Multilayer Polymer Film (MLP) X7R Ceramic (MLC)
✔ Stable under voltage Cap drops 40% at 100 volts bias
✔ Stable under AC voltage DF increases with AC voltage
✔ Chip is plastic with good TCE Body is ceramic which cracks
✔ Stable over temperature DF increases at low temperature
✔ No aging mechanism Cap drops per decade hour
✔ Resilient under thermal shock Ceramic body cracks easily
✔ Self-clearing thin electrodes Thick film electrodes fail short
✔ Stable under mechanical stress Piezoelectric voltage sensitive
✔ Ultra Low ESR Low ESR
✔ Dissipation Factor ≤ 1% Dissipation Factor ≤ 2.5%
TYPICAL CHARACTERISTICS
The following graphs contrast important characteristics of MLP Capsticks to MLC ceramic units in
typical, dynamic converter conditions. The electrical stability of the MLP capacitor is clear.
MULTILAYER POLYMER CAPACITORS
MLP Capacitor Advantages over Ceramics
• Ultra Low ESR • High Frequency
• High Ripple Current • Long Life
Paktron specializes in Ultra Low ESR multilayer
polymer film capacitors and leads in Film-Chip
and SMT designs. Paktron has been manufactur-
ing film capacitors for over 50 years. Paktron
holds in excess of seventyfive patents for film
capacitors and machine design.
Capacitors featured are:
Angstor® Miniature Radial
Capstick® Lead-Framed MLP
Surfilm® Surface Mount Chip
Quencharc® R-C Network/Snubber
The metallized electrode used in Paktron’s propri-
etary Interleaf® Technology process assures reli-
able performance. Multilayer Polymer (MLP)
surface mount, chip and lead framed capacitors
are replacing MLC (ceramic) capacitors in higher
voltage and reliability-sensitive equipment. This
includes the popular -48 volt telecom bus, off-
line HVAC and PFC front ends.
Today, the fastest-growing market segment that
Paktron serves is Power Conversion for industries
such as Telecommunications/Datacom, military
infrastructure, automotive, medical and high-
end industrial. The 100 volt rated MLP film capac-
itor is becoming the part of choice for input/out-
put filtering in -48 volt telecom bus power appli-
cations (on-board or dc/dc modules). The MLP
capacitor provides improved stability, both elec-
trically and mechanically, compared to multilayer
ceramics. The MLP features “non-shorting” opera-
tion and does not crack like large ceramic blocks.
ESR vs. Frequency
Dissipation Factor vs Vrms
120 Hz ESR vs. Temperature
Capacitance vs DC Bias
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Vrms (AC Volts @ 1KHz)
CapstickX7R Z
5U
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0 %DF
-100.00
-80.00
-60.00
-40.00
-20.00
0.00
050100 150200 250300 350400
DC Bias (volts)
Capstick X7R
% Cap. Change
ESR (ohms)
2
0
-55-40 -20025 45 65 85 105125
4
6
8
10
Capstick X7R
Temperature (°C )
Frequency
ESR (milliohms)
10
1
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz10 MHz
100
1000
10000
Capstick X7R
PAGE 2 www.paktron.com
Metallized PET-SMD (Low Shrinkage Polyester) dielectric — MLP Capacitor Styles
Category Series Case Style Lead Style Voltages Capacitance Page
(V) (µF)
Category Series Case Style Lead Style Voltages Capacitance Page
(V) (µF)
Metallized PET (Polyester) dielectric with series resistor (snubber network)
Ordering/Part Number Information
Example:
405 K 100 CS4 G _ _
Suffix: A two-letter suffix may be added by the factory to denote special
construction and/or RoHS (Pb-Free) status.
Lead Style or Packaging: G = Gull-wing lead, T = Tape/Reel
Product Type: Identifies the basic capacitor design and lead spacing. Includes resistor
value for Type Q/QRL.
DC Voltage Rating: Expressed in hundreds of volts, except for Type Q/QRL, which is
expressed in two digit voltage code.
Capacitance Tolerance: J = ±5%, K = ±10%, M = ±20%
Capacitance: Expressed in picofarad code. The first two digits are the significant figures, the third digit is
the number of zeros following. (i.e. 405 = 4000000 pF = 4.0 µF)
Premier Line of Film Capacitors
Angstor RA Taped Radial 100 - 500 0.1 - 10.0 4
Capstick CS Epoxy coated Lead frame 50 - 500 0.33 - 20.0 10
Capstick CB Shell Lead frame 100 2.0 - 10.0 12
Capstick CB-FS Shell Lead frame 100 - 500 0.47 -10.0 13
Surfilm ST Chip Surface mount 100 1.0 - 2.2 16
Quencharc Q/QRL Epoxy coated Radial 200 - 1600 0.1 - 1.0 18
Soldering Guidelines 20
Paktron System Summary 22
Paktron RoHS Position Statement 23
www.paktron.com PAGE 3
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
PAGE 4 www.paktron.com
100 VDC / 80 VAC
PF
Code
Value
µF
L
MAX
T
MAX
H
MAX
S
±.02 (.5) dMax dv/dt
(V/µs) Case Part
Number
224 0.22 0.350 (8.9) 0.155 (3.9) 0.280 (7.1) 0.295 (7.5) 0.025 (.6) 75 RA3 224K100RA3 _ _
474 0.47 0.350 (8.9) 0.180 (4.6) 0.305 (7.7) 0.295 (7.5) 0.025 (.6) 65 RA3 474K100RA3 _ _
105 1.0 0.450 (11.4) 0.175 (4.4) 0.285 (7.2) 0.394 (10) 0.025 (.6) 35 RA4 105K100RA4 _ _
225 2.2 0.350 (8.9) 0.250 (6.3) 0.350 (8.9) 0.295 (7.5) 0.025 (.6) 25 RA3 225K100RA3 _ _
225 2.2 0.450 (11.4) 0.205 (5.2) 0.285 (7.2) 0.394 (10) 0.025 (.6) 25 RA4 225K100RA4 _ _
335 3.3 0.450 (11.4) 0.250 (6.3) 0.350 (8.9) 0.394 (10) 0.025 (.6) 25 RA4 335K100RA4 _ _
405 4.0 0.450 (11.4) 0.200 (5.1) 0.380 (9.7) 0.394 (10) 0.032 (.8) 20 RA4 405K100RA4 _ _
505 5.0 0.450 (11.4) 0.220 (5.6) 0.480 (12.2) 0.394 (10) 0.032 (.8) 20 RA4 505K100RA4 _ _
106 10.0 0.650 (16.5) 0.260 (6.6) 0.460 (11.7) 0.591 (15) 0.032 (.8) 13 RA6 106K100RA6 _ _
250 VDC / 160 VAC
PF
Code
Value
µF
L
MAX
T
MAX
H
MAX
S
±.02 (.5) dMax dv/dt
(V/µs) Case Part
Number
104 0.1 0.450 (11.4) 0.160 (4.1) 0.255 (6.5) 0.394 (10) 0.025 (.6) 100 RA4 104K250RA4 _ _
224 0.22 0.450 (11.4) 0.190 (4.8) 0.305 (7.7) 0.394 (10) 0.025 (.6) 75 RA4 224K250RA4 _ _
334 0.33 0.450 (11.4) 0.250 (6.3) 0.330 (8.4) 0.394 (10) 0.025 (.6) 75 RA4 334K250RA4 _ _
474 0.47 0.450 (11.4) 0.210 (5.3) 0.305 (7.7) 0.394 (10) 0.025 (.6) 55 RA4 474K250RA4 _ _
474 0.47 0.650 (16.5) 0.230 (5.8) 0.340 (8.6) 0.591 (15) 0.032 (.8) 50 RA6 474K250RA6 _ _
105 1.0 0.650 (16.5) 0.240 (6.1) 0.340 (8.6) 0.591 (15) 0.032 (.8) 35 RA6 105K250RA6 _ _
• Efficient size
• Rugged construction
• Does not fail short – Self healing
• Low ESR/ESL
• No entrapped moisture or air in self-encased design
• No dissimilar metals to chemically degrade or attract
moisture
• High dv/dt
• Wave solderable
• Operating temperature range: –55°C to +125°C
• Made in U.S.A.
RA
Capacitor Type
Electrical
Schematic
Non-polarized
Dimensions in inches, metric (mm) in parenthesis.
Tolerance: K (±10%) standard, J (±5%) available
RoHS part number information:
No suffix indicates RoHS-5 compliant standard part number. RoHS-5 product does not contain five of the RoHS banned materials (Hg,
CrVI, Cd, PBB and PBDE) in levels exceeding the industry defined limits. Component lead wires are plated with Sn / Pb and match con-
ventional SnPb board assembly requirements.
For a RoHS-6 compliant part, add a –FA suffix. RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB,
PBDE and Pb) in levels exceeding the industry defined limits. Component lead wires are plated with Sn.
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
www.paktron.com PAGE 5
400 VDC / 250 VAC
PF
Code
Value
µF
L
MAX
T
MAX
H
MAX
S
±.02 (.5) dMax dv/dt
(V/µs) Case Part
Number
224 0.22 0.650 (16.5) 0.230 (5.8) 0.340 (8.6) 0.591 (15) 0.032 (.8) 65 RA6 224K400RA6 _ _
474 0.47 0.650 (16.5) 0.290 (7.4) 0.440 (11.1) 0.591 (15) 0.032 (.8) 120 RA6 474K400RA6 _ _
500 VDC / 250 VAC
PF
Code
Value
µF
L
MAX
T
MAX
H
MAX
S
±.02 (.5) dMax dv/dt
(V/µs) Case Part
Number
504 0.5 0.650 (16.5) 0.280 (7.1) 0.540 (13.7) 0.591 (15) 0.032 (.8) 120 RA6 504K500RA6 _ _
Tolerance: K (±10%) standard, J (±5%) available
RoHS part number information:
No suffix indicates RoHS-5 compliant standard part number. RoHS-5 product does not contain five of the RoHS banned materials (Hg, CrVI, Cd, PBB and PBDE)
in levels exceeding the industry defined limits. Component lead wires are plated with Sn / Pb and match conventional SnPb board assembly requirements.
For a RoHS-6 compliant part, add a –FA suffix. RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB, PBDE and Pb) in levels
exceeding the industry defined limits. Component lead wires are plated with Sn.
