OPA OPA 277 227 OPA277 OPA2277 OPA4277 OPA 4277 7 OPA2 277 OPA2 77 OPA4 277 OPA2 77 OPA2 277 SBOS079A - MARCH 1999 - REVISED APRIL 2005 High Precision OPERATIONAL AMPLIFIERS FEATURES DESCRIPTION ULTRA LOW OFFSET VOLTAGE: 10V ULTRA LOW DRIFT: 0.1V/C HIGH OPEN-LOOP GAIN: 134dB HIGH COMMON-MODE REJECTION: 140dB HIGH POWER SUPPLY REJECTION: 130dB LOW BIAS CURRENT: 1nA max WIDE SUPPLY RANGE: 2V to 18V LOW QUIESCENT CURRENT: 800A/amplifier SINGLE, DUAL, AND QUAD VERSIONS REPLACES OP-07, OP-77, OP-177 The OPA277 series precision op amps replace the industry standard OP-177. They offer improved noise, wider output voltage swing, and are twice as fast with half the quiescent current. Features include ultra low offset voltage and drift, low bias current, high common-mode rejection, and high power supply rejection. Single, dual, and quad versions have identical specifications for maximum design flexibility. OPA277 series op amps operate from 2V to 18V supplies with excellent performance. Unlike most op amps which are specified at only one supply voltage, the OPA277 series is specified for real-world applications; a single limit applies over the 5V to 15V supply range. High performance is maintained as the amplifiers swing to their specified limits. Because the initial offset voltage (20V max) is so low, user adjustment is usually not required. However, the single version (OPA277) provides external trim pins for special applications. APPLICATIONS TRANSDUCER AMPLIFIER BRIDGE AMPLIFIER TEMPERATURE MEASUREMENTS STRAIN GAGE AMPLIFIER PRECISION INTEGRATOR BATTERY POWERED INSTRUMENTS TEST EQUIPMENT OPA277 op amps are easy to use and free from phase inversion and overload problems found in some other op amps. They are stable in unity gain and provide excellent dynamic behavior over a wide range of load conditions. Dual and quad versions feature completely independent circuitry for lowest crosstalk and freedom from interaction, even when overdriven or overloaded. Single (OPA277) and dual (OPA2277) versions are available in DIP-8, SO-8, and DFN-8 (4mm x 4mm) packages. The quad (OPA4277) comes in DIP-14 and SO-14 surface-mount packages. All are fully specified from -40C to +85C and operate from -55C to +125C. OPA277 Offset Trim 1 8 Offset Trim -In 2 7 V+ +In 3 6 Output V- 4 5 NC 8-Pin DIP, SO-8 OPA277AIDRM Out A 1 14 Out D -In A 2 13 -In D +In A 3 12 +In D V+ 4 11 V- A Out A 1 -In A 2 +In A 3 V- 4 A B 8 V+ 7 Out B 6 -In B 5 +In B D +In B 5 10 +In C -In B 6 9 -In C Out B 7 8 Out C B OPA2277 Offset Trim OPA4277 1 Pin 1 Indicator 8 Offset Trim 7 V+ -In 2 +In 3 6 Output V- 4 5 NC OPA2277AIDRM Out A 1 8 Out B -In A 2 7 V+ +In A 3 6 -In B V- 4 5 +In B C Pin 1 Indicator DFN-8 4mm x 4mm (top view) Thermal Pad on Bottom (Connect to V-) 14-Pin DIP, SO-14 8-Pin DIP, SO-8 NC = No connection. DFN-8 4mm x 4mm (top view) Thermal Pad on Bottom (Connect to V-) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright (c) 1999-2005, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Supply Voltage .................................................................................... 36V Input Voltage ..................................................... (V-) -0.7V to (V+) +0.7V Output Short-Circuit(2) .............................................................. Continuous Operating Temperature .................................................. -55C to +125C Storage Temperature ..................................................... -55C to +125C Junction Temperature ...................................................................... 150C Lead Temperature (soldering, 10s) ................................................. 