© Semiconductor Components Industries, LLC, 2009
January, 2009 − Rev. 17
1Publication Order Number:
MC33275/D
MC33275, NCV33275
300 mA, Low Dropout
Voltage Regulator
The MC33275 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount
packages. These devices feature a very low quiescent current and are
capable of supplying output currents up to 300 mA. Internal current
and thermal limiting protection are provided by the presence of a short
circuit at the output and an internal thermal shutdown circuit.
Due to the low input−to−output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
Features
•Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA,
and 260 mV at IO = 300 mA
•Extremely Tight Line and Load Regulation
•Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
•Internal Current and Thermal Limiting
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
•Pb−Free Packages are Available
Applications
•Battery Powered Consumer Products
•Hand−Held Instruments
•Camcorders and Cameras
Figure 1. Simplified Block Diagram
Vin
Thermal &
Anti−sat
Protection
54 K
Rint
This device contains 41 active transistors
1.23 V
V. Ref.
Vout
GND
LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
SOIC−8
D SUFFIX
CASE 751
SOT−223
ST SUFFIX
CASE 318E
4
1
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 10 of this data sheet.
xx = Voltage Version
A = Assembly Location
L = Wafer Lot
Y = Year
W, WW = Work Week
G or G = Pb−Free Device
(Note: Microdot may be in either location)
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MARKING
DIAGRAMS
3
1
3
4DPAK−3
DT SUFFIX
CASE 369A
1
275xxG
ALYWW
1
8
DFN−8, 4x4
MN SUFFIX
CASE 488AF
275xx
ALYWG
G
1
275xx
ALYWG G
1
8
1
AYW
275xxG
G
1
MC33275, NCV33275
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2
PIN CONNECTIONS
GND
Vin Vout
4
123
GND
GND
Vin Vout
4
123
GND
Input
GND
GND
N/C
Output
GND
GND
N/C
Pins 4 and 5 Not Connected
MC33275ST
1
2
3
4
8
7
6
5
MC33275D
MC33275DT
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
Ç
Ç
Ç
Ç
Ç
4
3
2
1
5
6
7
8
Input
Input
Input
N/C
Output
N/C
GND
N/C
MC33275MN
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage VCC 13 Vdc
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOIC−8) D Suffix
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 369A (DPAK−3) DT Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 488AF (DFN−8, 4x4) MN Suffix
Thermal Resistance, Junction−to−Air (with 1.0 oz PCB cu area)
Thermal Resistance, Junction−to−Air (with 1.8 oz PCB cu area)
Thermal Resistance, Junction−to−Case
PD
RJA
RJC
RJA
RJC
RJA
RJC
RJA
RJA
psi−JC*
Internally Limited
160
25
245
15
92
6.0
183
93
9.0
W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Output Current IO300 mA
Maximum Junction Temperature TJ150 °C
Operating Ambient Temperature Range TA−40 to +125 °C
Storage Temperature Range Tstg −65 to +150 °C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
4000
400
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
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3
ELECTRICAL CHARACTERISTICS (CL = 1.0F, TA = 25°C, for min/max values TJ = −40°C to +125°C, Note 1)
Characteristic Symbol Min Typ Max Unit
Output Voltage IO = 0 mA to 250 mA
2.5 V Suffix TA = 25°C, Vin = [VO + 1] V
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
2.5 V Suffix Vin = [VO + 1] V, 0 < IO < 100 mA
3.0 V Suffix 2% Tolerance from TJ = −40 to +125°C
3.3 V Suffix
5.0 V Suffix
VO
2.475
2.970
3.267
4.950
2.450
2.940
3.234
4.900
2.50
3.00
3.30
5.00
−
−
−
−
2.525
3.030
3.333
5.05
2.550
3.060
3.366
5.100
Vdc
Line Regulation Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline −2.0 10 mV
Load Regulation Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload −5.0 25 mV
Dropout Voltage
IO = 10 mA TJ = −40°C to +125°C
IO = 100 mA
IO = 250 mA
IO = 300 mA
Vin − VO
−
−
−
−
25
115
220
260
100
200
400
500
mV
Ripple Rejection (120 Hz) Vin(peak−peak) = [VO + 1.5] V to [VO + 5.5] V −65 75 −dB
Output Noise Voltage
CL = 1.0 FI
O = 50 mA (10 Hz to 100 kHz)
CL = 200 F
Vn
−
−
160
46
−
−
Vrms
CURRENT PARAMETERS
Quiescent Current ON Mode Vin = [VO + 1] V, IO = 0 mA IQOn −125 200 A
Quiescent Current ON Mode SAT Vin = [VO − 0.5] V, IO = 0 mA (Note 2)
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
IQSAT
−
−
−
−
1100
1500
1500
1500
1500
2000
2000
2000
A
Current Limit Vin = [VO + 1] V, VO Shorted ILIMIT −450 −mA
THERMAL SHUTDOWN
Thermal Shutdown − − 150 −°C
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO − 0.5] V guarantees this condition.