Dimensions in inches, metric (mm) in parenthesis.
Electrical
Capacitance Range:
0.1 µF to 10.0 µF @ 1KHz
Tolerance:
Available in ± 5%, 10% (standard), 20%
Voltage Range:
100, 250, 400, 500 VDC
Dissipation Factor:
≤ 1.0 % @ 25°C, 1KHz
Insulation Resistance:
≥ 1,000 Megohms x µF
Need not exceed 1,000 Megohms
Rated Voltage ≤ 100 VDC > 100 VDC
Test Voltage 10 VDC 100 VDC
Dielectric Strength:
1.6 x RVDC, 2 seconds max.
(Bold P/Ns) 1.3 x RVDC, 2 seconds max.
Self Inductance:
2 to 6nh typical
Temperature Range:
-55°C to 125°C @ rated DC voltage
(Bold P/Ns) –55°C to 125°C,
derate voltage 1.25% / °C above 85°C
Performance
Accelerated DC Voltage Life Test:
1,000 Hours, 85°C, 1.25 × Rated VDC
∆ C/C ≤ 5%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 1,000 Megohm x µF
Need not exceed 1,000 Megohms
Moisture Test:
85°C / 85% RH / 21 days
Applied Voltage: zero bias
∆ C/C ≤ 7%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 30% of initial limit
Long Term Stability:
After 2 years storage, standard environment
∆ C/C ≤ 2%
Physical
Vibration:
Mil Std 202 Method 204D
Solder Resistance:
260°C, 5 Sec. ∆ C/C ≤ 2%
Construction:
Non-inductively constructed with metallized
polyester dielectric (polyethylene terephthal-
ate). Parallel plate–multilayer polymer (MLP)
design.
Electrode:
Aluminum metallization
Case:
Polyester tape wrap
Marking:
Parts are continuously marked and pf
code. Capacitance, tolerance and working
voltage are printed on container.
Packaging:
Bulk Packaging Standard
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
PAGE 6 www.paktron.com
Angstor® Capacitor Application Notes
Paktron developed the highly advanced Interleaf® Technology
method of capacitor manufacturing to improve device electri-
cal properties and stability in actual use conditions. As
opposed to the conventional winding method, Interleaf®
Technology uses a high laminating pressure, linear stacking
technology. The resulting capacitor chip is a construction
hybrid resembling a multilayer ceramic capacitor in cross sec-
tion, while offering all the fail-safe advantages of a stacked
plastic film capacitor. We refer to the resultant parts as MLP or
multilayer polymer. The Angstor® Capacitor (or RA Style) is a
self-encased, metallized film capacitor which features small
size, high dv/dt capability and very low ESR at high frequency.
Intended for thru-hole and wired applications, the units fea-
ture all aluminum electrodes and terminals that are pulse
welded to the lead wires. The units are back impregnated with
a microcrystalline polymer sealant, and require no external
coatings for moisture protection. The internal layers are heav-
ily laminated to eliminate air from the core material which
improves high frequency response compared to competitive
units. Operating temperature limit is extended to125ºC.
The following are a few examples of applications wherein the
Angstor’s unique features have proven desirable:
HIGH FREQUENCY SWITCHING POWER INPUTS
As the modern power converter broke the 100 KHz switching
frequency barrier, the ripple voltage and RFI control compo-
nents changed drastically. On the input side of 48 volt con-
verters, a low ESR and ESL capacitor is needed in the pi filter
network to control EMI generated by the switching MOSFET.
Metallized film capacitors should be used because of the volt-
age bias and due to the unit’s ability to “clear” during a high
voltage event, rather than short out like a common MLC
capacitor. Electrolytic (aluminum and tantalum) capacitors are
not useful because of their extremely high parasitic resistance
and inductance. Under ripple voltage the Angstor is stable,
while ceramic capacitors increase in loss factor, creating incre-
mental I2R losses.
LINE AND DATA LINE NOISE SUPPRESSION
A ≥ 250V Angstor will not lose value due to the bias voltage
and can be used on higher voltage lines as a differential noise
bypass for RFI control. High input dv/dt up to 100 volts per
micro second can be handled. In modems, the Angstor is a
space efficient alternative to other input current control devic-
es. Since the capacitor body is “plastic” there exists no piezo-
electric emf due to input di/dt.
EMI/RFI SUPPRESSION
Noise suppression is required on a variety of motors and field
effect devices close to the offending source to minimize RFI on
the voltage bus. Noise or transients emanating from switched
state motors or inductors require a low ESR capacitor as part of
the filtering arrangement. The Angstor is an excellent choice
for these 12, 36 and 48 volt bus-rails because of its small size
compared to other film capacitors and better ESR and reliabil-
ity than ceramic capacitors. As the automotive bus voltage
rises from 12 to 36/42 volts, this technology will replace many
ceramic and tantalum capacitors because of its enhanced volt-
age coefficient (stability).
A significant new market is in on-board converters to charge
batteries in EV and HEV applications.
GRACEFUL AGING
There exists no chemical interactions within the MLP Capacitor
to effect long term life. The parts are suitable for 10 to 20 year
life applications due to their stability and inherently low loss.
The polymer dielectric becomes more crystalline over long
periods of time, which can gradually lower the capacitance
value. The thin-film metallized electrodes are capable of “self
healing” under high voltage events. This feature avoids the
shorting, cracking and rapid heat generation problem often
found in ceramic capacitors.
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
www.paktron.com PAGE 7
Typical Performance Curves
Comparison of Multilayer Polmer (RA) vs. Multilayer Ceramic (X7R)
100 KHz10 KHz1 KHz100 Hz
X7R-MLC
RA
-4
-2
0
2
Capacitance Change (%)
Capacitance Change vs. Frequency
RA
X7R-MLC
125105856545250-20-40-55
-10
-5
0
5
10
Capacitance Change (%)Capacitance Change (%)Capacitance Change (%)
Capacitance Change vs. Temperature
Capacitance Change vs. AC Volts
0
01 23
45
1
2
3
DF(%)
RA
X7R-MLC
6
5
4
3
2
1
0-55 -40 -20 025456585 105 125
RA
X7R-MLC
DF (%)
Dissipation Factor vs. Temperature
Dissipation Factor vs. AC Volts (1 KHz)
Capacitance vs. Time (Aging)
0
1
2
3
4
100 Hz 1 KHz 10 KHz 100 KHz
DF (%)
RA
X7R-MLC
Dissipation Factor vs. Frequency
0
-20
0
+20
123
RA
X7R-MLC
10
100
10 1000 10000
100000
0
-10
RA
X7R-MLC
-10
-20
-30
-40
0
-50 02040 60 80 100
RA
X7R-MLC
Capacitance Change vs. DC Bias
Frequency
Temperature (˚C)
AC Voltage (Vrms)
Temperature (˚C)
Frequency
AC Voltage (Vrms)
Time (Hrs.)
DC Bias (volts)
Capacitance Change (%)
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
PAGE 8 www.paktron.com
10,000
1000
100.0
10.00
10.00
100.0
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz
10 MHz
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance Z (Ω)
ESR (Ω)
1000
100.0
10.00
10.00
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance Z (Ω)
ESR (Ω)
Frequency
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz 10 MHz
10,000
1000
100.0
10.00
10.00
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance
ESR
Impedance Z (Ω)
ESR (Ω)
Frequency
Impedance
ESR
Impedance
ESR
Impedance
ESR
Impedance
ESR
Impedance
ESR
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz 10 MHz
1000
100.0
10.00
10.000
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance Z (Ω)
ESR (Ω)
Frequency
Frequency
Frequency
Frequency
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz 10 MHz
10,000
1000
100.0
10.00
10.00
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance Z (Ω)
ESR (Ω)
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz
10 MHz
10,000
1000
100.0
10.00
10.00
1.000
0.100
0.010
1.000
0.100
0.010
0.001
Impedance Z (Ω)
ESR (Ω)
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz
10 MHz
Impedance & ESR vs. Frequency
Impedance & ESR vs. Frequency
Impedance & ESR vs. Frequency
Impedance & ESR vs. Frequency
Impedance & ESR vs. Frequency
Impedance & ESR vs. Frequency
1.0 µF 100 VDC RA4 0.47 µF 250 VDC RA4
1.0 µF 250 VDC RA63.3 µF 100 VDC RA4
2.2 µF 100 VDC RA4 0.47 µF 400 VDC RA6
Typical Performance Curves
Selected High Value “Power” Capacitors
Type RA Angstor®Capacitor
Metallized Polyester (PET) Dielectric
www.paktron.com PAGE 9
0
.
001
0
.
01
0
.
10
1
.
00
10
.
00
.
1000
0
.
001
0
.
01
0
.
10
1
.
00
10
.
00
1
MHz
1
0
KH
z
100
KHz
1
KHz
1
00
H
z
1
0
MHz
0
.
001
0
.
01
0
.
10
1
.
00
.
.
0
.
01
0
.
10
1
.
00
10
.
00
100
.
0
0
.
001
1
MHz
1
0
KHz 100 KHz
1
KH
z
1
00
Hz 10
MHz
0
.
001
0
.
01
0
.
10
1
.
00
10
.
00
.
1000
0
.
001
0
.
0
1
0
.
10
1
.
00
10
.
00
1
MH
z
10
KH
z
1
00 KHz
1
KH
z
100
Hz
1
0
MH
z
0
.
00
1
0
.
01
0
.
10
1
.
00
.
100
.
0
0
.
001
0
.
0
1
0
.
10
1
.
00
10
.
00
1
MHz
10
KHz
1
00
KH
z
1
KHz
1
00
H
z10
MHz
Maximum RMS Voltage & Current vs Frequenc
y
M
aximum RMS Voltage & Current vs Frequenc
y
3
35K100RA4 (3.3
µ
F RA4 MLP)
1
06K100RA6 (10.0
µ
F RA6 MLP
)
Maximum RMS Voltage & Current vs Frequenc
y
M
aximum RMS Voltage & Current vs Frequenc
y
405K100RA4 (4.0
µ
F RA4 MLP)
1
05K250RA6 (1.0
µ
F RA6 MLP
)
Maximum RMS Voltage & Current vs Frequenc
y
M
aximum RMS Voltage & Current vs Frequenc
y
505K100RA4 (5.0
µ
F RA4 MLP)
4
74K400RA6 (0.47
µ
F RA6 MLP
)
1
MHz
1
0
KH
z1
00
KHz1
KH
z1
00
H
z1
0
MH
z
0
.
