ISP1102BSTM - ST-Ericsson - Datasheet.Support

ISP1102

Advanced Universal Serial Bus transceiver

Rev. 03 — 02 September 2003 Product data

1. General description

The ISP1102 Universal Serial Bus (USB) transceiver is fully compliant with the

Universal Serial Bus Speciﬁcation Rev. 2.0

. The ISP1102 can transmit and receive

USB data at full-speed (12 Mbit/s).

The transceiver allows USB Application Speciﬁc ICs (ASICs) and Programmable

Logic Devices (PLDs) with power supply voltages from 1.65 to 3.6 V to interface with

the physical layer of the USB. The transceiver has an integrated 5 V-to-3.3 V voltage

regulator for direct powering via the USB supply line VBUS. The transceiver has an

integrated voltage detector to detect the presence of the VBUS voltage (VCC(5.0)).

When VCC(5.0) or Vreg(3.3) is lost, the D+ and D−pins can be shared with other serial

protocols.

The transceiver is a bi-directional differential interface and is available in HBCC16

and HVQFN14 packages.

The transceiver is ideal for use in portable electronic devices, such as mobile phones,

digital still cameras, personal digital assistants and information appliances.

2. Features

■Complies with

Universal Serial Bus Speciﬁcation Rev. 2.0

■Supports data transfer at full-speed (12 Mbit/s)

■Integrated 5 V-to-3.3 V voltage regulator for powering via USB line VBUS

■VBUS voltage presence indication on pin VBUSDET

■VP and VM pins function in bi-directional mode allowing pin count saving for ASIC

interface

■Used as USB device transceiver or USB host transceiver

■Stable RCV output during single-ended zero (SE0) condition

■Two single-ended receivers with hysteresis

■Low-power operation

■Supports I/O voltage range from 1.65 to 3.6 V

■±12 kV ESD protection (ISP1102W) at D+, D−, VCC(5.0) and GND pins

■Full industrial operating temperature range from −40 to +85 C

■Available in HBCC16 and HVQFN14 lead-free and halogen-free packages.

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 2 of 23

3. Applications

■Portable electronic devices, such as:

◆Mobile phone

◆Digital Still Camera (DSC)

◆Personal Digital Assistant (PDA)

◆Information Appliance (IA).

4. Ordering information

5. Block diagram

Table 1: Ordering information

Type number Package

Name Description Version

ISP1102W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals;

body 3 ×3×0.65 mm SOT639-2

ISP1102BS HVQFN14 plastic thermal enhanced very thin quad ﬂat package; no leads;

14 terminals; body 2.5 ×2.5 ×0.85 mm SOT773-1

Fig 1. Block diagram.

004aaa207

VCC(I/O) VCC(5.0)

VOLTAGE

REGULATOR

3.3 V

1.5 kΩ

33 Ω (1%)

LEVEL

SHIFTER

ISP1102

SOFTCON

Vreg(3.3)

GND

Vpu(3.3)

D+

D−

RCV

VP/VPO

VM/VMO

VBUSDET

SUSPND

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 3 of 23

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pin conﬁguration HBCC16. Fig 3. Pin conﬁguration HVQFN14.

004aaa209

Bottom view

ISP1102W

SOFTCON

Vpu(3.3)

RCV

VP/VPO

D+

D−

VCC(I/O)

n.c.

VM/VMO

SUSPND

n.c.

VCC(5.0)

Vreg(3.3)

n.c.

141516

876

GND

(exposed diepad)

VBUSDET

004aaa208

Bottom view

ISP1102BS

SOFTCON

Vpu(3.3)

RCV

VP/VPO

D+

D−

VCC(I/O)

VM/VMO

SUSPND

VCC(5.0)

Vreg(3.3)

GND

(exposed diepad)

VBUSDET

n.c.

