BAS21WX
High Voltage
Switching Diode
SOD-323
Suggested Solder
Pad Layout
Features
• Plastic case
• Preferred devices are recommended choices for future use and
best overall value.
• Device Marking: JS
Maximum Ratings
Symbol Rating Value Unit
VR Continuous Reverse Voltage 250 Vdc
IF Peak Forward Current 200 mAdc
IFM(surge) Peak Forward Surge Current 625 mAdc
Thermal Characteristics
Symbol Characteristic Max Unit
PD Total Device Dissipation FR-5
Board *, TA=25OC
Derate above 25OC
200
1.57
mW
mW/OC
RJA Thermal Resistance Junction to
Ambient 635 OC/W
TJ, TSTG Junction and Storage Temperature
Range -55 to
+155 OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Characteristic Min Max Unit
Off Characteristics
IR Reverse Voltage Leakage Current
(VR=200Vdc)
(VR=200Vdc, TJ=150OC) ---
--- 0.1
100 uAdc
V(BR) Reverse Breakdown Voltage
(IBR=100uAdc) 250 --- Vdc
VF Forward Voltage
(IF=100mAdc)
(IF=200mAdc) ---
--- 1000
1250 mVdc
CD Diode Capacitance
(VR=0, f=1.0MHz) --- 5.0 pF
trr Reverse Recovery Time
(IF=IR=30mAdc, RL=100 OHM) --- 50 ns
A
B
E
C
J
D
H
G
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .043 0.80 1.10
E .010 .016 0.25 0.40
G .006 .018 0.15 0.45
H .004 .010 0.10 0.25
J ----- .004 ----- 0.10
.118”
.022”
.027”
omponents
21201 Itasca Street Chatsworth
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MCC
www.mccsemi.com
* FR-5 Minimum Pad