001
0
.
01
0
.
10
1
.
00
10
.
00
0
.
001
0
.
01
0
.
10
1
.
00
10
.
00
.
0
.
001
0
.
01
0
.
10
1
.
00
.
1
MH
z
10 KHz 1
00
KHz
1 KHz
100 Hz 10 MHz
0
.
001
0
.
01
0
.
10
1
.
00
.
100
.
0
Voltage (rms)
Current (rms)
Frequency
Vrms
Irms
Voltage (rms)
Current (rms)
Vrms
Irms
Voltage (rms)
Current (rms)
Vrms
Irms
Voltage (rms)
Current (rms)
Vrms
Irms
Voltage (rms)
Current (rms)
Vrms
Irms
Voltage (rms)
Current (rms)
Vrms
Irms
3.3 µF 100 VDC RA4 10.0 µF 100 VDC RA6
5.0 µF 100 VDC RA4
1.0 µF 250 VDC RA6
4.0 µF 100 VDC RA4
0.47 µF 400 VDC RA6
Typical Performance Curves
Selected High Value “Power” Capacitors
PAGE 10 www.paktron.com
Type CS4/CS6 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
205 2.0 0.500 (12.7) 0.250 (6.3) 0.450 (11.4) 0.009 8.3 3 Thru-hole CS4 205K100CS4 _ _
205 2.0 0.500 (12.7) 0.250 (6.3) 0.450 (11.4) 0.009 8.3 3 SMD CS4G 205K100CS4G _ _
405 4.0 0.500 (12.7) 0.250 (6.3) 0.450 (11.4) 0.007 11.5 3 Thru-hole CS4 405K100CS4 _ _
405 4.0 0.500 (12.7) 0.250 (6.3) 0.450 (11.4) 0.007 11.5 3 SMD CS4G 405K100CS4G _ _
475 4.7 0.500 (12.7) 0.250 (6.3) 0.525 (13.3) 0.006 12.2 3 Thru-hole CS4 475K100CS4 _ _
475 4.7 0.500 (12.7) 0.250 (6.3) 0.525 (13.3) 0.006 12.2 3 SMD CS4G 475K100CS4G _ _
685 6.8 0.500 (12.7) 0.250 (6.3) 0.700 (17.8) 0.005 13.7 5 Thru-hole CS4 685K100CS4 _ _
685 6.8 0.500 (12.7) 0.250 (6.3) 0.700 (17.8) 0.005 13.7 5 SMD CS4G 685K100CS4G _ _
106 10.0 0.500 (12.7) 0.250 (6.3) 0.995 (25.3) 0.003 15.3 7 Thru-hole CS4 106K100CS4 _ _
106 10.0 0.500 (12.7) 0.250 (6.3) 0.995 (25.3) 0.003 15.3 7 SMD CS4G 106K100CS4G _ _
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
105 1.0
0.700 (17.8) 0.300 (7.5) 0.440 (11.2) 0.012 5.2 3 Thru-hole CS6 105K250CS6 _ _
105 1.0
0.700 (17.8) 0.300 (7.5) 0.440 (11.2) 0.012 5.2 3 SMD CS6G
105K250CS6G _ _
100 VDC / 80 VAC
250 VDC / 160 VAC
50 VDC / 35 VAC
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
106 10.0 0.500 (12.7) 0.320 (8.1) 0.620 (15.7) 0.003 15.3 5 Thru-hole CS4 106K050CS4 _ _
106 10.0 0.500 (12.7) 0.320 (8.1) 0.620 (15.7) 0.003 15.3 5 SMD CS4G 106K050CS4G _ _
206 20.0 0.500 (12.7) 0.320 (8.1) 1.150 (29.2) 0.0025 17.8 9 Thru-hole CS4 206K050CS4 _ _
206 20.0 0.500 (12.7) 0.320 (8.1) 1.150 (29.2) 0.0025 17.8 9 SMD CS4G 206K050CS4G _ _
Non-polarized
Electrical
Schematic
• Surface mount capability
• Ideal for high frequency switching
power supplies and DC to DC
converters
• Low ESR/ESL
• High ripple current/
High capacitance
• Operating temperature range:
–55°C to 125°C
• Volumetrically efficient
• Made in U.S.A.
Voltage Ratings Note:
Like all film capacitors, Capstick capacitors have “true” voltage ratings and unlike other
dielectric systems require no voltage deratings for maximizing reliability (MTBF) or use
life. With FIT rates of well under 5 FIT when used at rated voltage, these units provide
only a positive contribution to circuit MTBF calculations.
Circuit designers requiring 500 volt ratings in other dielectric systems for their 370 volt
input applications are being penalized by that system’s inherent deficiencies. In the film
capacitor industry if a device is rated at a certain voltage, then the device is designed to
be fully functional and reliable at that voltage for the life of the equipment. Many lead-
ing edge circuit designs take advantage of a film capacitor’s inherent reliability at rated
voltage to both reduce board size and improve performance.
Capacitor Types
CS4
CS6
Ceramic Capacitor Replacements
www.paktron.com PAGE 11
Type CS4/CS6 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
400 VDC / 250 VAC
500 VDC / 250 VAC
Tolerance: K (±10%) standard
RoHS part number information:
No suffix indicates RoHS-5 compliant standard part number. RoHS-5 product does not contain five of the RoHS banned materials (Hg, CrVI, Cd, PBB and PBDE) in
levels exceeding the industry defined limits. Component lead frame pin-outs are plated with Sn / Pb and match conventional SnPb board assembly requirements.
For a RoHS-6 compliant part, add a –FA suffix. RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB, PBDE and Pb) in levels
exceeding the industry defined limits. Component lead wires are plated with Sn.
Dimensions in inches, metric (mm) in parenthesis.
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
334 0.33 0.700 (17.8) 0.320 (8.1) 0.435 (11.0) 0.012 6.0 3 Thru-hole CS6 334K400CS6 _ _
334 0.33 0.700 (17.8) 0.320 (8.1) 0.435 (11.0) 0.012 6.0 3 SMD CS6G 334K400CS6G _ _
474 0.47 0.700 (17.8) 0.320 (8.1) 0.460 (11.7) 0.011 6.2 3 Thru-hole CS6 474K400CS6 _ _
474 0.47 0.700 (17.8) 0.320 (8.1) 0.460 (11.7) 0.011 6.2 3 SMD CS6G 474K400CS6G _ _
105 1.0 0.700 (17.8) 0.320 (8.1) 0.880 (22.4) 0.008 9.5 7 Thru-hole CS6 105K400CS6 _ _
105 1.0 0.700 (17.8) 0.320 (8.1) 0.880 (22.4) 0.008 9.5 7 SMD CS6G 105K400CS6G _ _
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
474 0.47 0.700 (17.8) 0.320 (8.1) 0.625 (15.9) 0.011 6.2 4 Thru-hole CS6 474K500CS6 _ _
474 0.47 0.700 (17.8) 0.320 (8.1) 0.625 (15.9) 0.011 6.2 4 SMD CS6G 474K500CS6G _ _
105 1.0 0.700 (17.8) 0.320 (8.1) 1.135 (28.8) 0.008 9.5 8 Thru-hole CS6 105K500CS6 _ _
105 1.0 0.700 (17.8) 0.320 (8.1) 1.135 (28.8) 0.008 9.5 8 SMD CS6G 105K500CS6G _ _
Electrical
Capacitance Range:
0.33 µF to 20.0 µF @ 1KHz
Tolerance:
Available in K (±10%) standard
Voltage Range:
50, 100, 250, 400, 500 VDC
Dissipation Factor:
≤ 1.0 % @ 25°C, 1KHz
Insulation Resistance:
≥ 1,000 Megohms x µF
Need not exceed 1,000 Megohms.
Rated Voltage ≤ 100 VDC >100 VDC
Test Voltage 10 VDC 100 VDC
Temperature Coefficient:
+6% from –55°C to 85°C
Dielectric Strength:
1.3 x rated voltage for 50/100/250/500
volt ratings.
1.6 x rated voltage for 400 volt rating
Self Inductance:
< 6nH (Typical) CS6
< 4nH (Typical) CS4
Temperature Range:
-55°C to 125°C , derate voltage 1.25% / °C
above 85°C for 50/100/250 volt ratings.
-55°C to 125°C, with no voltage derating for
400/500 volt ratings.
Performance
Accelerated DC Voltage Life Test:
1,000 Hours, 85°C, 1.25 × Rated VDC
∆ C/C ≤ 5%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 1,000 Megohm × µF
Need not exceed 1,000 Megohms
Moisture/Humidity Test:
85°C / 85% RH / 21 days
Applied Voltage: zero bias
∆ C/C ≤ 7%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 30% of initial limit
Long Term Stability:
After 2 years storage, standard environment
∆ C/C ≤ 2%
Physical
Vibration:
Mil Std 202 Method 204D
Solder Resistance:
Thru-hole wave: 260°C, 5 Sec. ∆ C/C ≤ 2%
SMD reflow: 220°C, 30 Sec. ∆ C/C ≤ 2%
Construction:
Non-inductively constructed with
metallized polyester dielectric (polyethylene
terephthalate). Parallel plate–multilayer
polymer (MLP) design.
Electrode: Aluminum metallization.
Case:
UL94V-0 rated epoxy coating
Lead Frame Material:
Tinned Cu Alloy Lead Frame
Lead Spacing:
.400” (10.0mm) nominal CS4
.600” (15.0mm) nominal CS6
Marking:
type, capacitance code, tolerance
code, voltage and date code
Packaging:
Anti-static tube. SMD units dry packed with
desiccant in moisture barrier bag. JEDEC
level on package.