456

1314

Table 2: Pin description

Symbol[1] Pin Type Description

HBCC16 HVQFN14

OE 1 1 I input for output enable (CMOS level with respect to VCC(I/O), active LOW);

enables the transceiver to transmit data on the USB bus

input pad; push pull; CMOS

RCV 2 2 O differential data receiver output (CMOS level with respect to VCC(I/O));

driven LOW when input SUSPND is HIGH; the output state of RCV is

preserved and stable during an SE0 condition

output pad; push pull; 4 mA output drive; CMOS

VP/VPO 3 3 I/O single-ended D+ receiver output VP (CMOS level with respect to VCC(I/O));

for external detection of SE0, error conditions, speed of connected device;

this pin also acts as the drive data input VPO; see Table 3 and Table 4

bidirectional pad; push-pull input; three-state output; 4 mA output drive;

CMOS

VM/VMO 4 4 I/O single-ended D−receiver output VM (CMOS level with respect to VCC(I/O));

for external detection of SE0, error conditions, speed of connected device;

this pin also acts as the drive data input VMO; see Table 3 and Table 4

bidirectional pad; push-pull input; three-state output; 4 mA output drive;

CMOS

SUSPND 5 5 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables

low-power state while the USB bus is inactive and drives output RCV to a

LOW level

input pad; push pull; CMOS

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 4 of 23

[1] Symbol names with an overscore (e.g. OE) indicate active LOW signals.

n.c. 6 - - not connected

VCC(I/O) 7 6 - supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not

connected, the D+ and D−pins are in three-state. This supply pin is totally

independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)

voltage.

VBUSDET 8 7 O VBUS indicator output (CMOS level with respect to VCC(I/O)); when

VBUS > 4.1 V, then VBUSDET = HIGH and when VBUS < 3.6 V, then

VBUSDET = LOW; when SUSPND = HIGH, then pin VBUSDET is pulled

HIGH

output pad; push pull; 4 mA output drive; CMOS

D−9 8 AI/O negative USB data bus connection (analog, differential)

D+ 10 9 AI/O positive USB data bus connection (analog, differential)

n.c. 11 - not connected

n.c. 12 - not connected

n.c. - 10 - not connected

Vreg(3.3) 13 11 - internal regulator option: regulated supply voltage output (3.0 to 3.6 V)

during 5 V operation; a decoupling capacitor of at least 0.1 µF is required

regulator bypass option: used as a supply voltage input (3.3 V ±10%)

for 3.3 V operation

VCC(5.0) 14 12 - internal regulator option: supply voltage input (4.0 to 5.5 V); can be

connected directly to USB line VBUS

regulator bypass option: connect to Vreg(3.3)

Vpu(3.3) 15 13 - pull-up supply voltage (3.3 V ±10%); connect an external 1.5 kΩ resistor

on D+ (full-speed).

Pin function is controlled by input SOFTCON:

SOFTCON = LOW — Vpu(3.3) ﬂoating (high impedance); ensures zero

pull-up current

SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3)

SOFTCON 16 14 I software controlled USB connection input; a HIGH level applies 3.3 V to

pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this

allows USB connect or disconnect signalling to be controlled by software

input pad; push pull; CMOS

GND exposed

die pad exposed

die pad - ground supply; down bonded to the exposed die pad (heatsink); to be

connected to the PCB ground

Table 2: Pin description

…continued

Symbol[1] Pin Type Description

HBCC16 HVQFN14

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 5 of 23

7. Functional description

7.1 Function selection

[1] Signal levels on the D+ and D−pins are determined by other USB devices and external pull-up or

pull-down resistors.

[2] In the suspend mode (SUSPND = HIGH), the differential receiver is inactive and the output RCV is

always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP/VPO and

VM/VMO.

7.2 Operating functions

[1] RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable

during the SE0 period.

7.3 Power supply conﬁgurations

The ISP1102 can be used with different power supply conﬁgurations, which can be

changed dynamically. Table 7 provides an overview of the power supply

conﬁgurations.

Normal mode — VCC(I/O) is connected. VCC(5.0) is connected only, or VCC(5.0) and

Vreg(3.3) are connected.

For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal

voltage regulator then produces 3.3 V for the USB connections.

Table 3: Function table

SUSPND OE D+, D−RCV VP/VPO VM/VMO Function

L L driving/

receiving active VPO input VMO input normal driving

(differential receiver

active)

L H receiving[1] active VP output VM output receiving

H L driving inactive[2] VPO input VMO input driving during suspend

(differential receiver

inactive)

H H high-Z[1] inactive[2] VP output VM output low-power state

Table 4: Driving function using differential input data interface (pin OE=L)

VM/VMO VP/VPO Data

L L SE0

L H differential logic 1

H L differential logic 0

H H illegal state

Table 5: Receiving function (pin OE=H)

D+, D−RCV VP/VPO VM/VMO

differential logic 0 L L H

differential logic 1 H H L

SE0 RCV*[1] LL

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 6 of 23

For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source

(3.0 to 3.6 V).

