ULN2002A . . . N PACKAGE
ULN2003A . . . D, N, NS, OR PW PACKAGE
ULN2004A . . . D, N, OR NS PACKAGE
ULQ2003A, ULQ2004A . . . D OR N PACKAGE
(TOP VIEW)
1B 116
2B 215
3B 314
4B 413
5B 512
6B 611
7B 710
E8 9
1C
2C
3C
4C
5C
6C
7C
COM
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS
Check for Samples: ULN2002A,ULN2003A,ULN2003AI,ULN2004A,ULQ2003A,ULQ2004A
1FEATURES
• 500-mA-Rated Collector Current (Single
Output)
• High-Voltage Outputs: 50 V
• Output Clamp Diodes
• Inputs Compatible With Various Types of
Logic
• Relay-Driver Applications
DESCRIPTION
The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current
Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with
common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington
pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay
drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers.
For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and
SN75469, respectively.
The ULN2002A is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a
Zener diode and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have
a 2.7-kΩseries base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The
ULN2004A and ULQ2004A have a 10.5-kΩseries base resistor to allow operation directly from CMOS devices
that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the
ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1976–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
7C
6C
5C
4C
3C
2C
1C
COM
7
6
5
4
3
2
1
7B
6B
5B
4B
3B
2B
1B
10
11
12
13
14
15
16
9
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
ULN2002AN ULN2002AN
PDIP – N Tube of 25 ULN2003AN ULN2003AN
ULN2004AN ULN2004AN
Tube of 40 ULN2003AD
Reel of 2500 ULN2003ADR ULN2003A
SOIC – D Reel of 2500 ULN2003ADRG3
–20°C to 70°C Tube of 40 ULN2004AD ULN2004A
Reel of 2500 ULN2004ADRG3
ULN2003ANSR ULN2003A
SOP – NS Reel of 2000 ULN2004ANSR ULN2004A
Tube of 90 ULN2003APW
TSSOP – PW UN2003A
Reel of 2000 ULN2003APWR
ULQ2003AN ULQ2003A
PDIP – N Tube of 25 ULQ2004AN ULQ2004AN
Tube of 40 ULQ2003AD ULQ2003A
–40°C to 85°C Reel of 2500 ULQ2003ADR
SOIC – D Tube of 40 ULQ2004AD ULQ2004A
Reel of 2500 ULQ2004ADR
SOP – NS Reel of 2000 ULN2003AINSR ULN2003AI
PDIP – N Tube of 425 ULN2003AIN ULN2003AIN
Tube of 40 ULN2003AID
–40°C to 105°C SOIC – D ULN2003AI
Reel of 2500 ULN2003AIDR
TSSOP – PW Reel of 2500 ULN2003AIPWR UN2003AI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
LOGIC DIAGRAM
2Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
7.2 kW
3 kW
10.5 kW
ULN2002A
ULN/ULQ2003A: R = 2.7 k
BW
ULN/ULQ2004A: R = 10.5 k
BW
ULN2003AI: R = 2.7 k
BW7.2 kW3 kW
ULN2003A, ULN2004A, ULQ2003A, ULQ2004AULN2003AI,
RB
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
SCHEMATICS (EACH DARLINGTON PAIR)
All resistor values shown are nominal.
The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go
below ground an external Schottky diode should be added to clamp negative undershoots.