300C ESD Rating (Human Body Model) .................................................. 2000V (Machine Model) ........................................................... 100V This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses above these rating may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Short-circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION(1) OFFSET VOLTAGE max, V OFFSET VOLTAGE DRIFT max, V/C PACKAGE-LEAD Single OPA277PA OPA277P OPA277UA OPA277U OPA277AIDRM 50 20 50 20 100 1 0.15 1 0.15 1 DIP-8 DIP-8 SO-8 Surface Mount SO-8 Surface Mount DFN-8 (4mm x 4mm) Dual OPA2277PA OPA2277P OPA2277UA OPA2277U OPA2277AIDRM 50 25 50 25 100 1 0.25 1 0.25 1 DIP-8 DIP-8 SO-8 Surface Mount SO-8 Surface Mount DFN-8 (4mm x 4mm) Quad OPA4277PA OPA4277UA 50 50 1 1 DIP-14 SO-14 Surface Mount PRODUCT NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet or visit the TI web site at www.ti.com. PIN DESCRIPTIONS OPA277 OPA2277AIDRM Offset Trim 1 8 Offset Trim -In 2 7 V+ +In 3 6 Output V- 4 5 NC(1) Out A 1 Pin 1 Indicator 8 Out B 7 V+ -In A 2 +In A 3 6 -In B V- 4 5 +In B OPA4277 8-Pin DIP, SO-8 Out A 1 -In A 2 A 14 Out D 13 -In D DFN-8 4mm x 4mm (top view) D +In A 3 12 +In D V+ 4 11 V- +In B 5 10 +In C Thermal Pad on Bottom (Connect to V-) OPA277AIDRM B C -In B 6 9 -In C Out B 7 8 Out C OPA2277 Offset Trim 1 Pin 1 Indicator 8 Offset Trim 7 V+ -In 2 +In 3 6 Output V- 4 5 NC 14-Pin DIP, SO-14 Out A 1 -In A 2 +In A 3 V- 4 A B 8-Pin DIP, SO-8 2 8 V+ 7 Out B 6 -In B 5 +In B DFN-8 4mm x 4mm (top view) NOTE: (1) NC = No connection. Thermal Pad on Bottom (Connect to V-) OPA277, OPA2277, OPA4277 www.ti.com SBOS079A ELECTRICAL CHARACTERISTICS: VS = 5V to VS = 15V At TA = +25C, and RL = 2k, unless otherwise noted. Boldface limits apply over the specified temperature range, -40C to +85C. OPA277PA, UA OPA2277PA, UA OPA4277PA, UA OPA277P, U OPA2277P, U PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage: OPA277P, U (high grade, single) OPA2277P, U (high grade, dual) All PA, UA, Versions AIDRM Versions VOS TYP(1) MAX 10 10 20 25 TYP(1) MAX MIN TYP(1) Input Offset Voltage Drift dVOS/dT OPA277P, U (high grade, single) OPA2277P, U (high grade, dual) All PA, UA, AIDRM Versions TA = -40C to +85C TA = -40C to +85C TA = -40C to +85C PSRR INPUT BIAS CURRENT Input Bias Current TA = -40C to +85C Input Offset Current TA = -40C to +85C -40C -40C -40C -40C to to to to +85C +85C +85C +85C 30 50 0.1 0.1 0.2 0.3 VS = 2V to 18V VS = 2V to 18V dc 0.5 IOS 0.5 Input Voltage Noise Density, f = 10Hz en f = 100Hz f = 1kHz f = 10kHz Current Noise Density, f = 1kHz in 0.22 0.035 12 8 8 8 0.2 NOISE Input Voltage Noise, f = 0.1 to 10Hz INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain AOL TA = -40C to +85C FREQUENCY RESPONSE Gain-Bandwidth Product GBW Slew Rate SR Settling Time, 0.1% 0.01% Overload Recovery Time Total Harmonic Distortion + Noise THD+N VCM = (V-) +2V to (V+) -2V VCM = (V-) +2V to (V+) -2V 0.15 0.5 0.5 (V-) +2 130 128 1 0.15 1 1 0.1 IB VCM CMRR 100 0.15 0.25 1 2 1 2 (V+) -2 115 115 2.8 4 2.8 4 100 V V V V 165 V V V V 1 V/C V/C V/C 1 1 V/mo V/V V/V V/V 2.8 4 2.8 4 nA nA nA nA VPP Vrms nV/Hz nV/Hz nV/Hz nV/Hz pA/Hz UNITS 140 MAX 50 35 TA = TA = TA = TA = INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection TA = -40C to +85C MIN 20 Input Offset Voltage Over Temperature OPA277P, U (high grade, single) OPA2277P, U (high grade, dual) All PA, UA, Versions AIDRM Versions Input Offset Voltage: (all models) vs Time vs Power Supply TA = -40C to +85C Channel Separation (dual, quad) MIN OPA277AIDRM, OPA2277AIDRM 