1
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
• CLASS I DIELECTRIC, TEMPERATURE COMPENSATING
• HIGH STABILITY OVER TIME, VOLTAGE AND
TEMPERATURE CHANGES
• LOW DIELECTRIC LOSS
• NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
SPECIFICATIONS NPO
FEATURES
Multilayer Ceramic Chip Capacitors NMC Series NPO
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-55 -25 0 25 50 75 100 125
Typical NPO Temperature Coefcient
1 10 100 1000
1000
100
10
1
0.1
0.01
Impedance vs. Frequency NPO
1000pF 100pF
Temperature (Degrees Celsius)
Frequency (MHz)
0.2
0.1
0.0
-0.1
-0.2
0 10 20 30 40 50 60 70 80 90 100
Voltage Coefcient of
Capacitance - NPO
DC Volts Applied
Minimum Insulation Resistance
vs Temperature
Temperature (Degrees C)
10 25 100 150
10,000
1000
100
10
0.2
0.1
0.0
-0.1
-0.2
1 10 100 1000 10000
Aging Rate - NPO
Hours
NMC 0805 NPO 101 J 50 TRP or TRPLP 3K F
RoHS Compliant
"3K" denotes optional reel quantity or
"4" denotes optional 4mm carrier width (01005 case size only)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, rst 2 digits are
signicant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
Series
PART NUMBER SYSTEM
Capacitance Range 0.3pF to 0.1µF
Capacitance Tolerance <5pF: ±0.1pF(B), ± 0.25pF(C)
>5pF to <10pF: ±0.1pF(B), ± 0.25pF(C), ±0.5pF(D)
10pF and above: ±1%(F), ±2%(G), ±5% (J)
Operating Temperature Range -55°C ~ +125°C
Temperature Characteristics 0 ± 30ppm/°C
Rated Voltages 10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc, 100Vdc (see NMC-H Series for higher voltages)
Dissipation Factor For values >30pF 0.1% @ 25°C; For values < 30pF Q=400+20 x C (C in pF)
insulation Resistance 10,000Megohms min. or 500Megohm/µF (min.), whichever is less @ +25°C
Dielectric Withstanding Voltage 250% of Rated Voltage for 1 ~ 5 seconds, 50mA maximum current
Test Conditions (EIA-198-2E) <1000pF; 1MHz, 1.2Vrms max. or >1000pF; 1KHz, 1.2Vrms max.
Expanded
Value Range
Up to 0.1µF
2
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
EIA Case Size 0201 0402 0603 0805
Length (L) 0.6±0.03 1.0±0.05 1.6±0.15 2.0±0.2
Width (W) 0.3±0.03 0.5±0.05 0.8±0.15 1.25±0.2
Thickness max. (T) 0.33 0.6 1.0 1.35
Termination Width
(P) 0.15±0.05 0.2±0.1 0.12 ~ 0.51 0.25 ~ 0.71
Capacitance Working Voltage (Vdc)
10 16 25 50 16 25 50 100 16 25 50 100 16 25 50 100
0.3pF & 0.4pF
0.47pF ~ 22pF
24pF
27pF
30pF
33pF
36pF
39pF
43pF
47pF
51pF
56pF
62pF
68pF
75pF
82pF
91pF
100pF
110pF
120pF
130pF
150pF
160pF
180pF
200pF
220pF
240pF
270pF
300pF
330pF
360pF
390pF
430pF
470pF
510pF
560pF
620pF
680pF
750pF
820pF
910pF
0.001µF
0.0012µF
0.0015µF
0.0018µF
0.0022µF
0.0027µF*
0.0033µF*
0.0039µF* *
0.0047µF*
0.0056µF* *
0.0068µF* *
0.0082µF* *
0.01µF***
*1.45mm maximum thickness
Multilayer Ceramic Chip Capacitors NMC Series NPO
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
EIA Case Size 01005
Length (L) 0.4±0.02
Width (W) 0.2±0.02
Thickness max. (T) 0.22
Termination Width
(P) 0.10 +0.04/-0.03
Capacitance Working Voltage (Vdc)
16
0.5pF
0.6pF
0.7pF
0.8pF
0.9pF
1.0pF
1.1pF
1.2pF
1.3pF
1.5pF
1.6pF
1.8pF
2.0pF
2.2pF
2.4pF
2.5pF
2.7pF
3.0pF
3.3pF
3.6pF
3.9pF
4.0pF
4.7pF
5.0pF
5.6pF
6.0pF
6.2pF
6.8pF
7.0pF
7.5pF
8.0pF
8.2pF
9.0pF
9.1pF
10pF
12pF
15pF
18pF
22pF
27pF
33pF
39pF
47pF
56pF
68pF
82pF
100pF
Highlighted values available on 4mm carrier,
40K pieces per reel.
