34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. Company name - Philips Semiconductors is replaced with ST-NXP Wireless. Copyright - the copyright notice at the bottom of each page "(c) Koninklijke Philips Electronics N.V. 200x. All rights reserved", shall now read: "(c) ST-NXP Wireless 200x All rights reserved". Web site - http://www.semiconductors.philips.com is replaced with http://www.stnwireless.com Contact information - the list of sales offices previously obtained by sending an email to sales.addresses@www.semiconductors.philips.com, is now found at http://www.stnwireless.com under Contacts. If you have any questions related to the document, please contact our nearest sales office. Thank you for your cooperation and understanding. ST-NXP Wireless 34 .80 7IRELESS www.stnwireless.com ISP1105/1106 Advanced Universal Serial Bus transceivers Rev. 08 -- 19 February 2004 Product data 1. General description The ISP1105/1106 range of Universal Serial Bus (USB) transceivers are compliant with the Universal Serial Bus Specification Rev. 2.0. They can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. The ISP1105/1106 range can be used as a USB device transceiver or a USB host transceiver. They allow USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical layer of the Universal Serial Bus. They have an integrated 5 V-to-3.3 V voltage regulator for direct powering via the USB supply VBUS. ISP1105 allows single-ended and differential input modes selectable by a MODE input and it is available in HVQFN16 and HBCC16 packages. ISP1106 allows only differential input mode and is available in both TSSOP16 and HBCC16 packages. The ISP1105/1106 are ideal for portable electronics devices such as mobile phones, digital still cameras, Personal Digital Assistants (PDA) and Information Appliances (IA). 2. Features Complies with Universal Serial Bus Specification Rev. 2.0 Can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates Integrated bypassable 5 V-to-3.3 V voltage regulator for powering via USB VBUS VBUS disconnection indication through VP and VM Used as a USB device transceiver or a USB host transceiver Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Low-power operation Supports an I/O voltage range from 1.65 V to 3.6 V 12 kV ESD protection at the D+, D-, VCC(5.0) and GND pins Full industrial operating temperature range from -40 to +85 C Available in small HBCC16, HVQFN16 (only ISP1105) and TSSOP16 (only ISP1106) packages; HBCC16 and HVQFN16 are lead-free and halogen-free packages. ISP1105/1106 Philips Semiconductors Advanced USB transceivers 3. Applications Portable electronic devices, such as: Mobile phone Digital still camera Personal Digital Assistant (PDA) Information Appliance (IA). 4. Ordering information Table 1: Ordering information Type number Package Name Description Version ISP1105BS HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm SOT758-1 ISP1105W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOT639-2 ISP1106DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 ISP1106W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOT639-2 4.1 Ordering options Table 2: Selection guide Product Package Description ISP1105 HVQFN16 and HBCC16 supports both single-ended and differential input modes; see Table 5 and Table 6. ISP1106 TSSOP16 and HBCC16 supports only the differential input mode; see Table 6. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 2 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 5. Block diagram 3.3 V V CC(I/O) VOLTAGE REGULATOR VCC(5.0) Vreg(3.3) Vpu(3.3) SOFTCON 1.5 k(1) OE SPEED D+ VMO/FSE0(2) D- VPO/VO(2) 33 (1%) 33 (1%) MODE(3) LEVEL SHIFTER SUSPND RCV ISP1105 ISP1106 VP VM MBL301 GND (1) Connect to D- for low-speed operation. (2) Pin function depends on device type. (3) Only for ISP1105. Fig 1. Block diagram (combined ISP1105 and ISP1106). (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 3 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 6. Pinning information 10 D+ 11 VPO/VO 12 VMO/FSE0 15 14 13 Vpu(3.3) VCC(5.0) Vreg(3.3) Bottom view 16 SOFTCON OE 1 2 OE 1 Bottom view Vpu(3.3) 1 16 VCC(5.0) SOFTCON 2 15 Vreg(3.3) OE 3 14 VMO RCV 4 13 VPO VP 5 12 D+ VM 6 11 D- SUSPND 7 10 SPEED GND 8 9 9 D- 10 D+ 11 VPO/VO 12 VMO/FSE0 SUSPND 5 VM 4 VP 3 RCV 2 OE 1 Bottom view Fig 4. Pin configuration ISP1106DH (TSSOP16). 