© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Section 1. Cyclone III Device
Data Sheet
This section includes the following chapter:
■Chapter 1, Cyclone III Device Data Sheet
■Chapter 2, Cyclone III LS Device Data Sheet
Revision History
Refer to each chapter for its own specific revision history. For information on when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the complete handbook.
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
1. Cyclone III Device Data Sheet
This chapter describes the electric characteristics, switching characteristics, and I/O
timing for Cyclone®III devices. A glossary is also included for your reference.
Electrical Characteristics
The following sections provide information about the absolute maximum ratings,
recommended operating conditions, DC characteristics, and other specifications for
Cyclone III devices.
Operating Conditions
When Cyclone III devices are implemented in a system, they are rated according to a
set of defined parameters. To maintain the highest possible performance and
reliability of Cyclone III devices, system designers must consider the operating
requirements in this document. Cyclone III devices are offered in commercial,
industrial, and automotive grades. Commercial devices are offered in –6 (fastest), –7,
and –8 speed grades. Industrial and automotive devices are offered only in –7 speed
grade.
1In this chapter, a prefix associated with the operating temperature range is attached to
the speed grades; commercial with “C” prefix, industrial with “I” prefix, and
automotive with “A” prefix. Commercial devices are therefore indicated as C6, C7,
and C8 per respective speed grades. Industrial and automotive devices are indicated
as I7 and A7, respectively.
Absolute Maximum Ratings
Absolute maximum ratings define the maximum operating conditions for Cyclone III
devices. The values are based on experiments conducted with the device and
theoretical modeling of breakdown and damage mechanisms. The functional
operation of the device is not implied at these conditions. Table 1–1 lists the absolute
maximum ratings for Cyclone III devices.
1Conditions beyond those listed in Table 1–1 cause permanent damage to the device.
Additionally, device operation at the absolute maximum ratings for extended periods
of time has adverse effects on the device.
Tab le 1–1. Cyclone III Devices Absolute Maximum Ratings (Note 1) (Part 1 of 2)
Symbol Parameter Min Max Unit
VCCINT Supply voltage for internal logic –0.5 1.8 V
VCCIO Supply voltage for output buffers –0.5 3.9 V
VCCA
Supply voltage (analog) for phase-locked loop
(PLL) regulator –0.5 3.75 V
VCCD_PLL Supply voltage (digital) for PLL –0.5 1.8 V
VIDC input voltage –0.5 3.95 V
CIII52001-3.3
1–2 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Maximum Allowed Overshoot or Undershoot Voltage
During transitions, input signals may overshoot to the voltage listed in Table 1–2 and
undershoot to –2.0 V for a magnitude of currents less than 100 mA and for periods
shorter than 20 ns. Table 1–2 lists the maximum allowed input overshoot voltage and
the duration of the overshoot voltage as a percentage over the lifetime of the device.
The maximum allowed overshoot duration is specified as percentage of high-time
over the lifetime of the device.
1A DC signal is equivalent to 100% duty cycle. For example, a signal that overshoots to
4.2 V can only be at 4.2 V for 10.74% over the lifetime of the device; for device lifetime
of 10 years, this amounts to 10.74/10ths of a year.
IOUT DC output current, per pin –25 40 mA
VESDHBM
Electrostatic discharge voltage using the human
body model — ±2000 V
VESDCDM
Electrostatic discharge voltage using the
charged device model —±500 V
TSTG Storage temperature –65 150 °C
TJOperating junction temperature –40 125 °C
Note to Tabl e 1 –1 :
(1) Supply voltage specifications apply to voltage readings taken at the device pins with respect to ground, not at the
power supply.
Tab le 1–1. Cyclone III Devices Absolute Maximum Ratings (Note 1) (Part 2 of 2)
Symbol Parameter Min Max Unit
Chapter 1: Cyclone III Device Data Sheet 1–3
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Tab le 1–2. Cyclone III Devices Maximum Allowed Overshoot During Transitions over a 10-Year Time
Frame (Note 1)
Symbol Parameter Condition Overshoot Duration as % of High Time Unit
Vi
AC Input
Voltage
VI = 3.95 V 100 %
VI = 4.0 V 95.67 %
VI = 4.05 V 55.24 %
VI = 4.10 V 31.97 %
VI = 4.15 V 18.52 %
VI = 4.20 V 10.74 %
VI = 4.25 V 6.23 %
VI = 4.30 V 3.62 %
VI = 4.35 V 2.1 %
VI = 4.40 V 1.22 %
VI = 4.45 V 0.71 %
VI = 4.50 V 0.41 %
VI = 4.60 V 0.14 %
VI = 4.70 V 0.047 %
Note to Tabl e 1 –2 :
(1) Figure 1–1 shows the methodology to determine the overshoot duration. In the example in Figure 1–1, overshoot
voltage is shown in red and is present on the input pin of the Cyclone III device at over 4.1 V but below 4.2 V. From
Table 1–1, for an overshoot of 4.1 V, the percentage of high time for the overshoot can be as high as 31.97% over
a 10-year period. Percentage of high time is calculated as ([delta T]/T) × 100. This 10-year period assumes the
device is always turned on with 100% I/O toggle rate and 50% duty cycle signal. For lower I/O toggle rates and
situations in which the device is in an idle state, lifetimes are increased.
1–4 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Figure 1–1 shows the methodology to determine the overshoot duration.
Recommended Operating Conditions
This section lists the functional operation limits for AC and DC parameters for
Cyclone III devices. The steady-state voltage and current values expected from
Cyclone III devices are provided in Table 1–3. All supplies must be strictly monotonic
without plateaus.
Figure 1–1. Cyclone III Devices Overshoot Duration
3.3 V
4.1 V
4.2 V
T
ΔT
Tab le 1–3. Cyclone III Devices Recommended Operating Conditions (Note 1), (2) (Part 1 of 2)
Symbol Parameter Conditions Min Typ Max Unit
VCCINT
(3) Supply voltage for internal logic — 1.15 1.2 1.25 V
VCCIO
(3), (4)
Supply voltage for output buffers, 3.3-V
operation — 3.135 3.3 3.465 V
Supply voltage for output buffers, 3.0-V
operation — 2.85 3 3.15 V
Supply voltage for output buffers, 2.5-V
operation — 2.375 2.5 2.625 V
Supply voltage for output buffers, 1.8-V
operation — 1.71 1.8 1.89 V
Supply voltage for output buffers, 1.5-V
operation — 1.425 1.5 1.575 V
Supply voltage for output buffers, 1.2-V
operation — 1.14 1.2 1.26 V
VCCA
(3) Supply (analog) voltage for PLL
regulator — 2.375 2.5 2.625 V
VCCD_PLL
(3) Supply (digital) voltage for PLL — 1.15 1.2 1.25 V
VIInput voltage — –0.5 — 3.6 V
VOOutput voltage — 0 — VCCIO V
Chapter 1: Cyclone III Device Data Sheet 1–5
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
DC Characteristics
This section lists the I/O leakage current, pin capacitance, on-chip termination (OCT)
tolerance, and bus hold specifications for Cyclone III devices.
Supply Current
Standby current is the current the device draws after the device is configured with no
inputs or outputs toggling and no activity in the device. Use the Excel-based early
power estimator (EPE) to get the supply current estimates for your design because
these currents vary largely with the resources used. Table 1–4 lists I/O pin leakage
current for Cyclone III devices.
TJOperating junction temperature
For commercial use 0 — 85 °C
For industrial use –40 — 100 °C
For extended temperature
(5) –40 — 125 °C
For automotive use –40 — 125 °C
tRAMP Power supply ramp time
Standard power-on reset
(POR) (6) 50 µs — 50 ms —
Fast POR (7) 50 µs — 3 ms —
IDiode
Magnitude of DC current across
PCI-clamp diode when enabled ———10mA
Notes to Ta ble 1– 3 :
(1) VCC IO for all I/O banks must be powered up during device operation. All VCCA pins must be powered to 2.5 V (even when PLLs are not used), and
must be powered up and powered down at the same time.
(2) VCC D_PLL must always be connected to VCCINT through a decoupling capacitor and ferrite bead.
(3) The VCC must rise monotonically.
(4) All input buffers are powered by the VCCIO
supply.
(5) The I7 devices support extended operating junction temperature up to 125°C (usual range is –40°C to 100°C). When using I7 devices at the
extended junction temperature ranging from –40°C to 125°C, select C8 as the target device when designing in the Quartus® II software. The I7
devices meet all C8 timing specifications when I7 devices operate beyond 100°C and up to 125°C.
(6) POR time for Standard POR ranges between 50–200 ms. Each individual power supply should reach the recommended operating range within
50 ms.
(7) POR time for Fast POR ranges between 3–9 ms. Each individual power supply should reach the recommended operating range within 3 ms.
Tab le 1–3. Cyclone III Devices Recommended Operating Conditions (Note 1), (2) (Part 2 of 2)
Symbol Parameter Conditions Min Typ Max Unit
Tab le 1–4. Cyclone III Devices I/O Pin Leakage Current (Note 1), (2) (Part 1 of 2)
Symbol Parameter Conditions Device Min Typ Max Unit
IIInput pin leakage current VI = 0 V to VCCIOMAX —–10—10μA
IOZ
Tristated I/O pin leakage
current VO = 0 V to VCCIOMAX —–10—10μA
1–6 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
ICCINT0
VCC INT supply current
(standby)
VI = ground, no
load, no toggling
inputs, TJ=25°C
EP3C5 — 1.7
(3)
mA
EP3C10 — 1.7 mA
EP3C16 — 3.0 mA
EP3C25 — 3.5 mA
EP3C40 — 4.3 mA
EP3C55 — 5.2 mA
EP3C80 — 6.5 mA
EP3C120 — 8.4 mA
ICCA0
VCCA supply current
(standby)
VI
= ground, no load,
no toggling inputs,
TJ=25°C
EP3C5 — 11.3
(3)
mA
EP3C10 — 11.3 mA
EP3C16 — 11.4 mA
EP3C25 — 18.4 mA
EP3C40 — 18.6 mA
EP3C55 — 18.7 mA
EP3C80 — 18.9 mA
EP3C120 — 19.2 mA
ICCD_PLL0
VCCD_PLL supply current
(standby)
VI
= ground, no load,
no toggling inputs,
TJ=25°C
EP3C5 — 4.1
(3)
mA
EP3C10 — 4.1 mA
EP3C16 — 8.2 mA
EP3C25 — 8.2 mA
EP3C40 — 8.2 mA
EP3C55 — 8.2 mA
EP3C80 — 8.2 mA
EP3C120 — 8.2 mA
ICCIO0
VCCIO supply current
(standby)
VI
= ground, no load,
no toggling inputs,
TJ=25°C
EP3C5 — 0.6
(3)
mA
EP3C10 — 0.6 mA
EP3C16 — 0.9 mA
EP3C25 — 0.9 mA
EP3C40 — 1.3 mA
EP3C55 — 1.3 mA
EP3C80 — 1.3 mA
EP3C120 — 1.2 mA
Notes to Ta ble 1– 4 :
(1) This value is specified for normal device operation. The value varies during device power-up. This applies for all VCCIO
settings (3.3, 3.0, 2.5, 1.8,
1.5, and 1.2 V).
(2) 10 μA I/O leakage current limit is applicable when the internal clamping diode is off. A higher current can be the observed when the diode is on.
(3) Maximum values depend on the actual TJ and design utilization. For maximum values, refer to the Excel-based PowerPlay EPE
(www.altera.com/support/devices/estimator/cy3-estimator/cy3-power_estimator.html) or the Quartus II PowerPlay power analyzer feature. For
more information about power consumption, refer to “Power Consumption” on page 1–14 for more information.
Tab le 1–4. Cyclone III Devices I/O Pin Leakage Current (Note 1), (2) (Part 2 of 2)
Symbol Parameter Conditions Device Min Typ Max Unit
Chapter 1: Cyclone III Device Data Sheet 1–7
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Bus Hold
Bus hold retains the last valid logic state after the source driving it either enters the
high impedance state or is removed. Each I/O pin has an option to enable bus hold in
user mode. Bus hold is always disabled in configuration mode.
Table 1–5 lists bus hold specifications for Cyclone III devices.
OCT Specifications
Table 1–6 lists the variation of OCT without calibration across process, temperature,
and voltage.
OCT calibration is automatically performed at device power-up for OCT enabled
I/Os.
Tab le 1–5. Cyclone III Devices Bus Hold Parameter (Note 1)
Parameter Condition
VCCIO (V)
Unit1.2 1.5 1.8 2.5 3.0 3.3
Min Max Min Max Min Max Min Max Min Max Min Max
Bus-hold
low,
sustaining
current
VIN > VIL
(maximum) 8 — 12 — 30 — 50 — 70 — 70 — μA
Bus-hold
high,
sustaining
current
VIN < VIL
(minimum) –8 — –12 — –30 — –50 — –70 — –70 — μA
Bus-hold
low,
overdrive
current
0 V < VIN < VCCIO —125 — 175 —200—300—500—500μA
Bus-hold
high,
overdrive
current
0 V < VIN < VCCIO — –125 — –175 — –200 — –300 — –500 — –500 μA
Bus-hold trip
point — 0.3 0.9 0.375 1.125 0.68 1.07 0.7 1.7 0.8 2 0.8 2 V
Note to Tabl e 1 –5 :
(1) The bus-hold trip points are based on calculated input voltages from the JEDEC standard.
Tab le 1–6. Cyclone III Devices Series OCT without Calibration Specifications
Description VCCIO (V)
Resistance Tolerance
Unit
Commercial
Max
Industrial and Automotive
Max
Series OCT without
calibration
3.0 ±30 ±40 %
2.5 ±30 ±40 %
1.8 +40 ±50 %
1.5 +50 ±50 %
1.2 +50 ±50 %
1–8 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Table 1–7 lists the OCT calibration accuracy at device power-up.
The OCT resistance may vary with the variation of temperature and voltage after
calibration at device power-up. Use Table 1–8 and Equation 1–1 to determine the final
OCT resistance considering the variations after calibration at device power-up.
Table 1–8 lists the change percentage of the OCT resistance with voltage and
temperature.