VCC(I/O) is independently connected to a voltage source (1.65 to 3.6 V), depending on

the supply voltage of the external circuit.

Sharing mode — VCC(I/O) is connected only; VCC(5.0) and Vreg(3.3) are not connected.

In this mode, the D+ and D−pins are made three-state and the ISP1102 allows

external signals of up to 3.6 V to share the D+ and D−lines. The internal circuits of

the ISP1102 ensure that virtually no current (maximum 10 µA) is drawn via the

D+ and D−lines. The power consumption through pin VCC(I/O) drops to the low-power

(suspended) state level.

Pins VBUSDET and RCV are driven LOW to indicate this mode. The VBUSDET

function is ignored during the suspend mode of the ISP1102.

Some hysteresis is built into the detection of Vreg(3.3) lost.

[1] VP/VPO and VM/VMO are bidirectional pins.

Table 6: Pin states in the sharing mode

Pin Sharing mode

VCC(5.0) not present

Vreg(3.3) not present

VCC(I/O) 1.65 to 3.6 V input

Vpu(3.3) high impedance (off)

D+, D−high impedance

VP/VPO, VM/VMO[1] L

RCV L

VBUSDET L

OE, SUSPND, SOFTCON high impedance

Table 7: Power supply conﬁguration overview

VCC(5.0) Conﬁguration Special characteristics

connected normal mode -

not connected sharing mode D+, D− and Vpu(3.3) high impedance;

VBUSDET driven LOW

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 7 of 23

7.4 Power supply input options

The ISP1102 has two power supply input options.

Internal regulator — pin VCC(5.0) is connected to 4.0 to 5.5 V. The internal regulator

is used to supply the internal circuitry with 3.3 V (nominal). The Vreg(3.3) pin becomes

a 3.3 V output reference.

Regulator bypass — pins VCC(5.0) and Vreg(3.3) are connected to the same supply.

The internal regulator is bypassed and the internal circuitry is supplied directly from

pin Vreg(3.3). The voltage range is 3.0 to 3.6 V to comply with the USB speciﬁcation.

The supply voltage range for each input option is speciﬁed in Table 8.

Table 8: Power supply input options

Input option VCC(5.0) Vreg(3.3) VCC(I/O)

Internal

regulator supply input for internal

regulator (4.0 to 5.5 V) voltage reference output

(3.3 V, 300 µA) supply input for digital

I/O pins (1.65 V to 3.6 V)

Regulator

bypass connected to Vreg(3.3)

with maximum voltage

drop of 0.3 V

(2.7 to 3.6 V)

supply input

(3.0 V to 3.6 V) supply input for digital

I/O pins (1.65 V to 3.6 V)

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 8 of 23

8. Electrostatic discharge (ESD)

8.1 ESD protection

For HBCC package, the pins that are connected to the USB connector (D+, D−,

VCC(5.0) and GND) have a minimum of ±12 kV ESD protection. The ±12 kV

measurement is limited by the test equipment. Capacitors of 4.7 µF connected from

Vreg(3.3) to GND and VCC(5.0) to GND are required to achieve this ±12 kV ESD

protection (see Figure 4).

The ISP1102W can withstand ±12 kV using the Human Body Model and ±5 kV using

the Contact Discharge Method as speciﬁed in

IEC 61000-4-2

Note: For HVQFN package, the pins that are connected to the USB connector (D+,

D−, VCC(5.0) and GND) have a minimum of ±7 kV ESD protection.

8.2 ESD test conditions

A detailed report on test set-up and results is available on request.

Fig 4. Human Body ESD test model.