16 15 14 13 Vreg(3.3) MBL303 Fig 3. Pin configuration ISP1105W (HBCC16). V CC(I/O) MBL302 6 7 8 ISP1106W 16 15 14 9 D- 10 D+ 11 VPO 12 VMO 13 Vreg(3.3) MBL304 Fig 5. Pin configuration ISP1106W (HBCC16). (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data (exposed diepad) 004aaa314 Fig 2. Pin configuration ISP1105BS (HVQFN). ISP1106DH RCV GND VCC(5.0) GND (exposed diepad) 3 SPEED 2 8 ISP1105W VP RCV SPEED 4 VCC(I/O) VM 7 VCC(5.0) ISP1105BS D- 6 Vpu(3.3) VP 3 9 5 VCC(I/O) 4 SUSPND Vpu(3.3) 8 MODE SPEED 7 SOFTCON VCC(I/O) 6 GND MODE 5 SOFTCON VM SUSPND 6.1 Pinning Rev. 08 -- 19 February 2004 4 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 6.2 Pin description Table 3: Pin description Symbol[1] Pin Type Description output enable input (CMOS level with respect to VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus ISP1105 ISP1106 BS W DH W OE 1 1 3 1 I RCV 2 2 4 2 O input pad; push pull; CMOS differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition output pad; push pull; 4 mA output drive; CMOS VP 3 3 5 3 O single-ended D+ receiver output (CMOS level with respect to VCC(I/O)); for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) output pad; push pull; 4 mA output drive; CMOS VM 4 4 6 4 O single-ended D- receiver output (CMOS level with respect to VCC(I/O)); for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) output pad; push pull; 4 mA output drive; CMOS SUSPND 5 5 7 5 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level input pad; push pull; CMOS MODE 6 6 - - I mode input (CMOS level with respect to VCC(I/O)); a HIGH level enables the differential input mode (VPO, VMO) whereas a LOW level enables a single-ended input mode (VO, FSE0); see Table 5 and Table 6 input pad; push pull; CMOS die pad die pad 8 6 - ground supply[2] VCC(I/O) 7 7 9 7 - supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not connected, the (D+, D-) pins are in three-state; this supply pin is totally independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3) voltage SPEED 8 8 10 8 I speed selection input (CMOS level with respect to VCC(I/O)); adjusts the slew rate of differential data outputs D+ and D- according to the transmission speed GND LOW -- low-speed (1.5 Mbit/s) HIGH -- full-speed (12 Mbit/s) input pad; push pull; CMOS D- 9 9 11 9 AI/O negative USB data bus connection (analog, differential); for low-speed mode connect to pin Vpu(3.3) via a 1.5 k resistor D+ 10 10 12 10 AI/O positive USB data bus connection (analog, differential); for full-speed mode connect to pin Vpu(3.3) via a 1.5 k resistor (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 5 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers Table 3: Pin description...continued Symbol[1] Pin ISP1105 ISP1106 BS W DH W 11 11 - - VPO - - 13 11 VO - - - - VPO/VO VMO/FSE0 12 12 - - VMO - - 14 12 FSE0 - - - - 13 13 15 13 Vreg(3.3) Type Description I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 5 and Table 6 input pad; push pull; CMOS I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 5 and Table 6 input pad; push pull; CMOS - internal regulator option: regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; a decoupling capacitor of at least 0.1 F is required regulator bypass option: used as a supply voltage input for 3.3 V 10% operation VCC(5.0) 14 14 16 14 - internal regulator option: supply voltage input (4.0 to 5.5 V); can be connected directly to USB supply VBUS Vpu(3.3) 15 15 1 15 - pull-up supply voltage (3.3 V 10%); connect an external 1.5 k resistor on D+ (full-speed) or D- (low-speed); pin function is controlled by input SOFTCON regulator bypass option: connect to Vreg(3.3) SOFTCON = LOW -- Vpu(3.3) floating (high impedance); ensures zero pull-up current SOFTCON = HIGH -- Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3) SOFTCON 16 16 2 16 I software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 k pull-up resistor; this allows USB connect/disconnect signalling to be controlled by software input pad; push pull; CMOS [1] [2] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. ISP1105: ground terminal is connected to the exposed die pad (heatsink). (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 6 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 7. Functional description 7.1 Function selection Table 4: Function table SUSPND OE (D+, D-) RCV VP/VM Function L L driving and receiving active active normal driving (differential receiver active) L