High-Voltage, High-Current
OPERATIONAL AMPLIFIER
DESCRIPTION
The OPA547 is a low-cost, high-voltage/high-current opera-
tional amplifier ideal for driving a wide variety of loads. A
laser-trimmed monolithic integrated circuit provides excellent
low-level signal accuracy and high output voltage and cur-
rent.
The OPA547 operates from either single or dual supplies for
design flexibility. In single-supply operation, the input com-
mon-mode range extends below ground.
The OPA547 is internally protected against over-temperature
conditions and current overloads. In addition, the OPA547
was designed to provide an accurate, user-selected current
limit. Unlike other designs which use a “power” resistor in
series with the output current path, the OPA547 senses the
load indirectly. This allows the current limit to be adjusted
from 0mA to 750mA with a 0 to 150µA control signal. This is
easily done with a resistor/potentiometer or controlled digi-
tally with a voltage-out or current-out DAC.
The Enable/Status (E/S) pin provides two functions. An input
on the pin not only disables the output stage to effectively
disconnect the load, but also reduces the quiescent current
to conserve power. The E/S pin output can be monitored to
determine if the OPA547 is in thermal shutdown.
The OPA547 is available in an industry-standard
7-lead staggered and straight lead TO-220 package, and a
7-lead DDPAK surface-mount plastic power package. The
copper tab allows easy mounting to a heat sink or circuit
board for excellent thermal performance. It is specified for
operation over the extended industrial temperature range,
–40°C to +85°C.
FEATURES
●WIDE SUPPLY RANGE
Single Supply: +8V to +60V
Dual Supply: ±4V to ±30V
●HIGH OUTPUT CURRENT:
500mA Continuous
●WIDE OUTPUT VOLTAGE SWING
●FULLY PROTECTED:
Thermal Shutdown
Adjustable Current Limit
●OUTPUT DISABLE CONTROL
●THERMAL SHUTDOWN INDICATOR
●HIGH SLEW RATE: 6V/µs
●LOW QUIESCENT CURRENT
●PACKAGES:
7-Lead TO-220, Zip and Straight Leads
7-Lead DDPAK Surface-Mount
APPLICATIONS
●VALVE, ACTUATOR DRIVERS
●SYNCHRO, SERVO DRIVERS
●POWER SUPPLIES
●TEST EQUIPMENT
●TRANSDUCER EXCITATION
●AUDIO AMPLIFIERS
OPA547
VIN
–
VIN
+
V+
E/S
RCL
RCL sets the current limit
value from 0 to 750mA.
(1/4 Watt Resistor)
ILIM
VO
V–
OPA547
SBOS056F – JANUARY 2002 – JULY 2005
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2002-2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OPA547
OPA547
OPA547
OPA547
2SBOS056F
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Output Current ................................................................. See SOA Curve
Supply Voltage, V+ to V–................................................................... 60V
Input Voltage .................................................. (V–) – 0.5V to (V+) + 0.5V
Input Shutdown Voltage ........................................................................ V+
Operating Temperature ..................................................–40°C to +125°C
Storage Temperature .....................................................–55°C to +125°C
Junction Temperature...................................................................... 150°C
Lead Temperature (soldering 10s)(2) .............................................. 300°C
Top Front View
PIN CONFIGURATIONS
NOTES: (1) Stresses above these ratings may cause permanent damage. (2)
Vapor-phase or IR reflow techniques are recommended for soldering the
OPA547F surface-mount package. Wave soldering is not recommended due to
excessive thermal shock and “shadowing” of nearby devices.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Ordering Addendum at the end of this document, or see
the TI website at www.ti.com.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
7-Lead
Straight-Formed
TO-220 (T-1)
NOTE: Tabs are electrically connected to the V– supply.
ILIMV–VO
V+
VIN–
VIN+
123456
E/S
7
7-Lead
DDPAK (FA)
Surface-Mount
ILIMV–VO
V+
VIN–
VIN+
123456
E/S
7
7-Lead
Stagger-Formed
TO-220 (T)
ILIMV–VO
V+
VIN–
VIN+
123456
E/S
7
OPA547 3
SBOS056F www.ti.com
ELECTRICAL CHARACTERISTICS
At TCASE = +25°C, VS = ±30V and E/S pin open, unless otherwise noted.
