Operation 3.1 Block Diagram The embedded USB flash module uses STEC`s proprietary USB flash memory controller, and is combined with SLC NAND flash for optimal device reliability. The controller`s firmware supports the latest NAND flash technology from multiple vendors, and is optimized for the highest performance and reliability. The controller consists of the functional blocks shown in Figure 4 and described below. Figure 4: Controller block diagram 3.1.1 Controller Embedded Components Microcontroller, the hardware backbone for the USB flash memory controller algorithm. USB 2.0 Interface Controller with high speed (480 Mbps) device function. This block interfaces with the host system via the USB interface. Dual Channel Flash Interface Controller that serves as the interface to the NAND flash components. It supports all the major NAND flash memory manufacturers. Flash Storage Management Algorithm Block is responsible for the flash management, including wear leveling, bad block management, and Error Detection and Correction. ECC block is responsible for on-the-fly error correction. Sector Buffer for optimized performance. SRAM for running controller firmware fast and efficient. ROM for storing controllers boot code. 61000-07022-108, September 2012 7 SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module 3.1.2 Controller External Components In addition to the functional blocks shown in Figure 4, the embedded USB flash module has the following external components: SLC NAND Flash for the most reliable data storage. Crystal Oscillator 12Mhz, as the main clock source. 3.2 Flash Management Since the embedded USB flash module provides a standard USB interface to the host, no software integration is required, providing the shortest time-to-market for design engineers. The firmware of the embedded USB 2.0 controller contains STEC`s advanced flash memory management algorithms to ensure the most optimum device performance, reliability and endurance. It was designed to maximize the benefits of flash memory, while at the same time overcoming inherent NAND flash limitations. Implemented in firmware are the below features: Flash file system management Bad-block management Wear-leveling Performance optimization 3.2.1 Bad Block Management Inherent to NAND flash technology are areas (blocks) on the media that cannot be used for storage because of their high error rate. These so-called bad blocks are already identified by the flash vendor during manufacturing, but can also be accumulated over time during device operation. The USB 2.0 controller contains a table that lists all the bad blocks on the device (Bad Block Table), and automatically maps out these blocks upon system initialization. During device operation it ensures that newly accumulated bad blocks are also mapped out and added to the Bad Block Table. Bad block management is 100% transparent to the host application, which will not be aware of the location or existence of bad blocks on the media. 3.2.2 Wear Leveling The SLC NAND flash devices that are being used in the USB flash module are rated for 100,000 Write/Erase cycles per block for 43nm flash and 60,000 Write/Erase cycles per block for 32nm flash. This means that after the rated erase cycles, the erase block has a higher probability for errors than the error rate that is typical to the flash. While standard flash write/erase cycles may be good for consumer data storage, such as digital cameras, MP3 players, etc., it is not sufficient for industrial and embedded applications where data is constantly written to the device and long product life is required. For example, operating systems that use a file system, will update the File Allocation Table (FAT) every time a write is done to the device. Without any wear leveling in place, the area on the flash where the FAT table is located would wear out faster than other areas, reducing the lifetime of the entire flash device. To overcome this limitation, the flash management algorithm needs to make sure that each block in the device ages, i.e. is worn out, at the same rate. The built-in wear leveling scheme makes sure that with every write to the flash, the youngest block is used. This ensures that the full flash media is used uniformly, so that one area of the flash will not reach the endurance limits prematurely before other areas. 