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4
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
Pd +
T
JT
A
RJA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
Iout +
P
D
V
CC V
out
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature and ambient temperature.
RJA +
T
JT
A
P
D
MC33275, NCV33275
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5
0
3.5
0
300
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LOAD CURRENT (mA)
CL = 1.0 F
Vout = 3.3 V
TA = 25°C
Vin = 4.3 V
Figure 2. Line Transient Response Figure 3. Line Transient Response
Figure 4. Load Transient Response Figure 5. Load Transient Response
Figure 6. Output Voltage versus Input Voltage
OUTPUT VOLTAGE CHANGE (mV)
50 100 150 200 250 400
100
-100
-200
-500
-600
-700
-0.8
-0.6
-0.4
-0.2
-1.0
0.4
0
0.2
OUTPUT VOLTAGE CHANGE (V)
Vout
CHANGE
LOAD
CURRENT
-750
LOAD CURRENT (mA)
CL = 33.0 F
Vout = 3.3 V
TA = 25°C
Vin = 4.3 V
0 250 300
-0.11
-0.16
-0.01
0.14
OUTPUT VOLTAGE CHANGE (V)
Vout
CHANGE
LOAD CURRENT
200
-0.06
0.04
0.09
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
IL = 1 mA
IL = 250 mA
50 100 150
1
300
DROPOUT VOLTAGE (mV)
IO, OUTPUT CURRENT (mA)
10 100 1000
250
200
150
100
50
0
0
Vin, INPUT VOLTAGE (V)
TIME (S)
20 40 60 80 100 120 140 160 180 200
7
6
5
4
3
2
1
0-100
-50
0
50
100
150
200
OUTPUT VOLTAGE CHANGE (mV)
Vin
Vout
Figure 7. Dropout Voltage versus Output Current
0
Vin, INPUT VOLTAGE (V)
TIME (S)
50 100 150 200
7
6
5
4
3
2
1
0-20
-10
0
20
40
50
70
10
30
60
TA = 25°C
CL = 33 F
IL = 10 mA
Vout = 3.3 V
Vin
Vout
-400
-300
0
200
300 350
0.6
0.8
1.0
-650
-550
-450
-350
-250
-150
-50
50
150
250
350
TIME (S) TIME (S)
TA = 25°C
CL = 0.47 F
IL = 10 mA
Vout = 3.3 V
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6
Figure 8. Dropout Voltage versus Temperature Figure 9. Ground Pin Current versus
Input Voltage
Figure 10. Ground Pin Current versus
Ambient Temperature
Figure 11. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
-40
8
0
I
TA (°C)
Vin (VOLTS)
23 8
10
6
4
2
0
7
5
4
3
2
1
0
-20 020 40 60 80 100 120 140
IL = 100 mA
IL = 250 mA
-40
2.5
V
TEMPERATURE (°C)
2.495
2.49
2.485
2.48
2.475
2.47
02585
(mA)
gnd
6
IL = 50 mA
(VOLTS)
out
IO = 0
IO = 250 mA
-40
300
TEMPERATURE (°C)
250
200
150
100
50
0
02585
DROPOUT VOLTAGE (mV)
IL = 10 mA
IL = 100 mA
IL = 250 mA
IL = 300 mA
1
8
12
I (mA)
gnd
IL = 300 mA
IL = 100 mA
IL = 50 mA
45 67
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7
Figure 12. Output Voltage versus Ambient
Temperature (Vin = 12 V)
Figure 13. Ripple Rejection Figure 14. Ripple Rejection
-40
2.5
V
TEMPERATURE (°C)
2.49
2.485
2.48
2.475
2.47
02585
(VOLTS)
out
IO = 0
IO = 250 mA
2.495
2.465
0.1
70
dB
FREQUENCY (kHz)
60
50
40
30
20
10
0
1 10 100
IL = 100 mA
IL = 250 mA
0.1
70
dB
FREQUENCY (kHz)
60
50
40
30
20
10
0
1 10 100
IL = 10 mA
IL = 1 mA
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8
APPLICATIONS INFORMATION
LOADCout
Vou
t
Vin
Cin
GND
Figure 15. Typical Application Circuit
The MC33275 regulators are designed with internal
current limiting and thermal shutdown making them
user−friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
EXTERNAL CAPACITORS
These regulators require only a 0.33 F (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 F for stability.