1 MΩ1500 Ω

HIGH VOLTAGE

DC SOURCE

4.7 µF

RCRD

VCC(5.0)

Vreg(3.3)

DEVICE UNDER

TEST

100 pF storage

capacitor

charge current

limit resistor discharge

resistance

GND

004aaa145

Philips Semiconductors ISP1102
Advanced USB transceiver
Product data Rev. 03 — 02 September 2003 9 of 23
9397 750 11228 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9. Limiting values
[1] Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3) (see Section 8).
[2] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
10. Recommended operating conditions
11. Static characteristics
Table 9: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC(5.0) supply voltage −0.5 +6.0 V
VCC(I/O) I/O supply voltage −0.5 +4.6 V
VIDC input voltage −0.5 VCC(I/O) + 0.5 V
Ilu latch-up current VI=−1.8 to +5.4 V - 100 mA
Vesd electrostatic discharge voltage pins D+, D−, VCC(5.0) and
GND; ILI <3µA for HBCC
package
[1][2] −12000 +12000 V
pins D+, D−, VCC(5.0) and
GND; ILI <3µA for HVQFN
package
[2] −7000 +7000 V
all other pins; ILI <1µA[2] −2000 +2000 V
Tstg storage temperature −40 +125 °C
Table 10: Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC(5.0) supply voltage 4.0 5.0 5.5 V
VCC(I/O) I/O supply voltage 1.65 - 3.6 V
VIinput voltage 0 - VCC(I/O) V
VI(AI/O) input voltage on AI/O pins pins D+ and D−0 - 3.6 V
Tamb ambient temperature −40 - +85 °C
Table 11: Static characteristics: supply pins
V
CC(5.0)
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 8 for valid voltage level
combinations; T
amb
=
−
40 to +85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Vreg(3.3) regulated supply voltage output internal regulator option;
Iload ≤300 µA[1][2] 3.0 3.3 3.6 V
ICC operating supply current transmitting and receiving at
12 Mbit/s; CL= 50 pF on
pins D+ and D−
[3] - 48mA
ICC(I/O) operating I/O supply current transmitting and receiving at
12 Mbit/s [3] - 12mA
ICC(idle) supply current during full-speed
idle and SE0 idle: VD+ > 2.7 V, VD−< 0.3 V;
SE0: VD+ < 0.3 V, VD−< 0.3 V [4] - - 300 µA
ICC(I/O)(static) static I/O supply current idle, SE0 or suspend - - 20 µA

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 10 of 23

[1] Iload includes the pull-up resistor current via pin Vpu(3.3).

[2] The minimum voltage is 2.7 V in the suspend mode.

[3] Maximum value characterized only, not tested in production.

[4] Excluding any load current and Vpu(3.3) or Vsw source current to the 1.5 kΩ and 15 kΩpull-up and pull-down resistors (200 µA typ.).

[5] When VCC(I/O) < 2.7 V, the minimum value for Vreg(3.3)th = 2.0 V for supply present condition.

ICC(susp) suspend supply current SUSPND = HIGH [4] --20µA

ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) not connected - - 20 µA

IDx(sharing) sharing mode load current on

pins D+ and D−VCC(5.0) not connected;

SOFTCON = LOW;

VDx = 3.6 V

--10µA

VCC(5.0)th supply voltage detection

threshold 1.65 V ≤VCC(I/O) ≤3.6 V

supply lost - - 3.6 V

supply present 4.1 - - V

VCC(5.0)hys supply voltage detection

hysteresis VCC(I/O) = 1.8 V - 70 - mV

VCC(I/O)th I/O supply voltage detection

threshold Vreg(3.3) = 2.7 to 3.6 V

supply lost - - 0.5 V

supply present 1.4 - - V

VCC(I/O)hys I/O supply voltage detection

hysteresis Vreg(3.3) = 3.3 V - 0.45 - V

Vreg(3.3)th regulated supply voltage

detection threshold 1.65 V ≤VCC(I/O) ≤Vreg(3.3);

2.7 V ≤Vreg(3.3) ≤3.6 V

supply lost - - 0.8 V

supply present [5] 2.4 - - V

Vreg(3.3)hys regulated supply voltage

detection hysteresis VCC(I/O) = 1.8 V - 0.45 - V

Table 11: Static characteristics: supply pins

…continued

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; see Table 8 for valid voltage level

combinations; T

amb

−

40 to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 12: Static characteristics: digital pins

CC(I/O)

= 1.65 to 3.6 V; V

GND

=0V; T

amb

−

40 to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCC(I/O) = 1.65 to 3.6 V

Input levels

VIL LOW-level input voltage - - 0.3VCC(I/O) V

VIH HIGH-level input voltage 0.6VCC(I/O) -- V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µAV

CC(I/O) −0.15 - - V

IOH = 2 mA VCC(I/O) −0.4 - - V

Leakage current

ILI input leakage current [1] −1-+1µA

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 11 of 23

[1] If VCC(I/O) ≥Vreg(3.3), then the leakage current will be higher than the speciﬁed value.

