Bi-Directiona! Triode Thyristor 53 STUD/; lance Hermetic Triacs SC240 6A to 40A RMS_ Up to 600 Volts $Cc245 The triac is a silicon AC switch which may be gate triggered from an OFF- $C260 State to an ON-State for either polarity of applied voltage. These triacs are S$C265 hermetically sealed devices which incorporate General Electrics patented POWER-GLAS process that improves upon normal passivation techniques. It provides an intimate bond between the silicon chip and the glass coating. P RESS-F IT The resulting stable, low-level leakage current provides excellent performance nares and demonstrated reliability. c241 FEATURES: $C246 POWER-GLAS passivated silicon chip for maximum reliability. $C251 e Very low off-state (leakage) current at room and elevated temperatures. e Inherent immunity from non-repetitive transient voltage damage (max. Sc261 critical rate-of-rise of on-state current subsequent to voltage breakover triggering, di/dt = 10 A/usec.) SC266 e Low on-state voltage at high current levels. e Excellent surge current capability. e 1800 volts RMS Surge Isolation Voltage on Isolated Triacs. e Selected types available from factory for use where circuit requires operation: -- with popular zero voltage triggering ICs at 400 Hz with low gate trigger current -- at higher voltage levels at higher commutating dv/dt levels. SIX BASIC PACKAGES e Other packages available upon request. ISOLATED TO-3 FLANGE PRESS-FIT ISOLATED STUD =. With Press-on MT2 Terminal NON-ISOLATED STUD ISOLATED STUD With Solder Ring MT2 Terminal NON-ISOLATED TO-3 FLANGESTUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60,65 | SC241, 46, 51, 61, 66 MAXIMUM ALLOWABLE RATINGS RMS ON-STATE REPETITIVE PEAK PEAK ONE FULL CYCLE 2t FOR FUSING CURRENT OFF-STATE VOLTAGE, SURGE (NON-REP) ON-STATE FOR TIMES AT(3) TYPE It(Rms) (1) Vprm!?) CURRENT, Itsm AMPERES | (pms AMPERE)2| (RMS AMPERE)? AMPERES B D E M 50 Hz 60 Hz SECONDS, 1.0 | SECONDS, 8.3 VOLTS | VOLTS | VOLTS {| VOLTS | AMPERES AMPERES | MILLISECONDS | MILLISECONDS SC240/241 6 200 400 500 600 74 80 18 26.5 SC245/246 10 200 400 500 600 90 100 20 41.5 $C250/251 15 200 400 500 600 90 100 20 41.5 $C260/261 25 200 400 500 600 230 250 150 260.0 SC265/266 40 200 400 500 600 275 300 300 375.0 Peak Gate Power Dissipation, Pgy (4) SC240/8C241, $C245/SC246, SC250/SC251, SC260/SC261...........-.-. 10 Watts for 10 Microseconds (See Figure 5A) SC265/SC266 0. eee ees 10 Watts for 20 Microseconds (See Figure 5B) Average Gate Power Dissipation, Pg(avy---- ett tet terete tees 0.5 Watts Peak Gate Current, Igy (4) 0. et te ee en ne nes (See Figures 6A, 6B, 6C) Peak Gate Voltage, Vom (4). --. 00 cece ett eee (See Figures 6A, 6B, 6C) Storage Temperature, Tytg 200 ett eee teen t tt tee eens -40C to 125C Operating Temperature, Ty 3 C240/SC241, SC245/SC246. 2. ee en es -40C to +100C SC250/SC251, SC260/SC261, SC265/SC266 2... tt ete -40C to 115C Stud Torque (Isolated and Non-Isolated Stud Types). ....-.- 2-2 eee eee rere ees 25 Lb.-In. (29 Kg-Cm) (2.8 N-M) Insertion Pressure (Press-Fit Types)... 