© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 4 1Publication Order Number:
MBR0530T1/D
MBR0530T1, MBR0530T3
Preferred Devices
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
The MBR0530T1/3 uses the Schottky Barrier principle with a large
area metal−to−silicon power diode. Ideally suited for low voltage,
high frequency rectification or as free wheeling and polarity
protection diodes in surface mount applications where compact size
and weight are critical to the system. This package also provides an
easy to work with alternative to leadless 34 package style. These
state−of−the−art devices have the following features:
Features
•Guardring for Stress Protection
•Low Forward Voltage
•125°C Operating Junction Temperature
•Epoxy Meets UL 94, V−0 @ 0.125 in
•Package Designed for Optimal Automated Board Assembly
•Pb−Free Packages are Available
Mechanical Characteristics
•Reel Options: MBR0530T1 = 3,000 per 7 in reel/8 mm tape
Reel Options: MBR0530T3 = 10,000 per 13 in reel/8 mm tape
•Polarity Designator: Cathode Band
•Weight: 11.7 mg (approximately)
•Case: Epoxy, Molded
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30 V
Average Rectified Forward Current
(Rated VR, TL = 100°C) IF(AV) 0.5 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 5.5 A
Storage Temperature Range Tstg −65 to +150 °C
Operating Junction Temperature TJ−65 to +125 °C
Voltage Rate of Change (Rated VR) dv/dt 1000 V/ms
ESD Rating: Machine Model = C
Human Body Model = 3B > 400
> 8000 V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above t h e
Recommended Operating Conditions may affect device reliability.
SOD−123
CASE 425
STYLE 1
SCHOTTKY BARRIER
RECTIFIER
0.5 AMPERES
30 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
MARKING DIAGRAM
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See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
B3 = Device Code
M = Date Code
G= Pb−Free Package
B3 M G
G
(Note: Microdot may be in either location)
MBR0530T1, MBR0530T3
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2
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance − Junction−to−Ambient (Note 1) RqJA 206 °C/W
Thermal Resistance − Junction−to−Lead RqJL 150 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 0.1 Amps, TJ = 25°C)
(iF = 0.5 Amps, TJ = 25°C)
vF0.375
0.43
V
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TC = 25°C)
(VR = 15 V, TC = 25°C)
IR130
20
mA
1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2%.
1
0.1
0.01
0.15
vF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
4
1000
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current
5 101520 30354025
100
10
1
0
TJ = 125°C 75°C 25°C −40 °C75°C
25°C
IR, REVERSE CURRENT (A)μ
180
160
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
5101520 3025
140
120
100
0
TYPICAL CAPACITANCE AT 0 V = 170 pF
C, CAPACITANCE (pF)
40
60
80
TJ = 125°C
MBR0530T1, MBR0530T3
http://onsemi.com
3
1
0.875
0
LEAD TEMPERATURE (°C)
Figure 4. Current Derating (Lead)
67 74 81 88 13095
0.75
0.625
0.5
60
AVERAGE FORWARD CURRENT (AMP)
0.125
0.25
0.375
123116109102
DC
SQUARE WAVE
= p
= 5
= 10
Ipk/Iav = 20
0.35
0.315
0
IF(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 5. Power Dissipation
0.1 0.2 0.3 0.4 0.80.5
0.28
0.245
0.21
0
0.105
0.14
0.175
0.70.6
DC
SQUARE WAVE
= p
= 5
= 10
Ipk/Iav = 20
0.07
0.035
PF(AV), AVERAGE POWER DISSIPATION (WATT
)
TJ = 125°C
ORDERING INFORMATION
Device Package Shipping†
MBR0530T1 SOD−123 3000 / Tape & Reel
MBR0530T1G SOD−123
(Pb−Free) 3000 / Tape & Reel
MBR0530T3 SOD−123 10,000 Tape & Reel
MBR0530T3G SOD−123
(Pb−Free) 10,000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MBR0530T1, MBR0530T3
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
ÂÂÂÂ
ÂÂÂÂ
ÂÂÂÂ
E
b
DA
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D1.40 1.80
E2.54 2.69 2.84 0.100
−−−
3.68 0.140
L0.25
3.86
0.010
HE
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
HE
−−−
−−− −−−
0.006
−−− −−−
−−− −−−
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.22
0.048
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ǒmm
inchesǓ
SCALE 10:1
ÉÉ
ÉÉ
ÉÉ
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Phone: 81−3−5773−3850
MBR0530LT1/D
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