Capacitance

CIN input capacitance pin to GND - - 10 pF

Example 1: VCC(I/O) = 1.8 V ±0.15 V

Input levels

VIL LOW-level input voltage - - 0.5 V

VIH HIGH-level input voltage 1.2 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 1.5 - - V

IOH = 2 mA 1.25 - - V

Example 2: VCC(I/O) = 2.5 V ±0.2 V

Input levels

VIL LOW-level input voltage - - 0.7 V

VIH HIGH-level input voltage 1.7 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 2.15 - - V

IOH = 2 mA 1.9 - - V

Example 3: VCC(I/O) = 3.3 V ±0.3 V

Input levels

VIL LOW-level input voltage - - 0.9 V

VIH HIGH-level input voltage 2.15 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 2.85 - - V

IOH = 2 mA 2.6 - - V

Table 12: Static characteristics: digital pins

…continued

CC(I/O)

= 1.65 to 3.6 V; V

GND

=0V; T

amb

−

40 to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 13: Static characteristics: analog I/O pins D+ and D−

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

GND

=0V; T

amb

−

40 to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Input levels

Differential receiver

VDI differential input sensitivity |VI(D+) −VI(D−)|0.2 - - V

VCM differential common mode

voltage includes VDI range 0.8 - 2.5 V

Philips Semiconductors ISP1102
Advanced USB transceiver
Product data Rev. 03 — 02 September 2003 12 of 23
9397 750 11228 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[1] VOH(min) =V
reg(3.3) −0.2 V.
[2] Includes external resistors of 33 Ω±1% on both pins D+ and D−.
[3] This voltage is available at pins Vreg(3.3) and Vpu(3.3).
[4] The minimum voltage is 2.7 V in the suspend mode.
12. Dynamic characteristics
Single-ended receiver
VIL LOW-level input voltage - - 0.8 V
VIH HIGH-level input voltage 2.0 - - V
Vhys hysteresis voltage 0.4 - 0.7 V
Output levels
VOL LOW-level output voltage RL= 1.5 kΩ to 3.6 V - - 0.3 V
VOH HIGH-level output voltage RL=15kΩ to GND [1] 2.8 - 3.6 V
Leakage current
ILZ OFF-state leakage current −1- +1µA
Capacitance
CIN transceiver capacitance pin to GND - - 20 pF
Resistance
ZDRV driver output impedance steady-state drive [2] 34 39 44 Ω
ZINP input impedance 10 - - MΩ
RSW internal switch resistance at
pin Vpu(3.3)
--10Ω
Termination
VTERM termination voltage for
upstream port pull-up (Rpu)[3][4] 3.0 - 3.6 V
Table 13: Static characteristics: analog I/O pins D+ and D−
…continued
V
CC(5.0)
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
GND
=0V; T
amb
=
−
40 to +85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Table 14: Dynamic characteristics: analog I/O pins D+ and D−
V
CC(5.0)
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 8 for valid voltage level
combinations; T
amb
=
−
40 to +85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Driver characteristics
tFR rise time CL= 50 to 125 pF;
10% to 90% of |VOH −VOL|;
see Figure 5
4 - 20 ns
tFF fall time CL= 50 to 125 pF;
90% to 10% of |VOH −VOL|;
see Figure 5
4 - 20 ns
FRFM differential rise/fall time
matching (tFR/tFF)excluding the ﬁrst transition
from Idle state 90 - 111.1 %
VCRS output signal crossover
voltage excluding the ﬁrst transition
from Idle state; see Figure 6 [1] 1.3 - 2.0 V