PAGE 12 www.paktron.com
Type CB4 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
Capacitor Type
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
405 4.0 0.500 (12.7) 0.250 (6.3) 0.450 (11.4) 0.007 11.5 3 SMD CB4G 405K100CB4G _ _
475 4.7 0.500 (12.7) 0.250 (6.3) 0.525 (13.3) 0.006 12.2 3 SMD CB4G 475K100CB4G _ _
106 10.0 0.500 (12.7) 0.250 (6.3) 0.995 (25.3) 0.003 15.3 7 SMD CB4G 106K100CB4G _ _
• Ideal for 48 volt bus input & output
• Low impedance (ESR/ESL) construction
• Self healing—Avoids shorts
• The reliable solution to ceramic and tantalum capacitor
faults at elevated voltage
• Made for >100KHz switching power trains and reflected
RFI
• Flat surface for pick and place
• Surface mount capability
• Operating temperature range:
–55°C to 125°C
• High ripple current/High capacitance
• Volumetrically efficient
• Made in U.S.A.
Second Generation High Frequency Switching Power
Supply Capacitors
CB4G
Non-polarized
Electrical
Schematic
Dimensions in inches, metric (mm) in parenthesis.
Tolerance: K (±10%) standard
RoHS part number information:
No suffix indicates RoHS-5 compliant standard part number. RoHS-5 product does not contain five of the RoHS banned materials (Hg, CrVI, Cd, PBB and PBDE) in
levels exceeding the industry defined limits. Component lead frame pin-outs are plated with Sn / Pb and match conventional SnPb board assembly requirements.
For a RoHS-6 compliant part, add a –FA suffix. RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB, PBDE and Pb) in lev-
els exceeding the industry defined limits. Component lead wires are plated with Sn.
100 VDC / 80 VAC
Electrical
Capacitance Range:
2.0 µF to 10.0 µF @ 1KHz
Tolerance:
Available in K (±10%) standard
Voltage Range:
100 VDC
Dissipation Factor:
≤ 1.0 % @ 25°C, 1KHz
Insulation Resistance:
≥ 1,000 Megohms x µF
Need not exceed 1,000 Megohms.
Rated Voltage ≤ 100 VDC
Test Voltage 10 VDC
Temperature Coefficient:
+6% from –55°C to 85°C
Dielectric Strength:
1.3 x rated voltage
Self Inductance:
< 4nH (Typical) CB4
Temperature Range:
-55°C to 125°C , derate voltage 1.25% / °C
above 85°C
Performance
Accelerated DC Voltage Life Test:
1,000 Hours, 85°C, 1.25 × Rated VDC
∆ C/C ≤ 5%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 1,000 Megohm × µF
Need not exceed 1,000 Megohms
Moisture/Humidity Test:
85°C / 85% RH / 21 days
Applied Voltage: zero bias
∆ C/C ≤ 7%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 30% of initial limit
Long Term Stability:
After 2 years storage, standard
environment ∆ C/C ≤ 2%
Physical
Construction:
Non-inductively constructed with metallized
polyester dielectric (polyethylene terephthal-
ate). Parallel plate–multilayer polymer (MLP)
design. Electrode: Aluminum metallization.
Case:
UL94V-0 rated premolded shell
Lead Frame Material:
Tinned Cu Alloy
Vibration:
Mil Std 202 Method 204D
Solder Resistance:
Thru-hole wave: 260°C, 5 Sec. ∆ C/C ≤ 2%
SMD reflow: 220°C, 30 Sec. ∆ C/C ≤ 2%
Lead Spacing:
.400” (10.0mm) nominal CB4
Marking:
type, capacitance code, tolerance
code, voltage and date code
Packaging:
Tape/Reel. 13” reel. 250 pcs/reel. Units dry
packed with desiccant in moisture barrier
bag. IPC/JEDEC J-STD-20 Moisture sensitivity
Level: MSL 4.
www.paktron.com PAGE 13
Type CB4 / CB6 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
Capacitor Type
PF
Code
Value
µF
W
MAX
T
MAX
L
MAX
ESR
@500 KHz
(Ω)
RMS
Current
@500 KHz
(A)
# Leads
per side
Lead
Configuration Case
Part
Number
405 4.0 0.500 (12.7) 0.350 (8.89) 0.525 (13.3) 0.007 11.5 3 SMD CB4G 405K100CB4G-FS
475 4.7 0.500 (12.7) 0.350 (8.89) 0.525 (13.3) 0.006 12.2 3 SMD CB4G 475K100CB4G-FS
106 10.0 0.500 (12.7) 0.350 (8.89) 0.995 (25.3) 0.003 15.3 7 SMD CB4G 106K100CB4G-FS
474 0.47 0.700 (17.78)
0.460 (11.68)
0.625 (15.88) 0.011 6.2 4 SMD CB6G 474K500CB6G-FS
• Ideal for 48 volt bus input & output
• Low impedance (ESR/ESL) construction
• Self healing—Avoids shorts
• The reliable solution to ceramic and tantalum capacitor
faults at elevated voltage
• Made for >100KHz switching power trains and reflected
RFI
• Flat surface for pick and place
• Surface mount capability
• Operating temperature range:
–55°C to 125°C
• High ripple current/High capacitance
• Volumetrically efficient
• Made in U.S.A.
3rd Generation, Thermally Shielded Capstick® Capacitor
Type CB4G-FS / CB6G-FS for Pb-Free Soldering
CB4G-FS
CB6G-FS
Non-polarized
Electrical
Schematic
Dimensions in inches, metric (mm) in parenthesis.
Tolerance: K (±10%) standard
RoHS part number information:
No suffix indicates RoHS-5 compliant standard part number. RoHS-5 product does not contain five of the RoHS banned materials (Hg, CrVI, Cd, PBB and PBDE) in
levels exceeding the industry defined limits. Component lead frame pin-outs are plated with Sn / Pb and match conventional SnPb board assembly requirements.
For a RoHS-6 compliant part, add a –FS suffix. RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB, PBDE and Pb) in levels
exceeding the industry defined limits. Component lead wires are plated with Sn.
100 VDC / 80 VAC
500 VDC /250 VAC
Electrical
Capacitance Range:
0.47 µF to 10.0 µF @ 1KHz
Voltage Range:
100 VDC
Dissipation Factor:
≤ 1.0 % @ 25°C, 1KHz
Insulation Resistance:
≥ 1,000 Megohms x µF
100 VDC Rating: Test Voltage=10 VDC
500 VDC Rating: Test Voltage=100 VDC
Dielectric Strength:
100 VDC Rating: 130 VDC for 2 seconds max.
500 VDC Rating: 650 VDC for 2 seconds max.
Temperature Range:
100 VDC Rating: -55°C to 125°C , derate
voltage 1.25% / °C above 85°C.
500 VDC Rating: -55°C to 125°C , no derating
Performance
Accelerated DC Voltage Life Test:
1,000 Hours, 85°C, 1.25 × Rated VDC
∆ C/C ≤ 5%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 1,000 Megohm × µF
Moisture/Humidity Test:
85°C / 85% RH / 21 days
∆ C/C ≤ 7%
DF ≤ 1.0%, 1KHz, 25°C
IR ≥ 30% of initial limit
Long Term Stability:
After 2 years storage, standard
environment ∆ C/C ≤ 2%
Physical
Construction:
Non-inductively constructed with metallized
polyester dielectric (polyethylene terephthal-
ate). Parallel plate–multilayer polymer (MLP)
design.
Electrode: Aluminum metallization.
Case:
UL94V-0 rated premolded shell
Lead Frame Material:
Tinned Cu Alloy
Vibration:
Mil Std 202 Method 204D
Peak Reflow:
245°C max.
Solder Resistance:
245°C, 30 Sec. ∆ C/C ≤ 2%
Marking:
type, capacitance code, tolerance
code, voltage and date code
Packaging:
Tape/Reel. 13” reel. 250 pcs/reel. Units dry
packed with desiccant in moisture barrier
bag. IPC/JEDEC J-STD-20 Moisture sensitivity
Level: MSL 4.
PAGE 14 www.paktron.com
Type CS4/CS6/CB4/CB6 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
Miniaturized pass filters made possible by
high frequency switching technology
need small but low ESR and ESL capacitors
to attenuate ripple and reflected RFI over
wide frequency bands. With equivalent
series resistance approaching zero, non-
polar MLP Capacitors reliably sink high
ripple currents in high density converters,
run cool and are stable.
The trend toward distributed power man-
agement and modular power converters has
driven the development of high efficiency,
low profile power train components. The
conventional capacitors historically used in
ripple filtering applications are either too
large or not suitable for popular methods of
surface mounting. Electrolytic capacitors,
while size efficient, do not provide the
desired, stable electrical characteristics and
reliability. Large value multilayer ceramic
capacitors are notoriously fragile, expensive
and unstable over voltage and temperature
extremes. A novel but proven capacitor tech-
nology, built upon selected manufacturing
techniques of multilayer ceramic and
stacked, plastic film capacitors is now the
preferred choice. Now film capacitor reliabil-
ity can be found in chip and block shaped
MLP capacitors that approach the board
space sizes of X7R, MLC (Ceramic) types.
These unique multilayer polymer capacitors
(MLP's) offer excellent electrical stability
under AC and DC current loads and are not
subject to the cracking, shorting or TC mis-
match inherent in Ceramic (MLC) capacitor
products. They are suitable as input and
output filter capacitors in megahertz fre-
quency switching converters, high power
ballasts and inverter drives at ambient tem-
peratures from -55° C to 125° C.
ULTRA LOW IMPEDANCE CONSTRUCTION
Figure 1 illustrates the multiple stacking
technique used to make the MLP structures
and the cross section which highlights simi-
larities to stacked film and MLC construc-
tion. An all aluminum electrode and termi-
nation construction results in a low resis-
tance and high current connection. The
terminations are gathered to multiple pin
lead frames for lowest ESR and ESL current
handling. Low loss and frequency stable,
ultra thin polyethylene-terephthalate poly-
mer film is used as the dielectric.
DRIVEN BY HIGH FREQUENCY POWER
CONVERSION APPLICATIONS
The trend in power conversion is the
increase in switching frequency to mini-
mize the size of the magnetic and filter
components and boost the wattage per
unit volume. Driven by portable comput-
ers and the distributed power approaches
of both telecom and computer systems,
switching frequencies have risen from 20
kilohertz to between 400 KHz and 1 mega-
hertz in high density power converters.
The filter capacitors have become an
important issue as low impedance and
equivalent series resistance are needed for
reliable high frequency current handling.