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
at 25°C free-air temperature (unless otherwise noted) MIN MAX UNIT
VCC Collector-emitter voltage 50 V
Clamp diode reverse voltage(2) 50 V
VIInput voltage(2) 30 V
See Figure 14 and
Peak collector current 500 mA
Figure 15
IOK Output clamp current 500 mA
Total emitter-terminal current –2.5 A
ULN200xA –20 70
ULN200xAI –40 105
TAOperating free-air temperature range °C
ULQ200xA –40 85
ULQ200xAT –40 105
D package 73
N package 67
θJA Package thermal impedance(3) (4) NS package 64 °C/W
PW package 108
D package 36
θJC Package thermal impedance(5) (6) N package 54
TJOperating virtual junction temperature 150 °C
Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds 260 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) Maximum power dissipation is a function of TJ(max), θJC, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJC. Operating at the absolute maximum TJof 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
ELECTRICAL CHARACTERISTICS
TA= 25°C ULN2002A
TEST
PARAMETER TEST CONDITIONS UNIT
FIGURE MIN TYP MAX
VI(on) On-state input voltage Figure 6 VCE = 2 V, IC= 300 mA 13 V
II= 250 μA, IC= 100 mA 0.9 1.1
VCE(sat) Collector-emitter saturation voltage Figure 4 II= 350 μA, IC= 200 mA 1 1.3 V
II= 500 μA, IC= 350 mA 1.2 1.6
VFClamp forward voltage Figure 7 IF= 350 mA 1.7 2 V
Figure 1 VCE = 50 V, II= 0 50
ICEX Collector cutoff current VCE = 50 V, II= 0 100 μA
Figure 2 TA= 70°C VI= 6 V 500
II(off) Off-state input current Figure 2 VCE = 50 V, IC= 500 μA 50 65 μA
IIInput current Figure 3 VI= 17 V 0.82 1.25 mA
TA= 70°C 100
IRClamp reverse current Figure 6 VR= 50 V μA
50
CiInput capacitance VI= 0, f = 1 MHz 25 pF
4Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
ELECTRICAL CHARACTERISTICS
TA= 25°C ULN2003A ULN2004A
TEST
PARAMETER TEST CONDITIONS UNIT
FIGURE MIN TYP MAX MIN TYP MAX
IC= 125 mA 5
IC= 200 mA 2.4 6
IC= 250 mA 2.7
VI(on) On-state input voltage Figure 6 VCE = 2 V V
IC= 275 mA 7
IC= 300 mA 3
IC= 350 mA 8
II= 250 μA, IC= 100 mA 0.9 1.1 0.9 1.1
Collector-emitter
VCE(sat) Figure 5 II= 350 μA, IC= 200 mA 1 1.3 1 1.3 V
saturation voltage II= 500 μA, IC= 350 mA 1.2 1.6 1.2 1.6
Figure 1 VCE = 50 V, II= 0 50 50
ICEX Collector cutoff current VCE = 50 V, II= 0 100 100 μA
Figure 2 TA= 70°C VI= 6 V 500
VFClamp forward voltage Figure 8 IF= 350 mA 1.7 2 1.7 2 V
VCE = 50 V, IC= 500 μA
II(off) Off-state input current Figure 3 50 65 50 65 μA
TA= 70°C,
VI= 3.85 V 0.93 1.35
IIInput current Figure 4 VI= 5 V 0.35 0.5 mA
VI= 12 V 1 1.45
50 50
IRClamp reverse current Figure 7 VR= 50 V μA
TA= 70°C 100 100
CiInput capacitance VI= 0, f = 1 MHz 15 25 15 25 pF
ELECTRICAL CHARACTERISTICS
TA= 25°C ULN2003AI
TEST
PARAMETER TEST FIGURE UNIT
CONDITIONS MIN TYP MAX
IC= 200 mA 2.4
VI(on) On-state input voltage Figure 6 VCE = 2 V IC= 250 mA 2.7 V
IC= 300 mA 3
II= 250 μA, IC= 100 mA 0.9 1.1
VCE(sat) Collector-emitter saturation voltage Figure 5 II= 350 μA, IC= 200 mA 1 1.3 V
II= 500 μA, IC= 350 mA 1.2 1.6
ICEX Collector cutoff current Figure 1 VCE = 50 V, II= 0 50 μA
VFClamp forward voltage Figure 8 IF= 350 mA 1.7 2 V
II(off) Off-state input current Figure 3 VCE = 50 V, IC= 500 μA 50 65 μA
IIInput current Figure 4 VI= 3.85 V 0.93 1.35 mA
IRClamp reverse current Figure 7 VR= 50 V 50 μA
