• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Chip Beads
For power line
MPZ series
Type:
Issue date:
MPZ0603 0603[0201 inch]*
MPZ1005 1005[0402 inch]
MPZ1608 1608[0603 inch]
MPZ2012 2012[0805 inch]
* Dimensions Code JIS[EIA]
November 2011
• All specifications are subject to change without notice.
(1/10)
001-07 / 20111129 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ0603
FEATURES
• This chip bead implements a 0603 shape in its capacity as an
EMC countermeasure component, and it supports compact
devices that need smaller spaces.
• This product can cope with a high current due to its low DC
resistance. It is also most suitable for lower power consumption.
• Because of its low DC resistance, it is useful for audio lines.
•
No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
220: 22Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
∗Test equipment: E4991A or equivalent
Test tool: 16197 or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MPZ 0603 S 220 C T
(1) (2) (3) (4) (5) (6) (7)
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 15000 pieces/reel
Part No. Impedance
(Ω)[100MHz]∗
DC resistance
(Ω)max.
Rated current
(mA)max.
MPZ0603S220C 22±25% 0.065 1000
MPZ0603S330C 33±25% 0.090 750
MPZ0603S470C 47±25% 0.120 500
0.1min.
0.3±0.03
0.6±0.03
0.3±0.03
0.300.25 0.25
0.30
Weight: 0.3mg
Dimensions in mm
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(2/10)
001-07 / 20111129 / e9413_mpz
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS
MPZ0603S SERIES
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ0603S220C MPZ0603S330C MPZ0603S470C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
100001000100101
Frequency(MHz)
0
Impedance(Ω)
10
20
30
40
50
60
70
80
90
100
MPZ0603S470C
MPZ0603S330C
MPZ0603S220C
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
10
20
30
40
50
60
70
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
5
10
15
20
25
30
35
40
45
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
10
20
30
40
50
60
70
80
90
Z
X
R
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
0.68±0.05
0.5max. 0.38±0.05
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05 2.0±0.05
Sprocket hole Cavity
1.5 +0.1
–0.0
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(3/10)
001-07 / 20111129 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ1005
FEATURES
•
TDK has manufactured MPZ1005 type as EMI countermeasure
product for power line.
•
This type is the best for energy-saving in the low DC resistance.
•
No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
121: 120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
∗Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MPZ 1005 S 121 C T
(1) (2) (3) (4) (5) (6) (7)
Operating/storage –40 to +85°C
Packaging style Quantity
Taping 10000 pieces/reel
Part No. Impedance
(Ω)[100MHz]∗
DC resistance
(Ω)max.
Rated current
(A)max.
MPZ1005S100C 10±5Ω0.025 2.0
MPZ1005S300C 30±10Ω0.035 1.7
MPZ1005S600C 60±25% 0.060 1.5
MPZ1005S121C 120±25% 0.090 1.2
MPZ1005Y900C 90±25% 0.100 1.2
0.1min.
0.5±0.05
1±0.05
0.5±0.05
0.40.5 0.5
0.5
Weight: 1mg
Dimensions in mm
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(4/10)
001-07 / 20111129 / e9413_mpz
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS
MPZ1005S/MPZ1005Y SERIES
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1005S100C MPZ1005S300C MPZ1005S600C
MPZ1005S121C MPZ1005Y900C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
100001000100101
Frequency(MHz)
0
Impedance(Ω)
MPZ1005Y900C
MPZ1005S600C
MPZ1005S121C
MPZ1005S100C
MPZ1005S300C
50
100
150
200
250
0100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
10
20
30
40
50
0100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
2
4
6
8
10
12
14
16
18
0
100
80
60
40
20
100001000100101
Impedance(Ω)
Frequency(MHz)
ZR
X
0100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
50
100
150
200
0
250
200
100
150
50
100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
1.15±0.1
0.8max. 0.65±0.1
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05 2.0±0.05
Sprocket hole Cavity
1.5 +0.1
–0.0
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(5/10)
001-07 / 20111129 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ1608
FEATURES
• This type is the best for energy-saving in the low DC resistance.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
221: 220Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for
effectiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal
frequency is far from the cutoff frequency. Impedance
values selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low
frequencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high
frequencies (300MHz to 1GHz) for signal line
applications.
TYPICAL MATERIAL CHARACTERISTICS
Conformity to RoHS Directive
MPZ 1608 S 221 A T
(1) (2) (3) (4) (5) (6) (7)
0
500
1000
1500
2000
2500
10 100 1000
Frequency(MHz)
Impedance(Ω)
RS
D
Y
B
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(6/10)
001-07 / 20111129 / e9413_mpz
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
∗1Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
∗2Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
RATED CURRENT vs. TEMPERATURE CHARACTERISTICS
(DERATING)
Thickness(T) Weight
0.6±0.15mm 3mg
0.8±0.15mm 4mg
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 4000 pieces/reel
0.8±0.15
T
1.6±0.15
0.3±0.2 0.3±0.2
0.8 0.60.6
0.8
Dimensions in mm
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Part No. Impedance
(Ω)[100MHz]∗1
DC resistance
(Ω)max.
Rated current∗2
(A)max.