OPA547T, F
PARAMETER CONDITION MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VCM = 0, IO = 0 ±1±5mV
vs Temperature TA = –40°C to +85°C±25 µV/°C
vs Power Supply VS = ±4V to ±30V 10 100 µV/V
INPUT BIAS CURRENT(1)
Input Bias Current(2) VCM = 0V –100 –500 nA
vs Temperature ±0.5 nA/°C
Input Offset Current VCM = 0V ±5±50 nA
NOISE
Input Voltage Noise Density, f = 1kHz 90 nV/√Hz
Current Noise Density, f = 1kHz 200 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range: Positive Linear Operation (V+) –3 (V+) –2.3 V
Negative Linear Operation (V–) –0.1 (V–) –0.2 V
Common-Mode Rejection VCM = (V–) –0.1V to (V+) –3V 80 95 dB
INPUT IMPEDANCE
Differential 107 || 6 Ω || pF
Common-Mode 109 || 4 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain, f = 10Hz VO = ±25V, RL = 1kΩ100 115 dB
VO = ±25V, RL = 50Ω110 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product RL = 50Ω1 MHz
Slew Rate G = 1, 50VPP, RL = 50Ω6V/µs
Full-Power Bandwidth See Typical Curve kHz
Settling Time: ±0.1% G = –10, 50V Step 18 µs
Total Harmonic Distortion + Noise, f = 1kHz RL = 50Ω, G = +3V, 1W Power 0.004(3) %
OUTPUT
Voltage Output, Positive IO = 0.5A (V+) –2.2 (V+) –1.9 V
Negative IO = –0.5A (V–) +1.6 (V–) +1.3 V
Positive IO = 0.1A (V+) –1.8 (V+) –1.5 V
Negative IO = –0.1A (V–) +1.2 (V–) +0.8 V
Maximum Continuous Current Output: dc ±500 mA
ac 500 mArms
Leakage Current, Output Disabled, dc See Typical Curve
Output Current Limit
Current Limit Range 0 to ±750 mA
Current Limit Equation ILIM = (5000)(4.75)/(31600Ω + RCL)A
Current Limit Tolerance(1) RCL = 31.6kΩ (ILIM = ±375mA), ±10 ±30 mA
RL = 50Ω
Capacitive Load Drive See Typical Curve(4)
OUTPUT ENABLE /STATUS (E/S) PIN
Shutdown Input Mode
VE/S HIGH (output enabled) E/S Pin Open or Forced HIGH (V–) +2.4 V
VE/S LOW (output disabled) E/S Pin Forced LOW (V–) +0.8 V
IE/S HIGH (output enabled) E/S Pin HIGH –60 µA
IE/S LOW (output disabled) E/S Pin LOW –65 µA
Output Disable Time 1µs
Output Enable Time 3µs
Thermal Shutdown Status Output
Normal Operation Sourcing 20µA(V–) +2.4 (V–) +3.5 V
Thermally Shutdown Sinking 5µA, TJ > 160°C(V–) +0.35 (V–) +0.8 V
Junction Temperature, Shutdown +160 °C
Reset from Shutdown +140 °C
POWER SUPPLY
Specified Voltage ±30 V
Operating Voltage Range ±4±30 V
Quiescent Current ILIM Connected to V–, IO = 0 ±10 ±15 mA
Quiescent Current, Shutdown Mode ILIM Connected to V–±4mA
TEMPERATURE RANGE
Specified Range –40 +85 °C
Operating Range –40 +125 °C
Storage Range –55 +125 °C
Thermal Resistance,
θ
JC
7-Lead DDPAK, 7-Lead TO-220 f > 50Hz 2 °C/W
7-Lead DDPAK, 7-Lead TO-220 dc 3 °C/W
Thermal Resistance,
θ
JA
7-Lead DDPAK, 7-Lead TO-220 No Heat Sink 65 °C/W
NOTES: (1) High-speed test at TJ = +25°C. (2) Positive conventional current flows into the input terminals. (3) See
Total Harmonic Distortion+Noise
in the Typical
Characteristics section for additional power levels. (4) See
Small-Signal Overshoot vs Load Capacitance
in the Typical Characteristics section.