115 115 V dB dB VCM = (V-) +2V to (V+) -2V 100 || 3 250 || 3 M || pF G || pF VO = (V-)+0.5V to (V+)-1.2V, RL = 10k 140 dB dB VO = (V-)+1.5V to (V+)-1.5V, RL = 2k 126 VO = (V-)+1.5V to (V+)-1.5V, RL = 2k 126 VS = 15V, G = 1, 10V Step VS = 15V, G = 1, 10V Step VIN * G = VS 1kHz, G = 1, VO = 3.5Vrms 134 1 0.8 14 16 3 0.002 dB MHz V/s s s s % Specifications same as OPA277P, U. NOTE: (1) VS = 15V. OPA277, OPA2277, OPA4277 SBOS079A www.ti.com 3 ELECTRICAL CHARACTERISTICS: VS = 5V to VS = 15V (CONT) At TA = +25C, and RL = 2k, unless otherwise noted. Boldface limits apply over the specified temperature range, -40C to +85C. OPA277PA, UA OPA2277PA, UA OPA4277PA, UA OPA277P, U OPA2277P, U PARAMETER CONDITION OUTPUT Voltage Output TA = -40C to +85C TA = -40C to +85C Short-Circuit Current Capacitive Load Drive VO (V-) (V-) (V-) (V-) +0.5 +0.5 +1.5 +1.5 IQ (V+) (V+) (V+) (V+) 5 2 VS MAX -1.2 -1.2 -1.5 -1.5 MIN 790 IO = 0 IO = 0 -40 -55 -55 TYP(1) 35 See Typical Curve ISC CLOAD POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current (per amplifier) TA = -40C to +85C TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SO-8 Surface-Mount DIP-8 DIP-14 SO-14 Surface-Mount DFN-8(2) RL = 10k RL = 10k RL = 2k RL = 2k TYP(1) MIN OPA277AIDRM, OPA2277AIDRM MAX MIN 15 18 825 900 +85 +125 +125 TYP(1) UNITS V V V V mA V V A A C C C JA 150 100 80 100 MAX 45 C/W C/W C/W C/W C/W Specifications same as OPA277P, U. NOTES: (1) VS = 15V. (2) Thermal pad soldered to printed circuit board (PCB). 4 OPA277, OPA2277, OPA4277 www.ti.com SBOS079A TYPICAL CHARACTERISTICS At TA = +25C, VS = 15V, and RL = 2k, unless otherwise noted. POWER SUPPLY AND COMMON-MODE REJECTION vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 140 140 0 100 -30 80 -60 60 -90 40 -120 20 -150 0 -180 120 +PSR -PSR PSR, CMR (dB) AOL (dB) 120 CL = 0 CL = 1500pF Phase () G 100 80 CMR 60 40 20 0 -20 0.1 1 10 100 1k 10k 100k 1M 0.1 10M 1 10 100 1k 10k Frequency (Hz) Frequency (Hz) INPUT NOISE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY INPUT NOISE VOLTAGE vs TIME 100k 1M Noise signal is bandwidth limited to lie between 0.1Hz and 10Hz. Current Noise 100 50nV/div Voltage Noise (nV/Hz) Current Noise (fA/Hz) 1000 Voltage Noise 10 1 1 10 100 1k 10k 1s/div Frequency (Hz) TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 140 1 120 THD+Noise (%) Channel Separation (dB) VOUT = 3.5Vrms 100 Dual and quad devices. G = 1, all channels. Quad measured channel A to D or B to C--other combinations yield similar or improved rejection. 80 60 0.1 G = 10, RL = 2k, 10k 0.01 G = 1, RL = 2k, 10k 0.001 40 10 100 1k 10k 100k 1M 10 Frequency (Hz) 1k 10k 100k Frequency (Hz) OPA277, OPA2277, OPA4277 SBOS079A 100 www.ti.com 5 TYPICAL CHARACTERISTICS (CONT) At TA = +25C, VS = 15V, and RL = 2k, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION OFFSET VOLTAGE PRODUCTION DISTRIBUTION 16 12 Typical distribution of packaged units. Single, dual, and quad included. 30 Percent of Amplifiers (%) 10 8 6 4 25 20 15 10 5 2 0 0 -50-45-40-35-30-25-20-15-10 -5 0 5 10 15 20 25 30 35 40 45 50 Offset Voltage (V) 0 0.1 160 2 150 AOL, CMR, PSR (dB) Offset Voltage Change (V) 0.4 0.5 0.6 0.7 0.8 0.9 1.0 AOL, CMR, PSR vs TEMPERATURE 3 1 0 -1 -2 CMR 140 AOL 130 PSR 120 110 -3 0 15 30 45 60 75 90 105 100 -75 120 -50 -25 0 25 50 75 100 Time from Power Supply Turn-On (s) Temperature (C) INPUT BIAS CURRENT vs TEMPERATURE QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT vs TEMPERATURE 125 5 1000 100 4 950 90 3 900 80 Quiescent Current (A) Input Bias Current (nA) 0.3 Offset Voltage (V/C) WARM-UP OFFSET VOLTAGE DRIFT 2 1 0 -1 -2 Curves represent typical production units. 