The MLP Capstick Capacitor can increase
the series current of the converter which
translates into higher wattage density at
maximum efficiency.
NOTES ON USABILITY AND RELIABILITY
Because of the use of the well known PET
dielectric in ultra thin sheet, the reliability
of these capacitors is far better than the
industry experience with electrolytic or
ceramic capacitors. There exists no capaci-
tance drop or aging with time. The dissipa-
tion factor is stable over time. The insula-
tion resistance tends to get better under
the influence of heat and voltage. We have
shown that in-circuit problems are evident
immediately and usually the result of mis-
handling or overheating during mounting
assembly. There exist no metal leaching or
dielectric diffusion mechanisms to affect
the reliability over time. A complete reli-
ability data package on this and other
quality MLP capacitor styles may be
obtained by contacting Paktron.
MOUNTING OPTIONS
The Capstick can be conditioned for sur-
face mounting (including IR Reflow). Leads
can be trimmed to a dimension for butt or
through-hole mounting, or configured as
gull wing leads. See Appendix for Capstick
soldering guidelines.
Figure 1
CS/CB Surface Mount Pad Layout
Typical Recommendations
Low ESR, Multilayer Polymer (MLP) Capacitors
Ceramic Capacitor Replacements
Part Number Number of Leads per Side A
Left
Right
0.565”4474K500CS6G, 474K500CB4G-FS
105K500CS6G
334K400CS6G
8
3
0.565”
0.565”
474K400CS6
G3
0.565”
105K400CS6G 7 0.565”
205K100CS4G, 3 0.365”
405K100CS4G, 405K100CB4G, 405K100CB4G-FS 3 0.365”
475K100CS4G, 475K100CB4G, 475K100CB4G-FS 3 0.365”
685K100CS4G 50.365”
106K100CS4G, 106K100CB4G, 106K100CB4G-FS 7 0.365”
106K050CS4
G5
0.365”
206K050CS4G 9 0.365”
Left Right
0.110”
0.040"- 0.060"
A0.110”
0.100”
Note: All left side capacitor leads are
joined in common internal to the
capacitor and all right side capacitor
leads are also joined in common internal
to the capacitor
www.paktron.com PAGE 15
Type CS4/CS6/CB4/CB6 Capstick®Capacitor
Metallized Polyester (PET) Dielectric
MAXIMUM RMS CURRENT (AMPS)
VS. FREQUENCY
Value Rated
µF VDC 1 KHz 10 KHz 100 KHz 500 KHz 1MHz
0.47 500 0.8 1.9 3.9 6.2 7.1
1.0 500 1.1 2.4 5.9 9.5 10.6
0.33 400 0.7 1.3 3.5 6.0 6.9
0.47 400 0.8 1.9 3.9 6.2 7.0
1.0 400 1.1 2.4 5.9 9.5 10.5
1.0 250 0.7 1.6 3.3 5.2 5.9
2.0 100 0.4 2.6 6.0 8.3 8.9
4.0 100 1.9 4.2 10.2 11.5 12.0
4.7 100 2.0 4.5 10.8 12.2 12.6
6.8 100 2.9 6.6 12.5 13.7 14.0
10.0 100 4.3 9.9 14.1 15.3 15.6
10.0 50 4.2 9.7 14.0 15.3 15.6
20.0 50 9.3 13.3 16.7 17.8 18.0
MAXIMUM RMS VOLTAGE
VS. FREQUENCY
Value Rated
µF VDC 1 KHz 10 KHz 100 KHz 500 KHz 1MHz
0.47 500 250 64 13.1 4.2 2.4
1.0 500 176 38 9.4 3.0 1.6
0.33 400 250 64 17.2 6.9 4.0
0.47 400 250 64 13.1 4.2 2.4
1.0 400 176 38 9.4 3.0 1.6
1.0 250 94 24 5.0 1.6 0.9
2.0 100 35 21 4.7 1.3 0.7
4.0 100 35 18 4.2 1.0 0.4
4.7 100 35 18 3.7 0.8 0.3
6.8 100 35 18 2.9 0.6 0.3
10.0 100 35 18 2.2 0.5 0.3
10.0 50 35 18 2.2 0.5 0.2
20.0 50 35 18 1.3 0.3 0.1
10000
1000
100
10
110MHz
1KHz 10KHz 100KHz 1MHz
Frequency
Impedance (milliohms)
10F
15F
20F
CS4 50 VDC
10000
1000
100
10
110MHz
1KHz 10KHz 100KHz 1MHz
Frequency
Impedance (milliohms)
4F
4.7F
6.8F
10F
CS4/CB4 100 VDC
2F
10000
1000
100
10
110MHz
1KHz 10KHz 100KHz 1MHz
Frequency
Impedance (milliohms)
.33F
.47F
1F
CS6 400/500 VDC
10000
1000
100
10
1
100Hz 1KHz 10KHz 100KHz 1MHz 100H
Frequency
ESR (milliohms)
10F
15F
20F
CS4 50 VDC
10000
1000
100
10
1
100Hz 1KHz 10KHz 100KHz 1MHz
Frequency
ESR (milliohms)
4F
2F
4.7F
6.8F
10F
CS4/CB4 100 VDC
10000
1000
100
10
1
100Hz 1KHz 10KHz 100KHz 1MHz 100H
Frequency
ESR (milliohms)
1F
.33F
.47F
CS6 400/500 VDC
TYPICAL IMPEDANCE VS. FREQUENCY
TYPICAL ESR VS. FREQUENCY
TYPICAL APPLICATIONS
Load
Input
Output Filter
Vin
Vout
High Voltage
Input Filter
AC Input
VDC
AC & Quasi AC Input Filter
L
C
T
Q
Low Pass Filter
CS/CB Performance Characteristics over a range of -55°C to +85°C
Very High Ripple Current
PAGE 16 www.paktron.com
Type ST Surflim®Capacitor
Metallized Polyester (PET) Dielectric
st
Capacitor Type
T
W
L
0.025" ± 0.015"
• Pb free machined terminations
• Multilayer metallized polymer
surface mount chips
• EIA Chip sizes
• Reflow solderable
• Made in U.S.A.
Lead Frame Pins
Thickness 0.010" ±0.005"
Width 0.020" ±0.005"
Pitch 0.100" ±0.015"
Height 0.025" ±0.015"
# of Pins 2
T
W
L
ST2824/ST3827
CHIP STYLE
ST3/ST4
Lead Frame Style
A
B
C
Recommended Pad Sizes (inches)
Case Code A B C
ST2824/ST3 0.210 0.365 0.275
ST3827/ST4 0.310 0.465 0.305
T
0.025" ± 0.015"
L
S
PF
Code
Value
µF
L T
MAX
W
MAX
Case Part
Number
105 1.0 0.280 - 0.305 (7.1 – 7.7) 0.175 (4.4) 0.256 (6.5) ST2824 105K100ST2824T
225 2.2 0.380 - 0.405 (9.6 – 10.3) 0.200 (5.1) 0.286 (7.3) ST3827 225K100ST3827T
100 VDC / 80 VAC
100 VDC / 80 VAC
Dimensions in inches, metric (mm) in parenthesis.
Dimensions in inches, metric (mm) in parenthesis. RoHS-5 Compliant
RoHS-6 Compliant
RoHS-6 product does not contain any of the six RoHS banned materials (Hg, CrVI, Cd, PBB, PBDE and Pb) in levels
exceeding the industry defined limits
RoHS-5 product does not contain five of the RoHS banned materials
(Hg, CrVI, Cd, PBB, and PBDE) in levels
exceeding
the industry defined limits. Component lead frame pin-outs are plated with Sn /Pb and match conventional SnPb
board assembly requirements
PF
Code
Value
µF
L T
MAX
W
MAX
Case Part
Number
105 1.0 0.280 - 0.310 (7.1 – 7.9) 0.175 (4.4) 0.256 (6.5) ST3 105K100ST3T
225 2.2 0.380 - 0.410 (9.6 – 10.4) 0.200 (5.1) 0.286 (7.3) ST4 225K100ST4T
Non-polarized
Electrical
Schematic
www.paktron.com PAGE 17
Type ST Surflim®Capacitor
Metallized Polyester (PET) Dielectric
Electrical
Capacitance Range
1.0 & 2.2µF @1KHz
Voltage Range
100 VDC
Tolerance
±10% (K)
Dissipation Factor
≤1.0% @ 1KHz
Insulation Resistance
≥ 1K MegOhms x µF,
measured after 1 minute of
electrification at 10 VDC
Dielectric Strength
1.3 x Rated Voltage
Temperature Coef.
+6.0% from -55°C to 85°C (typical)
Dielectric Absorption
0.30% (typical)
Self Inductance
6.0nH (typical) ST2824/ST3
9.0nH (typical) ST3827/ST4
Physical
Construction
Non–inductively constructed with metal-
lized polyester dielectric (polyethylene
terephthalate). Parallel plate–multilayer
polymer (MLP) design. Electrode:
Aluminum metallization
ST2824/ST3827
Chip Style
Tin-based solderable surface
ST3/ST4
Lead Frame Style
Tin Cu Alloy Lead Frame,
“I” lead configuration for SMD
butt joint mounting
Enclosure
Self-encased
Marking
Parts are not marked.
Capacitance code, tolerance and rated
voltage are printed on container.
Temperature Range
-55°C to 125°C, derate
voltage 1.25% / °C above 85°C
Packaging
Tape/Reel
Dry packed with dessicant in moisture bar-
rier bag. JEDEC level on package.
Quantity per reel
ST2824 1200
ST3827 850
ST3 800
ST4 700
Solder Attachment
Yes No
Conductive Reflow √
Convection Reflow √
IR Reflow √
Soldering Iron (220°C) √
Wave Solder √
See Soldering Guidelines Spec. for details.