61000-07022-108, September 2012 8 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 3.2.3 Error Correction The USB 2.0 Interface Controller implements an advanced Error Correction scheme, based on the BCH error correct algorithm. The ECC engine can correct up to 16 bits per 1 KByte. To ensure the fastest performance, correction is done on-the-fly, in hardware only. Each time the host application writes a sector of 512 bytes to the embedded USB flash module, a unique ECC signature is created by the ECC engine and written together with the data to the flash. When the data is read back by the host, the ECC engine creates again the unique ECC signature. It will then compare the original written signature with the newly created signature, and sets an error flag if the two signatures are not the same. Correction of the data is done on-the-fly when the error flag is set, and the data presented to the host will be the same as the original written data. This powerful Error Correction scheme results in 14 an Uncorrectable Bit Error Rate (UBER) of less than 1 in 10 bits, read. 3.3 OS and Boot Support The embedded USB flash module can be used as the OS boot and main storage device for most Microsoft Operating Systems, as well as most embedded Operating Systems, as listed in Table 8 When used as the OS boot and main storage device, the embedded USB flash module is recognized as the fixed hard drive in the system. Table 8: Supported Operating Systems Operating System Secondary Storage Boot and Main Storage Version Windows Vista/7 Conditional Windows XP Pro Windows XP Embedded Service Pack 2007 Windows CE 4.2 and 5.0 Windows for POS (WEPOS) - VxWorks 6.1 and up Linux Kernel 2.4 and up Note: When using the embedded USB flash module as the OS boot device, it should be verified that the system BIOS supports booting from a USB device. Please contact your BIOS vendor to verify this. 3.3.1 Using USB Flash Module with XP Embedded When using embedded USB flash module with Windows XP Embedded, it is recommended that the Enhanced Write Filter (EWF) feature is implemented. The EWF intercepts calls at the sector level, and thereby eliminates many file system updates/writes to the flash. Windows XP Embedded Service Pack 2 Feature Pack 2007 introduced an additional write protect feature, called File Based Write Filter (FBWF). The new FBWF function write-protects embedded devices at the file level, in contrast to the EWF, which has been protecting devices at the sector level. FBWF and EWF, combined with the built-in wear leveling algorithm, ensure that the maximum life span of the flash device is achieved. 61000-07022-108, September 2012 9 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 3.4 Unique Serial Number During manufacturing stage, a unique serial number is written to the embedded USB flash module that includes a date code related to the time of manufacturing. The serial number uses the following format: [AA][B][C][DD][EE][FFFF][GGGG]. Table 9 below describes the parameters of the serial number. Table 9: Unique Serial Number format Symbol Parameter AA STEC Reserved (86h) B Year (hex) C Month (hex) DD Day (hex) EE Production PC Number (hex) FFFF Last 2 Bytes of MAC Address GGGG Serial Number, Incremental (hex) The Serial Number can be obtained through Windows Device Manager or Linux lsusb utility. 4.0 Environmental Specifications 4.1 Recommended Operating Conditions Table 10: Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Commercial Operating Temperature TA1 0 25 70 C 4.2 Industrial Operating Temperature TA2 -40 - 85 C Bus Voltage (5V) VBUS(5V) 4.75 5.0 5.25 V Reliability Table 11: Reliability Parameter Value Uncorrectable Bit Error Rate (UBER) <1 uncorrectable error per 10 14 bits read Endurance 1GB-4GB 8GB-16GB Data Retention Up to seven (7) full drive capacity writes per day for three (3) years Up to five (5) full drive capacity writes per day for three (3) years Fresh: From Life End: 10 years at 40C 1 year at life end at 40C Note: Endurance varies with usage, above numbers assumes a mix of 50% sequential and 50% unaligned random 4KB writes. All parts covered under 3-year warranty. Data Retention listed as specified by NAND flash manufacturer. 61000-07022-108, September 2012 10 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 4.3 Shock, Vibration, and Humidity Table 12: Shock, Vibration & Humidity 4.4 Parameter Value Shock 1500G Peak, 0.5m pulse duration, 5 pulses, 6 axes (per JESD22-B110) Vibration 20G Peak, 20-2000 Hz, 4 cycles per direction (X, Y and Z) (per JESD22-B103) Humidity 85C, 85% RH, Vmax for 500 hrs (per JESD22-A101) Electrostatic Discharge (ESD) The embedded USB flash module has been tested and approved for immunity from ESD under the conditions described in Table 13 below. Table 13: ESD Rating for USB Flash Module 4.5 ESD Type Value (KV) Air 2, 4, 8 Contact 2, 4 Mean Time Between Failure (MTBF) STEC estimates the Mean Time Between Failure (MTBF) using a prediction methodology based on reliability data for the individual components in the embedded USB flash module. Table 14 below summarizes the prediction results for the embedded USB flash module, based on the following two methodologies: Telcordia Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment. MIL-HNBK-217 The analysis was performed using Relex Software. Table 14: USB Flash Module MTBF