The output capacitor must be mounted as close as possible
to the MC33275. If the output capacitor must be mounted
further than two centimeters away, then a larger value of
output capacitor may be required for stability. A value of
0.68 F or larger is recommended. Most type of aluminum,
tantalum, or multilayer ceramic will perform adequately.
Solid tantalums or appropriate multilayer ceramic
capacitors are recommended for operation below 25°C. An
input bypass capacitor is recommended to improve transient
response or if the regulator is connected to the supply input
filter with long wire lengths, more than 4 inches. This will
reduce the circuit’s sensitivity to the input line impedance at
high frequencies. A 0.33 F or larger tantalum, mylar,
ceramic, or other capacitor having low internal impedance
at high frequencies should be chosen. The bypass capacitor
should be mounted with shortest possible lead or track
length directly across the regulator’s input terminals.
Figure 16 shows the ESR that allows the LDO to remain
stable for various load currents.
0
100
ESR (ohm)
LOAD CURRENT (mA)
100 200 30
0
10
1.0
0.1
Figure 16. ESR for Vout = 3.0V
Vout = 3.0 V
Cout = 1.0 F
Cin = 1.0 F
50 150 250
Stable Region
Applications should be tested over all operating
conditions to insure stability.
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the noise.
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9
Figure 17. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
60
80
100
120
140
160
180
0.4
0.6
0.8
1.0
1.2
1.4
1.6
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
PD, MAXIMUM POWER DISSIPATION (W)
Minimum
Size Pad
RJA
L
L
2.0 oz. Copper
ÎÎÎ
ÎÎÎ
ÎÎÎ
Figure 18. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
40
50
60
70
80
90
100
010203025155.0
L, LENGTH OF COPPER (mm)
0.6
0.8
1.0
1.2
1.4
1.6
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
0.4
PD, MAXIMUM POWER DISSIPATION (W)
L
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
2.0 oz. Copper
RJA
Minimum
Size Pad
PD(max) for TA = 50°C
L
Figure 19. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
30
50
70
90
110
170
0.4
0.8
1.2
1.6
3.2
02040503010
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
L
L
RJA
130
2.0
150
2.4
2.8
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Graph Represents Symmetrical Layout
2.0 oz.