Tab le 1–7. Cyclone III Devices Series OCT with Calibration at Device Power-Up Specifications
Description VCCIO (V)
Calibration Accuracy
Unit
Commercial Max Industrial and Automotive
Max
Series OCT with
calibration at device
power-up
3.0 ±10 ±10 %
2.5 ±10 ±10 %
1.8 ±10 ±10 %
1.5 ±10 ±10 %
1.2 ±10 ±10 %
Tab le 1–8. Cyclone III Devices OCT Variation After Calibration at Device Power-Up
Nominal Voltage dR/dT (%/°C) dR/dV (%/mV)
3.0 0.262 –0.026
2.5 0.234 –0.039
1.8 0.219 –0.086
1.5 0.199 –0.136
1.2 0.161 –0.288
Equation 1–1. (Note 1), (2), (3), (4), (5), (6)
ΔRV = (V2 – V1) × 1000 × dR/dV ––––– (7)
ΔRT = (T2 – T1) × dR/dT ––––– (8)
For ΔRx < 0; MFx
= 1/ (|ΔRx|/100 + 1) ––––– (9)
For ΔRx > 0; MFx = ΔRx/100 + 1 ––––– (10)
MF = MFV × MFT ––––– (11)
Rfinal = Rinitial × MF ––––– (12)
Notes to Equation 1–1:
(1) T2 is the final temperature.
(2) T1 is the initial temperature.
(3) MF is multiplication factor.
(4) Rfinal is final resistance.
(5) Riniti al is initial resistance.
(6) Subscript × refers to both V and T
.
(7) ΔRV is variation of resistance with voltage.
(8) ΔRT is variation of resistance with temperature.
(9) dR/dT is the change percentage of resistance with temperature after calibration at device power-up.
(10) dR/dV is the change percentage of resistance with voltage after calibration at device power-up.
(11) V2 is final voltage.
(12) V1 is the initial voltage.
Chapter 1: Cyclone III Device Data Sheet 1–9
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Example 1–1 shows you the example to calculate the change of 50 Ω I/O impedance
from 25°C at 3.0 V to 85°C at 3.15 V:
Pin Capacitance
Table 1–9 lists the pin capacitance for Cyclone III devices.
Example 1–1.
ΔRV = (3.15 – 3) × 1000 × –0.026 = –3.83
ΔRT = (85 – 25) × 0.262 = 15.72
Because ΔRV is negative,
MFV = 1 / (3.83/100 + 1) = 0.963
Because ΔRT is positive,
MFT = 15.72/100 + 1 = 1.157
MF = 0.963 × 1.157 = 1.114
Rfinal = 50 × 1.114 = 55.71 Ω
Tab le 1–9. Cyclone III Devices Pin Capacitance
Symbol Parameter Typical –
QFP
Typical –
FBGA Unit
CIOTB Input capacitance on top/bottom I/O pins 7 6 pF
CIOLR Input capacitance on left/right I/O pins 7 5 pF
CLV D SL R
Input capacitance on left/right I/O pins with dedicated
LVDS output 87pF
CVREFLR (1) Input capacitance on left/right dual-purpose VREF pin
when used as VREF or user I/O pin 21 21 pF
CVREFTB (1) Input capacitance on top/bottom dual-purpose VREF pin
when used as VREF or user I/O pin 23 (2) 23 (2) pF
CCLKTB
Input capacitance on top/bottom dedicated clock input
pins 76pF
CCLKLR Input capacitance on left/right dedicated clock input pins 6 5 pF
Notes to Ta ble 1– 9 :
(1) When VREF pin is used as regular input or output, a reduced performance of toggle rate and tCO
is expected due to
higher pin capacitance.
(2) CVREFTB for EP3C25 is 30 pF.
1–10 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Internal Weak Pull-Up and Weak Pull-Down Resistor
Table 1–10 lists the weak pull-up and pull-down resistor values for Cyclone III
devices.
Hot Socketing
Table 1–11 lists the hot-socketing specifications for Cyclone III devices.
Schmitt Trigger Input
Cyclone III devices support Schmitt trigger input on TDI, TMS, TCK, nSTATUS,
nCONFIG, nCE, CONF_DONE, and DCLK pins. A Schmitt trigger feature introduces
hysteresis to the input signal for improved noise immunity, especially for signal with
slow edge rate. Table 1–12 lists the hysteresis specifications across supported VCCIO
range for Schmitt trigger inputs in Cyclone III devices.
Table 1–10. Cyclone III Devices Internal Weak Pull-Up and Weak Pull-Down Resistor (Note 1)
Symbol Parameter Conditions Min Typ Max Unit
R_PU
Value of I/O pin pull-up resistor before
and during configuration, as well as
user mode if the programmable
pull-up resistor option is enabled
VCCIO = 3.3 V ± 5% (2), (3) 7 2541kΩ
VCCIO = 3.0 V ± 5% (2), (3) 7 2847kΩ
VCCIO = 2.5 V ± 5% (2), (3) 8 3561kΩ
VCCIO = 1.8 V ± 5% (2), (3) 10 57 108 kΩ
VCCIO = 1.5 V ± 5% (2), (3) 13 82 163 kΩ
VCCIO = 1.2 V ± 5% (2), (3) 19 143 351 kΩ
R_PD
Value of I/O pin pull-down resistor
before and during configuration
VCCIO = 3.3 V ± 5% (4) 6 1930kΩ
VCCIO = 3.0 V ± 5% (4) 6 2236kΩ
VCCIO = 2.5 V ± 5% (4) 6 2543kΩ
VCCIO = 1.8 V ± 5% (4) 7 3571kΩ
VCCIO = 1.5 V ± 5% (4) 850112kΩ
Notes to Ta ble 1– 10 :
(1) All I/O pins have an option to enable weak pull-up except configuration, test, and JTAG pin. Weak pull-down feature is only available for JTAG
TCK.
(2) Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.
(3) R_P U = (VCCIO –V
I)/IR_PU
Minimum condition: –40°C; VCCIO = VCC + 5%, VI = VCC + 5% – 50 mV;
Typical condition: 25°C; VCCIO = VCC
, VI = 0 V;
Maximum condition: 125°C; VCCIO = VCC – 5%, VI = 0 V; in which VI refers to the input voltage at the I/O pin.
(4) R_P D = VI/IR_PD
Minimum condition: –40°C; VCCIO = VCC + 5%, VI = 50 mV;
Typical condition: 25°C; VCCIO = VCC
, VI = VCC –5%;
Maximum condition: 125°C; VCCIO = VCC – 5%, VI = VCC – 5%; in which VI refers to the input voltage at the I/O pin.
Table 1–11. Cyclone III Devices Hot-Socketing Specifications
Symbol Parameter Maximum
IIOPIN(DC) DC current per I/O pin 300 μA
IIOPIN(AC) AC current per I/O pin 8 mA (1)
Note to Tabl e 1 –1 1:
(1) The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN| = C
dv/dt, in which C is I/O pin capacitance and dv/dt is the slew rate.
Chapter 1: Cyclone III Device Data Sheet 1–11
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
I/O Standard Specifications
The following tables list input voltage sensitivities (VIH and VIL), output voltage (VOH
and VOL), and current drive characteristics (IOH and IOL) for various I/O standards
supported by Cyclone III devices. Table 1–13 through Table 1–18 provide the I/O
standard specifications for Cyclone III devices.
Table 1–12. Hysteresis Specifications for Schmitt Trigger Input in Cyclone III Devices
Symbol Parameter Conditions Minimum Typical Maximum Unit
VSCHMITT
Hysteresis for Schmitt trigger
input
VCCIO = 3.3 V 200 — — mV
VCCIO = 2.5 V 200 — — mV
VCCIO = 1.8 V 140 — — mV
VCCIO = 1.5 V 110 — — mV
Table 1–13. Cyclone III Devices Single-Ended I/O Standard Specifications (Note 1), (2)
I/O Standard
VCCIO (V) VIL (V) VIH (V) VOL (V) VOH
(V) IOL
(mA)
IOH
(mA)
Min Typ Max Min Max Min Max Max Min
3.3-V LVTTL (3) 3.135 3.3 3.465 — 0.8 1.7 3.6 0.45 2.4 4 –4
3.3-V LVCMOS (3) 3.135 3.3 3.465 — 0.8 1.7 3.6 0.2 VCCIO
– 0.2 2 –2
3.0-V LVTTL (3) 2.85 3.0 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.45 2.4 4 –4
3.0-V LVCMOS (3) 2.85 3.0 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.2 VCCIO
– 0.2 0.1 –0.1
2.5-V LVTTL and
LVCMOS (3) 2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO + 0.3 0.4 2.0 1 –1
1.8-V LVTTL and
LVCMOS 1.71 1.8 1.89 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
2.25 0.45 VCC IO – 0.45 2 –2
1.5-V LVCMOS 1.425 1.5 1.575 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
VCCIO + 0.3 0.25 * VCCIO 0.75 * VCC IO 2–2
1.2-V LVCMOS 1.14 1.2 1.26 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
VCCIO + 0.3 0.25 * VCCIO 0.75 * VCC IO 2–2
3.0-V PCI 2.85 3.0 3.15 — 0.3 *
VCCIO
0.5 *
VCCIO
VCCIO + 0.3 0.1 * VCCIO 0.9 * VCCIO 1.5 –0.5
3.0-V PCI-X 2.85 3.0 3.15 — 0.35*
VCCIO
0.5 *
VCCIO
VCCIO + 0.3 0.1 * VCCIO 0.9 * VCCIO 1.5 –0.5
Notes to Ta ble 1– 13 :
(1) For voltage referenced receiver input waveform and explanation of terms used in Table 1–13, refer to “Single-ended Voltage referenced I/O Standard”
in “Glossary” on page 1–27.
(2) AC load CL = 10 pF.
(3) For more detail about interfacing Cyclone III devices with 3.3/3.0/2.5-V LVTTL/LVCMOS I/O standards, refer to AN 447: Interfacing Cyclone III
Devices with 3.3/3.0/2.5-V LVTTL and LVCMOS I/O Systems.
1–12 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
fFor more illustrations of receiver input and transmitter output waveforms, and for
other differential I/O standards, refer to the High-Speed Differential Interfaces in
Cyclone III Devices chapter.
Table 1–14. Cyclone III Devices Single-Ended SSTL and HSTL I/O Reference Voltage Specifications (Note 1)
I/O
Standard
VCCIO (V) VREF (V) VTT (V) (Note 2)
Min Typ Max Min Typ Max Min Typ Max
SSTL-2
Class I, II 2.375 2.5 2.625 1.19 1.25 1.31 VREF – 0.04 VREF VREF + 0.04
SSTL-18
Class I, II 1.7 1.8 1.9 0.833 0.9 0.969 VREF – 0.04 VREF VREF + 0.04
HSTL-18
Class I, II 1.71 1.8 1.89 0.85 0.9 0.95 0.85 0.9 0.95
HSTL-15
Class I, II 1.425 1.5 1.575 0.71 0.75 0.79 0.71 0.75 0.79
HSTL-12
Class I, II 1.14 1.2 1.26 0.48 * VCC IO (3) 0.5 * VCCIO
(3) 0.52 * VCC IO (3) — 0.5 * VCC IO —
0.47 * VCCIO (4) 0.5 * VCCIO
(4) 0.53 * VCC IO (4)
Notes to Ta ble 1– 14 :
(1) For an explanation of terms used in Table 1–14, refer to “Glossary” on page 1–27.
(2) VTT of transmitting device must track VREF of the receiving device.
(3) Value shown refers to DC input reference voltage, VREF(DC).
(4) Value shown refers to AC input reference voltage, VREF(AC).
Table 1–15. Cyclone III Devices Single-Ended SSTL and HSTL I/O Standards Signal Specifications
I/O
Standard
VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL
(mA)
IOH
(mA)
Min Max Min Max Min Max Min Max Max Min
SSTL-2
Class I —VREF –
0.18
VREF +
0.18 ——
VREF –
0.35
VREF +
0.35 —VTT –
0.57
VTT +
0.57 8.1 –8.1
SSTL-2
Class II —VREF –
0.18
VREF +
0.18 ——
VREF –
0.35
VREF +
0.35 —VTT –
0.76 VTT + 0.76 16.4 –16.4
SSTL-18
Class I —VREF –
0.125
VREF +
0.125 ——
VREF –
0.25
VREF +
0.25 —VTT –
0.475
VTT +
0.475 6.7 –6.7
SSTL-18
Class II —VREF –
0.125
VREF +
0.125 ——
VREF –
0.25
VREF +
0.25 —0.28
VCCIO –
0.28 13.4 –13.4
HSTL-18
Class I —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4V
CCIO – 0.4 8 –8
HSTL-18
Class II —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 16 –16
HSTL-15
Class I —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 8–8
HSTL-15
Class II —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 16 –16
HSTL-12
Class I –0.15 VREF –
0.08
VREF
+
0.08 VCCIO + 0.15 –0.24 VREF –
0.15
VREF +
0.15 VCCIO
+ 0.24 0.25 ×
VCCIO
0.75 ×
VCCIO
8–8
HSTL-12
Class II –0.15 VREF –
0.08
VREF
+
0.08 VCCIO + 0.15 –0.24 VREF –
0.15
VREF +
0.15 VCCIO
+ 0.24 0.25 ×
VCCIO
0.75 ×
VCCIO
14 –14
Chapter 1: Cyclone III Device Data Sheet 1–13
Electrical Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 1–16. Cyclone III Devices Differential SSTL I/O Standard Specifications
I/O Standard
VCCIO
(V) VSwing(DC) (V) VX(AC)
(V) VSwing(AC) (V) VOX(AC) (V)
Min Typ Max Min Max Min Typ Max Min Max Min Typ Max
SSTL-2
Class I, II 2.375 2.5 2.625 0.36 VCC IO VCCIO /2 – 0.2 — VCCIO/2 +
0.2 0.7 VCCIO
VCCIO
/2 –
0.125 —VCC IO /2 +
0.125
SSTL-18
Class I, II 1.7 1.8 1.90 0.25 VCCIO
VCCIO/2 –
0.175 —VCCIO/2 +
0.175 0.5 VCCIO
VCCIO
/2 –
0.125 —VCC IO /2 +
0.125
Table 1–17. Cyclone III Devices Differential HSTL I/O Standard Specifications
I/O Standard
VCCIO (V) VDIF(DC) (V) VX(A C) (V) VCM (D C) (V) VDIF(AC)
(V)
Min Typ Max Min Max Min Typ Max Min Typ Max Mi
nMax
HSTL-18
Class I, II 1.71 1.8 1.89 0.2 — 0.85 — 0.95 0.85 — 0.95 0.4 —
HSTL-15
Class I, II 1.425 1.5 1.575 0.2 — 0.71 — 0.79 0.71 — 0.79 0.4 —
HSTL-12
Class I, II 1.14 1.2 1.26 0.16 VCCIO 0.48 * VCC IO —0.52 *
VCCIO
0.48 *
VCCIO
—0.52 *
VCCIO
0.3 0.48 *
VCCIO
Table 1–18. Cyclone III Devices Differential I/O Standard Specifications (Note 1) (Part 1 of 2)
I/O
Standard
VCCIO
(V) VID (mV) VIcM (V) (2) VOD (mV) (3) VOS
(V) (3)
Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max
LVPECL
(Row I/Os)
(4)
2.375 2.5 2.625 100 —
0.05 DMAX ≤ 500 Mbps 1.80
——————0.55 500 Mbps ≤ D
MAX
≤
700 Mbps 1.80
1.05 DMAX
> 700 Mbps 1.55
LVPECL
(Column
I/Os) (4)
2.375 2.5 2.625 100 —
0.05 DMAX ≤ 500 Mbps 1.80
——————0.55 500 Mbps ≤ D
MAX
≤
700 Mbps 1.80
1.05 DMAX
> 700 Mbps 1.55
LVDS (Row
I/Os) 2.375 2.5 2.625 100 —
0.05 DMAX ≤ 500 Mbps 1.80
247 — 600 1.125 1.25 1.375 0.55 500 Mbps ≤ D
MAX
≤
700 Mbps 1.80
1.05 DMAX > 700 Mbps 1.55
LVDS
(Column
I/Os)
2.375 2.5 2.625 100 —
0.05 DMAX ≤ 500 Mbps 1.80
247 — 600 1.125 1.25 1.3750.55 500 Mbps ≤ D
MAX ≤
700 Mbps 1.80
1.05 DMAX > 700 Mbps 1.55
BLVDS
(Row I/Os)
(5)
2.375 2.5 2.625 100 — — — — — — — — — —
BLVDS
(Column
I/Os) (5)
2.375 2.5 2.625 100 — — — — — — — — — —
1–14 Chapter 1: Cyclone III Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Power Consumption
You can use the following methods to estimate power for a design:
■the Excel-based EPE.