H receiving[1] active active receiving H L driving inactive[2] active driving during `suspend'[3] (differential receiver inactive) H H high-Z[1] inactive[2] active low-power state [1] [2] [3] Signal levels on (D+, D-) are determined by other USB devices and external pull-up/down resistors. In `suspend' mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always LOW. Out-of-suspend (`K') signalling is detected via the single-ended receivers VP and VM. During suspend, the slew-rate control circuit of low-speed operation is disabled. The (D+, D-) lines are still driven to their intended states, without slew-rate control. This is permitted because driving during suspend is used to signal remote wake-up by driving a `K' signal (one transition from idle to `K' state) for a period of 1 to 15 ms. 7.2 Operating functions Table 5: Driving function (pin OE = L) using single-ended input data interface for ISP1105 (pin MODE = L) FSE0 VO Data L L differential logic 0 L H differential logic 1 H L SE0 H H SE0 Table 6: Driving function (pin OE = L) using differential input data interface for ISP1105 (pin MODE = H) and ISP1106 VMO VPO Data L L SE0 L H differential logic 1 H L differential logic 0 H H illegal state Table 7: Receiving function (pin OE = H) (D+, D-) RCV VP[1] VM[1] Differential logic 0 L L H Differential logic 1 H H L SE0 RCV*[2] L L [1] [2] VP = VM = H indicates the sharing mode (VCC(5.0) and Vreg(3.3) are disconnected). RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is stable during the SE0 period. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 7 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 7.3 Power supply configurations The ISP1105/1106 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Table 9. Normal mode -- Both VCC(I/O) and VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 to 3.6 V). VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external circuit. Disable mode -- VCC(I/O) is not connected, VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. In this mode, the internal circuits of the ISP1105/1106 ensure that the (D+, D-) pins are in three-state and the power consumption drops to the low-power (suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost. Sharing mode -- VCC(I/O) is connected, (VCC(5.0) and Vreg(3.3)) are not connected. In this mode, the (D+, D-) pins are made three-state and the ISP1105/1106 allows external signals of up to 3.6 V to share the (D+, D-) lines. The internal circuits of the ISP1105/1106 ensure that virtually no current (maximum 10 A) is drawn via the (D+, D-) lines. The power consumption through pin VCC(I/O) drops to the low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of Vreg(3.3) lost. Table 8: Pin states in disable or sharing mode Pins Disable mode state Sharing mode state VCC(5.0) / Vreg(3.3) 5 V input / 3.3 V output; 3.3 V input / 3.3 V input not present VCC(I/O) not present 1.65 V to 3.6 V input Vpu(3.3) high impedance (off) high impedance (off) (D+, D-) high impedance high impedance (VP, VM) invalid[1] H RCV invalid[1] L Inputs (VO/VPO, FSE0/VMO, SPEED, MODE[2], SUSPND, OE, SOFTCON) high impedance high impedance [1] [2] High impedance or driven LOW. ISP1105 only. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 8 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers Table 9: Power supply configuration overview VCC(5.0) or Vreg(3.3) VCC(I/O) Configuration Special characteristics Connected connected normal mode - Connected not connected disable mode (D+, D-) and Vpu(3.3) high impedance; VP, VM, RCV: invalid[1] Not connected connected sharing mode (D+, D-) and Vpu(3.3) high impedance; VP, VM driven HIGH; RCV driven LOW [1] High impedance or driven LOW. 7.4 Power supply input options The ISP1105/1106 range has two power supply input options. Internal regulator -- VCC(5.0) is connected to 4.0 to 5.5 V. The internal regulator is used to supply the internal circuitry with 3.3 V (nominal). The Vreg(3.3) pin becomes a 3.3 V output reference. Regulator bypass -- VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed and the internal circuitry is supplied directly from the Vreg(3.3) power supply. The voltage range is 3.0 to 3.6 V to comply with the USB specification. The supply voltage range for each input option is specified in Table 10. Table 10: Power supply input options Input option VCC(5.0) Vreg(3.3) Internal regulator supply input