Copper
3.0
mm
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
PD, MAXIMUM POWER DISSIPATION (W)
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10
ORDERING INFORMATION
Device VO Typ (V)
Operating Temperature
Range, Tolerance Case Package Marking Shipping†
MC33275D−2.5
2.5 V
(Fixed Voltage)
1% Tolerance
at TA = 25°C
2% Tolerance at
TJ from −40°C to +125°C
751 SOIC−8 27525 98 Units/Rail
MC33275D−2.5G 751 SOIC−8
(Pb−Free)
27525 98 Units/Rail
MC33275D−2.5R2 751 SOIC−8 27525 2500/Tape & Reel
MC33275D−2.5R2G 751 SOIC−8
(Pb−Free)
27525 2500/Tape & Reel
MC33275DT−2.5 369A DPAK 27525 75 Units/Rail
MC33275DT−2.5G 369A DPAK
(Pb−Free)
27525G 75 Units/Rail
MC33275DT−2.5RK 369A DPAK 27525 2500/Tape & Reel
MC33275DT−2.5RKG 369A DPAK
(Pb−Free)
27525G 2500/Tape & Reel
MC33275MN−2.5R2G 488AF DFN8
(Pb−Free)
27525 3000/Tape & Reel
MC33275ST−2.5T3 318E SOT−223 27525 4000/Tape & Reel
MC33275ST−2.5T3G 318E SOT−223
(Pb−Free)
27525 4000/Tape & Reel
MC33275D−3.0
3.0 V
(Fixed Voltage)
751 SOIC−8 27530 98 Units/Rail
MC33275D−3.0G 751 SOIC−8
(Pb−Free)
27530 98 Units/Rail
MC33275D−3.0R2 751 SOIC−8 27530 2500/Tape & Reel
MC33275D−3.0R2G 751 SOIC−8
(Pb−Free)
27530 2500/Tape & Reel
MC33275DT−3.0 369A DPAK 27530 75 Units/Rail
MC33275DT−3.0G 369A DPAK
(Pb−Free)
27530G 75 Units/Rail
MC33275DT−3.0RK 369A DPAK 27530 2500/Tape & Reel
MC33275DT−3.0RKG 369A DPAK
(Pb−Free)
27530G 2500/Tape & Reel
MC33275MN−3.0R2G 488AF DFN8
(Pb−Free)
27530 3000/Tape & Reel
MC33275ST−3.0T3 318E SOT−223 27530 4000/Tape & Reel
MC33275ST−3.0T3G 318E SOT−223
(Pb−Free)
27530 4000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC33275, NCV33275
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11
ORDERING INFORMATION (continued)
Device VO Typ (V)
Operating Temperature
Range, Tolerance Case Package Marking Shipping†
MC33275D−3.3
3.3 V
(Fixed Voltage)
1% Tolerance
at TA = 25°C
2% Tolerance at
TJ from −40°C to +125°C
1% Tolerance
at TA = 25°C
751 SOIC−8 27533 98 Units/Rail
MC33275D−3.3G 751 SOIC−8
(Pb−Free)
27533 98 Units/Rail
MC33275D−3.3R2 751 SOIC−8 27533 2500/Tape & Reel
MC33275D−3.3R2G 751 SOIC−8
(Pb−Free)
27533 2500/Tape & Reel
MC33275DT−3.3 369A DPAK 27533 75 Units/Rail
MC33275DT−3.3G 369A DPAK
(Pb−Free)
27533G 75 Units/Rail
MC33275DT−3.3RK 369A DPAK 27533 2500/Tape & Reel
MC33275DT−3.3RKG 369A DPAK
(Pb−Free)
27533G 2500/Tape & Reel
MC33275ST−3.3T3 318E SOT−223 27533 4000/Tape & Reel
MC33275ST−3.3T3G 318E SOT−223
(Pb−Free)
27533 4000/Tape & Reel
NCV33275ST3.3T3G 318E SOT−223
(Pb−Free)
27533 4000/Tape & Reel
MC33275MN−3.3R2G 488AF DFN−8
(Pb−Free)
27330 3000/Tape & Reel
MC33275D−5.0
5.0 V
(Fixed Voltage)
1% Tolerance
at TA = 25°C
2% Tolerance at
TJ from −40°C to +125°C
1% Tolerance
at TA = 25°C
751 SOIC−8 27550 98 Units/Rail
MC33275D−5.0G 751 SOIC−8
(Pb−Free)
27550 98 Units/Rail
MC33275D−5.0R2 751 SOIC−8 27550 2500/Tape & Reel
MC33275D−5.0R2G 751 SOIC−8
(Pb−Free)
27550 2500/Tape & Reel
MC33275DT−5.0 369A DPAK 27550 75 Units/Rail
