74HC04; 74HCT04 Hex inverter Rev. 5 -- 27 November 2015 Product data sheet 1. General description The 74HC04; 74HCT04 is a hex inverter. The inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC. 2. Features and benefits Complies with JEDEC standard JESD7A Input levels: For 74HC04: CMOS level For 74HCT04: TTL level ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number 74HC04D Package Temperature range Name Description Version 40 C to +125 C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package; no leads; 14 terminals; body 2.5 3 0.85 mm 74HCT04D 74HC04DB 74HCT04DB 74HC04PW 74HCT04PW 74HC04BQ 74HCT04BQ 74HC04; 74HCT04 NXP Semiconductors Hex inverter 4. Functional diagram $ < $ < $ < $ < $ < $ < PQD Fig 1. < $ PQD Logic symbol Fig 2. PQD IEC logic symbol Fig 3. Logic diagram (one inverter) $ WHUPLQDO LQGH[DUHD 9&& 5. Pinning information $ < < $ < < $ *1' < $ $ $ < < $ < $ *1' < < < < 9&& $ *1' $ $ DDF 7UDQVSDUHQWWRSYLHZ DDF (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SO14 and (T)SSOP14 74HC_HCT04 Product data sheet Fig 5. Pin configuration DHVQFN14 All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 2 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 5.1 Pin description Table 2. Pin description Symbol Pin Description 1A, 2A, 3A, 4A, 5A, 6A 1, 3, 5, 9, 11, 13 data input 1Y, 2Y, 3Y, 4Y, 5Y, 6Y 2, 4, 6, 8, 10, 12 data output GND 7 ground (0 V) VCC 14 supply voltage 6. Functional description Table 3. Function table H = HIGH voltage level; L = LOW voltage level Input Output nA nY L H H L 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7 V - 20 mA - 20 mA - 25 mA 50 mA IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] IO output current 0.5 V < VO < VCC + 0.5 V ICC supply current - IGND ground current 50 - mA Tstg storage temperature 65 +150 C - 500 mW total power dissipation Ptot SO14, (T)SSOP14 and DHVQFN14 packages [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO14 package: Ptot derates linearly with 8 mW/K above 70 C. For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C. 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 3 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC04 Min Typ 74HCT04 Max Min Typ Unit Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V 74HC04 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 2 - 20 - 40 A 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 4 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter Table 6. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter CI 25 C Conditions input capacitance 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max - 3.5 - - - - - pF 74HCT04 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA 3.84 4.32 - 3.84 - 3.7 - V LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A - 0 0.1 - 0.1 - 0.1 V IO = 5.2 mA - 0.15 0.26 - 0.33 - 0.4 V VOL II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2 - 20 - 40 A ICC additional supply current per input pin; VI = VCC 2.1 V; IO = 0 A; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V - 120 432 - 540 - 590 A CI input capacitance - 3.5 - - - - - pF 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; CL = 50 pF; for test circuit see Figure 7. Symbol Parameter 25 C Conditions 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) - 25 85 105 130 74HC04 tpd propagation delay nA to nY; see Figure 6 [1] VCC = 2.0 V VCC = 4.5 V - 9 17 21 26 ns VCC = 5.0 V; CL = 15 pF - 7 - - - ns - 7 14 18 22 ns VCC = 6.0 V tt transition time 74HC_HCT04 Product data sheet ns see Figure 6 [2] VCC = 2.0 V - 19 75 95 110 ns VCC = 4.5 V - 7 15 19 22 ns VCC = 6.0 V - 6 13 16 19 ns All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 5 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter Table 7. Dynamic characteristics ...continued GND = 0 V; CL = 50 pF; for test circuit see Figure 7. Symbol Parameter CPD power dissipation capacitance 25 C Conditions 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) - 21 - - - VCC = 4.5 V - 10 19 24 29 ns VCC = 5.0 V; CL = 15 pF - 8 - - - ns per package; VI = GND to VCC [3] pF 74HCT04 [1] propagation delay nA to nY; see Figure 6 tpd transition time tt power dissipation capacitance CPD VCC = 4.5 V; see