0.0.00 ee ete tee (3.56 N x 10%) 800 Lbs. (364 Kg) Surge Isolation Voltage (5)... ee tet ete tts 1800 Volts RMS CASE ON -STATE 92 4 MT. + 18 QUADRANT OFF STATE <=sSSs OFF STATE 3RD QUADRANT 3 GATE Ol ON-STATE MAIN TYPICAL CHARACTERISTICS TERMINAL VOLT-AMPERES TERMINAL ARRANGEMENT NOTES: 1. Iy(RMs) tatings apply for 50 and 60 Hz with 360 conduction and at case reference point (see outline drawings) temperature as indicated in the following chart: CASE REFERENCE POINT TEMPERATURE CHART . Stud/ Non-lsolated tsolated Device A RMS | press-Fit Isolated Stud TO-3 Flange | TO-3 Flange $C240/SC241 6 82C 80C 80C 79C S$C245/SC246 10 80C 78C 78C 76C C250/SC251 15 86C 83C 83C 80C SC260/SC261 25 g0c 75C 75C 71C SC265/SC266 40 81C TAC 74C 68C VpRM tatings apply for zero gate voltage only. Ratings apply for either polarity of main terminal 2 referenced to main terminal 1. t ratings apply for either polarity of main terminal 2 referenced to main terminal 1. Ratings apply for either polarity of gate terminal referenced to main terminal 1. Surge isolation voltage rating applies to isolated triacs only. Rating applies from main terminals 1, 2 and gate terminal to device mounting sutface. Test voltage is 50 or 60 Hz sinusoidal waveform applied for one minute. Rating applies over the entire device operating temperature range. VPYn 13941395 STUD/TO-3 FLANGE PRESS-FIT S$C240, 45, 50, 60,65 | SC241, 46, 51, 61, 66 CHARACTERISTICS TEST SYMBOL MIN. TYP. MAX. UNITS TEST CONDITIONS REF. NOTE Repetitive Peak Off- IpRM mA VprM = Maximum Allowable Repe- 1 State Current titive Peak Off-State Voltage Rating. ~ oe Gate Open Circuited. 8C240/SC241 _ _ 01 To = 425C SC245/SC246 _ _ 0.5 To = Ty (Max.) SC250/SC251 sC260/SC261 | ~ 02 | To = 425C SC265/SC266 _ = 1.0 To = Ty (Max.) Peak On-State Vim - = Volts To = +25C, Ipm = 1 msec., Wide 1 Voltage Pulse. Duty Cycle & 2%. $C240/SC241 _ = 1.83 Itm = 8.5A Peak $8C245/SC246 - 1.65 Itm = 14 A Peak $C250/S8C251 _ 1.65 I7m = 21 A Peak $C260/SC261 - = 1.58 Ipm = 35 A Peak $C265/SC266 _ 1.38 I~m = 56 A Peak Critical Rate-of-Rise dv/dt Volts/usec | To = Ty Max. Rated Vppm. Gate 1 of Off-State Voltage Open Circuited. Exponential Voltage (Higher Values May Waveform. Cause Device Switching.) SC240/S8C241 30 100 _ SC245/8C246 100 150 $C250/8C251 100 250 $C260/SC261 50 150 _ 8C265/SC266 50 150 - Critical Rate-of-Rise | dv/dt(c) Volts/usec | It(ams) = Rated Maximum Allow- 1,7 of Commutating able RMS On-State Current, Vppy = Off-State Voltage Maximum Rated Peak Off-State (Commutating dv/dt) Voltage. Gate Open Circuited. S$C240/SC241 4 = 8C245/SC246 4 ~ = S$C250/SC251 4 - S8C260/SC261 5 _ SC265/SC266 5 DC Gate Trigger Ier mAdc Vp = 12Vdc 2 Current TRIGGER MODE RL Tec rn so | MT2+ Gatet | 100 Ohms $C240/S8C241 _ 50 MT2 Gate | 100 Ohms | +25C 8C245/SC246 _ _ 50 MT2+ Gate 50 Ohms $C250/SC251 80 MT2+ Gate+ 50 Ohms $C260/SC261 80 MT2- Gate 50 Ohms | -40C _ 80 MT2+ Gate 25 Ohms on 80. | | MT2+ Gate+ | 100 Ohms - 80 MT2 Gate | 100 Ohms | +25C . 80 MT2+ Gate 50 Ohms $265/SC266 ~ 120 MT2+ Gatet 50 Ohms _ _ 120 MT2 Gate 50 Ohms | -40C = 120 MT2+ Gate 25 Ohms CONTINUED:STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60, 65 $C241, 46, 51, 61, 66 CHARACTERISTICS (Continued) TEST SYMBOL MIN. TYP. MAX. UNITS TEST CONDITIONS REF. NOTE DC Gate Trigger VoT Vde Vp = 12 Vdc 2 Voltage TRIGGER MODE Rv Tc 2.5 MT2+ Gatet+ 100 Ohms _ - 2.5 MT2 Gate | 100 Ohms | +25C ~_ _ 2.5 MT2+ Gate 50 Ohms 3.5 MT2+ Gatet 50 Ohms _ _ 3.5 MT2 Gate 50 Ohms | -40C 3.5 MT2+ Gate 25 Ohms DC Gate Non- Vep Vde 2,3 Trigger Voltage TRIGGER MODE Ru Te 0.2 _ _ MT2+ Gatet 0.2 _ _ MT2 Gate 1000 Max. 0.2 MT2+ Gate Ohms Ty 0.2 - _ MT2 Gatet+ DC Holding Current Iy mAdc Main Terminal Source Voltage = 24 1 Vdc. Peak Initiating On-State Current = 0.5Amps, 0.1 milliseconds to 10 milliseconds wide pulse. Gate Trigger Source = 7 Volts, 20 Ohms $C240/8SC241 | - - so |! To = 425C 8C245/8C246 } SC250/SC251 ~ ~ 4 100 Te = 40C sc260/sc261 | - 7 | To = +25C 8C265/SC266 _ 150 Tc = -40C DC Latching Ip mAdc Main Terminal Source Voltage = 24 2 Current Vdc. Gate Trigger Source = 15 Volts, 100 Ohms, 50 usec pulse width, 5 psec rise and fall times maximum. TRIGGER MODE Te _ - 100 MT2+ Gate - 100 MT2- Gate +25C _ _ 200 MT2+ Gate _ _ 200 MT2+ Gatet+ ~ _ 200 MT2- Gate -40C - 400 MT2+ Gate Steady State Rosa - - 45 C/Watt | Junction-to-Ambient 1,4 Thermal Resistance Steady State Reic c/Watt | Junction-to-Case. 1,5 Thermal Resistance This characteristic is useful as an ac- ceptance test at an incoming inspec- _ tion station. sc24o/sc241 [ ~ [280 [| Non-Isolated Stud/Press-Fit _ _ 2.95 Isolated Stud ~ 2.95 Non-Isolated TO-3 Flange oo _ _ 3.10 _ Isolated TO-3 Flange $C245/SC246 [200 [| Non-Isolated Stud/Press-Fit - _ 2.15 Isolated Stud _ 2.15 Non-Isolated TO-3 Flange oo. 2.30 Isolated TO-3 Flange $C250/S8C251 - _ 200) Non-Isolated Stud/Press-Fit _ _ 2.15 Isolated Stud _ 2.15 Non-Isolated TO-3 Flange _ ~ 2.30 Isolated TO-3 Flange CONTINUED: 1396CHARACTERISTICS (Continued) STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60, 65 $C241, 46, 51, 61, 66 TEST SYMBOL MIN. TYP. MAX, UNITS TEST CONDITIONS REF. NOTE $C260/SC261 Rgjc - 1.80 C/Watt | Non-Isolated Stud/Press-Fit 1,5 - 1.95 Isolated Stud _ _ 1.95 Non-Isolated TO-3 Flange _ 2.10 Isolated TO-3 Flange 8C265/SC266 _ _ 1.00 Non-Isolated Stud/Press-Fit _ 1.15 Isolated Stud _ ~ 1.15 Non-Isolated TO-3 Flange _ _ 1.30 Isolated TO-3 Flange Apparent Thermal Resc(ac) C/Watt | Junction-to-Case. 6 Resistance This characteristic is useful in the calculation of junction temperature rise above case temperature for AC current conduction. $C240/SC241 - 2.00 Non-Isolated Stud/Press-Fit _ _ 2.20 Isolated Stud _ _ 2.20 Non-Isolated TO-3 Flange - 2.40 Isolated TO-3 Flange S$C245/SC246 _ 1.50 Non-Isolated Stud/Press-Fit _ 1.65 Isolated Stud _ 1.65 Non-Isolated TO-3 Flange 1.80 Isolated TO-3 Flange S8C250/8C251 - 1.45 Non-Isolated Stud/Press-Fit _ _ 1.60 Isolated Stud _ 1.60 Non-Isolated TO-3 Flange _ _ 1.75 Isolated TO-3 Flange SC260/SC261 _ _ 1.25 Non-Isolated Stud/Press-Fit _ _ 1.40 Isolated Stud 1.40 Non-Isolated TO-3 Flange ~ _ 1.55 Isolated TO-3 Flange S8C265/8C266 0.80 Non-Isolated Stud/Press-Fit _ 0.95 Isolated Stud _ _ 0.95 Non-Isolated TO-3 Flange - 1.10 Isolated TO-3 Flange NOTES: 7, Values for these test conditions are: 1. Characteristic values apply for either polarity of main terminal 2 tati referenced to main terminal 1. Device Package core ing Te (PC) . : : inal f : inal 2 and 2, wate terminal 1 is the reference terminal for main terminal 2 an Nomsolated Stud/PressFit 55 3. With Vp equal to maximum allowable off-state voltage. $C240/SC241 tobe 0-3 lance 3.2 A/msec, =a 4. The junction-to-ambient value is under worst case conditions; i.e., Isolated TO-3 Flance e 79 with No, 22 copper wire used for electrical contact to the terminals ng - and natural convection cooling. Non-Isolated Stud/Press-Fit 80 : . : : Isolated Stud 78 5, Junction-to-case steady-state thermal resistance (Rg jc) is tested in S$C245/SC246 5.4 A/msec. accordance with EIA-NEMA Standard RS-397, Section 3.3.2, which Non-Isolated TO-3 Flange 78 states: Thermal characteristics are to be measured with the device Isolated TO-3 Flange _ 76 operating in only one direction. The values listed are the limiting Non-Isolated Stud/Press-Fit 86 value for either direction. $250/SC251 Isolated Stud 8.0 A/msec. 83 6. Apparent thermal resistance applies for a 50 or 60 Hz full sine wave Non-Isolated TO-3 Flange 83 of current, It