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LM137

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LM137, LM337-N 3-Terminal Adjustable Negative Regulators

1 Features 3 Description

The LM137 and LM337-N are adjustable 3-terminal

1• 1.5-A Output Current negative voltage regulators capable of supplying

• Line Regulation 0.01%/V (Typical) −1.5 A or more currents over an output voltage range

• Load Regulation 0.3% (Typical) of −1.25 V to −37 V. It requires only two external

resistors to set the output voltage and one output

• 77-dB Ripple Rejection capacitor for frequency compensation. The circuit

• 50 ppm/°C Temperature Coefficient design has been optimized for excellent regulation

• Thermal Overload Protection and low thermal transients. Further, the LM137 and

LM337-N feature internal current limiting, thermal

• Internal Short-Circuit Current Limiting Protections shutdown and safe-area compensation, making it

virtually blowout-proof against overloads.

2 Applications The LM137 and LM337-N are ideal complements to

• Industrial Power Supplies the LM117 and LM317 adjustable positive regulators.

• Factory Automation Systems The LM137 has a wider operating temperature range

• Building Automation Systems than the LM337-N and is also offered in military and

• PLC Systems space qualified versions.

• Instrumentation Device Information(1)

• IGBT Drive Negative Gate Supplies PART NUMBER PACKAGE BODY SIZE (NOM)

• Networking LM137 TO (3) 8.255 mm × 8.255 mm

• Set-Top Boxes SOT-223 (4) 3.50 mm × 6.50 mm

LM337-N TO (3) 8.255 mm × 8.255 mm

TO-220 (3) 10.16 mm × 14.986 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet. The LF01 is a lead formed (bent)

version of the TO-220 package.

Adjustable Negative Voltage Regulator

Full output current not available at high input-output voltages

†C1 = 1-μF solid tantalum or 10-μF aluminum electrolytic required for stability

*C2 = 1-μF solid tantalum is required only if regulator is more than 4″from power-supply filter capacitor

Output capacitors in the range of 1-μF to 1000-μF of aluminum or tantalum electrolytic are commonly used to provide

improved output impedance and rejection of transients

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM137

LM337-N

SNVS778E –MAY 1999–REVISED JANUARY 2016

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Table of Contents

1 Features.................................................................. 18 Application and Implementation ........................ 12

8.1 Application Information............................................ 12

2 Applications ........................................................... 18.2 Typical Applications ................................................ 12

3 Description............................................................. 19 Power Supply Recommendations...................... 16

4 Revision History..................................................... 210 Layout................................................................... 16

5 Pin Configuration and Functions......................... 310.1 Layout Guidelines ................................................. 16

6 Specifications......................................................... 410.2 Layout Example .................................................... 16

6.1 Absolute Maximum Ratings ...................................... 410.3 Thermal Considerations........................................ 17

6.2 ESD Ratings.............................................................. 411 Device and Documentation Support................. 18

6.3 Recommended Operating Conditions....................... 411.1 Documentation Support ........................................ 18

6.4 Thermal Information.................................................. 411.2 Related Links ........................................................ 18

6.5 Electrical Characteristics........................................... 511.3 Community Resources.......................................... 18

6.6 Typical Characteristics.............................................. 611.4 Trademarks........................................................... 18

7 Detailed Description.............................................. 811.5 Electrostatic Discharge Caution............................ 18

7.1 Overview................................................................... 811.6 Glossary................................................................ 18

7.2 Functional Block Diagram......................................... 812 Mechanical, Packaging, and Orderable

7.3 Feature Description................................................... 8Information ........................................................... 18

7.4 Device Functional Modes........................................ 10

4 Revision History

Changes from Revision D (April 2013) to Revision E Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Deleted soldering information from Absolute Maximum Ratings ........................................................................................... 4

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ............................................................................................................. 7

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5 Pin Configuration and Functions