OPA547
4SBOS056F
www.ti.com
TYPICAL CHARACTERISTICS
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
1 10 100 1k 10k 100k 1M 10M
120
100
80
60
40
20
0
–20
Gain (dB)
0
–45
–90
–135
–180
Phase (°)
Frequency (Hz)
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
RL = 50Ω
G
φ
–75 –50 –25 0 25 50 75 100 125 150
–160
–140
–120
–100
–80
–60
–40
–20
0
Input Bias Current (nA)
Temperature (°C)
INPUT BIAS CURRENT vs TEMPERATURE
IB
VS = ±5V
VS = ±30V
–75 –50 –25 0 25 50 75 100 125 150
±600
±500
±400
±300
±200
±100
Current Limit (mA)
Temperature (°C)
CURRENT LIMIT vs TEMPERATURE
R
CL
= 31.6kΩ
R
CL
= 63.4kΩ
R
CL
= 15.9kΩ
0±5±10 ±15 ±20 ±25 ±30
±600
±550
±500
±450
+400
±350
±300
±250
±200
Current Limit (mA)
Supply Voltage (V)
CURRENT LIMIT vs SUPPLY VOLTAGE
R
CL
= 15.9kΩ
R
CL
= 31.6kΩ
R
CL
= 63.4kΩ
+I
LIM
–I
LIM
1 10 100 1k 10k 100k 1M
400
300
200
100
0
Voltage Noise (nV/√Hz)
Frequency (Hz)
VOLTAGE NOISE DENSITY vs FREQUENCY
–75 –50 –25 0 25 50 75 100 125 150
±12
±10
±8
±6
±4
±2
Quiescent Current (mA)
Temperature (°C)
QUIESCENT CURRENT vs TEMPERATURE
IQ
IQ Shutdown
VS = ±30V
VS = ±5V
VS = ±30V
VS = ±5V
OPA547 5
SBOS056F www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
10 100 1k 10k 100k 1M
100
90
80
70
60
50
40
30
20
CMR (dB)
Frequency (Hz)
COMMON-MODE REJECTION vs FREQUENCY
1 10 100 1k 10k 100k 1M
120
100
80
60
40
20
0
PSR (dB)
Frequency (Hz)
POWER SUPPLY REJECTION
vs FREQUENCY
+PSRR
–PSRR
0 2k 4k 6k 8k 10k 12k 14k 16k 18k 20k
50
40
3
20
10
0
Overshoot (%)
Load Capacitance (pF)
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
G = –1
G = +1
–75 –50 –25 0
AOL
25 50 75 100 125 150
105
100
95
90
85
CMRR (dB)
120
115
100
95
90
PSRR, AOL (dB)
Temperature (°C)
OPEN-LOOP GAIN, COMMON-MODE REJECTION,
AND POWER SUPPLY REJECTION vs TEMPERATURE
CMRR
PSRR
–75 –50 –25 0 25 50 75 100 125 150
1.25
1
0.75
0.5
0.25
0
7.5
7
6.5
6
5.5
5
Gain-Bandwidth Product (MHz)
Slew Rate (V/µs)
Temperature (°C)
GAIN-BANDWIDTH PRODUCT AND
SLEW RATE vs TEMPERATURE
SR+
SR–
GBW
20 100 1k 10k 20k
0.1
0.01
0.001
0.0001
THD+N (%)
Frequency (Hz)
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
R
L
= 50Ω
G = +3
0.1W
1W
6.25W
OPA547
6SBOS056F
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
0 100 200 300 400 500 600
3
2.5
2
1.5
1
0.5
0
V
SUPPLY
–
V
OUT
(V)
Output Current (mA)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
(V+) –V
O
(V–) –V
O
–75 –50 –25 0 25 50 75 100 125 150
2.5
2
1.5
1
0.5
0
V
SUPPLY
–
V
OUT
(V)
Temperature (°C)
OUTPUT VOLTAGE SWING vs TEMPERATURE
I
O
= +500mA
I
O
= +100mA
I
O
= –500mA
I
O
= –100mA
1k 10k 100k 1M
30
25
20
15
10
5
0
Output Voltage (Vp)
Frequency (Hz)
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
Maximum Output
Voltage Without
Slew Rate Induced
Distortion
–40 –30 –20 –10 0 10 20 30
1
0.5
0
–0.5
–1
Leakage Current (mA)
Output Voltage (V)
OUTPUT LEAKAGE CURRENT
vs APPLIED OUTPUT VOLTAGE
RCL = 31.6kΩRCL = ∞
RCL = 0
RL = 10Ω
VS = ±30V
Output Disabled
VE/S < (V–) + 0.8V
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage (mV)
20
18
16
14
12
10
8
6
4
2
0
Typical production
distribution of
packaged units.