■the Quartus II PowerPlay power analyzer feature.
The interactive Excel-based EPE is used prior to designing the device to get a
magnitude estimate of the device power. The Quartus II PowerPlay power analyzer
provides better quality estimates based on the specifics of the design after place-and-
route is complete. The PowerPlay power analyzer can apply a combination of user-
entered, simulation-derived, and estimated signal activities which, combined with
detailed circuit models, can yield very accurate power estimates.
fFor more information about power estimation tools, refer to the Early Power Estimator
User Guide and the PowerPlay Power Analysis chapter in volume 3 of the Quartus II
Handbook.
mini-LVDS
(Row I/Os)
(6)
2.375 2.5 2.625 — — — — — 300 — 600 1.0 1.2 1.4
mini-LVDS
(Column
I/Os) (6)
2.375 2.5 2.625 — — — — — 300 — 600 1.0 1.2 1.4
RSDS®
(Row
I/Os)(6)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5
RSDS
(Column
I/Os) (6)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5
PPDS®
(Row I/Os)
(6)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4
PPDS
(Column
I/Os) (6)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4
Notes to Ta ble 1– 18 :
(1) For an explanation of terms used in Table 1–18, refer to “Transmitter Output Waveform” in “Glossary” on page 1–27.
(2) VIN range: 0 V ≤ VIN ≤ 1.85 V.
(3) RL range: 90 ≤ R
L ≤ 110 Ω.
(4) LVPECL input standard is only supported at clock input. Output standard is not supported.
(5) No fixed VIN , VOD , and VOS specifications for BLVDS. They are dependent on the system topology.
(6) Mini-LVDS, RSDS, and PPDS standards are only supported at the output pins for Cyclone III devices.
Table 1–18. Cyclone III Devices Differential I/O Standard Specifications (Note 1) (Part 2 of 2)
I/O
Standard
VCCIO
(V) VID (mV) VIcM (V) (2) VOD (mV) (3) VOS
(V) (3)
Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max
Chapter 1: Cyclone III Device Data Sheet 1–15
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Switching Characteristics
This section provides the performance characteristics of the core and periphery blocks
for Cyclone III devices. All data is final and is based on actual silicon characterization
and testing. These numbers reflect the actual performance of the device under
worst-case silicon process, voltage, and junction temperature conditions.
Core Performance Specifications
Clock Tree Specifications
Table 1–19 lists the clock tree specifications for Cyclone III devices.
PLL Specifications
Table 1–20 describes the PLL specifications for Cyclone III devices when operating in
the commercial junction temperature range (0°C to 85°C), the industrial junction
temperature range (–40°C to 100°C), and the automotive junction temperature range
(–40°Cto 125°C). For more information about PLL block, refer to “PLL Block” in
“Glossary” on page 1–27.
Table 1–19. Cyclone III Devices Clock Tree Performance
Device
Performance
Unit
C6 C7 C8
EP3C5 500 437.5 402 MHz
EP3C10 500 437.5 402 MHz
EP3C16 500 437.5 402 MHz
EP3C25 500 437.5 402 MHz
EP3C40 500 437.5 402 MHz
EP3C55 500 437.5 402 MHz
EP3C80 500 437.5 402 MHz
EP3C120 (1) 437.5 402 MHz
Note to Tab le 1–1 9 :
(1) EP3C120 offered in C7, C8, and I7 grades only.
Table 1–20. Cyclone III Devices PLL Specifications (Note 1) (Part 1 of 2)
Symbol Parameter Min Typ Max Unit
fIN (2) Input clock frequency 5 — 472.5 MHz
fINPFD PFD input frequency 5 — 325 MHz
fVCO (3) PLL internal VCO operating range 600 — 1300 MHz
fINDUTY Input clock duty cycle 40 — 60 %
tINJITTER_CCJ (4)
Input clock cycle-to-cycle jitter
FREF ≥ 100 MHz — — 0.15 UI
FREF < 100 MHz — — ±750 ps
fOUT_EXT (external clock output)
(2) PLL output frequency — — 472.5 MHz
1–16 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
fOUT (to global clock)
PLL output frequency (–6 speed grade) — — 472.5 MHz
PLL output frequency (–7 speed grade) — — 450 MHz
PLL output frequency (–8 speed grade) — — 402.5 MHz
tOUTDUTY Duty cycle for external clock output (when set to 50%) 45 50 55 %
tLOCK Time required to lock from end of device configuration — — 1 ms
tDLOCK
Time required to lock dynamically (after switchover,
reconfiguring any non-post-scale counters/delays or
areset is deasserted)
—— 1 ms
tOUTJITTER_PERIOD_DEDCLK (5)
Dedicated clock output period jitter
FOUT ≥ 100 MHz ——300 ps
FOUT < 100MHz ——30 mUI
tOUTJITTER_CCJ_DEDCLK (5)
Dedicated clock output cycle-to-cycle jitter
FOUT ≥ 100 MHz ——300 ps
FOUT < 100MHz ——30 mUI
tOUTJITTER_PERIOD_IO (5)
Regular I/O period jitter
FOUT ≥ 100 MHz ——650 ps
FOUT < 100MHz ——75 mUI
tOUTJITTER_CCJ_IO (5)
Regular I/O cycle-to-cycle jitter
FOUT ≥ 100 MHz ——650 ps
FOUT < 100MHz ——75 mUI
tPLL_PSERR Accuracy of PLL phase shift — — ±50 ps
tARESET Minimum pulse width on areset signal. 10 — — ns
tCONFIGPLL Time required to reconfigure scan chains for PLLs — 3.5 (6) —SCANCLK
cycles
fSCANC LK scanclk frequency — — 100 MHz
Notes to Ta ble 1– 20 :
(1) VCC D_PLL should always be connected to VCCINT through decoupling capacitor and ferrite bead.
(2) This parameter is limited in the Quartus II software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O standard.
(3) The VCO frequency reported by the Quartus II software in the PLL summary section of the compilation report takes into consideration the VCO
post-scale
counter K value. Therefore, if the counter K has a value of 2, the frequency reported can be lower than the fVCO specification.
(4) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source, which is less than 200 ps.
(5) Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification applies to the intrinsic
jitter of the PLL, when an input jitter of 30 ps is applied.
(6) With 100 MHz scanclk frequency.
Table 1–20. Cyclone III Devices PLL Specifications (Note 1) (Part 2 of 2)
Symbol Parameter Min Typ Max Unit
Chapter 1: Cyclone III Device Data Sheet 1–17
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Embedded Multiplier Specifications
Table 1–21 describes the embedded multiplier specifications for Cyclone III devices.
Memory Block Specifications
Table 1–22 describes the M9K memory block specifications for Cyclone III devices.
Configuration and JTAG Specifications
Table 1–23 lists the configuration mode specifications for Cyclone III devices.
Table 1–24 lists the active configuration mode specifications for Cyclone III devices.
Table 1–21. Cyclone III Devices Embedded Multiplier Specifications
Mode
Resources Used Performance
Unit
Number of Multipliers C6 C7, I7, A7 C8
9×9-bit
multiplier 1 340 300 260 MHz
18 × 18-bit
multiplier 1 287 250 200 MHz
Table 1–22. Cyclone III Devices Memory Block Performance Specifications
Memory Mode
Resources Used Performance
LEs M9K
Memory C6 C7, I7, A7 C8 Unit
M9K Block
FIFO 256 × 36 47 1 315 274 238 MHz
Single-port 256 × 36 0 1 315 274 238 MHz
Simple dual-port 256 × 36 CLK 0 1 315 274 238 MHz
True dual port 512 × 18 single CLK 0 1 315 274 238 MHz
Table 1–23. Cyclone III Devices Configuration Mode Specifications
Programming Mode DCLK Fmax Unit
Passive Serial (PS) 133 MHz
Fast Passive Parallel (FPP) (1) 100 MHz
Note to Tabl e 1 –2 3:
(1) EP3C40 and smaller density members support 133 MHz.
Table 1–24. Cyclone III Devices Active Configuration Mode Specifications
Programming Mode DCLK Range Unit
Active Parallel (AP) 20 – 40 MHz
Active Serial (AS) 20 – 40 MHz
1–18 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Table 1–25 lists the JTAG timing parameters and values for Cyclone III devices.
Periphery Performance
High-Speed I/O Specifications
Table 1–26 through Table 1–31 list the high-speed I/O timing for Cyclone III devices.
For definitions of high-speed timing specifications, refer to “Glossary” on page 1–27.
Table 1–25. Cyclone III Devices JTAG Timing Parameters (Note 1)
Symbol Parameter Min Max Unit
tJCP TCK clock period 40 — ns
tJCH TCK clock high time 20 — ns
tJCL TCK clock low time 20 — ns
tJPSU_TDI JTAG port setup time for TDI (2) 1—ns
tJPSU_TMS JTAG port setup time for TMS (2) 3—ns
tJPH JTAG port hold time 10 — ns
tJPCO JTAG port clock to output (2) —15ns
tJPZX JTAG port high impedance to valid output (2) —15ns
tJPXZ JTAG port valid output to high impedance (2) —15ns
tJSSU Capture register setup time (2) 5—ns
tJSH Capture register hold time 10 — ns
tJSCO Update register clock to output — 25 ns
tJSZX Update register high impedance to valid output — 25 ns
tJSXZ Update register valid output to high impedance — 25 ns
Notes to Ta ble 1– 25 :
(1) For more information about JTAG waveforms, refer to “JTAG Waveform” in “Glossary” on page 1–27.
(2) The specification is shown for 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS operation of JTAG pins. For 1.8-V LVTTL/LVCMOS
and 1.5-V LVCMOS, the JTAG port clock to output time is 16 ns.
Table 1–26. Cyclone III Devices RSDS Transmitter Timing Specifications (Note 1), (2) (Part 1 of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Typ Max Min Typ Max Min Typ Max
fHSCLK
(input clock
frequency)
×10 10 — 180 10 — 155.5 10 — 155.5 MHz
×8 10 — 180 10 — 155.5 10 — 155.5 MHz
×7 10 — 180 10 — 155.5 10 — 155.5 MHz
×4 10 — 180 10 — 155.5 10 — 155.5 MHz
×2 10 — 180 10 — 155.5 10 — 155.5 MHz
×1 10 — 360 10 — 311 10 — 311 MHz
Chapter 1: Cyclone III Device Data Sheet 1–19
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Device operation in
Mbps
×10 100 — 360 100 — 311 100 — 311 Mbps
×8 80 — 360 80 — 311 80 — 311 Mbps
×7 70 — 360 70 — 311 70 — 311 Mbps
×4 40 — 360 40 — 311 40 — 311 Mbps
×2 20 — 360 20 — 311 20 — 311 Mbps
×1 10 — 360 10 — 311 10 — 311 Mbps
tDUTY — 45 — 55 45 — 55 45 — 55 %
TCCS — — — 200 — — 200 — — 200 ps
Output jitter
(peak to peak) — — — 500 — — 500 — — 550 ps
tRISE 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tFALL 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tLOCK (3) ———1——1——1ms
Notes to Ta ble 1– 26 :
(1) Applicable for true RSDS and emulated RSDS_E_3R transmitter.
(2) True RSDS transmitter is only supported at output pin of Row I/O (Banks 1, 2, 5, and 6). Emulated RSDS transmitter is supported at the output
pin of all I/O banks.