TO Metal Can Package

TO-220 Plastic Package 3-Pin Package Number NDT0003A

Package Number NDE0003B Bottom View

Front View

SOT-223

3-Lead Package Marked N02A

Front View

Pin Functions

PIN I/O DESCRIPTION

NAME TO-220 TO SOT-223

ADJ 1 1 1 — Adjust pin

VIN 2, TAB 3, CASE 2, 4 I Input voltage pin for the regulator

VOUT 3 2 3 O Output voltage pin for the regulator

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6 Specifications

6.1 Absolute Maximum Ratings MIN MAX UNIT

Power dissipation Internally Limited

Input-output voltage differential –0.3 40 V

LM137 –55 150

Operating junction temperature LM337-N 0 125 °C

LM337I –40 125

Storage temperature, Tstg –65 150 °C

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000

V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

LM137 –55 150

Operating junction temperature LM337-N 0 125 °C

LM337I –40 125

6.4 Thermal Information LM137 LM337-N

NDT NDT DCY NDE OR NDG

THERMAL METRIC(1) UNIT

(TO) (TO) (SOT-223) (TO-220)

3 PINS 3 PINS 3 PINS 3 PINS

RθJA Junction-to-ambient thermal resistance 140(2) 140(2) 58.3 22.9 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 12 12 36.6 15.7 °C/W

RθJB Junction-to-board thermal resistance — — 7.2 4.1 °C/W

ψJT Junction-to-top characterization parameter — — 1.3 2.4 °C/W

ψJB Junction-to-board characterization parameter — — 7 4.1 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 1 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2) No heat sink.

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6.5 Electrical Characteristics

Unless otherwise specified, these specifications apply −55°C ≤Tj≤150°C for the LM137, 0°C ≤Tj≤125°C for the LM337-N;

VIN −VOUT = 5 V; and IOUT = 0.1 A for the TO package and IOUT = 0.5 A for the SOT-223 and TO-220 packages. Although

power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO and SOT-

223, and 20 W for the TO-220. IMAX is 1.5 A for the SOT-223 and TO-220 packages, and 0.2 A for the TO package.

LM137 LM337-N

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX MIN TYP MAX

TJ= 25°C, 3 V ≤|VIN −VOUT|≤40 V(1)

Line regulation 0.01 0.02 0.01 0.04 %/V

IL= 10 mA

Load regulation TJ= 25°C, 10 mA ≤IOUT ≤IMAX 0.3% 0.5% 0.3% 1%

Thermal regulation TJ= 25°C, 10-ms Pulse 0.002 0.02 0.003 0.04 %/W

Adjustment pin current 65 100 65 100 μA

10 mA ≤IL≤IMAX

Adjustment pin current charge 3 V ≤|VIN −VOUT|≤40 V, 2 5 2 5 μA

TA= 25°C

TJ= 25°C (2) −1.225 −1.25 −1.275 −1.213 −1.25 −1.287 V

3 V ≤|VIN −VOUT|≤40 V, (2)

Reference voltage 10 mA ≤IOUT ≤IMAX, P ≤PMAX −55°C ≤TJ≤150°C −1.2 −1.25 −1.3 −1.2 −1.25 −1.3 V

Line regulation 3 V ≤|VIN −VOUT|≤40 V, (1) 0.02 0.05 0.02 0.07 %/V

Load regulation 10 mA ≤IOUT ≤IMAX,(1) 0.3% 1% 0.3% 1.5%

Temperature stability TMIN ≤Tj≤TMAX 0.6% 0.6%

|VIN −VOUT|≤40 V 2.5 5 2.5 10 mA

Minimum load current |VIN −VOUT|≤10 V 1.2 3 1.5 6 mA

K, DCY and NDE 1.5 2.2 3.5 1.5 2.2 3.7 A

package

|VIN −VOUT|≤15 V NDT package 0.5 0.8 1.8 0.5 0.8 1.9 A

Current limit K, DCY and NDE 0.24 0.4 0.15 0.4 A

package

|VIN −VOUT| = 40 V, TJ= 25°C NDT package 0.15 0.17 0.1 0.17 A

RMS output noise, % of VOUT Tj= 25°C, 10 Hz ≤f≤10 kHz 0.003% 0.003%

VOUT =−10 V, f = 120 Hz 60 60 dB

Ripple rejection ratio CADJ = 10 μF 66 77 66 77 dB

Long-term stability TJ= 125°C, 1000 Hours 0.3% 1% 0.3% 1%

(1) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point ⅛in.

below the base of the TO packages.

(2) Selected devices with tightened tolerance reference voltage available.