–5–4–2–3–1012345
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage Drift (µV/°C)
25
20
15
10
5
0
Typical production
distribution of
packaged units.
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
OPA547 7
SBOS056F www.ti.com
5µs/div
LARGE SIGNAL STEP RESPONSE
G = 3, CL = 100pF, RL = 50Ω
SMALL SIGNAL STEP RESPONSE
G = 3, CL = 1000pF
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±35V, and E/S pin open, unless otherwise noted.
50mV/div
2µs/div
50mV/div
2µs/div
10V/div
SMALL SIGNAL STEP RESPONSE
G = 1, CL = 1000pF
OPA547
8SBOS056F
www.ti.com
APPLICATIONS INFORMATION
Figure 1 shows the OPA547 connected as a basic noninverting
amplifier. The OPA547 can be used in virtually any op amp
configuration.
Power-supply terminals should be bypassed with low series
impedance capacitors. The technique shown, using a ce-
ramic and tantalum type in parallel, is recommended. Power-
supply wiring should have low series impedance.
G = 1+
R
2
R
1
Z
L
E/S
3
7
5
4
2
1
6
R
2
I
LIM(1)
R
1
0.1µF
(2)
10µF
OPA547
V–
V+
+
+
V
IN
10µF
0.1µF
(2)
V
O
NOTES: (1) I
LIM
connected to V– gives the maximum
current limit, 750mA (peak). (2) Connect 0.1µF capacitors
directly to package power-supply pins.
With the OPA547, the simplest method for adjusting the
current limit uses a resistor or potentiometer connected
between the ILIM pin and V– according to the Equation 1:
RIk
CL LIM
=()(.)
–.
5000 4 75 31 6 Ω
The low-level control signal (0µA to 150µA) also allows the
current limit to be digitally controlled with a current-out or
voltage-out DAC reference to V– according to the equations
given in Figure 3.
Figure 3 shows a simplified schematic of the internal circuitry
used to set the current limit. Leaving the ILIM pin open
programs the output current to zero, while connecting ILIM
directly to V– programs the maximum output current limit,
typically 750mA.
SAFE OPERATING AREA
Stress on the output transistors is determined both by the
output current and by the output voltage across the conduct-
ing output transistor, VS – VO. The power dissipated by the
output transistor is equal to the product of the output current
and the voltage across the conducting transistor, VS – VO.
The Safe Operating Area (SOA curve, Figure 2) shows the
permissible range of voltage and current.
FIGURE 1. Basic Circuit Connections.
POWER SUPPLIES
The OPA547 operates from single (+8V to +60V) or dual
(±4V to ±30V) supplies with excellent performance. Most
behavior remains unchanged throughout the full operating
voltage range. Parameters which vary significantly with oper-
ating voltage are shown in the typical characteristic curves.
Some applications do not require equal positive and negative
output voltage swing. Power-supply voltages do not need to
be equal. The OPA547 can operate with as little as 8V
between the supplies and with up to 60V between the
supplies. For example, the positive supply could be set to
55V with the negative supply at –5V, or vice-versa.
ADJUSTABLE CURRENT LIMIT
The OPA547 features an accurate, user-selected current
limit. Current limit is set from 0mA to 750mA by controlling
the input to the ILIM pin. Unlike other designs which use a
power resistor in series with the output current path, the
OPA547 senses the load indirectly. This allows the current
limit to be set with a 0µA to 150µA control signal. In contrast,
other designs require a limiting resistor to handle the full
output current (750mA in this case).