(3) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 1–26. Cyclone III Devices RSDS Transmitter Timing Specifications (Note 1), (2) (Part 2 of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Typ Max Min Typ Max Min Typ Max
Table 1–27. Cyclone III Devices Emulated RSDS_E_1R Transmitter Timing Specifications (Note 1) (Part 1 of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Typ Max Min Typ Max Min Typ Max
fHSCLK (input
clock
frequency)
×10 10 — 85 10 — 85 10 — 85 MHz
×8 10 — 85 10 — 85 10 — 85 MHz
×7 10 — 85 10 — 85 10 — 85 MHz
×4 10 — 85 10 — 85 10 — 85 MHz
×2 10 — 85 10 — 85 10 — 85 MHz
×1 10 — 170 10 — 170 10 — 170 MHz
Device
operation in
Mbps
×10 100 — 170 100 — 170 100 — 170 Mbps
×8 80 — 170 80 — 170 80 — 170 Mbps
×7 70 — 170 70 — 170 70 — 170 Mbps
×4 40 — 170 40 — 170 40 — 170 Mbps
×2 20 — 170 20 — 170 20 — 170 Mbps
×1 10 — 170 10 — 170 10 — 170 Mbps
tDUTY — 45 — 55 45 — 55 45 — 55 %
TCCS — — — 200 — — 200 — — 200 ps
Output jitter
(peak to
peak)
— — — 500 — — 500 — — 550 ps
1–20 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
tRISE
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tFALL
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tLOCK (2) ———1——1——1ms
Notes to Ta ble 1– 27 :
(1) Emulated RSDS_E_1R transmitter is supported at the output pin of all I/O banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 1–27. Cyclone III Devices Emulated RSDS_E_1R Transmitter Timing Specifications (Note 1) (Part 2 of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Typ Max Min Typ Max Min Typ Max
Table 1–28. Cyclone III Devices Mini-LVDS Transmitter Timing Specifications (Note 1), (2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Typ Max Min Typ Max Min Typ Max
fHSCLK (input
clock
frequency)
×10 10 — 200 10 — 155.5 10 — 155.5 MHz
×8 10 — 200 10 — 155.5 10 — 155.5 MHz
×7 10 — 200 10 — 155.5 10 — 155.5 MHz
×4 10 — 200 10 — 155.5 10 — 155.5 MHz
×2 10 — 200 10 — 155.5 10 — 155.5 MHz
×1 10 — 400 10 — 311 10 — 311 MHz
Device
operation in
Mbps
×10 100 — 400 100 — 311 100 — 311 Mbps
×8 80 — 400 80 — 311 80 — 311 Mbps
×7 70 — 400 70 — 311 70 — 311 Mbps
×4 40 — 400 40 — 311 40 — 311 Mbps
×2 20 — 400 20 — 311 20 — 311 Mbps
×1 10 — 400 10 — 311 10 — 311 Mbps
tDUTY — 45—5545—5545—55 %
TCCS — — — 200 — — 200 — — 200 ps
Output jitter
(peak to
peak)
— — — 500 — — 500 — — 550 ps
tRISE
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tFALL
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — — 500 — ps
tLOCK (3) ———1——1——1ms
Notes to Ta ble 1– 28 :
(1) Applicable for true and emulated mini-LVDS transmitter.
(2) True mini-LVDS transmitter is only supported at the output pin of Row I/O (Banks 1, 2, 5, and 6). Emulated mini-LVDS transmitter is supported
at the output pin of all I/O banks.
(3) tLOCK is the time required for the PLL to lock from the end of device configuration.
Chapter 1: Cyclone III Device Data Sheet 1–21
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 1–29. Cyclone III Devices True LVDS Transmitter Timing Specifications (Note 1)
Symbol Modes
C6 C7, I7 C8, A7
Unit
MinMaxMinMaxMinMax
fHSCLK (input
clock frequency)
×10 10 420 10 370 10 320 MHz
×8 10 420 10 370 10 320 MHz
×7 10 420 10 370 10 320 MHz
×4 10 420 10 370 10 320 MHz
×2 10 420 10 370 10 320 MHz
×1 10 420 10 402.5 10 402.5 MHz
HSIODR
×10 100 840 100 740 100 640 Mbps
×8 80 840 80 740 80 640 Mbps
×7 70 840 70 740 70 640 Mbps
×4 40 840 40 740 40 640 Mbps
×2 20 840 20 740 20 640 Mbps
×1 10 420 10 402.5 10 402.5 Mbps
tDUTY — 455545554555%
TCCS — —200—200—200ps
Output jitter
(peak to peak) — —500—500—550ps
tLOCK (2) ——1—1—1ms
Notes to Ta ble 1– 29 :
(1) True LVDS transmitter is only supported at the output pin of Row I/O (Banks 1, 2, 5, and 6).
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 1–30. Cyclone III Devices Emulated LVDS Transmitter Timing Specifications (Note 1) (Part 1
of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
MinMaxMinMaxMinMax
fHSCLK (input clock
frequency)
×10 10 320 10 320 10 275 MHz
×8 10 320 10 320 10 275 MHz
×7 10 320 10 320 10 275 MHz
×4 10 320 10 320 10 275 MHz
×2 10 320 10 320 10 275 MHz
×1 10 402.5 10 402.5 10 402.5 MHz
HSIODR
×10 100 640 100 640 100 550 Mbps
×8 80 640 80 640 80 550 Mbps
×7 70 640 70 640 70 550 Mbps
×4 40 640 40 640 40 550 Mbps
×2 20 640 20 640 20 550 Mbps
×1 10 402.5 10 402.5 10 402.5 Mbps
tDUTY — 455545554555%
1–22 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
TCCS — — 200 — 200 — 200 ps
Output jitter
(peak to peak) — —500—500—550ps
tLOCK (2) ——1—1—1ms
Notes to Ta ble 1– 30 :
(1) Emulated LVDS transmitter is supported at the output pin of all I/O banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 1–31. Cyclone III Devices LVDS Receiver Timing Specifications (Note 1)
Symbol Modes
C6 C7, I7 C8, A7
Unit
Min Max Min Max Min Max
fHSCLK (input clock
frequency)
×10 10 437.5 10 370 10 320 MHz
×8 10 437.5 10 370 10 320 MHz
×7 10 437.5 10 370 10 320 MHz
×4 10 437.5 10 370 10 320 MHz
×2 10 437.5 10 370 10 320 MHz
×1 10 437.5 10 402.5 10 402.5 MHz
HSIODR
×10 100 875 100 740 100 640 Mbps
×8 80 875 80 740 80 640 Mbps
×7 70 875 70 740 70 640 Mbps
×4 40 875 40 740 40 640 Mbps
×2 20 875 20 740 20 640 Mbps
×1 10 437.5 10 402.5 10 402.5 Mbps
SW — —400—400—400ps
Input jitter
tolerance — —500—500—550ps
tLOCK (2) ——1—1—1ms
Notes to Ta ble 1– 31 :
(1) LVDS receiver is supported at all banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 1–30. Cyclone III Devices Emulated LVDS Transmitter Timing Specifications (Note 1) (Part 2
of 2)
Symbol Modes
C6 C7, I7 C8, A7
Unit
MinMaxMinMaxMinMax
Chapter 1: Cyclone III Device Data Sheet 1–23
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
External Memory Interface Specifications
Cyclone III devices support external memory interfaces up to 200 MHz. The external
memory interfaces for Cyclone III devices are auto-calibrating and easy to implement.
fFor more information about external memory system performance specifications,
board design guidelines, timing analysis, simulation, and debugging information,
refer to Literature: External Memory Interfaces.
Table 1–32 lists the FPGA sampling window specifications for Cyclone III devices.
Table 1–32. Cyclone III Devices FPGA Sampling Window (SW) Requirement – Read Side (Note 1)
Memory Standard
Column I/Os Row I/Os Wraparound Mode
Setup Hold Setup Hold Setup Hold
C6
DDR2 SDRAM 580 550 690 640 850 800
DDR SDRAM 585 535 700 650 870 820
QDRII SRAM 785 735 805 755 905 855
C7
DDR2 SDRAM 705 650 770 715 985 930
DDR SDRAM 675 620 795 740 970 915
QDRII SRAM 900 845 910 855 1085 1030
C8
DDR2 SDRAM 785 720 930 870 1115 1055
DDR SDRAM 800 740 915 855 1185 1125
QDRII SRAM 1050 990 1065 1005 1210 1150
I7
DDR2 SDRAM 765 710 855 800 1040 985
DDR SDRAM 745 690 880 825 1000 945
QDRII SRAM 945 890 955 900 1130 1075
A7
DDR2 SDRAM 805 745 1020 960 1145 1085
DDR SDRAM 880 820 955 935 1220 1160
QDRII SRAM 1090 1030 1105 1045 1250 1190
Note to Tabl e 1 –3 2:
(1) Column I/Os refer to top and bottom I/Os. Row I/Os refer to right and left I/Os. Wraparound mode refers to the combination of column and row
I/Os.
1–24 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Table 1–33 lists the transmitter channel-to-channel skew specifications for Cyclone III
devices.
Table 1–33. Cyclone III Devices Transmitter Channel-to-Channel Skew (TCCS) – Write Side (Note 1) (Part 1 of 2)
Memory
Standard I/O Standard
Column I/Os (ps) Row I/Os (ps) Wraparound Mode (ps)
Lead Lag Lead Lag Lead Lag
C6
DDR2 SDRAM SSTL-18 Class I 790 380 790 380 890 480
SSTL-18 Class II 870 490 870 490 970 590
DDR SDRAM SSTL-2 Class I 750 320 750 320 850 420
SSTL-2 Class II 860 350 860 350 960 450
QDRII SRAM 1.8 V HSTL Class I 780 410 780 410 880 510
1.8 V HSTL Class II 830 510 830 510 930 610
C7
DDR2 SDRAM SSTL-18 Class I 915 410 915 410 1015 510
SSTL-18 Class II 1025 545 1025 545 1125 645
DDR SDRAM SSTL-2 Class I 880 340 880 340 980 440
SSTL-2 Class II 1010 380 1010 380 1110 480
QDRII SRAM 1.8 V HSTL Class I 910 450 910 450 1010 550
1.8 V HSTL Class II 1010 570 1010 570 1110 670
C8
DDR2 SDRAM SSTL-18 Class I 1040 440 1040 440 1140 540
SSTL-18 Class II 1180 600 1180 600 1280 700
DDR SDRAM SSTL-2 Class I 1010 360 1010 360 1110 460
SSTL-2 Class II 1160 410 1160 410 1260 510
QDRII SRAM 1.8 V HSTL Class I 1040 490 1040 490 1140 590
1.8 V HSTL Class II 1190 630 1190 630 1290 730
I7
DDR2 SDRAM SSTL-18 Class I 961 431 961 431 1061 531
SSTL-18 Class II 1076 572 1076 572 1176 672
DDR SDRAM SSTL-2 Class I 924 357 924 357 1024 457
SSTL-2 Class II 1061 399 1061 399 1161 499
QDRII SRAM 1.8 V HSTL Class I 956 473 956 473 1056 573
1.8 V HSTL Class II 1061 599 1061 599 1161 699
A7
DDR2 SDRAM
(2)
SSTL-18 Class I 1092 462 1092 462 1192 562
SSTL-18 Class II 1239 630 1239 630 1339 730
DDR SDRAM SSTL-2 Class I 1061 378 1061 378 1161 478
SSTL-2 Class II 1218 431 1218 431 1318 531
Chapter 1: Cyclone III Device Data Sheet 1–25
Switching Characteristics
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 1–34 lists the memory output clock jitter specifications for Cyclone III devices.
Duty Cycle Distortion Specifications
Table 1–35 lists the worst case duty cycle distortion for Cyclone III devices.
OCT Calibration Timing Specification
Table 1–36 lists the duration of calibration for series OCT with calibration at device
power-up for Cyclone III devices.
QDRII SRAM 1.8 V HSTL Class I 1092 515 1092 515 1192 615
1.8 V HSTL Class II 1250 662 1250 662 1350 762
Notes to Ta ble 1– 33 :
(1) Column I/O banks refer to top and bottom I/Os. Row I/O banks refer to right and left I/Os. Wraparound mode refers to the combination of column
and row I/Os.
(2) For DDR2 SDRAM write timing performance on Columns I/O for C8 and A7 devices, 97.5 degree phase offset is required.
Table 1–33. Cyclone III Devices Transmitter Channel-to-Channel Skew (TCCS) – Write Side (Note 1) (Part 2 of 2)
Memory
Standard I/O Standard
Column I/Os (ps) Row I/Os (ps) Wraparound Mode (ps)
Lead Lag Lead Lag Lead Lag
Table 1–34. Cyclone III Devices Memory Output Clock Jitter Specifications (Note 1), (2)
Parameter Symbol Min Max Unit
Clock period jitter tJIT(per) -125 125 ps
Cycle-to-cycle period jitter tJIT(cc) -200 200 ps
Duty cycle jitter tJ I T(du ty ) -150 150 ps
Notes to Ta ble 1– 34 :
(1) The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC DDR2 standard.
(2) The clock jitter specification applies to memory output clock pins generated using DDIO circuits clocked by a PLL output routed on a global
clock network.
Table 1–35. Duty Cycle Distortion on Cyclone III Devices I/O Pins (Note 1), (2)
Symbol
C6 C7, I7 C8, A7
Unit
Min Max Min Max Min Max
Output Duty Cycle 45 55 45 55 45 55 %
Notes to Table 1–35:
(1) Duty cycle distortion specification applies to clock outputs from PLLs, global clock tree, and IOE driving dedicated
and general purpose I/O pins.
(2) Cyclone III devices meet specified duty cycle distortion at maximum output toggle rate for each combination of
I/O standard and current strength.
Table 1–36. Cyclone III Devices Timing Specification for Series OCT with Calibration at Device
Power-Up (Note 1)
Symbol Description Maximum Unit
tOCTCAL
Duration of series OCT with
calibration at device power-up 20 µs
Notes to Ta ble 1– 36 :
(1) OCT calibration takes place after device configuration, before entering user mode.
1–26 Chapter 1: Cyclone III Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
IOE Programmable Delay
Table 1–37 and Table 1–38 list IOE programmable delay for Cyclone III devices.
Table 1–37. Cyclone III Devices IOE Programmable Delay on Column Pins (Note 1), (2)
Parameter Paths
Affected
Number
of
Settings
Min
Offset
Max Offset
UnitFast Corner Slow Corner
A7, I7 C6 C6 C7 C8 I7 A7
Input delay from pin to
internal cells
Pad to I/O
dataout to
core
7 0 1.211 1.314 2.175 2.32 2.386 2.366 2.49 ns
Input delay from pin to
input register
Pad to I/O
input register 8 0 1.203 1.307 2.19 2.387 2.54 2.43 2.545 ns
Delay from output
register to output pin
I/O output
register to
pad
2 0 0.479 0.504 0.915 1.011 1.107 1.018 1.048 ns
Input delay from
dual-purpose clock pin
to fan-out destinations
Pad to global
clock
network
12 0 0.664 0.694 1.199 1.378 1.532 1.392 1.441 ns
Notes to Ta ble 1– 37 :
(1) The incremental values for the settings are generally linear. For exact values of each setting, use the latest version of the Quartus II software.
(2) The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Quartus II software.