can be calculated with the following formula: Isolated TO-3 Flange 80 Ty(max) Tc Non-Isolated Stud/Press Fit 80 Apparent thermal resistance = ~-~_ Isolated Stud 75 PT(AV) SC260/SC261 Non-Isolated TO-3 Flange 13.5 A/msec. 75 where: qo(anax) = maximum Junction temperature Isolated TO-3 Flange 71 Cc = case temperature = PT(AV) = average on-state power Non-Isolated Stud/Press-Fit 81 ient Thermal Imped $C265/SC266 elated Stud 21.5 A/msec, -_4 See Figure 7 for Maximum Apparent Transient Thermal Impedance. Non-Isolated TO-3 Flange : . 74 Isolated TO-3 Flange 68 1397STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60,65 | SC241, 46, 51, 61, 66 nS 115 Q oO o oe SNe | seat Es 105 PRESS-FIT AND Wl ios _ PRESS-FIT AND 2 NON-ISOLATED STUD SX SS NON-ISOLATED STUD < & is ISOLATED STUD < ISOLATED STUD a ANO NON-ISOLATED 5 = AND NON ISOLATED = 95 0-3 FLANG a 95 < - ual . SQ = r | c2a0 $245 | rm sc20NN SN SC241 - rm C246 7 SC26| 3 85 = @ as a oO a a Z ISOLATED | < 75 N ~~ 75) hoTES: TO-3 FLANGE & | [NOTES: oN 5 |. CURRENT WAVEFORM IS SINUSOIDAL AT ISOLATED Z CURRENT wal Z|! CURRENT WAVEFORM IS SINUSOIDAL SQLATED 3 65+ 2. CONDUCTION ANGLE =360 % 65|> CONDUCTION ANGLE = 360 > 3. CASE TEMPERATURE MEASUREMENT POINT AS = 3. CASE TEMPERATURE MEASUREMENT POINT a SHOWN ON OUTLINE DRAWING. x AS SHOWN ON OUTLINE DRAWING. * 55 | | | | | = 55 L I | L 0 2 4 6 8 10 12 14 16 fo) 5 10 15 20 25 30 35 40 RMS ON-STATE CURRENT, I7(Rms) AMPERES RMS ON-STATE CURRENT, Iy(RMs) AMPERES $C240/SC241, $C245/SC246, $C250/SC251 $C260/SC261, SC265/SC266 1. MAXIMUM ALLOWABLE CASE TEMPERATURE VS. RMS ON-STATE CURRENT 19 50 o NOTES: a NOTES: ke I. Tj = 100C be 1 Ti = 15C g "Fe TIO = 360 ~ g a eg 1 = ~ CONDUCTION ANGLE = 360 = aol 2. CONDUCTION ANGLE = 360 . CURRENT M | Zz 8 EASON Ne eM Soo ue $C245 3. CURRENT WAVEFORM IS C265 2 1o- $0246 5 SINUSOIDAL AT 50 OR 60 Hz sc266 $c240 & l % $624] , B ao a 7 a $C260 V4 a S626] g LZ 3 e & ms a SA w 20 $250, YY 3 2 sc2si <q 4 _ a i A 5 < = 10 4 = es so | z a7 5 ZA = FS a 2 A 2 4 2 % 2 3.4 5 6 7 @ 9 10 0 5 10 15 20 25 30 35 40 RMS ON-STATE CURRENT Iipms) AMPERES RMS ON-STATE CURRENT, It(pmg)-AMPERES $C240/SC241, $C245/SC246 $C250/SC251, SC260/SC261, SC265/SC266 2. MAXIMUM AVERAGE POWER DISSIPATION VS. RMS ON-STATE CURRENT 120 700 o NOTES: on NOTES: F | Ti stooee. Sc245 L Tj=t5ec. < j A SC246 < 600- =4E0 SC265 7 t0o} 2 CONDUCTION ANGLE=360 = 2. CONDUCTION ANGLE = 360 sc266 | S 3. CURRENT WAVEFORM IS 3 3. CURRENT WAVEFORM IS = SINUSOIDAL AT 50, 60 Hz. 3 | SINUSOIDAL AT 50, 60 Hz. < J z 500 aH 80 4 a $C260 / a $C240 Y 2 SC26I a sceai/| ae 400 _f WwW WwW $ $ LZ a a 300 o w 7 & 40 & GA, SC250 a aMs YY gz 200 $C25i Co = LIMIT LL | = LZ 2 20 AO 2 100 iS LL | x x S RMS 3 i LIMFT 9g 0 20 30 40 Es) 60 0 50 100 150 200 250 300 RMS ON-STATE CURRENT, It(pqs) AMPERES $C240/SC241, $C245/SC246 3. MAXIMUM AVERAGE POWER DISSIPATION VS 1398 RMS ON-STATE CURRENT, It(Rms) AMPERES $C250/SC251, SC260/SC261, SC265/SC266 . RMS ON-STATE CURRENT (HIGH LEVEL)100 50 20 5.0 2.0 0.5 +25C }aunetion TEMPERATURE 02 INSTANTANEOUS ON-STATE CURRENT-AMPERES 1 14 18 2.2 2.6 3.0 3.4 3.8 INSTANTANEOUS ON-STATE VOLTAGE-VOLTS $C240/SC241 ied oO 100 n Oo _ nN Oo. 90 a INSTANTANEOUS ON-STATE CURRENT - AMPERES Nn o sea NEON lo +115C { TEMPERATURE 0.5 0.2 OTS 10 5.0 5 20 25 30 35 40 45 INSTANTANEOUS ON-STATE VOLTAGE-VOLTS $C250/SC251 300 100 30 425C +115C JUNCTION O38 TEMPERATURE INSTANTANEOUS ON-STATE CURRENT-AMPERES Ol 0 25 INSTANTANEOUS ON-STATE VOLTAGE-VOLTS $260/SC261 INSTANTANEOUS ON-STATE CURRENT-AMPERES N INSTANTANEOUS ON-STATE CURRENT-AMPERES STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60,65 | SC241, 46, 51, 61, 66 200 100 50 20 10 5.0 20 +25C | JUNCTION Lo +100C J TEMPERATURE 05 0.2 Gg 1.0 1S 2.0 25 3.0 35 40 45 5.0 INSTANTANEOUS ON-STATE VOLTAGE-VOLTS $C245/SC246 OTES: 1. lt = 1 msec. wide pulse, duty cycle < 2%. 