Product Condition MTBF (hours) SLUFM4GU2TU-A Telcordia SR-332, GB, 25C, MIL-HNBK-217 >8,000,000 SLUFM8GU2TU-A Telcordia SR-332, GB, 25C, MIL-HNBK-217 >7,000,000 4.6 Standards Compliance The embedded USB flash module complies with the following standards: CE - EN 55022/55024 FCC - Class B for Information Technology UL 60950 RoHS-6 USB 2.0 - Mass Storage Class 61000-07022-108, September 2012 11 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 5.0 Electrical Specifications 5.1 Absolute Maximum Ratings Operation not guaranteed at extreme corner cases. Table 15: Absolute Maximum Ratings Parameter Symbol Value Unit Power Supply Voltage Relative to Ground VBUS -0.3 to 5.5 V Voltage on D+ and D- Relative to Ground VDATA -0.3 to 3.6 V Ambient Operating Temperature (Commercial) TA1 0 to +70 C Ambient Operating Temperature (Industrial) TA2 -40 to +85 C Storage Temperature Tstg -40 to +85 C 5.2 DC Characteristics Measurements at Recommended Operating Conditions, unless otherwise specified. Table 16: DC Characteristics for Full-Speed Operation (TA=25C, Vdd=5V, Vss=0V) Parameter Symbol Supply Voltage VBUS Test conditions Min Typ Max Unit 4.75 5 5.25 V Input LOW Voltage VIL - - 0.8 V Input HIGH Voltage VIH 2.0 - - V Output LOW Voltage VOL RL of 1.5k to 3.6V - - 0.3 V Output HIGH Voltage VOH RL of 15k to GND 2.8 - 3.6 V Output Signal Crossover Voltage VCRS 1.3 - 2.0 V Table 17: DC Characteristics for High-Speed Operation (TA=25C, Vdd=5V, Vss=0V) Parameter Symbol Test conditions Min Typ Max Unit Supply Voltage VBUS 4.75 5 5.25 V High Speed Idle Level VHSOI -10 - 10 mV High Speed Data Signaling High VHSOH 360 - 440 mV High Speed Data Signaling Low VHSOL -10 - 10 mV Chirp J Level (differential Voltage) VCHIRPJ 0.7 - 1.1 V Chirp K Level (differential Voltage) VCHIRPK -0.9 - -0.5 mV 61000-07022-108, September 2012 12 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 5.3 AC Characteristics Measurements at Recommended Operating Conditions, unless otherwise specified. Table 18: AC Characteristics Full Speed Parameter Symbol Min Typ Max Unit Rise Time TFR 4 - 20 ns Fall Time TFF 4 - 20 ns Differential Rise and Fall Time Matching TFRFM 90 111.11 % Driver Output Resistance ZDRV 28 44 - Table 19: AC Characteristics High Speed Parameter Symbol Min Typ Max Unit Rise Time (10%~90%) THSR 500 - - ps Fall Time (10%~90%) THSF 500 - - ps Driver Output Resistance ZHSDRV 40.5 - 49.5 6.0 SCSI Command List Table 20: SCSI Command List Command List OpCode RBC SPC-2 SPC-3 INQUIRY 12h MODESENSE(6) 1Ah MODESENSE(10) 5Ah - PREVENT/ALLOW MEDIUM REMOVAL 1Eh READ(10) 28h - - READ CAPACITY 25h - - REQUEST SENSE 03h - START STOP UNIT 1Bh - - TEST UNIT READY 00h WRITE(10) 2Ah - - VERIFY(10) 2Fh - - SYNC CACHE 35h - - 61000-07022-108, September 2012 13 SLUFMxxxU2TU(I)-y Data Sheet 7.0 STECTM Embedded USB Flash Module Evaluating USB Flash Module Adapters are available for customers that do not have the hardware layout ready for the embedded USB flash module. The adapter shown in Figure 5 uses a Standard 2x5 connector and enables inserting the embedded USB flash module into a standard USB port on a desktop or laptop PC. Inquire for adapters that use the Hirose9-pin connector. Figure 5: USB Flash Module Adapter The adapters can be ordered with the following ordering information: SLUFDM-2x5-ADPT-A for modules with Standard 2x5 connector SLUFDM-ADPT-C for modules with Hirose 9-pin connector (preliminary, inquire for availability) 61000-07022-108, September 2012 14 SLUFMxxxU2TU(I)-y Data Sheet 8.0 STECTM Embedded USB Flash Module Product Marking A manufacturing label is applied to the finished product. The label`s post-printed information is described in the tables below, and label is shown in Figure 6. Table 21: Label Post Printed Fields Customer P/N (Human Readable) Customer P/N (Bar Code) STEC Item No. (BOM Assembly No.) STEC P/N Mfg. Date Code (Kanban ID) Optional Optional See Table 22 As listed in Ordering Information See Table 23 Mfg's Logo Capacity As Listed in Ordering Information Table 22: BOM Assembly Number Information BOM Assembly Number (Format: ppp00-0xxxx-yyzT(C/I)U) Description ppp00 STEC designation for OEM Flash products (ppp is 940 for standard, or customer prefix for custom) 0xxxx PCB number yy Product Revision z Capacity Designator (Randomly assigned per PCB number based on designator availability) T Model Revision C, I Commercial and Industrial Operating Temperature U RoHS Compliant Table 23: Kanban ID Information Kanban ID yymmdd-XXX-xxx Description yymmdd Date code of manufacturing XXX SMT Line at which the part was manufactured xxx lot code 61000-07022-108, September 2012 15 SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module Figure 6: Label Specification 61000-07022-108, September 2012 16 SLUFMxxxU2TU(I)-y Data Sheet 9.0 STECTM Embedded USB Flash Module Programmed Vendor and Product Names