12 510
V
S
– V
O
(V) 20 50 100
SAFE OPERATING AREA
1k
100
Output Current (mA)
10
Current-Limited
T
C
= 25°C
T
C
= 125°C
T
C
= 85°C
Output current may
be limited to less
than 500mA—see text.
Pulse Operation Only (<50% Duty-Cycle)
FIGURE 2. Safe Operating Area.
The safe output current decreases as VS – VO increases.
Output short-circuits are a very demanding case for SOA. A
short-circuit to ground forces the full power-supply voltage
(V+ or V–) across the conducting transistor. With TC = 25°C
the maximum output current of 500mA can be achieved
under most conditions. Increasing the case temperature
reduces the safe output current that can be tolerated without
activating the thermal shutdown circuit of the OPA547. For
further insight on SOA, consult Application Bulletin SBOA022.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. For dc signals, power dissipation is equal to the
product of output current times the voltage across the con-
(1)
OPA547 9
SBOS056F www.ti.com
ducting output transistor. Power dissipation can be mini-
mized by using the lowest possible power-supply voltage
necessary to assure the required output voltage swing.
For resistive loads, the maximum power dissipation occurs at
a dc output voltage of one-half the power-supply voltage.
Dissipation with ac signals is lower. Application Bulletin
SBOA022 explains how to calculate or measure power
dissipation with unusual signals and loads.
HEAT SINKING
Most applications require a heat sink to assure that the
maximum junction temperature (150°C) is not exceeded. The
heat sink required depends on the power dissipated and on
ambient conditions. Consult Application Bulletin SBOA021 for
information on determining heat sink requirements. The inter-
nal protection circuitry was designed to protect against over-
load conditions. It does not activate until the junction tempera-
ture reaches approximately 160°C and was not intended to
replace proper heat sinking. Continuously running the OPA547
into thermal shutdown will degrade reliability.
The tab of the DDPAK surface-mount version should be
soldered to a circuit board copper area for good heat dissi-
pation. Figure 4 shows typical thermal resistance from junc-
tion to ambient as a function of the copper area.
FIGURE 4. Thermal Resistance versus Circuit Board Copper Area.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
50
40
30
20
10
0
Thermal Resistance, θ
JA
(°C/W)
012345
Copper Area (inches
2
)
OPA547F
Surface-Mount Package
1oz copper
Circuit Board Copper Area
OPA547
Surface-Mount Package
FIGURE 3. Adjustable Current Limit.
31.6kΩ
RCL 0.01µF
(optional, for noisy
environments)
3
4
3
4
4.75V
G = 5000
RCL = – 31.6kΩ
OPA547 CURRENT LIMIT: 0mA to 750mA
NOTE: (1) Resistors are nearest standard 1% values.
DESIRED
CURRENT LIMIT
0mA
100mA
375mA
500mA
750mA
RESISTOR(1)
(RCL)
ILIM Open
205kΩ
31.6kΩ
15.8kΩ
ILIM Shorted to V–
CURRENT DAC
(IDAC)
0µA
20µA
75µA
100µA
150µA
VOLTAGE DAC
(VDAC)
(V–) + 4.75V
(V–) + 4.12V
(V–) + 2.38V
(V–) + 1.59V
(V–) + 0.01V
RESISTOR METHOD
5000 (4.75V)
ILIM
V–
VO
31.6kΩ
4.75V
G = 5000
IDAC = ILIM /5000
VDAC = (V–) + 4.75V – (31.6kΩ) (ILIM)/5000
DAC METHOD (Current or Voltage)
V–
VO
D/A
OPA547
10 SBOS056F
www.ti.com
THERMAL PROTECTION
The OPA547 has thermal shutdown that protects the ampli-
fier from damage. Activation of the thermal shutdown circuit
during normal operation is an indication of excessive power
dissipation or an inadequate heat sink. Depending on load
and signal conditions, the thermal protection circuit may
cycle on and off. This limits the dissipation of the amplifier but
may have an undesirable effect on the load.
The thermal protection activates at a junction temperature of
approximately 160°C. However, for reliable operation, junc-
tion temperature should be limited to 150°C. To estimate the
margin of safety in a complete design (including heat sink),
increase the ambient temperature until the thermal protection
is activated. Use worst-case load and signal conditions. For
good reliability, the thermal protection should trigger more
than 35°C above the maximum expected ambient condition of
the application. This produces a junction temperature of
125°C at the maximum expected ambient condition.