2. Curves apply for either potarity of main terminal 2 refer- enced to main terminal 1. 300 100 30 JUNCTION TEMPERATURE +25C +115C 03 Ol 0.5 INSTANTANEOUS ON-STATE VOLTAGE-VOLTS $C265/SC266 4. MAXIMUM ON-STATE VOLTAGE VS. ON-STATE CURRENT 1399STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60, 65 $C241, 46, 51, 61, 66 INSTANTANEOUS GATE VOLTAGE -VOLTS 20 Lo ot PEAK INSTANTANEQUS GATE 4 POWER DISSIPATION EQUALS | 10 WATTS MAXIMUM FOR 10 MICROSECONDS PULSE WIOTH a 2 \ ; || 10 = 0 054 AVERA NOTE: 8 [- Bisceray rei SHADED AREA REPRESENTS LOCUS _| \ Sau atS 05 SECONDS) GUARANTEED TRIGGERING 6 vr? eh ~40C TO +100C. 4 | RECOMMENDED GATE _ CIRCUIT LOAD LINE _| aly ESE INSERT \, FOR PULSE TRIGGERING amnmment 0 0 0.5 1.0 1s 2.0 25 30 35 INSTANTANEOUS GATE CURRENT AMPERES $C240/SC241, $C245/SC246, $C250/SC251, SC260/SC261 5. GATE CHARACTERISTICS AND RATINGS NOTE: SHADED AREA REPRESENTS LOCUS OF ALL POSSIPLE DC (220s) 20 GUARANTEED TRIGGERING POINTS FROM ~40C TO +II5C RECOMMENDED GATE CIRCUIT LOAD LINE FOR TRIGGERING PWR. EQ. MAX. FOR 10 20us PULSE 80 WioTH. deo GATE 7 8 40 -40C 5 MIN.GA 320 VOLTAGE w UNITS 3 10 g 08 506 w 304 E aC MIN. GATE CURRENT. 2 REQD TO TRIGGER Fr o2 1,00 ALL UNITS AT: z MAX. GATE VOLTAGE THAT -40C MODE iv WILL NOT TRIGGER ANY 25C MODE IV UNITS AT +115C, O.25V, ~40C MODESI,! lor 2 ~4 060801 02 04 060610 20 40 INSTANTANEOUS GATE CURRENT-AMPERES S$C265/SC266 PEAK GATE CURRENT-MILLIAMPERES a a - _ Ny o a g 3 o o o PEAK GATE CURRENT-MILLIAMPERES a o ' u (3 i GATE PULSE WIDTH-MICROSECONDS $C240/SC241, SC245/SC246, $C250/SC251 i000 900 800 700 600 500 400 300 200 {00 71 23456789 GATE PULSE WIDTH-MICROSECONDS S$C265/SC266 6. MAXIMUM GATE TRIGGER CURRENT VS. GATE PULSE WIDTH io I) 12 13 t4 1S 16 17 18 19 20 1400 350 ow 3 nN a o Te#- 40C PEAK GATE CURRENT-MILLIAMPERES Sh 8 o oO o a 0 Oo 123 4 5&5 6 7 8 9 IO It 12 13 14 15 16 17 GATE PULSE WIDTH-MICROSECONDS $C260/SC261 18 19 20 NOTES: 14. Rectangular gate current pulse applied. 2. Rise and fall times equal to or. less than 10% of gate pulse width. 3. Main terminal voltage = 12 vdc, load resistor (see char- acteristic table). 4, Applies for all three guaranteed trigger modes.ISOLATED TO-3 FLANGE y po o PRESS-FIT AND NON-ISOLATED STUD ISOLATED STUD NONASOLATE TO-3 FLANGE a tp THERMAL IMPEDANCE - C/WATT @ 9 > ) 4 10 40 100 400 1000 4000 10900 NUMBER OF SINE WAVE CURRENT CYCLES $C240/SC241 20 ISOLATED 1.8 TO-3 FLANGE PRESS-FIT AND NON ISOLATED STUD ISOLATED STUD ANID NON-ISOLATED TO-3 FLANGE THERMAL IMPEDANCE C/ WATT 0.8 06; 4 10 40. 100 400 1000. 4000 10000 NUMBER OF SINE WAVE CURRENT CYCLES $C250/SC251 \2 TT TTI ISOLATED TO-3 FLANGE hl - HOT TT & / ISOLATED STUD = 10 AND NON-ISOLATED +H] 3 TO-3 FLANGE $ w a 2 og 4 yi PRESS-FIT AND a A NON-ISOLATED STUD| 5s 08 = beet 4 aq Z ov YA WW =x F a 06 i 4 05 \ 4 10 40 100 400 1000 4000 10,000 NUMBER OF SINE WAVE CURRENT CYCLES $C265/SC266 THERMAL IMPEDANCE C/WATT THERMAL IMPEDANCE C/WATT STUD/TO-3 FLANGE SC240, 45, 50, 60, 65 2.0 PRESS-FIT $C241, 46, 51, 61, 66 ISOLATED TO-3 FLANGE 18 PRESS-FIT NON-ISOLATED STUD ISOLATED STUD ANO NON-ISOLATED TO-3 FLANGE 08 06 10p00 NUMBER OF SINE WAVE CURRENT CYCLES $C245/SC246 @ ISOLATED TO-3 FLANGE a > iy PRESS-FIT NON-ISOLATED STUD 3 ISOLATED AND NON-ISOLA TO-3 FLANGE @ 9 a 04 4 10 49 100 400 1000 4000 10900 NUMBER OF SINE WAVE CURRENT CYCLES $C260/SC261 NOTES: 1. Curves define temperature rise of either junction above case tempera- ture for equal amplitudes symmetrical sine wave current at 50 and 60 Hz. 2. Curve considers junction temperature measured immediately after the final cycle of current. 