Table 1–38. Cyclone III Devices IOE Programmable Delay on Row Pins (Note 1), (2)
Parameter Paths
Affected
Number
of
Settings
Min
Offset
Max Offset
UnitFast Corner Slow Corner
A7, I7 C6 C6 C7 C8 I7 A7
Input delay from pin to
internal cells
Pad to I/O
dataout to
core
7 0 1.209 1.314 2.174 2.335 2.406 2.381 2.505 ns
Input delay from pin to
input register
Pad to I/O
input register 8 0 1.207 1.312 2.202 2.402 2.558 2.447 2.557 ns
Delay from output
register to output pin
I/O output
register to
pad
2 0 0.51 0.537 0.962 1.072 1.167 1.074 1.101 ns
Input delay from
dual-purpose clock pin
to fan-out destinations
Pad to global
clock network 12 0 0.669 0.698 1.207 1.388 1.542 1.403 1.45 ns
Notes to Ta ble 1– 38 :
(1) The incremental values for the settings are generally linear. For exact values of each setting, use the latest version of Quartus II software.
(2) The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Quartus II software
Chapter 1: Cyclone III Device Data Sheet 1–27
I/O Timing
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
I/O Timing
You can use the following methods to determine the I/O timing:
■the Excel-based I/O Timing.
■the Quartus II timing analyzer.
The Excel-based I/O Timing provides pin timing performance for each device density
and speed grade. The data is typically used prior to designing the FPGA to get a
timing budget estimation as part of the link timing analysis. The Quartus II timing
analyzer provides a more accurate and precise I/O timing data based on the specifics
of the design after place-and-route is complete.
fThe Excel-based I/O Timing spreadsheet is downloadable from Cyclone III Devices
Literature website.
Glossary
Table 1–39 lists the glossary for this chapter.
Table 1–39. Glossary (Part 1 of 5)
Letter Term Definitions
A——
B——
C——
D——
E——
FfHSCLK HIGH-SPEED I/O Block: High-speed receiver/transmitter input and output clock frequency.
GGCLK Input pin directly to Global Clock network.
GCLK PLL Input pin to Global Clock network through PLL.
HHSIODR HIGH-SPEED I/O Block: Maximum/minimum LVDS data transfer rate (HSIODR = 1/TUI).
I
Input Waveforms
for the SSTL
Differential I/O
Standard
VIL
VREF
VIH
VSWING
1–28 Chapter 1: Cyclone III Device Data Sheet
Glossary
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
JJTAG Waveform
K——
L——
M——
N——
O——
PPLL Block
The following block diagram highlights the PLL Specification parameters.
Q——
Table 1–39. Glossary (Part 2 of 5)
Letter Term Definitions
TDO
TCK
tJPZX tJPCO
tJSCO tJSXZ
tJPH
tJSH
tJPXZ
tJCP tJPSU_TMS
tJCL
tJCH
TDI
TMS
Signal
to be
Captured
Signal
to be
Driven
tJPSU_TDI
tJSZX
tJSSU
Core Clock
Phase tap
Reconfigurable in User Mode
Key
CLK
N
M
PFD VCOCP LF
CLKOUT Pins
GCLK
fINPFD
fINfVCO fOUT
fOUT_EXT
Switchover
Counters
C0..C4
Chapter 1: Cyclone III Device Data Sheet 1–29
Glossary
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
R
RLReceiver differential input discrete resistor (external to Cyclone III devices).
Receiver Input
Waveform
Receiver Input Waveform for LVDS and LVPECL Differential Standards.
RSKM (Receiver
input skew
margin)
HIGH-SPEED I/O Block: The total margin left after accounting for the sampling window and TCCS.
RSKM = (TUI – SW – TCCS) / 2.
S
Single-ended
Voltage
referenced I/O
Standard
The JEDEC standard for SSTl and HSTL I/O standards defines both the AC and DC input signal
values. The AC values indicate the voltage levels at which the receiver must meet its timing
specifications. The DC values indicate the voltage levels at which the final logic state of the
receiver is unambiguously defined. After the receiver input crosses the AC value, the receiver
changes to the new logic state. The new logic state is then maintained as long as the input stays
beyond the DC threshold. This approach is intended to provide predictable receiver timing in the
presence of input waveform ringing.
SW (Sampling
Window)
HIGH-SPEED I/O Block: The period of time during which the data must be valid to capture it
correctly. The setup and hold times determine the ideal strobe position in the sampling window.
Table 1–39. Glossary (Part 3 of 5)
Letter Term Definitions
Single-EndedWaveform
DifferentialWaveform (Mathematical Function of Positive & Negative Channel)
Positive Channel (p) = VIH
Negative Channel (n) = VIL
Ground
VID
VID
0 V
VCM
p - n
VID
V
IH(AC)
VIH(DC)
VREF
V
IL(DC)
V
IL(AC)
V
OH
V
OL
VCCIO
VSS
1–30 Chapter 1: Cyclone III Device Data Sheet
Glossary
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
T
tCHigh-speed receiver/transmitter input and output clock period.
TCCS (Channel-
to-channel-skew)
HIGH-SPEED I/O Block: The timing difference between the fastest and slowest output edges,
including tCO
variation and clock skew. The clock is included in the TCCS measurement.
tcin Delay from clock pad to I/O input register.
tCO Delay from clock pad to I/O output.
tcout Delay from clock pad to I/O output register.
tDUTY HIGH-SPEED I/O Block: Duty cycle on high-speed transmitter output clock.
tFALL Signal High-to-low transition time (80–20%).
tHInput register hold time.
Timing Unit
Interval (TUI)
HIGH-SPEED I/O block: The timing budget allowed for skew, propagation delays, and data
sampling window. (TUI = 1/(Receiver Input Clock Frequency Multiplication Factor) = tC/w).
tINJITTER Period jitter on PLL clock input.
tOUTJITTER_DEDCLK Period jitter on dedicated clock output driven by a PLL.
tOUTJITTER_IO Period jitter on general purpose I/O driven by a PLL.
tpllcin Delay from PLL inclk pad to I/O input register.
tpllcout Delay from PLL inclk pad to I/O output register.
Transmitter
Output Waveform
Transmitter Output Waveforms for the LVDS, mini-LVDS, PPDS and RSDS Differential I/O
Standards
tRISE Signal Low-to-high transition time (20–80%).
tSU Input register setup time.
U——
Table 1–39. Glossary (Part 4 of 5)
Letter Term Definitions
Single-Ended Waveform
Differential Waveform (Mathematical Function of Positive & Negative Channel)
Positive Channel (p) = VOH
Negative Channel (n) = VOL
Ground
VOD
VOD
VOD
0 V
Vos
p - n
Chapter 1: Cyclone III Device Data Sheet 1–31
Glossary
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
V
VCM(DC) DC Common Mode Input Voltage.
VDIF(AC) AC differential Input Voltage: The minimum AC input differential voltage required for switching.
VDIF(DC) DC differential Input Voltage: The minimum DC input differential voltage required for switching.
VICM Input Common Mode Voltage: The common mode of the differential signal at the receiver.
VID
Input differential Voltage Swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the receiver.
VIH
Voltage Input High: The minimum positive voltage applied to the input which is accepted by the
device as a logic high.
VIH(AC) High-level AC input voltage.
VIH(DC) High-level DC input voltage.
VIL
Voltage Input Low: The maximum positive voltage applied to the input which is accepted by the
device as a logic low.
VIL (AC) Low-level AC input voltage.
VIL (DC) Low-level DC input voltage.
VIN DC input voltage.
VOCM Output Common Mode Voltage: The common mode of the differential signal at the transmitter.
VOD
Output differential Voltage Swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the transmitter. VOD = VOH – VOL.
VOH
Voltage Output High: The maximum positive voltage from an output which the device considers is
accepted as the minimum positive high level.
VOL
Voltage Output Low: The maximum positive voltage from an output which the device considers is
accepted as the maximum positive low level.
VOS Output offset voltage: VOS = (VOH + VOL) / 2.
VOX ( AC)
AC differential Output cross point voltage: The voltage at which the differential output signals must
cross.
VREF Reference voltage for SSTL, HSTL I/O Standards.
VREF (AC)
AC input reference voltage for SSTL, HSTL I/O Standards. VREF(AC)
= VREF(DC) + noise. The
peak-to-peak AC noise on VREF should not exceed 2% of VREF(DC).
VREF (DC) DC input reference voltage for SSTL, HSTL I/O Standards.
VSWING (AC)
AC differential Input Voltage: AC Input differential voltage required for switching. For the SSTL
Differential I/O Standard, refer to Input Waveforms.
VSWING (DC)
DC differential Input Voltage: DC Input differential voltage required for switching. For the SSTL
Differential I/O Standard, refer to Input Waveforms.
VTT Termination voltage for SSTL, HSTL I/O Standards.
VX ( AC)
AC differential Input cross point Voltage: The voltage at which the differential input signals must
cross.
W——
X——
Y——
Z——
Table 1–39. Glossary (Part 5 of 5)
Letter Term Definitions
1–32 Chapter 1: Cyclone III Device Data Sheet
Document Revision History
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
Document Revision History
Table 1–40 lists the revision history for this chapter.
Table 1–40. Document Revision History (Part 1 of 3)
Date Version Changes Made
January 2010 3.3
■Removed Table 1-32 and Table 1-33.
■Added Literature: External Memory Interfaces reference.
December 2009 3.2 Minor changes to the text.
July 2009 3.1 Minor edit to the hyperlinks.
June 2009 3.0
■Changed chapter title from DC and Switching Characteristics to “Cyclone III
Device Data Sheet” on page 1–1.
■Updated (Note 1) to Table 1–23 on page 1–17.
■Updated “External Memory Interface Specifications” on page 1–23.
■Replaced Table 1–32 on page 1–23.
■Replaced Table 1–33 on page 1–23.
■Added Table 1–36 on page 1–26.
■Updated “I/O Timing” on page 1–28.
■Removed “Typical Design Performance” section.
■Removed “I/O Timing” subsections.
October 2008 2.2
■Updated chapter to new template.
■Updated Table 1–1, Table 1–3, and Table 1–18.
■Added (Note 7) to Table 1–3.
■Added the “OCT Calibration Timing Specification” section.
■Updated “Glossary” section.
July 2008 2.1
■Updated Table 1–38.
■Added BLVDS information (I/O standard) into Table 1–39, Table 1–40,
Table 1–41, Table 1–42.
■Updated Table 1–43, Table 1–46, Table 1–47, Table 1–48, Table 1–49,
Table 1–50, Table 1–51, Table 1–52, Table 1–53, Table 1–54, Table 1–55,
Table 1–56, Table 1–57, Table 1–58, Table 1–59, Table 1–60, Table 1–61,
Table 1–62, Table 1–63, Table 1–68, Table 1–69, Table 1–74, Table 1–75,
Table 1–80, Table 1–81, Table 1–86, Table 1–87, Table 1–92, Table 1–93,
Table 1–94, Table 1–95, Table 1–96, Table 1–97, Table 1–98, and Table 1–99.
Chapter 1: Cyclone III Device Data Sheet 1–33
Document Revision History
© January 2010 Altera Corporation Cyclone III Device Handbook, Volume 2
May 2008 2.0
■Updated “Operating Conditions” section and included information on
automotive device.
■Updated Table 1–3, Table 1–6, and Table 1–7, and added automotive
information.
■Under “Pin Capacitance” section, updated Table 1–9 and Table 1–10.
■Added new “Schmitt Trigger Input” section with Table 1–12.
■Under “I/O Standard Specifications” section, updated Table 1–13, 1–12 and
1–12.
■Under “Switching Characteristics” section, updated Table 1–19, 1–15, 1–16,
1–16, 1–17, 1–18, 1–19, 1–20, 1–21, 1–21, 1–23, 1–23, 1–23, 1–24, and
1–25.
■Updated Figure 1–5 and 1–29.
■Deleted previous Table 1-35 “DDIO Outputs Half-Period Jitter”.
■Under “I/O Timing” section, updated Table 1–38, 1–29, 1–32, 1–33, 1–26,
and 1–26.
■Under “Typical Design Performance” section updated Table 1–46 through
1–145.
December 2007 1.5
■Under “Core Performance Specifications”, updated Tables 1-18 and 1-19.
■Under “Preliminary, Correlated, and Final Timing”, updated Table 1-37.
■Under “Typical Design Performance”, updated Tables 1-45, 1-46, 1-51, 1-52,
1-57, 1-58, Tables 1-63 through 1-68. 1-69, 1-70, 1-75, 1-76, 1-81, 1-82,
Tables 1-87 through 1-92, Tables 1-99, 1-100, 1-107, and 1-108.
October 2007 1.4
■Updated the CVREFTB value in Table 1-9.
■Updated Table 1-21.
■Under “High-Speed I/O Specification” section, updated Tables 1-25 through
1-30.
■Updated Tables 1-31 through 1-38.
■Added new Table 1-32.
■Under “Maximum Input and Output Clock Toggle Rate” section, updated
Tables 1-40 through 1-42.
■Under “IOE Programmable Delay” section, updated Tables 1-43 through 1-
44.
■Under “User I/O Pin Timing Parameters” section, updated Tables 1-45
through 1-92.
■Under “Dedicated Clock Pin Timing Parameters” section, updated Tables 1-93
through 1-108.
July 2007 1.3
■Updated Table 1-1 with VESDHBM and VESDCDM information.
■Updated RCONF_PD information in Tables 1-10.
■Added Note (3) to Table 1-12.
■Updated tDLOCK information in Table 1-19.
■Updated Table 1-43 and Table 1-44.
■Added “Document Revision History” section.
June 2007 1.2 Updated Cyclone III graphic in cover page.
Table 1–40. Document Revision History (Part 2 of 3)
Date Version Changes Made
1–34 Chapter 1: Cyclone III Device Data Sheet
Document Revision History
Cyclone III Device Handbook, Volume 2 © January 2010 Altera Corporation
May 2007 1.1
■Corrected current unit in Tables 1-1, 1-12, and 1-14.
■Added Note (3) to Table 1-3.
■Updated Table 1-4 with ICCINT0
, ICCA 0, ICCD_PLL0, and ICCIO0
information.
■Updated Table 1-9 and added Note (2).
■Updated Table 1-19.
■Updated Table 1-22 and added Note (1).
■Changed I/O standard from 1.5-V LVTTL/LVCMOS and 1.2-V LVTTL/LVCMOS
to 1.5-V LVCMOS and 1.2-V LVCMOS in Tables 1-41, 1-42, 1-43, 1-44, and 1-
45.
■Updated Table 1-43 with changes to LVPEC and LVDS and added Note (5).
■Updated Tables 1-46, 1-47, Tables 1-54 through 1-95, and Tables 1-98
through 1-111.
■Removed speed grade –6 from Tables 1-90 through 1-95, and from Tables 1-
110 through 1-111.
■Added a waveform (Receiver Input Waveform) in glossary under letter “R”
(Table 1-112).
March 2007 1.0 Initial release.