Performance
Accelerated DC Voltage Life Test:
Test Conditions
Temperature 85°C ±5°C
Applied Voltage 1.25 x Rated Voltage
Test Duration 1000 hours
Performace Requirements
Capacitance delta of ≤ 5.0%
Dissipation Factor ≤ 1.00%
Insulation Resistance > 50% of specifica-
tion
Humidity:
Test conditions
Temperature 85°C ± 5°C
Applied Voltage Zero voltage
Humidity 85%
Test Duration 21 days
Performance Requirements
Capacitance delta of ≤ 7.0%
Dissipation Factor ≤1.00%
Insulation Resistance ≥ 50% of specifica-
tion
Solderability (Convection Reflow):
Test Conditions
Solder Temperature 220°C +0°C, -10°C
Test Duration 30 seconds ±1
Performance Requirements
Capacitance delta of ≤ 5.0%
Terminal Adhesion:
0.5 Kg through hole in substrate, centered.
Solder fillets ≥ 1/3 T, 5 seconds with no
damage.
Long Term Stability:
≤ 2.0% over two years at a temperature of
between 0°C and 35°C and a RH of between
35% and 65%.
Convection Reflow Profile (Typical)
Impedance & ESR vs Frequency
ST2824/ST3 100VDC 1.0
µ
F (Typical)
Impedance & ESR vs Frequency
ST3827/ST4 100VDC 2.2 µF (Typical)
Maximum RMS Current
ST2824/ST3 1.0 µF & ST3827/ST4 2.2 µF (Typical)
Surfilm® Capacitors Type ST Performance Characteristics
IR Reflow Profile (Typical)
Frequency
10 KHz 100 KHz 1 MHz
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Amps
1.0 mF
2.2 mF
1000
100.0
10.00
1.000
0.100
0.010
0.001
Ohms
Impedance
ESR
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz
10 MHz
Frequency
10,000
1000
100.0
10.00
100 Hz 1 KHz 10 KHz 100 KHz 1 MHz
10 MHz
1.000
0.100
0.010
0.001
Ohms
Frequency
Impedance
ESR
200
150
100
50
0
250
300
Temperature (C)
Time (Seconds)
0 30 60 90 120 150 180 210 240 270 300
200
150
100
50
0
250
300
Temperature (C)
Zones
0 1 2 3 4 5
PAGE 18 www.paktron.com
Type Q/QRL Quencharc®Capacitor
RC Snubber Network
VOLTAGE WAVEFORM
UNSUPPRESSED
100V/div .1ms/div
SUPPRESSED
100V/div .5ms/div
CURRENT WAVEFORM
UNSUPPRESSED
100V/div .1ms/div
SUPPRESSED
100V/div .1ms/div
Q/QRL
Arc Suppressor
Snubber Network
UL/CSA version
PF
Code
Value
µF
Voltage
VDC/VAC
Type Ohms
±10% Watt L
MAX
T
MAX
H
MAX
D
Typical
Part
Number
104 0.1 600 / 250 QC 22 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC22
104 0.1 600 / 250 QC 47 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC47
104 0.1 600 / 250 QC 100 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC100
104 0.1 600 / 250 QC 150 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC150
104 0.1 600 / 250 QC 220 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC220
104 0.1 600 / 250 QC 330 0.5 1.08 (27.4) 0.39(9.9) 0.66 (16.7) 0.82 (20.8) 104M06QC330
104 0.1 1200 / 480 QH 39 2.0 1.60(40.6) 0.64(16.3) 1.04(26.4) 1.29(32.7) 104M48QH39
104 0.1 1600 / 660 QV 39 2.0 2.18(55.3) 0.54(13.7) 1.00(25.4) 1.80(45.7) 104M66QV39
254 0.25 600 / 250 QD 22 0.5 1.45(36.8) 0.42(10.6) 0.75(19.0) 1.20(30.5) 254M06QD22
254 0.25 600 / 250 QD 47 0.5 1.45(36.8) 0.42(10.6) 0.75(19.0) 1.20(30.5) 254M06QD47
254 0.25 600 / 250 QD 100 0.5 1.45(36.8) 0.42(10.6) 0.75(19.0) 1.20(30.5) 254M06QD100
254 0.25 600 / 250 QD 150 0.5 1.45(36.8) 0.42(10.6) 0.75(19.0) 1.20(30.5) 254M06QD150
504 0.5 600 / 250 QE 22 0.5 1.45(36.8) 0.59(15.0) 0.92(23.4) 1.20(30.5) 504M06QE22
504 0.5 600 / 250 QE 47 0.5 1.45(36.8) 0.59(15.0) 0.92(23.4) 1.20(30.5) 504M06QE47
504 0.5 600 / 250 QE 100 0.5 1.45(36.8) 0.59(15.0) 0.92(23.4) 1.20(30.5) 504M06QE100
504 0.5 600 / 250 QE 150 0.5 1.45(36.8) 0.59(15.0) 0.92(23.4) 1.20(30.5) 504M06QE150
504 0.5 200 / 125 QA 22 0.5 1.08(27.4) 0.37(9.4) 0.64(16.3) 0.82(20.8) 504M02QA22
504 0.5 200 / 125 QA 47 0.5 1.08(27.4) 0.37(9.4) 0.64(16.3) 0.82(20.8) 504M02QA47
504 0.5 200 / 125 QA 100 0.5 1.08(27.4) 0.37(9.4) 0.64(16.3) 0.82(20.8) 504M02QA100
504 0.5 200 / 125 QA 220 0.5 1.08(27.4) 0.37(9.4) 0.64(16.3) 0.82(20.8) 504M02QA220
105 1.0 200 / 125 QB 22 0.5 1.45(36.8) 0.39(9.9) 0.66(16.7) 1.20(30.5) 105M02QB22
105 1.0 200 / 125 QB 47 0.5 1.45(36.8) 0.39(9.9) 0.66(16.7) 1.20(30.5) 105M02QB47
UL/CSA Recognized Across-the-Line Application Note: Complies with UL1414 / CSA-C22.2 No.1
104 0.1 125 VAC QRL 150 0.5 1.08(27.4) 0.44(11.18) 0.66(16.7) 0.82(20.8) 104MACQRL150
104 0.1 125 VAC QRL 680 0.5 1.08(27.4) 0.44(11.18) 0.66(16.7) 0.82(20.8) 104MACQRL680
Type QRL: UL Recognized for 125 VAC across-the-line. UL File No. E33628
CSA Certified for 125 VAC across-the-line. CSA File No. LR32208
Dimensions in inches, metric (mm) in parenthesis.
Non-polarized
Electrical
Schematic
Energy Efficient Noise Suppression
• Relay contact protection • Noise reduction on controllers/drivers
• dv/dt suppression on thyristor and triacs • EMI/RFI reduction
• No lag time in suppression • Available voltages: 125 VAC - 660 VAC
• Type QRL – UL/CSA version • RoHS-6 Compliant
www.paktron.com PAGE 19
Type Q/QRL Quencharc®Capacitor
RC Snubber Network
The most popular and commonly used method of arc
suppression is to connect a resistor-capacitor network
as shown in Figures A and B. The preferred method of
connection is across the contacts it wants to protect.
However, the network can be hooked across the load,
as is shown by the dashed line, when all inductance of
the load circuit is considered lumped together.
When the contacts open, the voltage across the
uncharged capacitor is zero and the transient voltage
starts charging the capacitor. In the meantime, the gap
of the contact is steadily widened, and by the time the
capacitor is charged to its full potential, the contact
gap is widened well beyond the minimum breakdown
potential of air, thus preventing the arcing. When the
contact closes, the inrush current from the capacitor
may damage the contact, and here resistance is
needed to limit the maximum current to Eo/Rc during
the contact closure.
The induced voltage on opening the contact is:
and, as can be seen, the larger the value of a series
resistor, the higher the induced voltage.
On the other
hand, the lower series resistance makes the current
on contact closure higher. The time dependence of
the voltage is given by:
and the rate of voltage change, which is important in
transient suppression of triac switching, is:
Equation 3 tells us that by knowing the circuit
conditions with given values of L and coil resistance
that limit the current prior to contact opening, the
rate of voltage rise is inversely proportional to
capacitance. In other words, the larger the
capacitance, the greater is the transient suppression.
However, when the contact closes, the additional
energy stored in the capacitor has to be discharged
through the contact. Hence, a compromise has to be
made in the selection of both resistance and
capacitance.
In an effort to provide a simple answer to designers’
requests for proper values of resistance and
capacitance, some relay manufacturers came out
with empirical formulas and nomographs. For
instance, C.C. Bates1 gives the equations:
where
C = capacitance in µ
F
I = load current in amperes prior to contact opening
R = resistance in ohms in series with capacitor
Eo = source voltage
The choice of resistance and capacitance value
however, is quite flexible. In fact, the choice is so
simple that one does not need a nomograph at all.
Besides, a nomograph published by a certain relay
manufacturer may be for the particular relays the firm
manufactures, not necessarily universal.
1Bates, C.C., “Contact Protection of Electro-
magnetic Relays.” Electro-mechanical Design,
August, 1966.
Eo
C
L RL
RC
Eo
C
L R
L
R
C
Figure A Figure B
HOW QUENCHARC® WORKS
OPERATING
TEMPERATURE RANGE –55°C to
+85°C at full rated voltage.
DISSIPATION FACTOR
The nominal dissipation factor is
determined from the
following equation:
DF = 2fCR + 0.006
where:
f = test frequency in hertz
C= nominal capacitance value in
farads
R = nominal value of series resistor
in Ω.
DIELECTRIC WITHSTANDING
VOLTAGE
Unit shall withstand a DC poten-
tial of 1.6 times the DC voltage
rating. Testing conducted at 25°C.
DC LIFE TEST
Unit shall withstand a test potential
of 125% of the rated voltage for a
period of 500 hours at a tempera-
ture of
85°C. A failure shall consist of:
• Capacitance change greater than 5%.
• Dissipation factor greater than origi-
nal limits.
LONG TERM STABILITY
The capacitance shall not change
more than 2% when stored at
ambient temperature and humidity
for a period of 2 years or less.
PHYSICAL
TOLERANCE
Capacitor ± 20%, Resistor
± 10%.
CONSTRUCTION*
Metallized polyester
capacitor in series with a carbon
composition resistor.
CASE
Coated with a UL94V-0 flame
retardant epoxy.
WIRE LEADS
#20 AWG (0.032") capacitor end.
Resistor end 0.025" to 0.032".
MARKING
, Quencharc®,
capacitance, resistance, voltage.