CiInput capacitance VI= 0, f = 1 MHz 15 25 pF
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
TA= –40°C to 105°C ULN2003AI
PARAMETER TEST FIGURE TEST CONDITIONS UNIT
MIN TYP MAX
IC= 200 mA 2.7
VI(on) On-state input voltage Figure 6 VCE = 2 V IC= 250 mA 2.9 V
IC= 300 mA 3
II= 250 μA, IC= 100 mA 0.9 1.2
VCE(sat) Collector-emitter saturation voltage Figure 5 II= 350 μA, IC= 200 mA 1 1.4 V
II= 500 μA, IC= 350 mA 1.2 1.7
ICEX Collector cutoff current Figure 1 VCE = 50 V, II= 0 100 μA
VFClamp forward voltage Figure 8 IF= 350 mA 1.7 2.2 V
II(off) Off-state input current Figure 3 VCE = 50 V, IC= 500 μA 30 65 μA
IIInput current Figure 4 VI= 3.85 V 0.93 1.35 mA
IRClamp reverse current Figure 7 VR= 50 V 100 μA
CiInput capacitance VI= 0, f = 1 MHz 15 25 pF
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted) ULQ2003A ULQ2004A
TEST
PARAMETER TEST CONDITIONS UNIT
FIGURE MIN TYP MAX MIN TYP MAX
IC= 125 mA 5
IC= 200 mA 2.7 6
IC= 250 mA 2.9
VI(on) On-state input voltage Figure 6 VCE = 2 V V
IC= 275 mA 7
IC= 300 mA 3
IC= 350 mA 8
II= 250 μA, IC= 100 mA 0.9 1.2 0.9 1.1
Collector-emitter
VCE(sat) Figure 5 II= 350 μA, IC= 200 mA 1 1.4 1 1.3 V
saturation voltage II= 500 μA, IC= 350 mA 1.2 1.7 1.2 1.6
Figure 1 VCE = 50 V, II= 0 100 50
ICEX Collector cutoff current VCE = 50 V, II= 0 100 μA
Figure 2 TA= 70°C VI= 6 V 500
VFClamp forward voltage Figure 8 IF= 350 mA 1.7 2.3 1.7 2 V
VCE = 50 V,
II(off) Off-state input current Figure 3 IC= 500 μA 65 50 65 μA
TA= 70°C,
VI= 3.85 V 0.93 1.35
IIInput current Figure 4 VI= 5 V 0.35 0.5 mA
VI= 12 V 1 1.45
TA= 25°C 100 50
IRClamp reverse current Figure 7 VR= 50 V μA
100 100
CiInput capacitance VI= 0, f = 1 MHz 15 25 15 25 pF
6Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
SWITCHING CHARACTERISTICS
TA= 25°C ULN2002A, ULN2003A,
ULN2004A
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
tPLH Propagation delay time, low- to high-level output See Figure 9 0.25 1 μs
tPHL Propagation delay time, high- to low-level output See Figure 9 0.25 1 μs
VOH High-level output voltage after switching VS= 50 V, IO= 300 mA, See Figure 10 VS– 20 mV
SWITCHING CHARACTERISTICS
TA= 25°C ULN2003AI
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
tPLH Propagation delay time, low- to high-level output See Figure 9 0.25 1 μs
tPHL Propagation delay time, high- to low-level output See Figure 9 0.25 1 μs
VOH High-level output voltage after switching VS= 50 V, IO≈300 mA, See Figure 10 VS– 20 mV
SWITCHING CHARACTERISTICS
TA= –40°C to 105°C ULN2003AI
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 μs
tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 μs
VOH High-level output voltage after switching VS= 50 V, IO≈300 mA, See Figure 10 VS– 50 mV
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted) ULQ2003A, ULQ2004A
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 μs
tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 μs
VOH High-level output voltage after switching VS= 50 V, IO= 300 mA, See Figure 10 VS– 20 mV
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
Open VCE
Open
ICEX
Open VCE
VI
ICEX
Open
Open
II(on)
VI
Open VCE
IC
II(off)
Open
VCE IC
II
hFE =IC
II
Open
VCE IC
VI(on)
IF
VF
Open
VR
Open
IR
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. ICEX Test Circuit Figure 2. ICEX Test Circuit