ENABLE/STATUS (E/S) PIN
The Enable/Status pin provides two functions: forcing this pin
low disables the output stage, or E/S can be monitored to
determine if the OPA547 is in thermal shutdown. One or both
of these functions can be utilized on the same device using
single or dual supplies. For normal operation (output en-
abled), the E/S pin can be left open or pulled high (at least
+2.4V above the negative rail).
Output Disable
A unique feature of the OPA547 is its output disable capabil-
ity. This function not only conserves power during idle peri-
ods (quiescent current drops to approximately 4mA), but also
allows multiplexing in low frequency (f<10kHz), multichannel
applications. Signals that are greater than 10kHz may cause
leakage current to increase in devices that are shutdown.
Figure 15 shows the two OPA547s in a switched amplifier
configuration. The on/off state of the two amplifiers is con-
trolled by the voltage on the E/S pin.
To disable the output, the E/S pin is pulled low, no greater than
0.8V above the negative rail. Typically the output is shutdown
in 1µs. Figure 5 provides an example of how to implement this
function using a single supply. Figure 6 gives a circuit for dual-
supply applications. To return the output to an enabled state,
the E/S pin should be disconnected (open) or pulled to at least
(V–) + 2.4V. It should be noted that pulling the E/S pin high
(output enabled) does not disable internal thermal shutdown.
OPA547
V+
E/S
V–
NOTE: (1) Optional—may be required to limit leakage
current of optocoupler at high temperatures.
(1)
61
1
4N38
Optocoupler
5
4HCT or TTL In
5V
FIGURE 6. Output Disable with Dual Supplies.
Thermal Shutdown Status
Internal thermal shutdown circuitry shuts down the output when
the die temperature reaches approximately 160°C, resetting
when the die has cooled to 140°C. The E/S pin can be
monitored to determine if shutdown has occurred. During
normal operation the voltage on the E/S pin is typically 3.5V
above the negative rail. Once shutdown has occurred this
voltage drops to approximately 350mV above the negative rail.
Figure 7 gives an example of monitoring shutdown in a
single-supply application. Figure 8 provides a circuit for dual
supplies. External logic circuitry or an LED could be used to
indicate if the output has been thermally shutdown, see
Figure 13.
FIGURE 7. Thermal Shutdown Status with a Single Supply.
FIGURE 8. Thermal Shutdown Status with Dual Supplies.
FIGURE 5. Output Disable with a Single Supply.
OPA547
V+
E/S
HCT
OR
TTL
2.49kΩ
Zetex
ZVN3310
5V
V–
OPA547
V+
E/S
V–
1kΩ
5V
22kΩ
470Ω
2N3906
Zetex
ZVN3310
OPA547
V+
E/S
V–CMOS or TTL
OPA547 11
SBOS056F www.ti.com
Output Disable and Thermal Shutdown Status
As mentioned earlier, the OPA547’s output can be disabled
and the disable status can be monitored simultaneously.
Figures 9 and 10 provide examples using a single supply and
dual supplies, respectively.
OPA547
V+
E/S
Open Drain
(Output Disable) HCT
(Thermal Status
Shutdown)
V–
FIGURE 9. Output Disable and Thermal Shutdown Status with
a Single Supply.
OUTPUT PROTECTION
Reactive and EMF-generating loads can return load cur-
rent to the amplifier, causing the output voltage to exceed
the power-supply voltage. This damaging condition can be
avoided with clamp diodes from the output terminal to the
power supplies, as shown in Figure 11. Schottkey rectifier
diodes with a 1A or greater continuous rating are recom-
mended.
FIGURE 10. Output Disable and Thermal Shutdown Status with Dual Supplies.
FIGURE 11. Motor Drive Circuit.
G = – = –4
R
2
R
1
3Ω
(Carbon)
0.01µF
R
2
20kΩ
R
1
5kΩ
OPA547
V–
V+
V
IN
Motor
D
1
D
2
D
1
, D
2
: International Rectifier 11DQ06.
OPA547
V+
E/S
NOTE: (1) Optional—may be required to limit leakage
current of optocoupler at high temperatures.