MC33275DT−5.0G 369A DPAK
(Pb−Free)
27550G 75 Units/Rail
MC33275DT−5.0RK 369A DPAK 27550 2500/Tape & Reel
MC33275DT−5.0RKG 369A DPAK
(Pb−Free)
27550G 2500/Tape & Reel
MC33275MN−5.0R2 488AF DFN−8 27550 3000/Tape & Reel
MC33275MN−5.0R2G 488AF DFN−8
(Pb−Free)
27550 3000/Tape & Reel
MC33275ST−5.0T3 318E SOT−223 27550 4000/Tape & Reel
MC33275ST−5.0T3G 318E SOT−223
(Pb−Free)
27550 4000/Tape & Reel
NCV33275ST−5.0T3 318E SOT−223 27550 4000/Tape & Reel
NCV33275ST−5.0T3G 318E SOT−223
(Pb−Free)
27550 4000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC33275, NCV33275
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12
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE M
A1
b1
D
E
b
e
e1
4
123
0.08 (0003)
A
L1
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
1.5
0.059 ǒmm
inchesǓ
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
SOLDERING FOOTPRINT
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.50 1.63 1.75 0.060
INCHES
A1 0.02 0.06 0.10 0.001
b0.60 0.75 0.89 0.024
b1 2.90 3.06 3.20 0.115
c0.24 0.29 0.35 0.009
D6.30 6.50 6.70 0.249
E3.30 3.50 3.70 0.130
e2.20 2.30 2.40 0.087
0.85 0.94 1.05 0.033
0.064 0.068
0.002 0.004
0.030 0.035
0.121 0.126
0.012 0.014
0.256 0.263
0.138 0.145
0.091 0.094
0.037 0.041
NOM MAX
L1 1.50 1.75 2.00 0.060
6.70 7.00 7.30 0.264
0.069 0.078
0.276 0.287
HE
− −
e1
0°10°0°10°
qq
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC33275, NCV33275
http://onsemi.com
13
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33275, NCV33275
http://onsemi.com
14
PACKAGE DIMENSIONS
8 PIN DFN, 4x4
MN SUFFIX
CASE 488AF−01
ISSUE C
ÉÉ
ÉÉ
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.25 0.35
D4.00 BSC
D2 1.91 2.21
E4.00 BSC
E2 2.09 2.39
e0.80 BSC
K0.20 −−−
L0.30 0.50
D
B
E
C0.15
A
C0.15
2X
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Ç
Ç
Ç
Ç
Ç
Ç
Ç
Ç
Ç
Ç
C
A
(A3)
A1
8X
SEATING
PLANE
C0.08
C0.10
Ç
Ç
Ç
Ç
Ç
Ç
e
8X L
K
E2
D2
b
NOTE 3
14
5
8
8X
0.10 C
0.05 C
AB
PIN ONE
REFERENCE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
0.63
2.21
2.39
8X
0.80
PITCH
4.30
0.35
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
ÉÉ
ÇÇ
A1
A3
L
ÇÇÇ
ÇÇÇ
ÉÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 −−− 0.15
DETAIL B
NOTE 4
DETAIL A
DIMENSIONS: MILLIMETERS
PACKAGE
OUTLINE
MC33275, NCV33275
http://onsemi.com
15
PACKAGE DIMENSIONS
DPAK−3
DT SUFFIX
CASE 369A−13
ISSUE AB
D
A
K
B
R
V
S
F
L
G
2 PL
M
0.13 (0.005) T
E
C
U
J
H
−T−SEATING
PLANE
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.235 0.250 5.97 6.35
B0.250 0.265 6.35 6.73
C0.086 0.094 2.19 2.38
D0.027 0.035 0.69 0.88
E0.033 0.040 0.84 1.01
F0.037 0.047 0.94 1.19
G0.180 BSC 4.58 BSC
H0.034 0.040 0.87 1.01
J0.018 0.023 0.46 0.58
K0.102 0.114 2.60 2.89
L0.090 BSC 2.29 BSC
R0.175 0.215 4.45 5.46
S0.020 0.050 0.51 1.27
U0.020 --- 0.51 ---
V0.030 0.050 0.77 1.27
Z0.138 --- 3.51 ---
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
123
4
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