for internal voltage reference regulator output (4.0 to 5.5 V) (3.3 V, 300 A) supply input for digital I/O pins (1.65 V to 3.6 V) Regulator bypass supply input for digital I/O pins (1.65 V to 3.6 V) connected to Vreg(3.3) with maximum voltage drop of 0.3 V (2.7 to 3.6 V) supply input (3.0 V to 3.6 V) (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data VCC(I/O) Rev. 08 -- 19 February 2004 9 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 8. Electrostatic discharge (ESD) 8.1 ESD protection The pins that are connected to the USB connector (D+, D-, VCC(5.0) and GND) have a minimum of 12 kV ESD protection. The 12 kV measurement is limited by the test equipment. Capacitors of 4.7 F connected from Vreg(3.3) to GND and VCC(5.0) to GND are required to achieve this 12 kV ESD protection (see Figure 6). ISP1105/1106 can withstand 12 kV using the Human Body Model and 5 kV using the Contact Discharge Method as specified in IEC 61000-4-2. R C 1 M charge current limit resistor RD 1500 discharge resistance DEVICE UNDER TEST VCC(5.0) A Vreg(3.3) HIGH VOLTAGE DC SOURCE CS 100 pF storage capacitor B 4.7 F 4.7 F GND 004aaa145 Fig 6. Human Body ESD test model. 8.2 ESD test conditions A detailed report on test set-up and results is available on request. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 10 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 9. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC(5.0) Min Max Unit supply voltage -0.5 +6.0 V VCC(I/O) I/O supply voltage -0.5 +4.6 V Vreg(3.3) regulated supply voltage -0.5 +4.6 V VI DC input voltage -0.5 VCC(I/O) + 0.5 V Ilu latch-up current VI = -1.8 to 5.4 V - 100 mA electrostatic discharge voltage ILI < 1 A on pins D+, D-, VCC(5.0) and GND -12000 +12000 V on other pins -2000 +2000 V -40 +125 C Vesd Tstg [1] [2] Conditions [1][2] storage temperature Testing equipment limits measurement to only 12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3); see Section 8. Equivalent to discharging a 100 pF capacitor via a 1.5 k resistor (Human Body Model). 10. Recommended operating conditions Table 12: Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VCC(5.0) supply voltage (internal regulator option) 5 V operation 4.0 5.0 5.5 V Vreg(3.3) supply voltage (regulator bypass option) 3.3 V operation 3.0 3.3 3.6 V VCC(I/O) I/O supply voltage 1.65 - 3.6 V VI input voltage 0 - VCC(I/O) V VI(AI/O) input voltage on analog I/O pins (D+/D-) 0 - 3.6 V Tamb operating ambient temperature -40 - +85 C (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 11 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 11. Static characteristics Table 13: Static characteristics: supply pins VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions [1][2] Min Typ Max Unit 3.0 3.3 3.6 V Vreg(3.3) regulated supply voltage output internal regulator option; Iload 300 A ICC operating supply current full-speed transmitting and receiving at 12 Mbit/s; CL = 50 pF on D+/D- [3] - 4 8 mA ICC(I/O) operating I/O supply current full-speed transmitting and receiving at 12 Mbit/s [3] - 1 2 mA ICC(idle) supply current during full-speed idle and SE0 full-speed idle: VD+ > 2.7 V, VD- < 0.3 V; SE0: VD+ < 0.3 V, VD- < 0.3 V [4] - - 500 A ICC(I/O)(static) static I/O supply current full-speed idle, SE0 or suspend ICC(susp) suspend supply current SUSPND = HIGH - - 20 A [4] - - 20 A [4] - - 20 A ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) or Vreg(3.3) not connected - - 20 A IDx(sharing) sharing mode load current on pins D+ and D- VCC(5.0) or Vreg(3.3) not connected; SOFTCON = LOW; VDx = 3.6 V - - 10 A Vreg(3.3)th regulated supply voltage detection threshold 1.65 V VCC(I/O) Vreg(3.3); 2.7 V Vreg(3.3) 3.6 V - - 0.8 V 2.4 - - V - 0.45 - V supply lost - - 0.5 V supply present 1.4 - - V - 0.45 - V ICC(dis) disable mode supply current VCC(I/O) not connected supply lost supply present Vreg(3.3)hys regulated supply voltage detection hysteresis VCC(I/O) = 1.8 V VCC(I/O)th I/O supply voltage detection threshold Vreg(3.3) = 2.7 to 3.6 V VCC(I/O)hys [1] [2] [3] [4] [5] I/O supply voltage detection hysteresis Vreg(3.3) = 3.3 V [5] Iload includes the pull-up resistor current via pin Vpu(3.3). In `suspend' mode, the minimum voltage is 2.7 V. Maximum value is characterized only, not tested in production. Excluding any load current and Vpu(3.3)/Vsw source current to the 1.5 k and 15 k pull-up and pull-down resistors (200 A typ.). When VCC(I/O) < 2.7 V, the minimum value for Vth(reg3.3)(present) is 2.0 V. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 12 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers Table 14: Static characteristics: digital pins VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 to 3.6 V Input levels VIL LOW-level input voltage - - 0.3VCC(I/O) V VIH HIGH-level input voltage 0.6VCC(I/O) - - V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 A VCC(I/O) - 0.15 - - V IOH = 2 mA VCC(I/O) - 0.4 - - V -1 - +1 A Leakage current ILI input leakage current Example 1: VCC(I/O) = 1.8 V 0.15 V Input levels VIL LOW-level input voltage - - 0.5 V VIH HIGH-level input voltage 1.2 - - V Output levels VOL LOW-level output voltage IOL = 100 A - - 0.15 V IOL = 2 mA - - 0.4 V VOH HIGH-level output voltage IOH = 100 A 1.5 - - V IOH = 2 mA 1.25 - - V Example 2: VCC(I/O) = 2.5 V 0.2 V Input levels VIL LOW-level input voltage - - 0.7 V VIH HIGH-level input voltage 1.7 - - V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 A 2.15 - - V IOH = 2 mA 1.9 - - V Example 3: VCC(I/O) = 3.3 V 0.3 V Input levels VIL LOW-level input voltage - - 0.9 V VIH HIGH-level input voltage 2.15 - - V IOL = 100 A - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 A 2.85 - - V IOH = 2 mA 2.6 - - V pin to GND - - 10 pF Output levels VOL VOH LOW-level output voltage HIGH-level output voltage Capacitance CIN input capacitance (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 13 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers Table 15: Static characteristics: analog I/O pins (D+, D-) VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels Differential receiver VDI differential input sensitivity |VI(D+) - VI(D-)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V Single-ended receiver VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V - - 0.3 V 2.8 - 3.6 V -1 - +1 A - - 20 pF Output levels LOW-level output voltage VOL VOH HIGH-level output voltage RL = 1.5 k to +3.6 V [1] RL = 15 k to GND Leakage current OFF-state leakage current ILZ Capacitance transceiver capacitance pin to GND ZDRV driver output impedance steady-state drive 34 39 44 ZINP input impedance 10 - - M RSW internal switch resistance at pin Vpu(3.3) - - 10 3.0 - 3.6 V CIN Resistance [2] Termination VTERM [1] [2] [3] [4] [3][4] termination voltage for upstream port pull-up (RPU) VOH(min) = Vreg(3.3) - 0.2 V. Includes external resistors of 33 1% on both D+ and D-. This voltage is available at pins Vreg(3.3) and Vpu(3.3). In `suspend' mode the minimum voltage is 2.7 V. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 14 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 12. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins (D+, D-)[1] VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics Full-speed mode tFR rise time CL = 50 to 125 pF; 10% to 90% of |VOH - VOL|; see Figure 7 4 - 20 ns tFF fall time CL = 50 to 125 pF; 90% to 10% of |VOH - VOL|; see Figure 7 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) excluding the first transition from idle state 90 - 111.1 % VCRS output signal crossover voltage excluding the first transition from idle state; see Figure 10 1.3 - 2.0 V [2] Low-speed mode tLR rise time CL = 50 to 600 pF; 10% to 90% of |VOH - VOL|; see Figure 7 75 - 300 ns tLF fall time CL = 50 to 600 pF; 90% to 10% of |VOH - VOL|; see Figure 7 75 - 300 ns LRFM differential rise/fall time matching (tLR/tLF) excluding the first transition from idle state 80 - 125 % VCRS output signal crossover voltage excluding the first transition from idle state; see Figure 10 1.3 - 2.0 V [2] Driver timing Full-speed mode tPLH(drv) driver propagation delay (VO/VPO, FSE0/VMO to D+,D-) LOW-to-HIGH; see Figure 10 - - 18 ns tPHL(drv) driver propagation delay (VO/VPO, FSE0/VMO to D+,D-) HIGH-to-LOW; see Figure 10 - - 18 ns tPHZ driver disable delay (OE to D+,D-) HIGH-to-OFF; see Figure 8 - - 15 ns tPLZ driver disable delay (OE to D+,D-) LOW-to-OFF; see Figure 8 - - 15 ns tPZH driver enable delay (OE to D+,D-) OFF-to-HIGH; see Figure 8 - - 15 ns tPZL driver enable delay (OE to D+,D-) OFF-to-LOW; see Figure 8 - - 15 ns Low-speed mode Not specified: low-speed delay timings are dominated by the slow rise/fall times tLR and tLF. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 15 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers Table 16: Dynamic characteristics: analog I/O pins (D+, D-)[1]...continued VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Receiver timings (full-speed and low-speed mode) Differential receiver tPLH(rcv) propagation delay (D+,D- to LOW-to-HIGH; see Figure 9 RCV) - - 15 ns tPHL(rcv) propagation delay (D+,D- to HIGH-to-LOW; see Figure 9 RCV) - - 15 ns Single-ended receiver tPLH(se) propagation delay (D+,D- to LOW-to-HIGH; see Figure 9 VP, VM) - - 18 ns tPHL(se) propagation delay (D+,D- to HIGH-to-LOW; see Figure 9 VP, VM) - - 18 ns [1] [2] Test circuit: see Figure 13. Characterized only, not tested. Limits guaranteed by design. 1.8 V logic input t FR, t LR VOH 0V t FF, t LF 90 % 10 % 90 % VOH 10 % MGS963 Fig 7. Rise and fall times. VOH -0.3 V VCRS VOL +0.3 V VOL MGS966 Fig 8. Timing of OE to D+, D-. 2.0 V differential data lines t PHZ t PLZ t PZH t PZL differential data lines VOL 0.9 V 0.9 V 1.8 V VCRS VCRS logic input 0.8 V t PLH(rcv) t PLH(se) 0V t PHL(rcv) t PHL(se) t PLH(drv) VOH logic output t PHL(drv) VOH 0.9 V VOL Fig 9. Timing of D+, D- to RCV, VP, VM. differential data lines 0.9 V MGS965 VCRS VCRS VOL MGS964 Fig 10. Timing of VO/VPO, FSE0/VMO to D+, D-. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data 0.9 V 0.9 V Rev. 08 -- 19 February 2004 16 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 13. Test information test point 33 500 D.U.T. 50 pF V MBL142 V = 0 V for tPZH, tPHZ V = Vreg(/3.3) for tPZL, tPLZ Fig 11. Load for enable and disable times. test point D.U.T. 25 pF MGS968 Fig 12. Load for VM, VP and RCV. Vpu(3.3) 1.5 k (1) D.U.T. test point D+/D- 33 CL 15 k MGS967 Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 50 pF or 600 pF (low-speed mode, minimum or maximum timing) (1) Full-speed mode: connected to D+; low-speed mode: connected to D-. Fig 13. Load for D+, D-. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 17 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C detail X e1 Dh C e y y1 C 5 9 e e4 Eh e2 1/2 e4 1 13 16 A1 X 1/2 e3 A2 e3 A 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b b1 b2 b3 D Dh E Eh e e1 e2 e3 e4 f v w y y1 mm 0.8 0.10 0.05 0.7 0.6 0.33 0.27 0.33 0.27 0.38 0.32 0.38 0.32 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.5 2.5 2.5 2.45 2.45 0.23 0.17 0.08 0.1 0.05 0.2 OUTLINE VERSION REFERENCES IEC SOT639-2 JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 01-11-13 03-03-12 MO-217 Fig 14. HBCC16 package outline. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 18 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A B D SOT758-1 terminal 1 index area A E A1 c detail X e1 C 1/2 e e 5 y y1 C v M C A B w M C b 8 L 4 9 e e2 Eh 1/2 e 12 1 16 terminal 1 index area 13 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 1.75 1.45 3.1 2.9 1.75 1.45 0.5 1.5 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT758-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 02-03-25 02-10-21 Fig 15. HVQFN16 package outline. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 19 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index Lp L 1 8 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT403-1 JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 16. TSSOP16 package outline. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 20 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 15. Packaging The ISP1105/1106W (HBCC16 package) is delivered on a type A carrier tape, see Figure 17. The tape dimensions are given in Table 17. The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 1 mm in 100 mm. 4 idth W A0 K0 B0 P1 Type A direction of feed A0 4 W K0 B0 elongated sprocket hole P1 Type B direction of feed MLC338 Fig 17. Carrier tape dimensions. Table 17: Type A carrier tape dimensions for ISP1105/1106W Dimension Value Unit A0 3.3 mm B0 3.3 mm K0 1.1 mm P1 8.0 mm W 12.0 0.3 mm (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 21 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 16. Soldering 16.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended. 16.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 22 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 16.