3
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
EIA Case Size 0805 1206 1210 1812 2225
Length (L) 2.0±0.2 3.2±0.2 3.2±0.2 4.5±0.3 5.70±0.4
Width (W) 1.25±0.2 1.6±0.2 2.5±0.2 3.2±0.25 6.35±0.25
Thickness max. (T) 1.45 1.80 1.80 1.80 1.80
Termination Width (P) 0.25 ~ 0.71 0.25 ~ 0.71 0.25 ~ 0.71 0.25 ~ 0.76 0.25 ~ 1.02
Capacitance Working Voltage (Vdc)
16 25 50 100 10 16 25 50 100 10 16 25 50 100 25 50 100 50 100
0.47pF ~ 9.1pF
See the
previous page
10pF ~ 22pF
24pF ~ 0.001µF
0.0012µF
0.0015µF
0.0018µF
0.0022µF
0.0027µF
0.0033µF
0.0039µF
0.0047µF
0.0056µF
0.0068µF
0.0075µF
0.0082µF
0.0091µF
0.01µF
0.012µF
0.015µF
0.018µF
0.022µF**
0.027µF**
0.033µF**
0.039µF**
0.047µF
0.056µF
0.068µF
0.082µF
0.1µF***
*1.90mm maximum thickness, **2.60mm maximum thickness,
***4.5mm ± 0.40 x 3.2mm ± 0.40 x 2.80mm maximum thickness
Multilayer Ceramic Chip Capacitors NMC Series NPO
See NMC High Capactiance datasheet for higher capacitance values
or NMC-H High Voltage datasheet for higher voltage ratings
PP
L
W
T
100% Sn over Ni barrier
4
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
Taping Specications
8MM & 12MM EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
REEL DIMENSIONS (mm)
7 INCH REEL QUANTITIES*
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
Notes:
1. Specications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
Size 01005 0201 0402 0603 0805 1206 1210 1812 2225
Tape Size 4mm 8mm 8mm 8mm 8mm 8mm 8mm 8mm 12mm 12mm
Min. Qty
Per Reel 40,000 20,000 20,000 10,000 4,000 4,000 4,000 2,000 1,000 400
Max. Qty
Per Reel 40,000 20,000 20,000 10,000 4,000 5,000 5,000 5,000 2,000 1,000
Multilayer Ceramic Chip Capacitors
C
B
T
A
REEL
D
Carrier Width WFE P0P2DK max. T max. P
8mm 8.0 ± 0.2 3.5 ± 0.05 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0 3.0 2.0 4.0 ± 0.1
12mm 12 ± 0.2 5.5 ± 0.05 4.5 8.0 ± 0.1
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
CARRIER TAPE MATERIAL
K
T
DP
o
W
F
A
o
P
B
o
E
P
2
See notes 2 & 3 regarding dimensions
Ao and Bo
Reel Diameter (A) B C D T max.
7” (178 ± 2.0) 13.0
± 0.5
50 min. 21.0
± 1.0
4mm Carrier: 5.0 ± 1.5
8mm Carrier: 8.4 ± 1.0
12mm Carrier: 12.8 ± 0.5
10” (250 ± 2.0) 100 ± 1.0
13” (330 ± 2.0) 100 ± 1.0
5
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type AoBoWFE P1 P0 D0 T1
max.
T2
max.
Mounting
Hole
01005 0.25 ± 0.04 0.45 ± 0.04
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1 1.5
+0.1/-0.0
0.27 0.36
Angular
Punch
Hole
0201 0.37 ± 0.03 0.67 ± 0.05 0.45 0.80
0402 0.65 ± 0.05 1.15 ± 0.05
1.1 1.4
0603 1.1 ± 0.2 1.9 ± 0.2
4.0 ± 0.100805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
t2
t1
DP
o
W
F
A
o
P1
Component
Pitch
B
o
E
PUNCHED CARRIER TAPE
Taping Specications
Multilayer Ceramic Chip Capacitors
4MM (01005 CASE SIZE) EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Carrier
Width A0B0WFE P P1P2DK max. T max.
4mm 0.23 ± 0.02 0.43 ± 0.02 4.0 ± 0.05 1.8 ± 0.02 0.90 ± 0.05 2.0 ± 0.04 1.0 ± 0.02 1.0 ± 0.02 1.5 +0.1
-0.0 0.50 0.15 ~ 0.40
K
T
DP
W
F
A
o
P1
B
o
E
P
2