Figure 3. II(off) Test Circuit Figure 4. IITest Circuit
A. IIis fixed for measuring VCE(sat), variable for measuring hFE.
Figure 5. hFE, VCE(sat) Test Circuit Figure 6. VI(on) Test Circuit
Figure 7. IRTest Circuit Figure 8. VFTest Circuit
Figure 9. Propagation Delay-Time Waveforms
8Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
90% 90%
1.5 V 1.5 V
10% 10%
40 µs
≤10 ns
≤5 ns
VIH
(see Note C)
0 V
VOH
VOL
Input
Output
VOLTAGE WAVEFORMS
200 W
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
PARAMETER MEASUREMENT INFORMATION (continued)
A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO= 50 Ω.
B. CLincludes probe and jig capacitance.
C. For testing the ULN2003A, ULN2003AI, and ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V; for the ULN2004A
and the ULQ2004A, VIH = 8 V.
Figure 10. Latch-Up Test Circuit and Voltage Waveforms
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
0
IC- Collector Current - mA
2.5
800
0
100 200 300 400 500 600 700
0.5
1
1.5
2
II= 350 µA
II= 500 µA
VCE(sat) - Collector-Emitter Saturation Voltage - V
VCE(sat)
TA= 25°C
II= 250 µA
2
1.5
1
0.5
700600500400300200100
0
800
2.5
IC(tot) - Total Collector Current - mA
0
VCE(sat) - Collector-Emitter Saturation Voltage - V
VCE(sat)
II= 250 µA
II= 350 µA
II= 500 µA
TA= 25°C
0
II- Input Current - µA
500
200
0
25 50 75 100 125 150 175
50
100
150
200
250
300
350
400
450
VS= 10 V
VS= 8 V
IC - Collector Current - mA
C
I
RL= 10 Ω
TA= 25°C
0
Duty Cycle - %
600
100
0
10 20 30 40 50 60 70 80 90
100
200
300
400
500
TA= 70°C
N = Number of Outputs
Conducting Simultaneously
N = 6
N = 7
N = 5
N = 3
N = 2
N = 1
IC - Maximum Collector Current - mA
C
I
N = 4
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
TYPICAL CHARACTERISTICS
COLLECTOR-EMITTER SATURATION VOLTAGE
COLLECTOR-EMITTER SATURATION VOLTAGE vs
vs TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN
COLLECTOR CURRENT (ONE DARLINGTON) PARALLEL)
Figure 11. Figure 12.
D PACKAGE
COLLECTOR CURRENT MAXIMUM COLLECTOR CURRENT
vs vs
INPUT CURRENT DUTY CYCLE
Figure 13. Figure 14.
10 Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2 2.5 3 3.5 4 4.5 5
Input Voltage – V
Input Current – µA
TJ= -40°C to 105°C
Maximum
Typical
Conducting Simultaneously
N = Number of Outputs
500
400
300
200
100
908070605040302010
0100
600
Duty Cycle - %
0
N = 7
TA= 85°C
N = 5
N = 3
N = 2
N = 6
N = 1
IC - Maximum Collector Current - mA
C
I
N = 4
0.9
1.1
1.3
1.5
1.7
1.9
2.1
100 200 300 400 500
Output Current – mA
Maximum VCE(sat) Voltage – V
TJ= -40°C to 105°C
Maximum
Typical
100
150
200
250
300
350
400
450
500
250 350 450 550 650
Input Current – µA
Output Current – mA
VCE = 2 V
TJ= -40°C to 105°C
Minimum
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
TYPICAL CHARACTERISTICS (continued)
N PACKAGE
MAXIMUM COLLECTOR CURRENT MAXIMUM AND TYPICAL INPUT CURRENT
vs vs
DUTY CYCLE INPUT VOLTAGE
Figure 15. Figure 16.