Table 1–40. Document Revision History (Part 3 of 3)
Date Version Changes Made
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
2. Cyclone III LS Device Data Sheet
This chapter describes the electric characteristics, switching characteristics, and I/O
timing for Cyclone®III LS devices. A glossary is also included for your reference.
Electrical Characteristics
The following sections provide information about the absolute maximum ratings,
recommended operating conditions, DC characteristics, and other specifications for
Cyclone III LS devices.
Operating Conditions
When Cyclone III LS devices are implemented in a system, they are rated according to
a set of defined parameters. To maintain the highest possible performance and
reliability of Cyclone III LS devices, you must consider the operating requirements in
this chapter. Cyclone III LS devices are offered in commercial and industrial grades.
Commercial devices are offered in –7 (fastest) and –8 speed grades. Industrial devices
are offered only in –7 speed grade.
1In this chapter, a prefix associated with the operating temperature range is attached to
the speed grades—commercial with a “C” prefix; industrial with an “I” prefix. For
example, commercial devices are described as C7 and C8 per respective speed grades.
Industrial devices are described as I7.
Absolute Maximum Ratings
Absolute maximum ratings define the maximum operating conditions for
Cyclone III LS devices. The values are based on experiments conducted with the
device and theoretical modeling of breakdown and damage mechanisms. The
functional operation of the device is not implied at these conditions. Table 2–1 lists the
absolute maximum ratings for Cyclone III LS devices.
1Conditions beyond those listed in Table 2–1 may cause permanent damage to the
device. Additionally, device operation at the absolute maximum ratings for extended
periods of time may have adverse effects on the device. All parameters representing
voltages are measured with respect to ground.
Tab le 2–1. Cyclone III LS Devices Absolute Maximum Ratings (Note 1) (Part 1 of 2)
Symbol Parameter Min Max Unit
VCCINT Supply voltage for internal logic –0.5 1.8 V
VCCIO Supply voltage for output buffers –0.5 3.9 V
VCCA Supply (analog) voltage for PLL regulator –0.5 3.75 V
VCCD_PLL Supply (digital) voltage for PLL –0.5 1.8 V
VCCBAT
Battery back-up power supply for design
security volatile key register –0.5 3.75 V
VIDC input voltage –0.5 3.95 V
CIII52002-1.2
2–2 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Maximum Allowed Overshoot or Undershoot Voltage
During transitions, input signals may overshoot to the voltage listed in Table 2–2 and
undershoot to –2.0 V for a magnitude of currents less than 100 mA and for periods
shorter than 20 ns.
Table 2–2 lists the maximum allowed input overshoot voltage and the duration of the
overshoot voltage as a percentage over the lifetime of the device. The maximum
allowed overshoot duration is specified as percentage of high-time over the lifetime of
the device.
1A DC signal is equivalent to 100% of the duty cycle. For example, a signal that
overshoots to 4.2 V can only be at 4.2 V for 10.74% over the lifetime of the device; for a
device lifetime of 10 years, this is equivalent to 10.74% of ten years, which is 12.89
months.
IOUT DC output current, per pin –25 40 mA
VESDHBM
Electrostatic discharge voltage using the human
body model — ±2000 V
VESDCDM
Electrostatic discharge voltage using the
charged device model —±500 V
TSTG Storage temperature –65 150 °C
TJOperating junction temperature –40 100 °C
Note to Tabl e 2 –1 :
(1) Supply voltage specifications apply to voltage readings taken at the device pins with respect to ground, not at the
power supply.
Tab le 2–1. Cyclone III LS Devices Absolute Maximum Ratings (Note 1) (Part 2 of 2)
Symbol Parameter Min Max Unit
Tab le 2–2. Cyclone III LS Devices Maximum Allowed Overshoot During Transitions over a 10-Year
Time Frame
Symbol Parameter Condition Overshoot Duration as % of High Time Unit
Vi
AC Input
Voltage
VI = 3.95 V 100 %
VI = 4.0 V 95.67 %
VI = 4.05 V 55.24 %
VI = 4.10 V 31.97 %
VI = 4.15 V 18.52 %
VI = 4.20 V 10.74 %
VI = 4.25 V 6.23 %
VI = 4.30 V 3.62 %
VI = 4.35 V 2.1 %
VI = 4.40 V 1.22 %
VI = 4.45 V 0.71 %
VI = 4.50 V 0.41 %
VI = 4.60 V 0.14 %
VI = 4.70 V 0.047 %
Chapter 2: Cyclone III LS Device Data Sheet 2–3
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Figure 2–1 shows the methodology to determine the overshoot duration. In this
example, overshoot voltage is shown in red and is present on the input pin of the
Cyclone III LS device at over 4.1 V but below 4.2 V. From Table 2–1, for an overshoot
of 4.1 V, the percentage of high time for the overshoot can be as high as 31.97% over a
10-year period. Percentage of high time is calculated as ([delta T]/T) × 100. This
10-year period assumes the device is always turned on with 100% I/O toggle rate and
50% duty cycle signal. For lower I/O toggle rates and situations in which the device is
in an idle state, lifetimes are increased.
Recommended Operating Conditions
This section lists the functional operation limits for AC and DC parameters for
Cyclone III LS devices.
The steady-state voltage and current values expected from Cyclone III LS devices are
provided in Table 2–3. All supplies must be strictly monotonic without plateaus.
Figure 2–1. Cyclone III LS Devices Overshoot Duration
3.3 V
4.1 V
4.2 V
T
ΔT
Tab le 2–3. Cyclone III LS Devices Recommended Operating Conditions (Note 1), (2) (Part 1 of 2)
Symbol Parameter Conditions Min Typ Max Unit
VCCINT
(3) Supply voltage for internal logic — 1.15 1.2 1.25 V
VCCIO
(3), (6)
Supply voltage for output buffers, 3.3-V
operation — 3.135 3.3 3.465 V
Supply voltage for output buffers, 3.0-V
operation — 2.85 3.0 3.15 V
Supply voltage for output buffers, 2.5-V
operation — 2.375 2.5 2.625 V
Supply voltage for output buffers, 1.8-V
operation — 1.71 1.8 1.89 V
Supply voltage for output buffers, 1.5-V
operation — 1.425 1.5 1.575 V
Supply voltage for output buffers, 1.2-V
operation — 1.14 1.2 1.26 V
VCCA
(3) Supply (analog) voltage for PLL regulator — 2.375 2.5 2.625 V
VCCD_PLL
(3) Supply (digital) voltage for PLL — 1.15 1.2 1.25 V
2–4 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
DC Characteristics
This section lists the I/O leakage current, pin capacitance, on-chip termination (OCT)
tolerance, and bus hold specifications for Cyclone III LS devices.
Supply Current
Supply current is the current the device draws after the device is configured with no
inputs or outputs toggling and no activity in the device. Use the Excel-based Early
Power Estimator (EPE) to get the supply current estimates for your design because
these currents vary largely with the resources you use.
Table 2–4 lists the I/O pin leakage current for Cyclone III LS devices.
VCCBAT
Battery back-up power supply for design
security volatile key register —1.23.03.3V
VIInput voltage — –0.5 — 3.6 V
VOOutput voltage — 0 — VCCIO V
TJOperating junction temperature For commercial use 0 — 85 °C
For industrial use –40 — 100 °C
tRAMP Power supply ramptime Standard POR (4) 50 µs — 50 ms —
Fast POR (5) 50 µs — 3 ms —
IDiode
Magnitude of DC current across
PCI-clamp diode when enabled ———10mA
Notes to Ta ble 2– 3 :
(1) VCC IO for all I/O banks must be powered up during device operation. All VCCA pins must be powered to 2.5 V (even when you do not use phase
locked-loops [PLLs}), and must be powered up and powered down at the same time.
(2) VCC D_PLL must always be connected to VCCINT through a decoupling capacitor and ferrite bead.
(3) VCC must rise monotonically.
(4) Power-on reset (POR) time for Standard POR ranges from 50 to 200 ms. Each individual power supply must reach the recommended operating
range within 50 ms.
(5) POR time for Fast POR ranges from 3 to 9 ms. Each individual power supply must reach the recommended operating range within 3 ms.
(6) All input buffers are powered by the VCCIO
supply.
Tab le 2–3. Cyclone III LS Devices Recommended Operating Conditions (Note 1), (2) (Part 2 of 2)
Symbol Parameter Conditions Min Typ Max Unit
Tab le 2–4. Cyclone III LS Devices I/O Pin Leakage Current (Note 1), (2)
Symbol Parameter Conditions Min Typ Max Unit
IIInput Pin Leakage Current VI = VCC IOM AX to 0 V –10 — 10 μA
IOZ
Tri-stated I/O Pin Leakage
Current VO = VCC IOMAX to 0 V –10 — 10 μA
Notes to Ta ble 2– 4 :
(1) This value is specified for normal device operation. The value varies during device power-up. This applies for all
VCCIO settings (3.3, 3.0, 2.5, 1.8, 1.5, and 1.2 V).
(2) The 10 μA I/O leakage current limit is applicable when the internal clamping diode is off. A higher current can be
observed when the diode is on.
Chapter 2: Cyclone III LS Device Data Sheet 2–5
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Bus Hold
Bus hold retains the last valid logic state after the source driving it either enters the
high impedance state or is removed. Each I/O pin has an option to enable bus hold in
user mode. Bus hold is always disabled in configuration mode.
Table 2–5 lists the bus hold specifications for Cyclone III LS devices. Also listed are the
input pin capacitances and OCT tolerance specifications.
OCT Specifications
Table 2–6 lists the variation of OCT without calibration across process, temperature,
and voltage (PVT).
Tab le 2–5. Cyclone III LS Devices Bus Hold Parameters (Note 1)
Parameter Condition
VCCIO (V)
Unit1.2 1.5 1.8 2.5 3.0 3.3
Min Max Min Max Min Max Min Max Min Max Min Max
Bus-hold
low,
sustaining
current
VIN > VIL
(maximum) 8 — 12 — 30 — 50 — 70 — 70 — μA
Bus-hold
high,
sustaining
current
VIN < VIL
(minimum) –8 — –12 — –30 — –50 — –70 — –70 — μA
Bus-hold
low,
overdrive
current
0 V < VIN < VCCIO — 125 — 175 — 200 — 300 — 500 — 500 μA
Bus-hold
high,
overdrive
current
0 V < VIN < VCCIO — –125 — –175 — –200 — –300 — –500 — –500 μA
Bus-hold
trip point — 0.3 0.9 0.375 1.125 0.68 1.07 0.7 1.7 0.8 2.0 0.8 2.0 V
Note to Tabl e 2 –5 :
(1) Bus-hold trip points are based on calculated input voltages from the JEDEC standard.
Tab le 2–6. Cyclone III LS Devices Series OCT without Calibration Specifications
Description VCCIO (V)
Resistance Tolerance
Unit
Commercial Max Industrial Max
Series OCT without
calibration
3.0 ±30 ±40 %
2.5 ±30 ±40 %
1.8 ±40 ±50 %
1.5 ±50 ±50 %
1.2 ±50 ±50 %
2–6 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
OCT calibration is automatically performed at device power-up for OCT enabled
I/Os.
Table 2–7 lists the OCT calibration accuracy at device power-up.
OCT resistance may vary with the variation of temperature and voltage after
power-up calibration. Use Table 2–8 and Equation 2–1 to determine the final OCT
resistance considering the variations after power-up calibration.
Table 2–8 lists the percentage change of the OCT resistance with voltage and
temperature.
Tab le 2–7. Cyclone III LS Devices Series OCT with Calibration at Device Power-Up Specifications
Description VCCIO (V)
Calibration Accuracy
Unit
Commercial Max Industrial Max
Series Termination with
power-up calibration
3.0 ±10 ±10 %
2.5 ±10 ±10 %
1.8 ±10 ±10 %
1.5 ±10 ±10 %
1.2 ±10 ±10 %
Tab le 2–8. Cyclone III LS Devices OCT Variation After Calibration at Device Power-Up (Note 1)
Nominal Voltage dR/dT (%/°C) dR/dV (%/mV)
3.0 0.262 –0.026
2.5 0.234 –0.039
1.8 0.219 –0.086
1.5 0.199 –0.136
1.2 0.161 –0.288
Note to Tabl e 2 –8 :
(1) Use this table to calculate the final OCT resistance with the variation of temperature and voltage.
Chapter 2: Cyclone III LS Device Data Sheet 2–7
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Example 2–1 shows you how to calculate the change of 50 Ω I/O impedance from
25°C at 3.0 V to 85°C at 3.15 V.
Pin Capacitance
Table 2–9 lists the pin capacitance for Cyclone III LS devices.
Equation 2–1. (Note 1), (2), (3), (4), (5), (6)
ΔRV = (V2 – V1) × 1000 × dR/dV ––––– (7)
ΔRT = (T2 – T1) × dR/dT ––––– (8)
For ΔRx < 0; MFx = 1/ (|ΔRx|/100 + 1) ––––– (9)
For ΔRx > 0; MFx = ΔRx/100 + 1 ––––– (10)
MF = MFV × MFT ––––– (11)
Rfinal = Rinitial × MF ––––– (12)
Notes to Equation 2–1:
(1) T2 is the final temperature.
(2) T1 is the initial temperature.
(3) MF is multiplication factor.
(4) Rfinal is final resistance.
(5) Riniti al is initial resistance.
(6) Subscript × refers to both V and T
.
(7) ΔRV is variation of resistance with voltage.
(8) ΔRT is variation of resistance with temperature.
(9) dR/dT is the percentage change of resistance with temperature.
(10) dR/dV is the percentage change of resistance with voltage.
(11) V2 is final voltage.
(12) V1 is the initial voltage.
Example 2–1.
ΔRV = (3.15 – 3) × 1000 × –0.026 = –3.83
ΔRT = (85 – 25) × 0.262 = 15.72
Because ΔRV is negative,
MFV = 1 / (3.83/100 + 1) = 0.963
Because ΔRT is positive,
MFT = 15.72/100 + 1 = 1.157
MF = 0.963 × 1.157 = 1.114
Rfinal = 50 × 1.114 = 55.71 Ω
Tab le 2–9. Cyclone III LS Devices Pin Capacitance (Part 1 of 2)
Symbol Parameter Typical –
QFP
Typical –
FBGA Unit
CIOTB Input capacitance on top/bottom I/O pins 7 6 pF
CIOLR Input capacitance on left/right I/O pins 7 5 pF
CLV D SL R
Input capacitance on left/right I/O pins with true LVDS
output 87pF
2–8 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
CVREFLR (1) Input capacitance on left/right dual-purpose VREF pin
when used as VREF or user I/O pin 21 21 pF
CVREFTB (1) Input capacitance on top/bottom dual-purpose VREF
pin when used as VREF or user I/O pin 23 23 pF
CCLKTB
Input capacitance on top/bottom dedicated clock input
pins 76pF
CCLKLR
Input capacitance on left/right dedicated clock input
pins 65pF
Note to Tabl e 2 –9 :
(1) When you use the VREF pin as a regular input or output, you can expect a reduced performance of toggle rate and
tCO
due to higher pin capacitance.