* 39Ω resistors are power wire-
wound
CHOOSING A QUENCHARC®
In choosing a Quencharc®, first of all, check the maximum switching current rating of the contacts to be
protected. This value differs for different types of contact materials and different types of relays. The maxi-
mum current during the contact closure with an RC network is Eo/Rc, where Eo is the source voltage and Rc is
the resistance value of the network. The quantity Eo/Rc must be lower than the maximum switching current
for obvious reasons. Next, the selection of capacitance is best done with an oscilloscope.
Connect the oscilloscope probe to the relay wiper and ground the other plate of the contact. Without an RC
network across the contacts, check the amplitude of the transient voltage on contact break and the ampli-
tude of the current on contact make. If the voltage is less than 300V and the current less than the maximum
switching current rating of the relay, and if you don’t see any arcing, you may not need the contact protection
at all. If you spot arcing, connect a 0.1 µF + 100, 250 VAC, QC100 (our most widely used Quencharc®), across
the contacts, and observe the levels of suppression, voltage on break and current on make. The suppressed
voltage should be below 250V, which provides 70 volts of safety margin from the breakdown potential of air.
If the voltage is still above 250V, try a 0.25 µF + 220 or a 0.5 µF + 330 range. If you need a higher capaci-
tance than 1.0 µF, you may be better off with a Zener or a varistor in terms of cost and space. For most relays
and triacs 0.1 µF + 100 provides a satisfactory suppression.
When protecting contacts in AC circuits, the same general guidelines as for DC circuits can be used, but the
wattage of the resistor must be considered if current flow is sustained for a long enough period of time to
heat the component. Compute the impedance of the RC unit to obtain a current value, then use I2R and time
considerations to determine whether the standard network resistor is adequate.
V = IRC = RC Eo
RL
dv = L di + (RL + RC) di + i
dt dt dt C
V(t) = L di + (RL +RC)i + Eo + 1
t idt
dt C °
(1)
(2)
(4)
(3)
C = I2 R = Eo
10 10I(1+ 50 )
Eo
PAGE 20 www.paktron.com
General
The Capstick and Surfilm capacitors Type CB, CS and ST use PET as the
film dielectric and have been thermally stabilized to withstand reflow
soldering temperatures for a maximum of 220°C for 30 seconds, with
1.5 minutes of allowable time at temperatures above 183°C., while
products with the "-FS" suffix can be reflow soldered at a maximum of
245°C for 30 seconds, with 1.5 minutes of allowable time at
temperatures above 217°C.
Dielectric Film
Type Name Code
CB polyethylene terephthalate PET
CS polyethylene terephthalate PET
ST polyethylene terephthalate PET
To prevent excessive changes to both the electrical and mechanical
characteristics, Paktron recommends that the following soldering
guidelines be observed when processing Capstick and Surfilm capacitors.
Pre-Conditioning
In case of high humidity storage and short cycle reflow soldering
profiles, it is recommended that the capacitors be pre-conditioned in an
85°C oven for a minimum of 12 hours prior to reflow soldering to
minimize any effects caused by the rapid vaporization of the moisture.
Solder Paste Thickness
Depending upon pad geometry, the recommended solder paste thickness
is .006" (6 mils) to .010" (10 mils). For optimum performance, 8 mils to 10
mils should be used. In the case where small pitch components do not
allow extra paste thickness, use of a "step screen" should be considered.
Board Attachment
Due to their low mass, it is recommended that for optimum soldering
results, Surfilm capacitors be spot glued to the substrate.
Maximum Solder Reflow Temperatures
Do not exceed the following temperatures:
Manufacturing
Solder Method
Maximum Temperature
CB CS ST "-FS"
Conductive Reflow 220°C 220°C 220°C 245°C
Convection Reflow 220°C 220°C 220°C 245°C
IR Reflow 220°C 220°C 220°C 245°C
Vapor Phase Reflow NA NA 220°C NA
Soldering Iron 220°C 220°C 220°C 245°C
Wave Solder NA NA NA NA
Wave Solder (thru-hole) 260°C 260°C NA 245°C
A
B
C
MLP Mounting Pad Layout
Typical Recommended
Capstick Surlm
Left
Left
Right
Right
0.110”
0.040"-0.060"
A
0.110”
0.100”
Note: All left side capacitor leads are joined in
common internal to the capacitor and all
right side capacitor leads are also joined in
common internal to the capacitor.
Recommended Pad Sizes (inches)
Case Code ABC
ST2824/ST3 0.210 0.365 0.275
ST3827/ST4 0.310 0.465 0.305
Soldering Guidelines Capstick® & Surfilm® Capacitors • Type CB, CS and ST
Board Cleaning
When cleaning the boards, avoid the use of alcohol based solvents.
These may cause a temporary drop in the insulation resistance of the
capacitor. The manufacturer's safety data sheet should also be studied
carefully before using any solvent.
Profile Criteria CB, CS, ST "-FS"
Average Ramp-Up Rate 3°C/second max 3°C/second max
Preheat:
Temperature Min 100°C 150°C
Temerature Max 150°C 200°C
Time 60 - 120 seconds 60 - 180 seconds
Time Above:
Temperature 183°C 217°C
Time 90 seconds 90 seconds
Peak Temperature 220°C 245°C
Time within 5°C of Peak 30 seconds 30 seconds
Ramp-Down Rate 6°C/seconds max 6°C/second max
Time from 25°C to Peak 360 seconds max 480 seconds max
Typical Convection Reow Solder Proles
0
50
100
150
200
250 245ºC
220ºC
300
0306090120 150 180 210 240 270 300 330 360
390
Time (Seconds)
Temperature (ºC)
Standard
“-FS”
www.paktron.com PAGE 21
Hand Soldering Surfilm Capacitors
The following hand soldering method has proven to be satisfactory
for soldering small quantities of Surfilm capacitors to printed circuit
pads.
Materials and Equipment:
a. Use a soldering iron that will control the iron tip temperature to
220°C maximum. The Weller EC 2002C Soldering station and the
EC1201P Iron will provide the temperature control needed
b. To reduce the heat exposure time, use a low temperature solder
alloy with a low residue solder flux.
c. For ease of handling, prevention of contamination and personal
injury, a pair of small tweezers should be employed to position the
units for hand soldering.
Procedure:
1. Flow a thin bead of solder to one printed circuit pattern.
2. Center the capacitor to be soldered on the printed circuit electrode
and place a small quantity of solder on the iron tip. Place the iron
point at the junction of the capacitor electrode and printed circuit
electrode and reflow the solder while applying a force to the top
surface of the capacitor so that it will seat flush against the printed
circuit pattern.
3. Clean the iron tip and apply the tip and solder to the opposite
printed circuit and capacitor electrode junction until the solder
wets the full length of the PC electrode and capacitor electrode.
Do not apply a force to the top of the capacitor when soldering the
second electrode.
4. Examine the first side soldered and repeat step 3 on the first side if
required. The first solder application of step 2 is to mechanically
position the capacitor on the board and hold it in place so that
both hands are free to apply both the solder and iron tip to the
second electrode. A full solder wetting may not be accomplished
in step 2.
Important Points In MLP Soldering
1. Reflow Temperature: The maximum reflow solder temperature for
capacitors made with PET based film dielectric is specified at
220°C. Type CB, CS and ST are made with low shrinkage PET dielec-
tric film that has been thermally stabilized to withstand reflow
soldering temperatures for a maximum of 220°C for 30 seconds,
with 1.5 minutes of allowable time at temperatures above 183°C.
The exception to this is product with the "-FS" suffix which is
capable of withstanding reflow soldering temperatures for a maxi-
mum of 245°C for 30 seconds, with 1.5 minutes of allowable time
at temperatures above 217°C. Typical reflow temperature profiles
are shown on the proceeding page. Exceeding the recommended
maximum temperature is one of the leading causes of soldering
problems. On Type ST Product, excessive reflow temperatures can
cause product swelling and shrinkage/curling of the white cover-
plates, which can lift the terminations out of the solder paste and
create a “drawbridge” condition that prevents complete soldering.
2. Solder Paste Thickness: While reliable solder joints have been
formed using paste thicknesses as low as 4 mils, for optimum per-
formance, 8 mils to 10 mils should be used.
3. Mounting Pad Sizes: The recommended pad size geometry is
shown on the proceeding page.
4. Board Attachment: Due to the low mass of the Type ST product, it
is recommended that the chips be spot glued to the substrate for
optimum soldering results.
5. Storage Conditions and Floor Life: The Capstick and Surfilm com-
ponent reel packaging from the factory is “dry pack.” Dry packing
involves sealing the reel of product with a desiccant inside a
moisture-barrier bag. This type of packaging provides moisture
protection for 12 months @ <40°C / <90% RH. The Floor Life or “out-
of-bag” exposure time is categorized according to the “JEDEC
Moisture-Sensitivity Level” specification. The Capstick and Surfilm
products meet “Level 4” which allows for “out-of-bag” exposure
time @ 30°C / 60% RH of 3 days (72 hours).
6. In the case of open exposure to high humidity storage, it is recom-
mended that the capacitors be pre-conditioned prior to reflow
soldering to minimize any effects caused by the rapid vaporization
of the moisture. The capacitors can be pre-conditioned either
while still in the reels and tubes @ 50°C for 48 hours or in bulk/
loose @ 85°C for 12 hours at <5% RH.
Capstick® & Surfilm® Capacitors • Type CB, CS and ST Soldering Guidelines
PAGE 22 www.paktron.com
Paktron System Summary
Company Overview
In existence since 1953, Paktron is one of the oldest capacitor manufacturers in
the US. Paktron is the technological leader in the manufacture of multilayer
polymer film capacitors and sells across diverse markets including automotive,
commercial, Hi-Rel, military, space, and telecommunications. As a quality con-
science company, Paktron follows the proven philosophy of building quality into
its products. Inherent quality provides for both long-term reliability as well as
outstanding product performance. Paktron’s longevity is testament to its com-
mitment to Quality.