3. Gate will regain controt if temper- ature is maintained below rated value and load current is reduced or main- tained at RMS value. 4, For more than 100 cycles of current the case temperature rise must be ob- served and used in calculating the tot- al junction temperature. 5. Junction temperature rise above case is defined as apparent transient therm- al impedance times average conduc- tion power dissipated during full cycle conduction. 6. Apparent steady-state value is not the same as JEDEC value listed as steady- state in characteristics table. 7. MAXIMUM APPARENT TRANSIENT THERMAL IMPEDANCE 1401STUD/TO-3 FLANGE PRESS-FIT $C240, 45, 50, 60,65 | SC241, 46, 51, 61, 66 12,= AMPERE2 SECONDS 100 NOTES. 350 NOTES: 6OHr |. GATE CONTROL MAY BE LOST DURING AND I. GATE CONTROL MAY BE LOST DURING AND b IMMEDIATELY FOLLOWING THE SURGE k IMMEDIATELY FOLLOWING THE SURGE S90 . CURRENT INTERVAL, 300 CURRENT INTERVAL. N\ 2. CURRENT OVERLOAD MAY NOT BE REPEATED = GOHz | 2. CURRENT OVERLOAD MAY NOT BE REPEATED 3 UNTIL JUNCTION TEMPERATURE HAS RE TURNED 5 UNTIL JUNCTION TEMPERATURE HAS RETURNED S5OHz NN, TO WITHIN STEADY-STATE RATED VALU 5 TO WITHIN STEADY-STATE RATED VALUE. \t Bo XN us 250} 5OHZ <_ Ee 6CHz SS < 6OHz 2 oN ~ bo ~~ Zz 70 . 2 200 3 N | S5OHz $C265 MJ 3 ry a so SN = | Pp | 8388 WwW IS > a P| 60 RS ~~ sc245 1 z '50 _ z S SN ms iq 8580 $ scz60 t+ | | wu SS SC25! = SC261 WW 50 wy 100 a 2 $0240 y 2 . SC241 a z ~ 40 = * 50 Wu TT} a a, 30 2 3 456 8 10 20. 30 40 60 80100 oO 2 3 456 810 20 30 40 60 80100 NUMBER OF FULL CYCLES NUMBER OF FULL CYCLES $C240/SC241, $C245/SC246, $C250/SC251 $C260/SC261, SC265/SC266 8. MAXIMUM ALLOWABLE FULL CYCLE SURGE CURRENT FOLLOWING RATED LOAD CONDITIONS 1000 1000 800 800, f 600 _ 600 [__ _| 500 a 500 _ SC265/266 400 9 400 =] 2a 300 eed 300 2a SC260/261 | P+} ve ee L $C245/246 a> $250/25) NOTES: aw EE lOO |. CURVES APPLY FOR EITHER POLARITY w 100 pl 80 OF MAIN TERMINAL 2 REFERENCE TO a2 B0 $C240/241. MAIN TERMINAL 1. Fu 60} 2. CURVES APPLY FOR HALF SINE WAVE bi 80 50 CURRENT WAVEFORM. ab 50 40 > 40 30 43 30|_ NOTES: w 1. CURVES APPLY FOR EITHER POLARITY OF MAIN TERMINAL 2 REFERENCE TO 20 20 MAIN TERMINAL |. 2. CURVES APPLY FOR HALF SINE WAVE CURRENT WAVEFORM. 10 10 1 1 L t 2 3 4 5 6 7 6 910 ! 2 3 4 5 6 7 8 910 PULSE BASE WIDTH-MILLISECONDS PULSE BASE WIDTH-MILLISECONDS 9. ?t RATING FOLLOWING RATED LOAD 10. SUB-CYCLE SURGE FOLLOWING RATED CONDITIONS LOAD CONDITIONS NOTES: |. Tg = SEE NOTE 4 OF CHARACTERISTICS TABLE 2. FOR FULL WAVE CONDUCTION di/dticy = ItRMs)Y T07 WHERE: di/dticy (S IN Tr (rg) 'S IN AMPERES = 377 FORGOHz, 314FORSOH NORMALIZED TO DEVICE RATED COMMUTATING di/dt | 2 5 Oo 20 50 100 TYPICAL COMMUTATING dv/dt-VOLTS/MICROSECOND 11. NORMALIZED DEVICE RATED COMMUTATING di/dt VS. COMMUTATING dv/dt (Typical Values) 1402OUTLINE DRAWINGS PRESS-FIT $C241, 46, 51, 61, 66 STUD/TO-3 FLANGE $C240, 45, 50, 60, 65 an FIGURE A FIGURE B MT1 TERMINAL SPECIFICATION Device Amperes MT1 Terminal $C240/SC241 6 See Figure A $C245/SC246 10 See Figure A $C250/SC251 15 See Figure A $C260/SC261 25 See Figure B $C265/SC266 