Tab le 2–9. Cyclone III LS Devices Pin Capacitance (Part 2 of 2)
Symbol Parameter Typical –
QFP
Typical –
FBGA Unit
Chapter 2: Cyclone III LS Device Data Sheet 2–9
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Internal Weak Pull-Up and Weak Pull-Down Resistor
Table 2–10 lists the weak pull-up and pull-down resistor values for Cyclone III LS
devices.
Hot Socketing
Table 2–11 lists the hot-socketing specifications for Cyclone III LS devices.
Table 2–10. Cyclone III LS Devices Internal Weak Pull-Up Weak and Pull-Down Resistor (Note 1)
Symbol Parameter Conditions Min Typ Max Unit
R_PU
Value of I/O pin pull-up resistor before
and during configuration, as well as
user mode if the programmable
pull-up resistor option is enabled
VCCIO = 3.3 V ± 5% (2), (3) 7 2541kΩ
VCCIO = 3.0 V ± 5% (2), (3) 7 2847kΩ
VCCIO = 2.5 V ± 5% (2), (3) 8 3561kΩ
VCCIO = 1.8 V ± 5% (2), (3) 10 57 108 kΩ
VCCIO = 1.5 V ± 5% (2), (3) 13 82 163 kΩ
VCCIO = 1.2 V ± 5% (2), (3) 19 143 351 kΩ
R_PD
Value of I/O pin pull-down resistor
before and during configuration
VCCIO = 3.3 V ± 5% (4) 6 1930kΩ
VCCIO = 3.0 V ± 5% (4) 6 2236kΩ
VCCIO = 2.5 V ± 5% (4) 6 2543kΩ
VCCIO = 1.8 V ± 5% (4) 7 3571kΩ
VCCIO = 1.5 V ± 5% (4) 850112kΩ
Notes to Ta ble 2– 10 :
(1) All I/O pins have an option to enable weak pull-up except the configuration, test, and JTAG pins. The weak pull-down feature is only available
for JTAG TCK.
(2) Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.
(3) R_P U = (VCCIO –V
I)/IR_PU
Minimum condition: –40°C; VCCIO = VCC + 5%, VI = VCC + 5% – 50 mV;
Typical condition: 25°C; VCCIO = VCC
, VI = 0 V;
Maximum condition: 125°C; VCCIO = VCC – 5%, VI = 0 V; in which VI refers to the input voltage at the I/O pin.
(4) R_P D = VI/IR_PD
Minimum condition: –40°C; VCCIO = VCC + 5%, VI = 50 mV;
Typical condition: 25°C; VCCIO = VCC
, VI = VCC –5%;
Maximum condition: 125°C; VCCIO = VCC – 5%, VI = VCC – 5%; in which VI refers to the input voltage at the I/O pin.
Table 2–11. Cyclone III Devices LS Hot-Socketing Specifications
Symbol Parameter Maximum
IIOPIN(DC) DC current per I/O pin 300 μA
IIOPIN(AC) AC current per I/O pin 8 mA (1)
Note to Tabl e 2 –1 1:
(1) The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN| = C dv/dt, in which C is I/O pin
capacitance and dv/dt is the slew rate.
2–10 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Schmitt Trigger Input
Cyclone III LS devices support Schmitt trigger input on TDI, TMS, TCK, nSTATUS,
nCONFIG, nCE, CONF_DONE, and DCLK pins. A Schmitt trigger feature introduces
hysteresis to the input signal for improved noise immunity, especially for signals with
a slow edge rate. Table 2–12 lists the hysteresis specifications across supported VCCIO
range for Schmitt trigger inputs in Cyclone III LS devices.
I/O Standard Specifications
The following tables list input voltage sensitivities (VIH and VIL), output voltage
(VOH and VOL), and current drive characteristics (IOH and IOL) for various I/O standards
supported by Cyclone III LS devices.
Table 2–13 through Table 2–18 provide Cyclone III LS devices I/O standard
specifications.
Table 2–12. Hysteresis Specifications for Schmitt Trigger Input in Cyclone III LS Devices
Symbol Parameter Conditions Minimum Typical Maximum Unit
VSCHMITT
Hysteresis for Schmitt trigger
input
VCCIO = 3.3 V 200 — — mV
VCCIO = 2.5 V 200 — — mV
VCCIO = 1.8 V 140 — — mV
VCCIO = 1.5 V 110 — — mV
Table 2–13. Cyclone III LS Devices Single-Ended I/O Standard Specifications (Note 1)
I/O Standard
VCCIO (V) VIL (V) VIH (V) VOL (V) VOH
(V) IOL
(mA)
IOH
(mA)
Min Typ Max Min Max Min Max Max Min
3.3-V LVTTL (2) 3.135 3.3 3.465 — 0.8 1.7 3.6 0.45 2.4 4 –4
3.3-V LVCMOS (2) 3.135 3.3 3.465 — 0.8 1.7 3.6 0.2 VCCIO
– 0.2 2 –2
3.0-V LVTTL (2) 2.85 3.0 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.45 2.4 4 –4
3.0-V LVCMOS (2) 2.85 3.0 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.2 VCCIO
– 0.2 0.1 –0.1
2.5-V LVTTL and
LVCMOS (2) 2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO + 0.3 0.4 2.0 1 –1
1.8-V LVTTL and
LVCMOS 1.71 1.8 1.89 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
2.25 0.45 VCC IO – 0.45 2 –2
1.5-V LVCMOS 1.425 1.5 1.575 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
VCCIO + 0.3 0.25 * VCCIO 0.75 * VCC IO 2–2
1.2-V LVCMOS 1.14 1.2 1.26 –0.3 0.35 *
VCCIO
0.65 *
VCCIO
VCCIO + 0.3 0.25 * VCCIO 0.75 * VCC IO 2–2
PCI 2.85 3.0 3.15 — 0.30*
VCCIO
0.50*
VCCIO
VCCIO + 0.3 0.1 * VCCIO 0.9 * VCCIO 1.5 –0.5
PCI-X 2.85 3.0 3.15 — 0.35*
VCCIO
0.50*
VCCIO
VCCIO + 0.3 0.1 * VCCIO 0.9 * VCCIO 1.5 –0.5
Notes to Ta ble 2– 13 :
(1) AC load CL = 10 pF.
(2) For more information about interfacing Cyclone III LS devices with 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS I/O standards,
refer to AN 447: Interfacing Cyclone III and Cyclone iV Devices with 3.3/3.0/2.5-V LVTTL and LVCMOS I/O Systems.
Chapter 2: Cyclone III LS Device Data Sheet 2–11
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 2–14. Cyclone III LS Devices Single-Ended SSTL and HSTL I/O Reference Voltage Specifications (Note 4)
I/O
Standard
VCCIO (V) VREF (V) VTT (V) (3)
Min Typ Max Min Typ Max Min Typ Max
SSTL-2
Class I, II 2.375 2.5 2.625 1.19 1.25 1.31 VREF – 0.04 VREF VREF + 0.04
SSTL-18
Class I, II 1.7 1.8 1.9 0.833 0.9 0.969 VREF – 0.04 VREF VREF + 0.04
HSTL-18
Class I, II 1.71 1.8 1.89 0.85 0.9 0.95 0.85 0.9 0.95
HSTL-15
Class I, II 1.425 1.5 1.575 0.71 0.75 0.79 0.71 0.75 0.79
HSTL-12
Class I, II 1.14 1.2 1.26 0.48 * VCC IO (1) 0.5 * VCCIO
(1) 0.52 * VCC IO (1) — 0.5 * VCC IO —
0.47 * VCCIO (2) 0.5 * VCCIO
(2) 0.53 * VCC IO (2)
Notes to Ta ble 2– 14 :
(1) The value shown refers to the DC input reference voltage, VREF(DC).
(2) The value shown refers to the AC input reference voltage, VREF(AC)
.
(3) VTT of the transmitting device must track VREF of the receiving device.
(4) For an explanation of the terms used in Table 2–14, refer to “Glossary” on page 2–26.
Table 2–15. Cyclone III LS Devices Single-Ended SSTL and HSTL I/O Standards Signal Specifications
I/O
Standard
VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL
(mA)
IOH
(mA)
Min Max Min Max Min Max Min Max Max Min
SSTL-2
Class I —VREF –
0.18
VREF
+
0.18 ——
VREF –
0.35
VREF +
0.35 —VTT –
0.57
VTT +
0.57 8.1 –8.1
SSTL-2
Class II —VREF –
0.18
VREF
+
0.18 ——
VREF –
0.35
VREF +
0.35 —VTT –
0.76
VTT +
0.76 16.4 –16.4
SSTL-18
Class I —VREF –
0.125
VREF +
0.125 ——
VREF –
0.25
VREF +
0.25 —VTT –
0.475
VTT +
0.475 6.7 –6.7
SSTL-18
Class II —VREF –
0.125
VREF +
0.125 ——
VREF –
0.25
VREF +
0.25 —0.28
VCCIO –
0.28 13.4 –13.4
HSTL-18
Class I —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO
–
0.4 8–8
HSTL-18
Class II —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 16 –16
HSTL-15
Class I —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 8–8
HSTL-15
Class II —VREF –
0.1
VREF +
0.1 ——
VREF –
0.2
VREF +
0.2 —0.4
VCCIO –
0.4 16 –16
HSTL-12
Class I –0.15 VREF –
0.08
VREF +
0.08 VCCIO + 0.15 –0.24 VREF –
0.15
VREF +
0.15 VCCIO
+ 0.24 0.25 ×
VCCIO
0.75 ×
VCCIO
8–8
HSTL-12
Class II –0.15 VREF –
0.08
VREF +
0.08 VCCIO + 0.15 –0.24 VREF –
0.15
VREF +
0.15 VCCIO
+ 0.24 0.25 ×
VCCIO
0.75 ×
VCCIO
14 –14
2–12 Chapter 2: Cyclone III LS Device Data Sheet
Electrical Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
fFor more information about receiver input and transmitter output waveforms, and for
other differential I/O standards, refer to the High-Speed Differential Interfaces in
Cyclone III Devices chapter.
Table 2–16. Cyclone III LS Devices Differential SSTL I/O Standard Specifications
I/O Standard
VCCIO
(V) VSwing(DC)
(V) VX(AC)
(V) VSwing(AC) (V) VOX(AC)
(V)
Min Typ Max Min Max Min Typ Max Min Max Min Typ Max
SSTL-2
Class I, II 2.375 2.5 2.625 0.36 VCCIO VCCIO /2 – 0.2 — VCCIO/2 +
0.2 0.7 VCCIO
VCCIO /2 –
0.125 —VCCIO/2 +
0.125
SSTL-18
Class I, II 1.7 1.8 1.90 0.25 VCCIO
VCCIO/2 –
0.175 —VCCIO/2 +
0.175 0.5 VCCIO
VCCIO /2 –
0.125 —VCCIO/2 +
0.125
Table 2–17. Cyclone III LS Devices Differential HSTL I/O Standard Specifications
I/O Standard
VCCIO
(V) VDIF(DC) (V) VX(AC) (V) VCM(DC)
(V) VDIF(AC ) (V)
Min Typ Max Min Max Min Typ Max Min Typ Max Min Max
HSTL-18
Class I, II 1.71 1.8 1.89 0.2 — 0.85 — 0.95 0.85 — 0.95 0.4 —
HSTL-15
Class I, II 1.425 1.5 1.575 0.2 — 0.71 — 0.79 0.71 — 0.79 0.4 —
HSTL-12
Class I, II 1.14 1.2 1.26 0.16 VCCIO 0.48 * VCCIO —0.52 *
VCCIO
0.48 *
VCCIO
—0.52 *
VCCIO
0.3 0.48 *
VCCIO
Table 2–18. Differential I/O Standard Specifications (Note 1) (Part 1 of 2)
I/O
Standard
VCCIO
(V) VID (mV) VICM (V) VOD
(mV) (2) VOS (V) (2)
Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max
LVPECL
(Row
I/Os) (3)
2.375 2.5 2.625 100 —
0D
MAX ≤ 500 Mbps 1.85
—— — — — —0.5 500 Mbps ≤ D
MAX ≤
700 Mbps 1.85
1D
MAX
> 700 Mbps 1.6
LVPECL
(Column
I/Os) (3)
2.375 2.5 2.625 100 —
0D
MAX ≤ 500 Mbps 1.85
—— — — — —0.5 500 Mbps ≤ DMA X ≤
700 Mbps 1.85
1D
MAX
> 700 Mbps 1.6
LVDS
(Row
I/Os)
2.375 2.5 2.625 100 —
0D
MAX ≤ 500 Mbps 1.85
247 — 600 1.125 1.25 1.375 0.5 500 Mbps ≤ DMAX ≤
700 Mbps 1.85
1D
MAX > 700 Mbps 1.6
LVDS
(Column
I/Os)
2.375 2.5 2.625 100 —
0D
MAX ≤ 500 Mbps 1.85
247 — 600 1.125 1.25 1.350.5 500 Mbps ≤ DMAX ≤
700 Mbps 1.85
1D
MAX > 700 Mbps 1.6
Chapter 2: Cyclone III LS Device Data Sheet 2–13
Electrical Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Power Consumption
Use the following methods to estimate power for your design:
■The Excel-based EPE
■The Quartus II® PowerPlay power analyzer feature
Use the interactive Excel-based EPE before designing your device to get a magnitude
estimate of the device power. The Quartus II PowerPlay power analyzer provides
better quality estimates based on the specifics of the design after place-and-route is
complete. The PowerPlay power analyzer can apply a combination of user-entered,
simulation-derived, and estimated signal activities which, combined with detailed
circuit models, can yield very accurate power estimates.