V–
(1)
6
1
2
4N38
Optocoupler
5
4
HCT or TTL In
5V 6
2
1
4N38
Optocoupler
5
4
Zetex
ZVN3310
TTL Out
7.5kΩ
1W
5V
OUTPUT STAGE COMPENSATION
The complex load impedances common in power op amp
applications can cause output stage instability. For normal
operation output compensation circuitry is not typically re-
quired. However, if the OPA547 is intended to be driven into
current limit, a R/C network may be required. Figure 11
shows an output series R/C compensation (snubber) net-
work (3Ω in series with 0.01µF) which generally provides
excellent stability. Some variations in circuit values may be
required with certain loads.
OPA547
12 SBOS056F
www.ti.com
VOLTAGE SOURCE APPLICATION
Figure 12 illustrates how to use the OPA547 to provide an
accurate voltage source with only three external resistors.
First, the current limit resistor, RCL, is chosen according to
the desired output current. The resulting voltage at the ILIM
pin is constant and stable over temperature. This voltage,
VCL, is connected to the noninverting input of the op amp and
used as a voltage reference, thus eliminating the need for an
external reference. The feedback resistors are selected to
gain VCL to the desired output voltage level.
FIGURE 13. Resistor-Controlled Programmable Power Supply.
FIGURE 12. Voltage Source.
31.6kΩ
RCL
ILIM
0.01µF
(Optional, for noisy
environments)
4.75V
IO =5000 (4.75V)
31.6kΩ + RCL
VO = VCL (1 + R2/R1)
V–
V+
VCL
VCL = = 2.375V
Desired VO = 19V,
R1 = 1kΩ and R2 = 7kΩ
G = = 8
19
2.375
For Example:
31.6kΩ • 4.75V
(31.6kΩ + 31.6kΩ)
If ILIM = 375mA, RCL = 31.6kΩ
R2
R1
Uses voltage developed at ILIM pin
as a moderately accurate reference
voltage.
PROGRAMMABLE POWER SUPPLY
A programmable power supply can easily be built using the
OPA547. Both the output voltage and output current are
user-controlled. Figure 13 shows a circuit using potentiom-
eters to adjust the output voltage and current while Figure 14
uses DACs. An LED tied to the E/S pin through a logic gate
indicates if the OPA547 is in thermal shutdown.
G = 1 + = 10
9kΩ
1kΩ
9kΩ1kΩ
OPA547
+30V
+5V
+5V
0.8V to 2.5V
0V to 4.75V
Output
Adjust
V+
56
Thermal
Shutdown Status
NOTES: (1) For V
O
= 0V, V– = –1V.
(2) Optional: Improves noise
immunity.
(LED)
74HCT04 R ≥ 250Ω
E/S V
O
= 0.8V to 25V
(1)
7
4
3
1
2
V–
I
LIM
14.7kΩ
4.7kΩ
Current
Limit
Adjust
1kΩ
20kΩ0.01µF
(2)
OPA547 13
SBOS056F www.ti.com
DAC B
1/2 DAC7800/1/2
(3)
1/2 DAC7800/1/2
(3)
10pF
I
OUT B
R
FB B
AGND B 0.01µF
(2)
I
LIM
Thermal
Shutdown Status (LED)
74HCT04 R ≥ 250Ω
9kΩ1kΩ
V
O
= 0.8 to 25V
(1)
I
O
= 0 to 750mA
G = 10
V–
E/S
DAC A
+5V
+5V
V
REF B
DGND
10pF
I
OUT A
R
FB A
OUTPUT ADJUST
OPA547
CURRENT LIMIT ADJUST
AGND A
+30V
V
REF A
NOTES: (1) For V
O
= 0V, V– = –1V. (2) Optional, improves noise immunity. (3) Chose DAC780X based on
digital interface: DAC7800—12-bit interface, DAC7801—8-bit interface + 4 bits, DAC7802—serial interface.
(4) Can use OPA2237, I
O
= 100mA to 750mA.
1/2
OPA2336
1/2
OPA2336
V
REF
+10V
FIGURE 14. Digitally-Controlled Programmable Power Supply.
FIGURE 16. Multiple Current Limit Values.