Thickness
T(mm)
MPZ1608B471A 470±25% 0.150 1.0 0.8
MPZ1608S300A 30±10Ω0.010 5.0 0.6
MPZ1608S600A 60±25% 0.020 3.5 0.6
MPZ1608S101A 100±25% 0.030 3.0 0.6
MPZ1608S121A 120±25% 0.045 2.0 0.6
MPZ1608S181A 180±25% 0.050 2.0 0.6
MPZ1608S221A 220±25% 0.050 2.2 0.8
MPZ1608S331A 330±25% 0.080 1.7 0.8
MPZ1608R391A 390±25% 0.120 1.2 0.8
MPZ1608S471A 470±25% 0.150 1.0 0.8
MPZ1608S601A 600±25% 0.150 1.0 0.8
MPZ1608S102A 1000±25% 0.300 0.8 0.8
MPZ1608Y600B 60±25% 0.030 2.3 0.8
MPZ1608Y101B 100±25% 0.040 2.0 0.8
MPZ1608Y151B 150±25% 0.050 1.8 0.8
MPZ1608Y221B 220±25% 0.100 1.5 0.8
MPZ1608D300B 30±10Ω0.060 1.8 0.8
MPZ1608D600B 60±25% 0.100 1.2 0.8
MPZ1608D101B 100±25% 0.150 1.0 0.8
0
1
2
3
4
5
6
–55 –35 –15 5 25 45 65 85 105 125
Temperature(˚C)
Rated current(A)
S300A S600A S101A Y600B
B471A,S471A,S601A,D101B S102A
Y221BS331A R391A,D600B
S221A Y151B,D300BS121A,S181A,Y101B
• All specifications are subject to change without notice.
(7/10)
001-07 / 20111129 / e9413_mpz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1608B471A MPZ1608S300A MPZ1608S600A
MPZ1608S101A MPZ1608S121A MPZ1608S181A
MPZ1608S221A MPZ1608S331A MPZ1608R391A
MPZ1608S471A MPZ1608S601A MPZ1608S102A
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
5
10
15
20
25
30
35
40
Z
R
X
100
80
60
40
20
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
100
200
300
400
500
Z
R
X
Impedance(Ω)
1 10 100 1000 10000
Frequency(MHz)
ZR
X
0
20
40
60
80
100
120
140
160
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
0
50
100
150
200
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
0
50
100
150
200
250
300
300
100
50
150
200
250
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
0
50
100
150
200
250
300
350
400
450
800
700
600
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
0
100
200
300
400
500
600
700
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
200
400
600
800
1000
1200
ZR
X
• All specifications are subject to change without notice.
(8/10)
001-07 / 20111129 / e9413_mpz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ1608Y600B MPZ1608Y101B MPZ1608Y151B
MPZ1608Y221B
MPZ1608D300B MPZ1608D600B MPZ1608D101B
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
20
40
60
80
100
120
140
R
X
Z
0
50
100
150
200
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
Z
R
X
50
100
150
200
250
300
350
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
100
200
300
400
500
600
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
0
50
100
150
200
250
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
50
0
100
150
200
250
300
350
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.9±0.2
1.75±0.1
1.1max. 1.1±0.2 4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(9/10)
001-07 / 20111129 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ2012
FEATURES
• The MPZ series are multilayer chip impeders for power supply
line applications.
• High miniaturized, these parts nonetheless exhibit low DC
resistance and high current handling capability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1)Series name
(2)Dimensions L×W
(3)Type name
(4)Impedance
331: 330Ω at 100MHz
(5)Characteristic type
(6)Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MPZ 2012 S 331 A T
(1) (2) (3) (4) (5) (6) (7)
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 4000 pieces/reel
1.25±0.20.85±0.2
0.5±0.3
2.0±0.2
Weight: 8mg
Dimensions in mm
10.8 0.8
1.2
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(10/10)
001-07 / 20111129 / e9413_mpz
ELECTRICAL CHARACTERISTICS
∗1Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
∗2Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
RATED CURRENT vs. TEMPERATURE CHARACTERISTICS
(DERATING)
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MPZ2012S300A MPZ2012S101A MPZ2012S221A
MPZ2012S331A MPZ2012S601A MPZ2012S102A
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
Part No. Impedance
(Ω)[100MHz]∗1
DC resistance
(Ω)max.
Rated current∗2
(A)max.
MPZ2012S300A 30±10Ω0.010 6
MPZ2012S101A 100±25% 0.020 4
MPZ2012S221A 220±25% 0.040 3
MPZ2012S331A 330±25% 0.050 2.5
MPZ2012S601A 600±25% 0.100 2
MPZ2012S102A 1000±25% 0.150 1.5
S300A
S331A
S101A
S221A
S601A
S102A
0
1
2
3
4
5
6
7
–55 –35 –15 5 25 45 65 85 105 125
Temperature(˚C)
Rated current
(A)
50
40
30
20
10
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
20
40
60
80
100
120
140
ZR
X
300
100
50
150
200
250
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
0
100
200
300
400
500
600
700
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
1200
400
200
600
800
1000
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
R
X
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
1.1max. 4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
2.3±0.2
1.5±0.2
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