70 850 IQ 800 60 50 750 -ISC 700 40 +ISC 650 30 600 20 -4 550 10 -5 500 -75 -3 -75 -50 -25 0 25 50 75 100 125 Temperature (C) 6 0.2 Short-Circuit Current (mA) Percent of Amplifiers (%) 35 Typical distribution of packaged units. Single, dual, and quad included. 14 0 -50 -25 0 25 50 75 100 125 Temperature (C) OPA277, OPA2277, OPA4277 www.ti.com SBOS079A TYPICAL CHARACTERISTICS (CONT) At TA = +25C, VS = 15V, and RL = 2k, unless otherwise noted. CHANGE IN INPUT BIAS CURRENT vs POWER SUPPLY VOLTAGE CHANGE IN INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 2.0 2.0 Curve shows normalized change in bias current with respect to VS = 10V (+20V). Typical IB may range from -0.5nA to +0.5nA at VS = 10V. 1.5 1.0 1.0 VS = 5V IB (nA) IB (nA) 0.5 0.0 Curve shows normalized change in bias current with respect to VCM = 0V. Typical IB may range from -05.nA to +0.5nA at VCM = 0V. 1.5 VCM = 0V 0.5 0.0 -0.5 -0.5 -1.0 -1.0 -1.5 -1.5 VS = 15V -2.0 -2.0 0 5 10 15 20 25 30 35 40 -15 -10 Supply Voltage (V) QUIESCENT CURRENT vs SUPPLY VOLTAGE 5 10 15 100 10V step CL = 1500pF per amplifier Settling Time (s) 900 800 700 50 0.01% 0.1% 20 600 10 500 0 5 10 15 20 1 10 Supply Voltage (V) 100 Gain (V/V) MAXIMUM OUTPUT VOLTAGE vs FREQUENCY OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (V+) 30 (V+) - 1 Output Voltage Swing (V) VS = 15V 25 Output Voltage (VPP) 0 SETTLING TIME vs CLOSED-LOOP GAIN 1000 Quiescent Current (A) -5 Common-Mode Voltage (V) 20 15 10 VS = 5V 5 -55C (V+) - 2 (V+) - 3 125C (V+) - 4 25C (V+) - 5 (V-) + 5 25C 125C (V-) + 4 (V-) + 3 (V-) + 2 -55C (V-) + 1 (V-) 0 1k 10k 100k 0 1M OPA277, OPA2277, OPA4277 SBOS079A 5 10 15 20 25 30 Output Current (mA) Frequency (Hz) www.ti.com 7 TYPICAL CHARACTERISTICS (CONT) At TA = +25C, VS = 15V, and RL = 2k, unless otherwise noted. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE LARGE-SIGNAL STEP RESPONSE G = +1, CL = 1500pF, VS = +15V 60 Gain = -1 40 Gain = +1 2V/div Overshoot (%) 50 30 20 Gain = 10 10 0 10 100 1k 10k 100k 10s/div Load Capacitance (pF) 20mV/div SMALL-SIGNAL STEP RESPONSE G = +1, CL = 1500pF, VS = 15V 20mV/div SMALL-SIGNAL STEP RESPONSE G = +1, CL = 0, VS = 15V 1s/div 8 1s/div OPA277, OPA2277, OPA4277 www.ti.com SBOS079A APPLICATIONS INFORMATION The OPA277 series is unity-gain stable and free from unexpected output phase reversal, making it easy to use in a wide range of applications. Applications with noisy or high impedance power supplies may require decoupling capacitors close to the device pins. In most cases 0.1F capacitors are adequate. connecting a potentiometer as shown in Figure 1. This adjustment should be used only to null the offset of the op amp. This adjustment should not be used to compensate for offsets created elsewhere in a system since this can introduce additional temperature drift. V+ Trim Range: Exceeds Offset Voltage Specification The OPA277 series has very low offset voltage and drift. To achieve highest performance, circuit layout and mechanical conditions should be optimized. Offset voltage and drift can be degraded by small thermoelectric potentials at the op amp inputs. Connections of dissimilar metals will generate thermal potential which can degrade the ultimate performance of the OPA277 series. These thermal potentials can be made to cancel by assuring that they are equal in both input terminals. * Keep thermal mass of the connections made to the two input terminals similar. * Locate heat sources as far as possible from the critical input circuitry. * Shield op amp and input circuitry from air currents such as cooling fans. OPERATING