Quality System Overview
Because of Paktron’s multi-industry sales markets, rather than attempting to
maintain registrations to each of the vast assortment of standardized qualty
sytems specific to each of these markets, since 1953 Paktron has utilized an ever
evolving, capacitor industry specific, documented quality system of its own
which equals or exceeds the requirements of market oriented, standardized
systems without the limitations imposed by market standardization. Paktron’s
Quality Assurance System is a full-featured system giving Paktron the ability to
produce the finest products possible. The system includes, but is not limited to:
1. Operator Training 8. Vender Qualification
2. Receiving Inspection 9. Material Review
3. Calibration 10. In-Process Inspections
4. Out-going Inspection 11. Surveillance Testing
5. Failure Analysis 12. Qualification Testing
6. Statistical Process Control 13. Reliability Testing
7. New Product/Process Authorization
Documentation System
The Paktron documentation system strictly follows the guidelines as outlined in
ISO-900x. The documentation system is separated into three different sections:
1) Procedure manuals: 2) General Procedures:
a) Quality Manual 3) Specification systems:
b) Document Control Procedures Manual a) Assembly Specifications
c) Accounting Procedures Manual b) Design Specifications
d) Engineering Procedures Manual c) Equipment
Specifications d) Material Specifications
e) Marketing and Sales Procedures Manual e) Process Specifications
f) Purchasing Procedures Manual f) Quality Specifications
g) Production Control Procedures Manual
h) Quality Control Procedures Manual
i) Shipping and Receiving Procedures Manual
j) Supplier Quality Assurance Procedures Manual
k) Test and Reliability Procedures Manuals
Statistical Process Control
Like many other manufacturers, in order to meet the changing quality needs of
its various customers, Paktron has long ago implemented a program of
Statistical Process Control (SPC). This program placed the responsibility for qual-
ity directly on the production operators who must build quality into the product
rather than trying to test defects out in the final test operations. This results in
the production of more consistent quality and performance products. Day-to-
day process control is being done with process control charts (X bar and R, per-
cent defective, histograms and range charts) with the Paktron QA department
moving into an overview function of doing trending analysis, process averaging,
specification compliance control, etc. Using these systems of certification, qual-
ity levels in the low PPMs becomes not just a goal, but a reality.
Reliability
Paktron's Quality Assurance does not end once the product has been shipped to
the customer. The long-term reliability of the product is as important as its initial
implementation. Theoretically, a well-designed, well-engineered, thoroughly
tested and properly applied component should "never" fail in operation (within
the life of the equipment). However, practical experience shows that even the
best design, manufacturing, and engineering efforts do not completely elimi-
nate the occurrence of "field" failures. Usually, field failure categories encoun-
tered in components are the "infantile", "random", and in the case of mis-appli-
cation, "wearout". Paktron eliminates the “infantile” category through extensive
testing and strict controls (QA/SPC). The "wearout" category is eliminated by
"guard-banding" the performance characteristics of the products and by main-
taining close contacts between the Paktron and customer Engineering groups.
"Random" failures occur after the infant mortality stage. They occur because of
"undetectable" weaknesses in the products. Although the time of occurrence of
random failures cannot be predicted, the probability of occurrence or non-
Failure Rate
Useful LifeEarly Life Wearout
Infant
Mortality
(Screenable)
Constant Random Failure Rate
(Inherent, NotScreenable)
End of Life
(Predictable)
Derating Useful
occurrence of such failures can be calculated by means of the theory of probabil-
ity. Paktron's reputation for "Quality" in the Industry is based not only on its
ability to eliminate "infantile" failures through strict QA controls, but also on
being able to minimize "random" failures through its SPC controls which
detects/eliminates heretofore "undetectable" weaknesses and significantly
increases the reliability of the product. Paktron’s film capacitors are so inherently
reliable that use life is measured in decades rather than hours of operation.
While Paktron’s own rigorous accelerated testing shows theoretical PPM failure
levels in the single digits, customer feedback consistently reports zero PPM fail-
ure levels.
Voltage Ratings
Like all polymer film capacitors, Paktron’s product offerings have “true” voltage
ratings and unlike other dielectric systems require no voltage de-ratings for
maximizing reliability (MTBF) or use life. With FIT rates of well under 5 FIT when
used at rated voltage, these capacitors provide a positive contribution to circuit
MTBF calculations.
Circuit designers requiring 500 volt ratings in other dielectric systems for their
370 volt input applications are being penalized by that dielectric system’s inher-
ent deficiencies. In the polymer film capacitor industry, if a capacitor is rated at
a certain voltage, then the capacitor is designed to be fully functional and reli-
able at that voltage for the life of the equipment. Many leading edge circuit
designs take advantage of a polymer film capacitor’s inherent reliability at rated
voltage to both reduce board size and significantly improve performance.
Material Content
Paktron’s product offerings neither contain nor are manufactured with any risk
level hazardous material. The material content for polymer film capacitors is
basically: polymer, aluminum, copper, tin, iron, microcrystalline polyolefin, trace
amounts of other materials such as antimony and lead and various non-toxic,
non-hazardous thermoplastics used for encasements. The polymers typically
used are polyethylene terephthalate (PET), polyethylene napthalate (PEN) and/
or polyphenylene sulfide (PPS). The products’ terminations are coated (tinned)
with either 60Sn-40Pb or 100% Sn to a thickness of 100-500 micro inches in
order to facilitate soldering without the possibility of whisker growth with the
100% Sn meeting current industry guidelines for lead-free (Pb-free) with a lead
(Pb) material content of under 0.1 wt% (1000ppm).
@ %RVDC and 40°C
50% 75% 100%
Angstor (RA) 0.0000 0.000030.00014
Capstick (CS, CB)0.0000 0.000100.00030
Surlm (ST) 0.0000 0.000300.00150
0.0000
0.0005
0.0010
0.0015
0.0020
0.0025
0.0030
0.0035
0.0040
0.0045
0.0050
50 60 70 80 90
100
% RVDC
% Failure Rate per 1000Hrs
Angstor
Capstick
Surfilm
www.paktron.com PAGE 23
RoHS Position Statement
RoHS-5
Standard Product
Angstor, Capstick and Surfilm (RA, RB, RS, CB, CS, ST3 and ST4):
I hereby certify that Paktron is in compliance with Directive 2002/95/
EC of the European Parliament and of the Council of 27 January 2003
on the use of certain hazardous substances in electrical and elec-
tronic equipment for all articles, products, materials and parts thereof
being supplied to Paktron’s target Sales markets on a RoHS-5 compli-
ance level and that the information submitted is true and accurate.
RoHS-5 means that the content of five RoHS banned materials (Hg,
CrVI, Cd, PBB and PBDE) are under the industry-defined limits stated
below. RoHS-5 compliant products have Pb in the termination (sec-
ondary interconnect: i.e. terminal leads and lead frames) and match
conventional SnPb board assembly requirements for those markets
exercising Pb solder exemptions. Exempt categories under RoHS cur-
rently include the Servers, Storage, Network and Telecom equipment,
Medical, Aerospace, Military and Automotive markets. While the ter-
minations contain Pb, the total unit Pb content of Paktron’s products
is under the industry-defined limits stated below.
RoHS-6
Standard Product
Quencharc and Surfilm (QA, QB, QC, QD, QE, QH, QRL, QV, ST2824
and ST3827):
I hereby certify that Paktron is in compliance with Directive 2002/95/
EC of the European Parliament and of the Council of 27 January 2003
on the use of certain hazardous substances in electrical and elec-
tronic equipment for all articles, products, materials and parts thereof
being supplied by Paktron on a full RoHS-6 compliance level and that
the information submitted is true and accurate. These Paktron prod-
ucts do not contain any of the six RoHS banned chemicals, com-
pounds or elements listed, in levels exceeding the industry-defined
limits stated below.
Special Lead-Free Product
Angstor, Capstick and Surfilm (RA, RB, RS, CB, CS, ST3 and ST4):
Subject to minimum order quantities and limited availability, I hereby
certify that Paktron is in compliance with Directive 2002/95/EC of the
European Parliament and of the Council of 27 January 2003 on the use
of certain hazardous substances in electrical and electronic equip-
ment for all articles, products, materials and parts thereof being sup-
plied by Paktron on a full RoHS-6 compliance level, on a specialized
part number basis (consisting of an added suffix of –F?; with the ?
assigned at time of order/quote), and that the information submitted
is true and accurate. Paktron’s special lead-free products do not con-
tain any of the six RoHS banned chemicals, compounds or elements
listed, in levels exceeding the industry-defined limits stated below
and also do not contain Pb in the terminations.
The maximum reflow temperature for surface mount product remains
at 220°C while the maximum wave solder temperature for thru-hole
product is 260°C. The maximum reflow temperature for surface mount
product with the “-FS” suffix is 245°C.
Chemical, Compound, or Element Content:
Maximum limit of 0.1% by weight (0.1w percent or 1000ppm):
• Polybrominated Diphenyl Ethers (PBDE); C12H(10–n)BrnO
Pentabromodiphenyl ether (PentaBDE) –
CAS number 32534-81-9; C12H5Br5O;
Octabromodiphenyl ether (OctaBDE) -
CAS number 32536-52-0; C12H2Br8O
Decabromodiphenyl ether (DecaBDE) –
CAS number 1163-19-5; C12Br10O
• Polybrominated Biphenyls (PBB)
Decabromobiphenyl (DeBBB) –
CAS number 13654-09-6; C12H(10–x-y)Brx+y
• Mercury – CAS number 7439-97-6; Hg
• Hexavalent Chromium – CAS number 18540-29-9; CrVI
• Lead – CAS number 7439-92-1; Pb
Maximum limit of 0.01% by weight (0.01w percent or 100ppm):
• Cadmium – CAS number 7440-43-9; Cd
Important Notice to Purchasers and Users All statements, technical information and recommendations are based on tests we believe to be reliable, but their accuracy or complete-
ness is not guaranteed. Buyer shall determine the suitability of the product for the intended use and Buyer and User assume all risk and liability of every kind. Any other statement or
recommendation shall not be binding or have any force unless in a separate written agreement signed by officers of Seller and Manufacturer. On all orders with special arrangements
we reserve the right to over -or short supply of 5% of the quantity ordered.
©2012 Paktron Capacitors
The Pancon Corporation, headquartered in Stoughton MA is comprised of three businesses;
Pancon Connectors, Ark-Les Connectors and Paktron Capacitors.
Pancon and Ark-Les Connectors manufacture custom and standard connectors that are used in power and signal
applications, while Paktron Capacitors multilayer polymer capacitors primarily serve power conversion applications,
Industries served include telecommunications/datacom, appliances, military, automotive, medical and industrial.