40 See Figure B Device current rating determines the standard MT1 terminal sup- plied on all hermetic triac package variations. Devices rated less than 25 Amperes RMS will be supplied with a pierced terminal as shown in Figure A. Devices rated 25 Amperes RMS and above will be supplied with a flag terminal as shown in Figure B (1). (Pierced MT1 Terminal) (Flag MT1 Terminal) VIEW SHOWING TERMINAL 2 8 rn a . ey WITH PRESS-ON 7] MT2 TERMINAL WITH SOLDER ry zn RING MT2 TERMINAL MAIN TERMINAL 2 (CASE) 2 3 GATE ! MAIN TERMINAL t ISOLATED TO-3 FLANGE NON-ISOLATED TO-3 FLANGE STUD ISOLATED STUD ISOLATED STUD TERMINAL ARRANGEMENT TYPE 1 TYPE 2 TYPE 3 VIEW SHOWING . TERMINAL 2 ah amt!) Bt ag) ow 4 AR ToAe on Cools DOE a i TYPE 4 TYPE 5 SYMBOL INCHES. METRIC MM SYMBOL INCHES METRIC MM NOTES: MIN. MAX. MIN. MAX. MIN, MAX. MIN. MAX. 1. Outline drawings and table dimensions are given for devices a 50! 505 12.73 12.82 x 975 = 24.76 with the MT1 flag terminal (Fig. B). To calculate the height 8 467 78 er ae st 580 Se 14,74 ose of devices with the MT1 pierced terminal (Fig. A}, subtract A777 a . zi _ - / . . 260 301 660 765 AB 585 = 14.85 0.282 inches (7.100 mm) from table data. E 083 097 2.1 2.46 AC 220 REF 5.59 REF 2, Case temperature is measured for press-fit devices at the cen- r 340 a6 8.64 9.55 AD on. 023 au er ter of the base; for stud types 1, 2 and 3 at the center of any - . - 19.86 AE tl 150 56 3.81 . . : : 7 aI as 06 236 AF 339 35 BaP 637 hex flat; for TO-3 outline mounting flange types 4 and 5 at J 060 069 1.53 7S AG 1182 1192 | 30.03 | 3027 the center of the bottom of the flange. K = 1.064 _ 27.02 AH 160 = 4.07 3. One external tooth lock washer and one nut (both steel, L 284 302 7.22 7.67 Ad 1.807 1567 | 38.28 | 39.80 : : : : a a6 160 371 ace AK SE (be 2477 3603 cadmium plated) are supplied with each stud and isolated ney = 1.180 - 29.2! AL 150 161 3.81 4.08 stud unit. P = 475 = (2.06 aml) = 1.300 = 33.02 4. Insulation hardware for stud devices consisting of solder Q 432 442 10.98 1.22 AN = 630 = 16.00 . : : . nal, nyl l,i? 74-28, UNF2A 2S a aP 13 31 303 332 term al, mica washers and one nylon bushing are available s 086 098 2.19 2.48 0) _ 1.198 =_ 30.35 at extra cost upon request. T 552 562 14.03 14.27 AR SIS 13.08 5. Other standard package variations are available upon request. Vv 240 260 6.10 6.60 . . . . . W 145 160 368 406 6. Metric stud 8mm x 1.25 (.315 in. x .049 in.) is available upon request. WARNING Isolated products described in this specification sheet should be handled with care. The ceramic portion of these thyristors contains BERYLLIUM OXIDE as a major ingredient. Do not crush, grind, or abrade these portions of the thyristors because the dust resulting from such action may be hazardous if inhaled. 1403PRESS-FIT $C241, 46, 51, 61, 66 STUD/TO-3 FLANGE $C240, 45, 50, 60, 65 HERMETIC TRIAC PART NUMBER DESIGNATION sC2 40 B 2 HERMETIC TRIAC WITH POWER-GLAST CHIP CURRENT RATING & PACKAGE STYLE 40 = 6 A RMS Stud/TO-3 Flange 41 = 6A RMS Press-Fit 45 = 10 A RMS Stud/TO-3 Flange 46 = 10 A RMS Press-Fit 50 = 15 A RMS Stud/TO-3 Flange 51 = 15 A RMS Press-Fit 60 = 25 A RMS Stud/TO-3 Flange 61 = 25 A RMS Press-Fit 65 = 40 A RMS Stud/TO-3 Flange 66 = 40 A RMS Press-Fit grupos FLANGE PACKAGE VARIATIONS VOLTAGE RATINGS B = 200 Volts None = Non-lsolated Stud Mount D = 400 Volts 2 = Isolated Stud Mount with E = 500 Volts Press on MT2 Terminal M = 600 Volts 3 = Isolated Stud Mount with Solder Ring MT2 Terminal 4 = Isolated on TO-3 Outline Mounting Flange 