The embedded USB flash module can be manufactured with standard or customer-specific Vendor and Product Names. Table 24 lists the standard names for USB Flash Module. The names can be displayed by the OS, for example, Windows XP displays the names in the notifications area in the right corner of the screen the first time the module is installed. Windows Device Manager and the properties of the USB Flash Module also can display the names Table 24: STEC Standard USB Vendor and Product Names Parameter Value Vendor Name STEC Product Name STEC USB 2.0 61000-07022-108, September 2012 17 STECTM Embedded USB Flash Module SLUFMxxxU2TU(I)-y Data Sheet 10.0 STEC's Contact Information 10.1 Worldwide Headquarters STEC, Inc. Headquarters STEC, Inc. Sunnyvale 3001 Daimler Street 640 W. California Ave. Ste. 200 Santa Ana, California 92705 USA Sunnyvale, California 94086 USA General Support: (949) 476-1180 Telephone: (949) 476-1180 Fax: (949) 476-1209 Fax: (408) 737-2554 10.2 Worldwide Locations STEC Technology Sdn Bhd STEC, Inc. China Plot 107 Bayan Lepas Industrial Park RM1805, 18F Bund Centre Phase 4 222 Yan An Rd. East 11900 Penang, Malaysia HangPu District Shanghai 200002 Telephone: +60-48-887-888 P.R. China Telephone: +86-21-6132-3892 Ext. 629 STEC, Inc. Taiwan STEC, Inc. Europe RM1101, 11F, No. 495 Via del Caravaggio, 3 Guang-Fu S. Rd. 20100 Milano Taipei, Taiwan Italy Telephone: +88-63-573-3233 Telephone: +39-02-479-56-213 STEC India Pvt. Ltd. STEC, Inc. Japan 702 - IRIZ, 7 TH Floor Shinyurigaoka-City Building 4-407 S.N. 134/2/1/1 and 134 1-1-1, Manpukuji, Aso-ku, Kawasaki-shi CTS No. 2344 Kanagawa-ken 215-0004, Japan Baner - Pashan Link Road Telephone: +81-44-959-2883 Pune - 411 008 Telephone: +91-20-4678 0681 61000-07022-108, September 2012 18 SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module 11.0 Revision History Revision Date Description -101 02/15/2011 Preliminary release. -102 02/23/2011 T designator added to BOM Assembly Number. Extended changed to Industrial Temperature. -103 04/08/2011 UBER, Endurance, and ECC Engine corrected (paper error only). -104 06/07/2011 Logo updated. 1-High replaced by Planar when describing flash placement. Preliminary notice removed. -105 07/07/2011 Product Marking section updated. -106 05/31/2012 Endurance removed. -107 09/10/2012 Endurance added. Data retention updated. Format updated. Trademarks clarified. Contact Information updated. ECC engine statement corrected. Reserved pin identified. OS Boot support for Vista and 7 is conditional. -108 09/21/2012 16GB Industrial Temperature added (Ordering Information and note on first page). 61000-07022-108, September 2012 19 SLUFMxxxU2TU(I)-y Data Sheet STECTM Embedded USB Flash Module DISCLAIMER OF LIABILITY STEC Inc. reserves the right to make changes to specifications and product descriptions such as but not limited to numbers, parameters and other technical information contained herein without notice. Please contact the STEC Inc. sales office to obtain the latest specifications. STEC Inc. grants no warranty with respect to this datasheet, neither explicit or implied, and is not liable for direct or indirect damages. Some states do not grant the exclusion of incidental damages and as such this statement may not be valid in such states. The provisions of the datasheet do not convey to the purchaser of the device any license under any patent rights or other intellectual property rights of STEC Inc. or others. EXPORT ADMINISTRATION REGULATIONS The information provided may be subject to United States Export Controls. Such information should not be downloaded or exported (i), into (or to a national or resident of) Cuba, Iraq, Libya, North Korea, Iran, Syria, or any other country to which the United States has embargoed goods; or given to (ii), anyone on the United States Treasury Department`s list of Specially Designated Nationals or the U.S. Commerce Department`s Table of Deny Orders. By using the information, you represent and warrant that you are not located in, under the control of, or a national or resident of any such country or on any such list. TRADEMARKS STEC, the STEC logo, and The SSD Company are either registered trademarks or trademarks of STEC, Inc. in the United States and certain other countries. All other trademarks or brand names referred to herein are the property of their respective owners. COPYRIGHT NOTICE Copyright (c) 2012 by STEC Inc. All rights reserved. Information contained in this document, including but not limited to any instructions, descriptions and product specifications, is considered proprietary and confidential to STEC, Inc. and shall not be modified, used, copied, reproduced or disclosed in whole or in part, in any form or by any means, electronic or mechanical, for any purpose, without the written consent of STEC Inc. 61000-07022-108, September 2012 20