VOLTAGE OPA277 series op amp operate from 2V to 18V supplies with excellent performance. Unlike most op amps which are specified at only one supply voltage, the OPA277 series is specified for real-world applications; a single limit applies over the 5V to 15V supply range. This allows a customer operating at VS = 10V to have the same assured performance as a customer using 15V supplies. In addition, key parameters are assured over the specified temperature range, -40C to +85C. Most behavior remains unchanged through the full operating voltage range (2V to 18V). Parameters which vary significantly with operating voltage or temperature are shown in typical performance curves. OFFSET VOLTAGE ADJUSTMENT The OPA277 series is laser-trimmed for very low offset voltage and drift so most circuits will not require external adjustment. However, offset voltage trim connections are provided on pins 1 and 8. Offset voltage can be adjusted by 0.1F 20k 7 1 2 8 3 0.1F OPA277 4 6 OPA277 single op amp only. Use offset adjust pins only to null offset voltage of op amp--see text. V- FIGURE 1. OPA277 Offset Voltage Trim Circuit. INPUT PROTECTION The inputs of the OPA277 series are protected with 1k series input resistors and diode clamps. The inputs can withstand 30V differential inputs without damage. The protection diodes will, of course, conduct current when the inputs are over-driven. This may disturb the slewing behavior of unity-gain follower applications, but will not damage the op amp. INPUT BIAS CURRENT CANCELLATION The input stage base current of the OPA277 series is internally compensated with an equal and opposite cancellation circuit. The resulting input bias current is the difference between the input stage base current and the cancellation current. This residual input bias current can be positive or negative. When the bias current is canceled in this manner, the input bias current and input offset current are approximately the same magnitude. As a result, it is not necessary to use a bias current cancellation resistor as is often done with other op amps (Figure 2). A resistor added to cancel input bias current errors may actually increase offset voltage and noise. R2 R2 R1 R1 Op Amp OPA277 RB = R2 || R1 No bias current cancellation resistor (see text) (a) (b) Conventional op amp with external bias current cancellation resistor. OPA277 with no external bias current cancellation resistor. FIGURE 2. Input Bias Current Cancellation. OPA277, OPA2277, OPA4277 SBOS079A www.ti.com 9 V+ 1/2 OPA2277 VOUT = (V1 - V2)(1 + R2 R1 ) R2 V- R-R Load Cell V1 R+R V+ R+R V2 R1 1/2 OPA2277 R-R V- R2 R1 For integrated solution see: INA126, INA2126 (dual) INA125 (on-board reference) INA122 (single-supply) FIGURE 3. Load Cell Amplifier. IREG 1mA 5V 12 V+ Type J VLIN 1/2 OPA2277 13 RF 10k 4 R 412 + VIN 1 IR1 3 11 VREG 10 V+ RG RG 1250 RF 10k 14 IR2 XTR105 B E RG 9 8 IO 1/2 OPA2277 1k 2 25 7 IRET V- 50 - VIN 6 + - IO = 4mA + (VIN - VIN) 40 RG RCM = 1250 (G = 1 + 2RF = 50) R 0.01F FIGURE 4. Thermocouple Low Offset, Low Drift Loop Measurement with Diode Cold Junction Compensation. 10 OPA277, OPA2277, OPA4277 www.ti.com SBOS079A DFN PACKAGE LAYOUT GUIDELINES The OPA277 series uses the 8-lead DFN (also known as SON), which is a QFN package with contacts on only two sides of the package bottom. This leadless, near-chip-scale package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. The leadframe die pad should be soldered to a thermal pad on the PCB. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. DFN packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics, with a pinout scheme that is consistent with other commonly-used packages, such as SO and MSOP. Additionally, the absence of external leads eliminates bent-lead issues. Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and longterm reliability. The DFN package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See Application Note, QFN/SON PCB Attachment (SLUA271) and Application Report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. The exposed leadframe die pad on the bottom of the package should be connected to V-. OPA277, OPA2277, OPA4277 SBOS079A www.ti.com 11 PACKAGE OPTION ADDENDUM www.ti.com 29-Feb-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) OPA2277AIDRMT ACTIVE VSON DRM 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA2277AIDRMTG4 ACTIVE VSON DRM 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA2277P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2277PA ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2277PAG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2277PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA2277U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA2277UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA2277UAE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA2277UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR OPA277AIDRMR ACTIVE VSON DRM 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA277AIDRMRG4 ACTIVE VSON DRM 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Feb-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA277AIDRMT ACTIVE VSON DRM 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA277AIDRMTG4 ACTIVE VSON DRM 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA277P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA277PA ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA277PAG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA277PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA277U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UAE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA277UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA4277PA ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA4277PAG4 ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA4277UA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Addendum-Page 2 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 29-Feb-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA4277UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA4277UA/2K5E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA4277UAE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA4277UAG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2277AIDRMT VSON DRM 8 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 OPA2277U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2277UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA277AIDRMR VSON DRM 8 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 OPA277AIDRMT VSON DRM 8 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 OPA277U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA277UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4277UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2277AIDRMT VSON DRM OPA2277U/2K5 SOIC D 8 250 210.0 185.0 35.0 8 2500 367.0 367.0 35.0 OPA2277UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA277AIDRMR VSON DRM 8 3000 367.0 367.0 35.0 OPA277AIDRMT VSON DRM 8 250 210.0 185.0 35.0 OPA277U/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA277UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA4277UA/2K5 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated