MCC omponents 21201 Itasca Street Chatsworth !"# $ % !"# BAS21WX Features * * * Plastic case Preferred devices are recommended choices for future use and best overall value. Device Marking: JS High Voltage Switching Diode Maximum Ratings Symbol VR IF IFM(surge) Rating Continuous Reverse Voltage Peak Forward Current Peak Forward Surge Current Value 250 200 625 Thermal Characteristics Symbol PD RJA TJ, TSTG SOD-323 Unit Vdc mAdc mAdc A B C Characteristic Total Device Dissipation FR-5 Board *, TA=25OC Derate above 25 OC Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Max 200 Unit mW 1.57 mW/ OC O 635 C/W E H D -55 to +155 O C Electrical Characteristics @ 25OC Unless Otherwise Specified Symbol Characteristic Min Max DIMENSIONS Off Characteristics IR V(BR) VF CD trr Reverse Voltage Leakage Current (V R=200Vdc) (V R=200Vdc, TJ=150 OC) Reverse Breakdown Voltage (IBR=100uAdc) Forward Voltage (IF=100mAdc) (I F=200mAdc) Diode Capacitance (V R=0, f=1.0MHz) Reverse Recovery Time (IF=IR=30mAdc, RL=100 OHM) ----- 0.1 100 uAdc 250 --- Vdc ----- 1000 1250 mVdc --- 5.0 pF --- 50 ns J G Unit DIM A B C D E G H J INCHES MIN .090 .063 .045 .031 .010 .006 .004 ----- MM MIN 2.30 1.60 1.15 0.80 0.25 0.15 0.10 ----- MAX .107 .071 .053 .043 .016 .018 .010 .004 MAX 2.70 1.80 1.35 1.10 0.40 0.45 0.25 0.10 Suggested Solder Pad Layout .118" .027" * FR-5 Minimum Pad .022" www.mccsemi.com NOTE