MMSZ5221B - MMSZ5259B 500mW SURFACE MOUNT ZENER DIODE Features * * * * Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes E D SOD-123 A B Mechanical Data * * * * * G Case: SOD-123, Plastic Terminals: Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Marking: Date Code and Type Code Type Code: See Table on Page 2 Weight: 0.01grams (approx.) Maximum Ratings H C Dim Min Max A 3.55 3.85 B 2.55 2.85 C 1.40 1.70 D 3/4 1.35 E 0.55 Typical G J 0.25 H 0.15 Typical J 3/4 0.10 All Dimensions in mm @ TA = 25C unless otherwise specified Characteristic Forward Voltage Symbol Value Unit @ IF = 10mA VF 0.9 V Power Dissipation (Note 1) Pd 500 mW Thermal Resistance, Junction to Ambient Air (Note 1) RqJA 350 K/W Tj, TSTG -65 to +150 C Operating and Storage Temperature Range Notes: 3/4 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp 1.0ms. DS18010 Rev. E-2 1 of 3 MMSZ5221B - MMSZ5259B Electrical Characteristics @ TA = 25C unless otherwise specified Zener Voltage Range (Note 2) Test Current VZ @ IZT IZT Type Number Type Code Nom (V) Min (V) Max (V) mA MMSZ5221B C1 2.4 2.28 2.52 20 MMSZ5223B C3 2.7 2.57 2.84 MMSZ5225B C5 3.0 2.85 MMSZ5226B G1 3.3 3.14 MMSZ5227B G2 3.6 MMSZ5228B G3 MMSZ5229B G4 MMSZ5230B Maximum Zener Impedance Maximum Reverse Leakage Current ZZK @ IZK = 0.25mA IR mA V 30 1200 100 1.0 20 30 1300 75 1.0 3.15 20 30 1600 50 1.0 3.47 20 28 1600 25 1.0 3.42 3.78 20 24 1700 15 1.0 3.9 3.71 4.10 20 23 1900 10 1.0 4.3 4.09 4.52 20 22 2000 5.0 1.0 G5 4.7 4.4 7 4.94 20 19 1900 5.0 2.0 MMSZ5231B E1 5.1 4.85 5.36 20 17 1600 5.0 2.0 MMSZ5232B E2 5.6 5.32 5.88 20 11 1600 5.0 3.0 MMSZ5233B E3 6.0 5.70 6.30 20 7 1600 5.0 3.5 MMSZ5234B E4 6.2 5.89 6.51 20 7 1000 5.0 4.0 MMSZ5235B E5 6.8 6.46 7.14 20 5 750 3.0 5.0 MMSZ5236B F1 7.5 7.13 7.88 20 6 500 3.0 6.0 MMSZ5237B F2 8.2 7.79 8.61 20 8 500 3.0 6.5 MMSZ5238B F3 8.7 8.27 9.14 20 8 600 3.0 6.5 MMSZ5239B F4 9.1 8.65 9.56 20 10 600 3.0 7.0 ZZT @ IZT W @ VR MMSZ5240B F5 10 9.50 10.50 20 17 600 3.0 8.0 MMSZ5241B H1 11 10.45 11.55 20 22 600 2.0 8.4 MMSZ5242B H2 12 11.40 12.60 20 30 600 1.0 9.1 MMSZ5243B H3 13 12.35 13.65 9.5 13 600 0.5 9.9 MMSZ5245B H5 15 14.25 15.75 8.5 16 600 0.1 11 MMSZ5246B J1 16 15.20 16.80 7.8 17 600 0.1 12 MMSZ5248B J3 18 17.10 18.90 7.0 21 600 0.1 14 MMSZ5250B J5 20 19.00 21.00 6.2 25 600 0.1 15 MMSZ5251B K1 22 20.90 23.10 5.6 29 600 0.1 17 MMSZ5252B K2 24 22.80 25.20 5.2 33 600 0.1 18 MMSZ5254B K4 27 25.65 28.35 5.0 41 600 0.1 21 MMSZ5255B K5 28 26.60 29.40 4.5 44 600 0.1 21 MMSZ5256B M1 30 28.50 31.50 4.2 49 600 0.1 23 MMSZ5257B M2 33 31.35 34.65 3.8 58 700 0.1 25 MMSZ5258B M3 36 34.20 37.80 3.4 70 700 0.1 27 MMSZ5259B M4 39 37.05 40.95 3.2 80 800 0.1 30 Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp 1.0ms. DS18010 Rev. E-2 2 of 3 MMSZ5221B - MMSZ5259B 0.6 PD, POWER DISSIPATION (W) 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) Fig. 1 Power Dissipation vs Ambient Temperature DS18010 Rev. E-2 3 of 3 MMSZ5221B - MMSZ5259B