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 16.5 Package related soldering information Table 18: Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, USON, VFBGA Reflow[2] not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable[4] HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS suitable PLCC[5], SO, SOJ suitable suitable recommended[5][6] suitable LQFP, QFP, TQFP not SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable CWQCCN..L[8], not suitable not suitable [1] [2] PMFP[9], WQCCN..L[8] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Wave Rev. 08 -- 19 February 2004 23 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers [3] [4] [5] [6] [7] [8] [9] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 24 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 17. Additional soldering information 17.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 m min.) ensures solderability, the Ni layer (5 m min.) prevents diffusion, and the Pd layer on top (0.5 m min.) ensures effective wire bonding. Terminal PCB land Solder resist mask Stencil mask All dimensions in mm Normal 0.05 b1 Solder land 0.05 b1 b Solder resist b Solder stencil 0.05 0.05 Corner 0.05 b2 b2 0.05 For exact dimensions see package outline drawing (SOT639-2) b2 b2 0.05 0.05 Cavity 0.05 0.3 (8x) Stencil print thickness: 0.1 to 0.12 mm Eh 0.1 (4x) Eh 004aaa123 Dh Dh 0.05 Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages. Fig 18. (H)BCC footprint and solder resist mask dimensions. 17.2 (H)BCC packages: reflow soldering profile The conditions for reflow soldering of (H)BCC packages are as follows: * Preheating time: minimum 90 s at T = 145 to 155 C * Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 C * Peak temperature: - Ambient temperature: Tamb(max) = 260 C - Device surface temperature: Tcase(max) = 255 C. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 25 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 18. Revision history Table 19: Revision history Rev Date 08 20040219 CPCN Description - Product data (9397 750 11231); removed ISP1107 related information. Modifications: * Changed the data sheet title from ISP1105/1106/1107 to ISP1105/1106 and removed all information pertaining to ISP1107 * * * * * * * Changed USB 1.1 reference to USB 2.0; also added data transfer rates Added HVQFN16 package details in Table 1, Section 6 and Section 14 Figure 1: removed the first figure note Table 3: added pad details Table 11: updated Table 15: removed ZDRV2, and also table note 3 Figure 8 and Figure 10: changed 1.65 V to 1.8 V. 07 20020329 - Product data (9397 750 09529) 06 20011130 - Product data; sixth version (9397 750 08872) 05 20010903 - Product data; fifth version (9397 750 08681) 04 20010802 - Preliminary data; fourth version (9397 750 08643) 03 20010704 - Preliminary data; third version (9397 750 08515) 02 20010205 - Objective specification; second version (9397 750 07879) ISP1107 stand-alone data sheet only. 01 20000223 - Objective specification; initial version (9397 750 06899) ISP1107 stand-alone data sheet only. (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Product data Rev. 08 -- 19 February 2004 26 of 28 ISP1105/1106 Philips Semiconductors Advanced USB transceivers 19. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 20. Definitions 21. Disclaimers Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Product data Fax: +31 40 27 24825 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 11231 Rev. 08 -- 19 February 2004 27 of 28 Philips Semiconductors ISP1105/1106 Advanced USB transceivers Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 8.1 8.2 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 16.5 17 17.1 17.2 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 7 Function selection. . . . . . . . . . . . . . . . . . . . . . . 7 Operating functions. . . . . . . . . . . . . . . . . . . . . . 7 Power supply configurations . . . . . . . . . . . . . . . 8 Power supply input options . . . . . . . . . . . . . . . . 9 Electrostatic discharge (ESD). . . . . . . . . . . . . 10 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . 10 ESD test conditions . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Recommended operating conditions. . . . . . . 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 Package related soldering information . . . . . . 23 Additional soldering information . . . . . . . . . . 25 (H)BCC packages: footprint . . . . . . . . . . . . . . 25 (H)BCC packages: reflow soldering profile. . . 25 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 (c) Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 19 February 2004 Document order number: 9397 750 11231