5 = Non-lsolated on TO-3 Outline Mounting Flange 6 9 = Other Standard Variations MOUNTING CONSIDERATIONS installation of Press-Fit Device in Heat Sink When press fitting a Triac into a heatsink, the following specifica- tions and recommendations apply: 1. Heatsink materials may be copper, aluminum, or steel. For maximum heat transfer and minimum corrosion problems, copper is recommended. The heatsink thickness, or amount of heatsink wall, in contact with the Triac should be 1/8 inch. 2. The hole diameter into which the Triac is pressed must be 0.4975 + .001 inch. A slight chamfer on the hole should be used, This hole may be punched in a flat plate and reamed, or extruded and sized in sheet metal. 3. The entire knurled section of the Triac should be in contact with the heatsink to insure maximum heat transfer. The Triac must not be inserted into a heatsink deeper than the knurl height. 4. The Triac insertion force must not exceed 800 pounds. If the insertion force approaches this value before complete insertion, either the Triac is misaligned with the hole or the Triac-to-hole interference is excessive, The insertion force must be uniformly applied to the top face (terminal end) of the Triac within an annular ring which has an inside diameter of not less than 0.370 inch and not larger than 0.390 inch; the outside diameter of the insertion force must not be less than 0.500 inch. 5. The thermal resistance between the Triac case and a copper heatsink will not exceed 0,5C/W, if the Triac is inserted in the manner described. Soldering of Press-Fit Package to Heat Sink The press-fit package may be soldered directly to a heatsink using 60/40 (Pb-Sn) solder at a temperature of about 200C. Attachment of Press-Fit Device to Printed Circuit Board For certain light load applications, the Triac can be inverted and, using a special brass bracket (A7149451), dip-soldered into a printed circuit board. The feet on the bracket act both as a mechanical support and Main Terminal 2 (case) electrical connection. For Triacs preassembled into the bracket, add X24 to the type number, for example, SC251BX24, PRINTED yt} a CIRCUIT BOARD Pr LLLL1L Ko} [oJ] pie sotper _/ ALL 3 CONNECTIONS CONNECTIONS L 3 GONNECTIO BOTTOM VIEW OF ASSEMBLY SEFORE MOUNT ING TO BOARD Attachment of the Stud & Isolated Stud Device To a Heat Sink These devices require certain precautions in order to insure good thermal transfer. The chassis hole must be drilled and deburred, and should be between .005 and .015 inches larger than the stud outside diameter. The use of a Torque wrench is highly recommended and must be used within the torque limits indicated on page 2. A good grade of silicone grease will minimize contact thermal resistance. OTHER TRIAC, TRIGGER AND APPLICATION INFORMATION AVAILABLE FROM GENERAL ELECTRIC PUBLICATION NUMBER TRIAC SPECIFICATION SHEETS 175.13 $C136 (Power Tab Triac) 175.35 Power Pac Triacs TRIGGER SPECIFICATION SHEETS 175.30 ST2 (Diac) 175.32 ST4 (Asymmetrical AC Trigger) 65.32 2N4992 (Silicon Bilateral Switch) RELIABILITY REPORT 95.29 Glassivated Triac Reliability Report PUBLICATION 1404 NUMBER APPLICATION NOTES 200.32 A Variety of Mounting Techniques for Press Fit Devices 200.35 Using the Triac for Control of AC Power 200.51 Better Room Conditioning Via Solid State Controls 200.53 Solid State Incandescent Lighting Controls 201.12 500 Watt AC Line Voltage and Power 201.19 RF Filter Consideration for Triac & SCR Circuits 201.24 Thyristor Selection for Incandescent Lamp Loads