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6.6 Typical Characteristics

(NDE Package)

Figure 2. Current Limit

Figure 1. Load Regulation

Figure 3. Adjustment Current Figure 4. Dropout Voltage

Figure 5. Temperature Stability Figure 6. Minimum Operating Current

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Typical Characteristics (continued)

(NDE Package)

Figure 7. Ripple Rejection Figure 8. Ripple Rejection

Figure 9. Ripple Rejection Figure 10. Output Impedance

Figure 11. Line Transient Response Figure 12. Load Transient Response

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7 Detailed Description

7.1 Overview

In operation, the LM137 and LM337-N develops a nominal −1.25-V reference voltage between the output and

adjustment terminal. The reference voltage is impressed across program resistor R1 (120 Ωfor example) and,

because the voltage is constant, a constant current then flows through the output set resistor R2, giving an

output voltage calculated by Equation 1.

(1)

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Thermal Regulation

When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC

circuit components. With an IC regulator, this gradient can be especially severe because power dissipation is

large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output

change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical

regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation.

Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage

regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is

applied. The LM137 device's specification is 0.02%/W, maximum.

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Feature Description (continued)

LM137

VOUT =−10 V

VIN −VOUT =−40 V

IIL = 0 A →0.25 A →0 A

Vertical sensitivity, 5 mV/div

Figure 13. Output Drift (10W Pulse for 10ms)

In Figure 13, a typical LM137 device's output drifts only 3 mV (or 0.03% of VOUT =−10 V) when a 10-W pulse is

applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10 W = 0.2%

maximum. When the 10-W pulse is ended, the thermal regulation again shows a 3-mV step at the LM137 chip

cools off.

NOTE

The load regulation error of about 8 mV (0.08%) is additional to the thermal regulation

error.

In Figure 14, when the 10-W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first

10 ms, and the thermal error stays well within 0.1% (10 mV).

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Feature Description (continued)

LM137

VOUT =−10 V

VIN −VOUT =−40 V

IL= 0 A →0.25 A →0 A

Horizontal sensitivity, 20 ms/div

Figure 14. Output Drift (10-W Pulse for 100 ms)

7.4 Device Functional Modes

7.4.1 Protection Diodes

When external capacitors are used with any IC regulator, it is sometimes necessary to add protection diodes to

prevent the capacitors from discharging through low current points into the regulator. Most 10-μF capacitors have

low enough internal series resistance to deliver 20-A spikes when shorted. Although the surge is short, there is

enough energy to damage parts of the IC.

When an output capacitor is connected to a negative output regulator and the input is shorted, the output

capacitor pulls current out of the output of the regulator. The current depends on the value of the capacitor, the

output voltage of the regulator, and the rate at which VIN is shorted to ground.

The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs

when either the input, or the output, is shorted. Figure 15 shows the placement of the protection diodes.

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Device Functional Modes (continued)

*When CLis larger than 20 μF, D1 protects the LM137 in case the input supply is shorted

**When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM137 in case the output is shorted

Figure 15. Regulator With Protection Diodes

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM137 and LM337-N are versatile, high performance, negative output linear regulators with high accuracy

and a wide temperature range. An output capacitor can be added to further improve transient response, and the

ADJ pin can be bypassed to achieve very high ripple-rejection ratios. The device's functionality can be utilized in

many different applications that require negative voltage supplies, such as bipolar amplifiers, operational

amplifiers, and constant current regulators.

8.2 Typical Applications

8.2.1 Adjustable Negative Voltage Regulator

The LM137 and LM337-N can be used as a simple, negative output regulator to enable a variety of output

voltages needed for demanding applications. By using an adjustable R2 resistor, a variety of negative output

voltages can be made possible as shown in Figure 16.

Full output current not available at high input-output voltages

†C1 = 1-μF solid tantalum or 10-μF aluminum electrolytic required for stability

*C2 = 1-μF solid tantalum is required only if regulator is more than 4 inches from power-supply filter capacitor

Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide

improved output impedance and rejection of transients

Figure 16. Adjustable Negative Voltage Regulator

(2)

8.2.1.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an

output capacitor for load regulation. An input capacitor is needed if the device is more than 4 inches from the

filter capacitors.

8.2.1.2 Detailed Design Procedure

The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 16.