Figure 6 [2] - 7 15 19 22 ns per package; VI = GND to VCC 1.5 V [3] - 24 - - - pF [1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 11. Waveforms 9, 90 Q$LQSXW 90 *1' W 3+/ W 3/+ 92+ 90 Q<RXWSXW 90 92/ W 7+/ W 7/+ PQD Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Table 8. The input (nA) to output (nY) propagation delay times Measurement points Type Input Output VM VM 74HC04 0.5VCC 0.5VCC 74HCT04 1.3 V 1.3 V 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 6 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 9, QHJDWLYH SXOVH W: 90 90 *1' WI 9, WI SRVLWLYH SXOVH *1' WU WU 90 90 W: 9&& * 9, 92 '87 57 &/ DDK Test data is given in Table 9. Definitions test circuit: RT = termination resistance should be equal to output impedance Zo of the pulse generator. CL = load capacitance including jig and probe capacitance. Fig 7. Table 9. Test circuit for measuring switching times Test data Type Input Load Test VI tr, tf CL 74HC04 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL 74HCT04 3.0 V 6.0 ns 15 pF, 50 pF tPLH, tPHL 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 7 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 12. Package outline 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 ' ( $ ; F \ +( Y 0 $ = 4 $ $ $ $ SLQLQGH[ /S / H GHWDLO; Z 0 ES PP VFDOH ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = PP LQFKHV R R 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG Fig 8. 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& 627 ( 06 -(,7$ (8523($1 352-(&7,21 ,668('$7( Package outline SOT108-1 (SO14) 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 8 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 6623SODVWLFVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F \ +( Y 0 $ = 4 $ $ $ $ SLQLQGH[ /S / GHWDLO; Z 0 ES H PP VFDOH ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = PP R R 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 Fig 9. 5()(5(1&(6 ,(& -('(& -(,7$ 02 (8523($1 352-(&7,21 ,668('$7( Package outline SOT337-1 (SSOP14) 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 9 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F \ +( Y 0 $ = 4 $ SLQLQGH[ $ $ $ /S / H GHWDLO; Z 0 ES PP VFDOH ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = PP R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 5()(5(1&(6 ,(& -('(& -(,7$ 02 (8523($1 352-(&7,21 ,668('$7( Fig 10. Package outline SOT402-1 (TSSOP14) 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 10 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter '+94)1SODVWLFGXDOLQOLQHFRPSDWLEOHWKHUPDOHQKDQFHGYHU\WKLQTXDGIODWSDFNDJHQROHDGV WHUPLQDOVERG\[[PP % ' 627 $ $ $ ( F GHWDLO; WHUPLQDO LQGH[DUHD WHUPLQDO LQGH[DUHD & H H Y Z E & $ % & \ \ & / (K H N 'K ; N PP VFDOH 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP PD[ QRP PLQ $ $ E F ' 'K ( (K H H N / Y Z \ \ 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ 627 5HIHUHQFHV ,(& -('(& -(,7$ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH 02 Fig 11. Package outline SOT762-1 (DHVQFN14) 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 11 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT04 v.5 20151127 Product data sheet - 74HC_HCT04 v.4 Modifications: 74HC_HCT04 v.4 Modifications: * Type numbers 74HC04N and 74HCT04N (SOT27-1) removed. 20120803 Product data sheet - 74HC_HCT04 v.3 * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * Legal texts have been adapted to the new company name where appropriate. 74HC_HCT04 v.3 20030723 Product data sheet - 74HC_HCT04_CNV v.2 74HC_HCT04_CNV v.2 19970826 Product specification - - 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 12 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74HC_HCT04 Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 13 of 15 74HC04; 74HCT04 NXP Semiconductors Hex inverter Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74HC_HCT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 27 November 2015 (c) NXP Semiconductors N.V. 2015. All rights reserved. 14 of 15 NXP Semiconductors 74HC04; 74HCT04 Hex inverter 17. Contents 1 2 3 4 5 5.1 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 November 2015 Document identifier: 74HC_HCT04