OPA547
RC2
RC1 Close for high current
(Could be open drain
output of a logic gate).
ILIM
V–
( )
E/S
R
2
R1
VIN1
AMP1
VO
E/S
R4
R3
VE/S > (V–) +2.4V: Amp 1 is on, Amp 2 if off
VO = –VIN1 R2
R1
VE/S VIN2
AMP2
( )
V
E/S < (V–) +2.4V: Amp 2 is on, Amp 1 if off
VO = –VIN2 R4
R3
FIGURE 15. Swap Amplifier.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
OPA547F OBSOLETE DDPAK KTW 7 TBD Call TI Call TI
OPA547F/500 ACTIVE DDPAK KTW 7 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
OPA547F/500G3 ACTIVE DDPAK KTW 7 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
OPA547FKTWT ACTIVE DDPAK KTW 7 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
OPA547FKTWTG3 ACTIVE DDPAK KTW 7 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
OPA547T ACTIVE TO-220 KVT 7 50 Green (RoHS &
no Sb/Br) CU SN N / A for Pkg Type
OPA547T-1 ACTIVE TO-220 KC 7 50 Green (RoHS &
no Sb/Br) CU SN N / A for Pkg Type
OPA547T-1G3 ACTIVE TO-220 KC 7 50 Green (RoHS &
no Sb/Br) CU SN N / A for Pkg Type
OPA547TG3 ACTIVE TO-220 KVT 7 50 Green (RoHS &
no Sb/Br) CU SN N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 14-Jul-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA547F/500 DDPAK KTW 7 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
OPA547FKTWT DDPAK KTW 7 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA547F/500 DDPAK KTW 7 500 346.0 346.0 41.0
OPA547FKTWT DDPAK KTW 7 50 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MPSF015 – AUGUST 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
KTW (R-PSFM-G7) PLASTIC FLANGE-MOUNT
0.010 (0,25) AM
4201284/A 08/01
0.385 (9,78)
0.410 (10,41)
MM
BC
–A– 0.006
–B–
0.170 (4,32)
0.183 (4,65)
0.000 (0,00)
0.012 (0,305)
0.104 (2,64)
0.096 (2,44)
0.034 (0,86)
0.022 (0,57)
0.050 (1,27)
0.055 (1,40)
0.045 (1,14)
0.014 (0,36)
0.026 (0,66)
0.330 (8,38)
0.370 (9,40)
0.297 (7,54)
0.303 (7,70)
0.0585 (1,485)
0.0625 (1,587)
0.595 (15,1 1)
0.605 (15,37)
0.019 (0,48)
0.017 (0,43)
0°~3°
0.179 (4,55)
0.187 (4,75)
0.056 (1,42)
0.064 (1,63)
0.296 (7,52)
0.304 (7,72)
0.300 (7,62)
0.252 (6,40)
F
C
C
H
H
H
C
A
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead width and height dimensions apply to the
plated lead.
D. Leads are not allowed above the Datum B.
E. Stand–of f height is measured from lead tip
with reference to Datum B.
F. Lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall not
cause the lead width to exceed the maximum
dimension by more than 0.003”.
G. Cross–hatch indicates exposed metal surface.
H. Falls within JEDEC MO–169 with the exception
of the dimensions indicated.
MECHANICAL DATA
MSOT010 – OCTOBER 1994
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
KC (R-PSFM-T7) PLASTIC FLANGE-MOUNT PACKAGE
4040251/B 01/95
0.420 (10,67)
0.055 (1,40)
0.335 (8,51)
0.030 (0,76)
0.026 (0,66)
0.380 (9,65)
0.325 (8,25)
0.045 (1,14)
0.113 (2,87)
0.103 (2,62)
0.146 (3,71)
0.156 (3,96)
0.122 (3,10)
0.102 (2,59)
DIA
(see Note C)
0.125 (3,18)
0.137 (3,48)
0.147 (3,73)
1.020 (25,91)
1.000 (25,40)
0.175 (4,46)
0.185 (4,70)
17
0.050 (1,27)
0.300 (7,62) 0.025 (0,64)
0.012 (0,30)
M
0.010 (0,25)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area.
D. All lead dimensions apply before solder dip.
E. The center lead is in electrical contact with the mounting tab.
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