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Typical Applications (continued)

8.2.1.3 Application Curve

As shown in Figure 17, the maximum output current capability is limited by the input-output voltage differential,

package type, and junction temperature.

Figure 17. Current Limit

8.2.2 Adjustable Lab Voltage Regulator

The LM337-N can be combined with a positive regulator such as the LM317-N to provide both a positive and

negative voltage rail. This can be useful in applications that use bi-directional amplifiers and dual-supply

operational amplifiers.

Full output current not available at high input-output voltages

*The 10 μF capacitors are optional to improve ripple rejection

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*0.8 R1 120W £ £ W

OUT

1.250V

I =

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Typical Applications (continued)

8.2.3 Current Regulator

A simple, fixed current regulator can be made by placing a resistor between the VOUT and ADJ pins of the

LM137. By regulating a constant 1.25 V between these two terminals, a constant current can be delivered.

(3)

(4)

8.2.4 −5.2-V Regulator with Electronic Shutdown

The LM337-N can be used with a PNP transistor to provide shutdown control from a TTL control signal. The PNP

can short or open the ADJ pin to GND. When ADJ is shorted to GND by the PNP, the output is −1.3V. When

ADJ is disconnected from GND by the PNP, then the LM337-N outputs the programmed output of −5.2 V.

Minimum output ≃−1.3 V when control input is low

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Typical Applications (continued)

8.2.5 High Stability −10-V Regulator

Using a high stability shunt voltage reference in the feedback path, such as the LM329, provides damping

necessary for a stable, low noise output.

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9 Power Supply Recommendations

The input supply to the LM137 and LM337-N must be kept at a voltage level such that its maximum input to

output differential voltage rating is not exceeded. The minimum dropout voltage must also be met with extra

headroom when possible to keep the LM137 and LM337-N in regulation. TI recommends an input capacitor,

especially when the input pin is placed more than 4 inches away from the power-supply filter capacitor.

10 Layout

10.1 Layout Guidelines

Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.

Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the

feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can

be placed at the ADJ pin and must be placed as close as possible to the IC. In cases when VIN shorts to ground,

an external diode must be placed from VIN to VOUT to divert the surge current into the output capacitor and

protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to

ground, an external diode must be placed from VOUT to ADJ to provide a path for the bypass capacitor to

discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.

10.2 Layout Example

Figure 18. Layout Example (SOT-223)

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10.3 Thermal Considerations

10.3.1 Heatsinking SOT-223 Package Parts

The SOT-223 DCY packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the

heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

Figure 19 and Figure 20 show the information for the SOT-223 package. Figure 20 assumes a θ(J−A) of 75°C/W

for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.

Figure 19. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package

Figure 20. Maximum Power Dissipation vs TAMB for the SOT-223 Package

See AN-1028, SNVA036, for power enhancement techniques to be used with the SOT-223 package.

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

AN-1028, SNVA036

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM137 Click here Click here Click here Click here Click here

LM337-N Click here Click here Click here Click here Click here

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM137H ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -55 to 150 ( LM137HP+, LM137H

P+)

LM137H/NOPB ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -55 to 150 ( LM137HP+, LM137H

P+)

LM337IMP NRND SOT-223 DCY 4 1000 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 N02A

LM337IMP/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N02A

LM337IMPX NRND SOT-223 DCY 4 2000 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 N02A

LM337IMPX/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N02A

LM337T NRND TO-220 NDE 3 45 Non-RoHS &

Non-Green Call TI Call TI 0 to 125 LM337T P+

LM337T/LF01 ACTIVE TO-220 NDG 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM337T P+

LM337T/NOPB ACTIVE TO-220 NDE 3 45 RoHS-Exempt

& Green SN Level-1-NA-UNLIM 0 to125 LM337T P+

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM337IMP SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM337IMP/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM337IMPX SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM337IMPX/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM337IMP SOT-223 DCY 4 1000 367.0 367.0 35.0

LM337IMP/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM337IMPX SOT-223 DCY 4 2000 367.0 367.0 35.0

LM337IMPX/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

MECHANICAL DATA

NDE0003B

www.ti.com

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

MECHANICAL DATA

NDG0003F

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T03F (Rev B)

MECHANICAL DATA

NDT0003A

www.ti.com

H03A (Rev D)

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