Philips Semiconductors ISP1102
Advanced USB transceiver
Product data Rev. 03 — 02 September 2003 13 of 23
9397 750 11228 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[1] Characterized only, not tested. Limits guaranteed by design.
Driver timing
tPLH(drv) driver propagation delay
(VPO, VMO to D+, D−)LOW-to-HIGH; see Figure 6
and Figure 9 --18ns
tPHL(drv) driver propagation delay
(VPO, VMO to D+, D−)HIGH-to-LOW; see Figure 6
and Figure 9 --18ns
tPHZ driver disable delay
(OE to D+, D−)HIGH-to-OFF; see Figure 7
and Figure 10 --15ns
tPLZ driver disable delay
(OE to D+, D−)LOW-to-OFF; see Figure 7
and Figure 10 --15ns
tPZH driver enable delay
(OE to D+, D−)OFF-to-HIGH; see Figure 7
and Figure 10 --15ns
tPZL driver enable delay
(OE to D+, D−)OFF-to-LOW; see Figure 7
and Figure 10 --15ns
Receiver timings
Differential receiver
tPLH(rcv) propagation delay
(D+, D−to RCV) LOW-to-HIGH; see Figure 8
and Figure 11 --15ns
tPHL(rcv) propagation delay
(D+, D−to RCV) HIGH-to-LOW; see Figure 8
and Figure 11 --15ns
Single-ended receiver
tPLH(se) propagation delay
(D+, D−to VP/VPO,
VM/VMO)
LOW-to-HIGH; see Figure 8
and Figure 11 --18ns
tPHL(se) propagation delay
(D+, D−to VP/VPO,
VM/VMO)
HIGH-to-LOW; see Figure 8
and Figure 11 --18ns
Table 14: Dynamic characteristics: analog I/O pins D+ and D−
…continued
V
CC(5.0)
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 8 for valid voltage level
combinations; T
amb
=
−
40 to +85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 14 of 23

Fig 5. Rise and fall times. Fig 6. Timing of VPO and VMO to D+ and D−.

Fig 7. Timing of OE to D+ and D−. Fig 8. Timing of D+ and D− to RCV, VP/VPO and

VM/VMO.

MGS963

VOL

tFR, tLR tFF, tLF

VOH 90 %

10 % 10 %

90 %

MGS964

VOL

VOH

tPHL(drv)

tPLH(drv)

VCRS VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS966

VOL

VOH

tPZH

tPZL tPHZ

tPLZ

VOH −0.3 V

VOL +0.3 V

VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS965

VOL

VOH

tPHL(rcv)

tPHL(se)

tPLH(rcv)

tPLH(se)

VCRS VCRS

0.9 V

2.0 V

0.8 V

logic output

differential

data lines

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 15 of 23

13. Test information

Load capacitance CL= 50 pF (minimum or maximum timing)

Fig 9. Load on pins D+ and D−.

V = 0 V for tPZH and tPHZ

V=V

reg(3.3) for tPZL and tPLZ

Fig 10. Load on pins D+ and D− for enable and disable times.

Fig 11. Load on pins VM/VMO, VP/VPO and RCV.

004aaa037

test point

15 kΩ

D+/D−

Vpu(3.3)

1.5 kΩ

33 Ω

D.U.T.

test point

33 Ω

D.U.T. 500 Ω

50 pF

MBL142

MGS968

25 pF

test point

D.U.T.

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 16 of 23

14. Package outline

Fig 12. Package outline HBCC16.

2.5

UNIT DEhe1

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

01-11-13

03-03-12

IEC JEDEC JEITA

mm 0.8 0.10

0.05 0.7

0.6 3.1

2.9 1.45

1.35

3.1

2.9

1.45

1.35

0.33

0.27

DIMENSIONS (mm are the original dimensions)

SOT639-2 MO-217

0.33

0.27

0.38

0.32

0.38

0.32

2.45

0.23

0.17

0.5

we yy

0.1 0.05 0.2

2.5

2.45

0.08

0 2.5 5 mm

scale

SOT639-2

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

max.

detail X

y1C

113

1/2 e3

1/2 e4

terminal 1

index area

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 17 of 23

Fig 13. Package outline HVQFN14.

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 2.6

2.4

1.45

1.15

2.6

2.4 1.45

1.15

1.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT773-1 - - - - - -- - -

0.35

0.25

0.1

0.05

0 2.5 5 mm

scale

SOT773-1

HVQFN14: plastic thermal enhanced very thin quad flat package; no leads;

14 terminals; body 2.5 x 2.5 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

02-07-05

terminal 1

index area

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

terminal 1

index area

14 11

1/2 e

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 18 of 23

15. Packaging

The ISP1102W (HBCC16 package) is delivered on a Type A carrier tape, see

Figure 14. The tape dimensions are given in Table 15.

The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not

designed for use in a baking process.

The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber

must not exceed 1 mm in 100 mm.

16. Soldering

16.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account

of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages

(document order number 9398 652 90011).

Fig 14. Carrier tape dimensions.