MAXIMUM AND TYPICAL SATURATED VCE MINIMUM OUTPUT CURRENT
vs vs
OUTPUT CURRENT INPUT CURRENT
Figure 17. Figure 18.
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
1
2
3
4
5
6
7
9
10
11
12
13
14
15
16
8
ULN2002A
P-MOS
Output
VSS V
ULQ2003A
Lam
Test
TTL
Output
VCC V
1
2
3
4
5
6
9
10
11
12
13
14
15
16
8
7
VDD V
ULN2004A
ULQ2004A
1
2
3
4
5
6
9
10
11
12
13
14
15
16
8
CMOS
Output
7
VCC V
RP
ULQ2003A
1
2
3
4
5
6
9
10
11
12
13
14
15
16
8
TTL
Output
7
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
www.ti.com
APPLICATION INFORMATION
Figure 19. P-MOS to Load Figure 20. TTL to Load
Figure 21. Buffer for Higher Current Loads Figure 22. Use of Pullup Resistors to Increase
Drive Current
12 Submit Documentation Feedback Copyright © 1976–2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027L –DECEMBER 1976–REVISED MARCH 2012
REVISION HISTORY
Changes from Revision K (August 2011) to Revision L Page
• Removed reference to obsolete ULN2001 part .................................................................................................................... 1
Copyright © 1976–2012, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ULN2001AD OBSOLETE SOIC D 16 TBD Call TI Call TI
ULN2001ADR OBSOLETE SOIC D 16 TBD Call TI Call TI
ULN2001AN OBSOLETE PDIP N 16 TBD Call TI Call TI
ULN2002AD OBSOLETE SOIC D 16 TBD Call TI Call TI
ULN2002AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2002ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2003AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ADE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ADRG3 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
ULN2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ULN2003AINE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2003AINSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003AJ OBSOLETE CDIP J 16 TBD Call TI Call TI
ULN2003AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2003ANE3 PREVIEW PDIP N 16 25 TBD Call TI Call TI
ULN2003ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2003ANSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003APW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003APWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2003APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ULN2003APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ADE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2004ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULN2004ANSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULN2004ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2003AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2003ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2003AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
ULQ2004AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2004ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ULQ2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ULQ2004AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ULQ2003A, ULQ2004A :
•Automotive: ULQ2003A-Q1, ULQ2004A-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ULN2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2003AIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2003AINSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
ULN2003AIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
ULN2003AIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
ULN2003AIPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
ULN2003ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
ULN2003APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
ULN2003APWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
ULN2003APWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2004ADRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2004ADRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
ULN2004ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
ULQ2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ULN2003ADR SOIC D 16 2500 367.0 367.0 38.0
ULN2003ADR SOIC D 16 2500 333.2 345.9 28.6
ULN2003AIDR SOIC D 16 2500 333.2 345.9 28.6
ULN2003AINSR SO NS 16 2000 367.0 367.0 38.0
ULN2003AIPWR TSSOP PW 16 2000 367.0 367.0 35.0
ULN2003AIPWR TSSOP PW 16 2000 364.0 364.0 27.0
ULN2003AIPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
ULN2003ANSR SO NS 16 2000 367.0 367.0 38.0
ULN2003APWR TSSOP PW 16 2000 367.0 367.0 35.0
ULN2003APWR TSSOP PW 16 2000 364.0 364.0 27.0
ULN2003APWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
ULN2004ADR SOIC D 16 2500 367.0 367.0 38.0
ULN2004ADR SOIC D 16 2500 333.2 345.9 28.6
ULN2004ADRG4 SOIC D 16 2500 333.2 345.9 28.6
ULN2004ADRG4 SOIC D 16 2500 367.0 367.0 38.0
ULN2004ANSR SO NS 16 2000 367.0 367.0 38.0
ULQ2003ADR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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