Table 15: Type A carrier tape dimensions for the ISP1102W

Dimension Value Unit

A0 3.3 mm

B0 3.3 mm

K0 1.1 mm

P1 8.0 mm

W 12.0 ±0.3 mm

dth

MLC338

Type B

Type A

4K0

elongated

sprocket hole

direction of feed

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 19 of 23

There is no soldering method that is ideal for all IC packages. Wave soldering can still

be used for certain surface mount ICs, but it is not suitable for ﬁne pitch SMDs. In

these situations reﬂow soldering is recommended. In these situations reﬂow

soldering is recommended.

16.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling

or pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 to 270 °C depending on solder

paste material. The top-surface temperature of the packages should preferably be

kept:

•below 220 °C (SnPb process) or below 245 °C (Pb-free process)

–for all BGA and SSOP-T packages

–for packages with a thickness ≥2.5 mm

–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called

thick/large packages.

•below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with

a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all

times.

16.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging

and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal

results:

•Use a double-wave soldering method comprising a turbulent wave with high

upward pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

Philips Semiconductors ISP1102
Advanced USB transceiver
Product data Rev. 03 — 02 September 2003 20 of 23
9397 750 11228 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
•For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be ﬁxed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or
265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in
most applications.
16.4 Manual soldering
Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
16.5 Package related soldering information
[1] For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofﬁce.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
.
[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reﬂow
soldering with peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reﬂow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
Table 16: Suitability of surface mount IC packages for wave and reﬂow soldering
methods
Package[1] Soldering method
Wave Reﬂow[2]
BGA, LBGA, LFBGA, SQFP, SSOP-T[3],
TFBGA, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
not suitable[4] suitable
PLCC[5], SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended[5][6] suitable
SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable
PMFP[8] not suitable not suitable

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 21 of 23

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Hot bar soldering or manual soldering is suitable for PMFP packages.

17. Revision history

Table 17: Revision history

Rev Date CPCN Description

03 20030902 - Product data (9397 750 11228)

Modiﬁcations:

•Added HVQFN14 package information

•Section 2: updated

•Added pad details to Table 2

•Section 7.3: updated the ﬁrst line under Normal mode

•Table 6: added a table note

•Section 8.1: updated the ﬁrst paragraph and added a note

•Table 9: updated info on Vesd and added a table note.

02 20030106 - Product data (9397 750 10397)

01 20000524 - Objective data

9397 750 11228

Philips Semiconductors ISP1102

Advanced USB transceiver

Product data Rev. 03 — 02 September 2003 22 of 23

Contact information

For additional information, please visit http://www.semiconductors.philips.com.

For sales ofﬁce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.Fax: +31 40 27 24825

18. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

19. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

licence or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Level Data sheet status[1] Product status[2][3] Deﬁnition

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheetcontains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 02 September 2003 Document order number: 9397 750 11228
Contents
Philips Semiconductors ISP1102
Advanced USB transceiver
General description . . . . . . . . . . . . . . . . . . . . . .  1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2
Ordering information. . . . . . . . . . . . . . . . . . . . .  2
Block diagram  . . . . . . . . . . . . . . . . . . . . . . . . . .  2
Pinning information. . . . . . . . . . . . . . . . . . . . . .  3
1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  3
Functional description  . . . . . . . . . . . . . . . . . . .  5
1 Function selection. . . . . . . . . . . . . . . . . . . . . . .  5
2 Operating functions. . . . . . . . . . . . . . . . . . . . . .  5
3 Power supply conﬁgurations. . . . . . . . . . . . . . .  5
4 Power supply input options. . . . . . . . . . . . . . . .  7
Electrostatic discharge (ESD). . . . . . . . . . . . . .  8
1 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . .  8
2 ESD test conditions  . . . . . . . . . . . . . . . . . . . . .  8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  9
Recommended operating conditions. . . . . . . .  9
Static characteristics. . . . . . . . . . . . . . . . . . . . .  9
Dynamic characteristics . . . . . . . . . . . . . . . . .  12
Test information. . . . . . . . . . . . . . . . . . . . . . . .  15
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  16
Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
Soldering  . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
1 Introduction to soldering surface mount
 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
2 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . .  19
3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . .  19
4 Manual soldering  . . . . . . . . . . . . . . . . . . . . . .  20
5 Package related soldering information . . . . . .  20
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .  22
Deﬁnitions  . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .  22