BLVDS
(Row
I/Os) (4)
2.375 2.5 2.625 100 — — — — — — — — — —
BLVDS
(Column
I/Os) (4)
2.375 2.5 2.625 100 — — — — — — — — — —
mini-LVDS
(Row
I/Os) (5)
2.375 2.5 2.625 — — — — — 300 — 600 1.0 1.2 1.4
mini-LVDS
(Column
I/Os) (5)
2.375 2.5 2.625 — — — — — 300 — 600 1.0 1.2 1.4
RSDS
(Row
I/Os) (5)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5
RSDS
(Column
I/Os) (5)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5
PPDS
(Row
I/Os) (5)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4
PPDS
(Column
I/Os) (5)
2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4
Notes to Ta ble 2– 18 :
(1) For an explanation of the terms used in Table 2–18, refer to “Transmitter Output Waveform” in “Glossary” on page 2–26.
(2) RL range: 90 ≤ R
L ≤ 110 Ω.
(3) The LVPECL input standard is only supported at clock input. The output standard is not supported.
(4) There is no fixed VICM, VOD , and VOS specification for BLVDS. They are dependent on the system topology.
(5) Mini-LVDS, RSDS, and PPDS standards are only supported at output pins of Cyclone III LS devices.
Table 2–18. Differential I/O Standard Specifications (Note 1) (Part 2 of 2)
I/O
Standard
VCCIO
(V) VID (mV) VICM (V) VOD
(mV) (2) VOS (V) (2)
Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max
2–14 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
fFor more information about power estimation tools, refer to the Early Power Estimator
User Guide and the PowerPlay Power Analysis chapter in volume 3 of the Quartus II
Handbook.
Switching Characteristics
This section describes performance characteristics of the core and periphery blocks for
Cyclone III LS devices. These characteristics are designated as Preliminary or Final,
as indicated in the title of each table. The designations are defined as follows:
■Preliminary—Preliminary characteristics are created using simulation results,
process data, and other known parameters.
■Final—Final numbers are based on actual silicon characterization and testing.
These numbers reflect the actual performance of the device under worst-case
silicon process, voltage, and junction temperature conditions.
Core Performance Specifications
Table 2–19 through Table 2–25 describe the core performance specifications for
Cyclone III LS devices.
Clock Tree Specifications
Table 2–19 lists the clock tree specifications for Cyclone III LS devices.
PLL Specifications
Table 2–20 lists the PLL specifications for Cyclone III LS devices when operating in
the commercial junction temperature range (0°C to 85°C) and the industrial junction
temperature range (-40°C to 100°C). For more information about the PLL block, refer
to “PLL Block” in “Glossary” on page 2–26.
Table 2–19. Cyclone III LS Devices Clock Tree Performance (Preliminary)
Device
Performance
Unit
C7 C8 I7
EP3CLS70 437.5 402 437.5 MHz
EP3CLS100 437.5 402 437.5 MHz
EP3CLS150 437.5 402 437.5 MHz
EP3CLS200 437.5 402 437.5 MHz
Table 2–20. Cyclone III LS Devices PLL Specifications (Note 4) (Part 1 of 2) (Preliminary)
Symbol Parameter Min Typ Max Unit
fIN (1) Input clock frequency — — 450 MHz
fINPFD PFD input frequency 5 — 325 MHz
fVCO (6) PLL internal VCO operating range 600 — 1300 MHz
fINDUTY Input clock duty cycle 40 — 60 %
tINJITTER_CCJ (5) Input clock cycle-to-cycle jitter FREF ≥ 100 MHz — — 0.15 UI
FREF < 100 MHz — — ±750 ps
Chapter 2: Cyclone III LS Device Data Sheet 2–15
Switching Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
fOUT_EXT (external clock
output) (1) PLL output frequency — — 450 MHz
fOUT (to global clock) PLL output frequency (–7 speed grade) 426 — 450 MHz
PLL output frequency (–8 speed grade) 379 — 402.5 MHz
tOUTDUTY
Duty cycle for external clock output (when set to
50%) 45 50 55 %
tLOCK
Time required to lock from end of device
configuration —— 1 ms
tDLOCK
Time required to lock dynamically (after switchover,
reconfiguring any non-post-scale counters/delays or
areset is deasserted)
—— 1 ms
tOUTJITTER_PERIOD_DEDCLK (3) Dedicated clock output period jitter FOUT ≥ 100 MHz — — 300 ps
FOUT < 100 MHz — — 30 mUI
tOUTJITTER_CCJ_DEDCLK (3)
Dedicated clock output cycle-to-cycle jitter
FOUT ≥ 100 MHz ——300 ps
FOUT < 100 MHz — — 30 mUI
tOUTJITTER_PERIOD_IO (3) Regular I/O period jitter FOUT ≥ 100 MHz — — 650 ps
FOUT < 100 MHz — — 75 mUI
tOUTJITTER_CCJ_IO (3) Regular I/O cycle-to-cycle jitter FOUT ≥ 100 MHz — — 650 ps
FOUT < 100 MHz — — 75 mUI
tPLL_PSERR Accuracy of PLL phase shift — — ±50 ps
tARESET Minimum pulse width on areset signal. 10 — — ns
tCONFIGPLL Time required to reconfigure scan chains for PLLs — 3.5
(2) —scanclk
cycles
fSCANCLK scanclk frequency — — 100 MHz
Notes to Ta ble 2– 20 :
(1) This parameter is limited in the Quartus II software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O
standard.
(2) With 100-MHz scanclk frequency.
(3) Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification applies to
the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied.
(4) VCC D_PLL must be connected to VCC INT through the decoupling capacitor and ferrite bead.
(5) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source, which is less
than 200 ps.
(6) The VCO frequency reported by the Quartus II software in the PLL summary section of the compilation report takes into consideration the VCO
post-scale counter K value. Therefore, if the counter K has a value of 2, the frequency reported can be lower than the fVCO specification.
Table 2–20. Cyclone III LS Devices PLL Specifications (Note 4) (Part 2 of 2) (Preliminary)
Symbol Parameter Min Typ Max Unit
2–16 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Embedded Multiplier Specifications
Table 2–21 lists the embedded multiplier specifications for Cyclone III LS devices.
Memory Block Specifications
Table 2–22 lists the M9K memory block and logic element (LE) specifications for
Cyclone III LS devices.
Configuration and JTAG Specifications
Table 2–23 lists the configuration mode specifications for Cyclone III LS devices.
Table 2–24 lists the active configuration mode specifications for Cyclone III LS
devices.
Table 2–21. Cyclone III LS Devices Embedded Multiplier Specifications (Preliminary)
Mode
Resources Used
EP3CLS70, EP3CLS100,
EP3CLS150, and EP3CLS200
Performance Unit
Number of Multipliers C7 and I7 C8
9 × 9-bit multiplier 1 300 260 MHz
18 × 18-bit multiplier 1 250 200 MHz
Table 2–22. Cyclone III LS Devices Memory Block Performance Specifications (Preliminary)
Memory Mode
Resources Used
EP3CLS70, EP3CLS100,
EP3CLS150, and EP3CLS200
Performance Unit
LEs M9K
Memory C7 and I7 C8
M9K Block
FIFO 256 × 36 47 1 274 238 MHz
Single-port 256 × 36 0 1 274 238 MHz
Simple dual-port 256 × 36 CLK 0 1 274 238 MHz
True dual port 512 × 18 single CLK 0 1 274 238 MHz
Table 2–23. Cyclone III LS Devices Configuration Mode Specifications (Preliminary)
Programming Mode DCLK fMA X Unit
Passive Serial (PS) 133 MHz
Fast Passive Parallel (FPP) 100 MHz
Table 2–24. Cyclone III LS Devices Active Configuration Mode Specifications (Preliminary)
Programming Mode DCLK Range Unit
Active Serial (AS) 20 to 40 MHz
Chapter 2: Cyclone III LS Device Data Sheet 2–17
Switching Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 2–25 lists the JTAG timing parameters and values for Cyclone III LS devices.
Periphery Performance
This section describes periphery performance, including high-speed I/O, external
memory interface, and IOE programmable delay.
I/O performance supports several systems interfacing, for example, the high-speed
I/O interface, external memory interface, and PCI/PCI-X bus interface. I/O using
SSTL-18 Class I termination standard can achieve up to the stated DDR2 SDRAM
interfacing speed with typical DDR2 SDRAM memory interface setup. I/O using
general purpose I/O standards such as 3.0, 2.5, 1.8, or 1.5 LVTTL/LVCMOS are
capable of typical 200 MHz interfacing frequency with 10 pF load.
1Your actual achievable frequency depends on design- and system-specific factors. You
should perform HSPICE/IBIS simulations based on your specific design and system
setup to determine the maximum achievable frequency in your system.
High-Speed I/O Specification
Table 2–26 through Table 2–31 list the high-speed I/O timing for Cyclone III LS
devices. For more information about the definitions of high-speed timing
specifications, refer to “Glossary” on page 2–26.
Table 2–25. Cyclone III LS Devices JTAG Timing Parameters (Note 2) (Preliminary)
Symbol Parameter Min Max Unit
tJCP TCK clock period 40 — ns
tJCH TCK clock high time 20 — ns
tJCL TCK clock low time 20 — ns
tJPSU_TDI JTAG port setup time for TDI (1) 2—ns
tJPSU_TMS JTAG port setup time for TMS (1) 3—ns
tJPH JTAG port hold time 10 — ns
tJPCO JTAG port clock to output (1) —16ns
tJPZX JTAG port high impedance to valid output (1) —15ns
tJPXZ JTAG port valid output to high impedance (1) —15ns
tJSSU Capture register setup time (1) 5—ns
tJSH Capture register hold time 10 — ns
tJSCO Update register clock to output — 25 ns
tJSZX Update register high impedance to valid output — 25 ns
tJSXZ Update register valid output to high impedance — 25 ns
Notes to Ta bl e 2– 25 :
(1) The specification shown is for the 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS operation of the JTAG pins. For the 1.8-V
LVTTL/LVCMOS and the 1.5-V LVCMOS, the JTAG port clock to output time is 16 ns.
(2) For more information, refer to “JTAG Waveform” in “Glossary” on page 2–26.
2–18 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Table 2–26. Cyclone III LS Devices RSDS Transmitter Timing Specification (Note 1), (2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Typ Max Min Typ Max
fHSCLK
(input clock
frequency)
×10 10 — 155.5 10 — 155.5 MHz
×8 10 — 155.5 10 — 155.5 MHz
×7 10 — 155.5 10 — 155.5 MHz
×4 10 — 155.5 10 — 155.5 MHz
×2 10 — 155.5 10 — 155.5 MHz
×1 10 — 311 10 — 311 MHz
Device operation
in Mbps
×10 100 — 311 100 — 311 Mbps
×8 80 — 311 80 — 311 Mbps
×7 70 — 311 70 — 311 Mbps
×4 40 — 311 40 — 311 Mbps
×2 20 — 311 20 — 311 Mbps
×1 10 — 311 10 — 311 Mbps
tDUTY — 45 — 55 45 — 55 %
TCCS — — — 200 — — 200 ps
Output jitter
(peak to peak) — — — 500 — — 550 ps
tRISE
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tFALL
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tLOCK
(3) ———1——1ms
Notes to Ta ble 2– 26 :
(1) Applicable for true RSDS and Emulated RSDS with three-resistor network transmitters.
(2) True RSDS transmitter is only supported at the output pin of the Row I/O (Banks 1, 2, 5, and 6). Emulated RSDS with three-resistor network
transmitter is supported at the output pin of all I/O banks.
(3) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 2–27. Cyclone III LS Devices Emulated RSDS with One-Resistor Network Transmitter Timing
Specifications (Note 1) (Part 1 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Typ Max Min Typ Max
fHSCLK (input
clock
frequency)
×10 10 — 85 10 — 85 MHz
×8 10 — 85 10 — 85 MHz
×7 10 — 85 10 — 85 MHz
×4 10 — 85 10 — 85 MHz
×2 10 — 85 10 — 85 MHz
×1 10 — 170 10 — 170 MHz
Chapter 2: Cyclone III LS Device Data Sheet 2–19
Switching Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Device
operation in
Mbps
×10 100 — 170 100 — 170 Mbps
×8 80 — 170 80 — 170 Mbps
×7 70 — 170 70 — 170 Mbps
×4 40 — 170 40 — 170 Mbps
×2 20 — 170 20 — 170 Mbps
×1 10 — 170 10 — 170 Mbps
tDUTY — 45 — 55 45 — 55 %
TCCS — — —200——200 ps
Output jitter
(peak to
peak)
— — —500——550 ps
tRISE
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tFALL
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tLOCK (2) ———1——1ms
Notes to Ta ble 2– 27 :
(1) Emulated RSDS with one-resistor network transmitter is supported at the output pin of all I/O banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 2–27. Cyclone III LS Devices Emulated RSDS with One-Resistor Network Transmitter Timing
Specifications (Note 1) (Part 2 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Typ Max Min Typ Max
Table 2–28. Cyclone III LS Devices Mini-LVDS Transmitter Timing Specification (Note 1), (2) (Part 1 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Typ Max Min Typ Max
fHSCLK (input clock
frequency)
×10 10 — 155.5 10 — 155.5 MHz
×8 10 — 155.5 10 — 155.5 MHz
×7 10 — 155.5 10 — 155.5 MHz
×4 10 — 155.5 10 — 155.5 MHz
×2 10 — 155.5 10 — 155.5 MHz
×1 10 — 311 10 — 311 MHz
Device operation
in Mbps
×10 100 — 311 100 — 311 Mbps
×8 80 — 311 80 — 311 Mbps
×7 70 — 311 70 — 311 Mbps
×4 40 — 311 40 — 311 Mbps
×2 20 — 311 20 — 311 Mbps
×1 10 — 311 10 — 311 Mbps
tDUTY — 45 — 55 45 — 55 %
TCCS — — — 200 — — 200 ps
2–20 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Output jitter
(peak to peak) ———500——550ps
tRISE
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tFALL
20 – 80%,
CLOAD = 5 pF — 500 — — 500 — ps
tLOCK (3) — ——1 ——1 ms
Notes to Ta ble 2– 28 :
(1) Applicable for true and emulated mini-LVDS with three-resistor network transmitter.
(2) True mini-LVDS transmitter is only supported at the output pin of the Row I/O (Banks 1, 2, 5, and 6). Emulated mini-LVDS with three-resistor
network transmitter is supported at the output pin of all I/O banks.
(3) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 2–28. Cyclone III LS Devices Mini-LVDS Transmitter Timing Specification (Note 1), (2) (Part 2 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Typ Max Min Typ Max
Table 2–29. Cyclone III LS Devices True LVDS Transmitter Timing Specifications (Note 1)
(Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Max Min Max
fHSCLK (input clock
frequency)
×10 10 370 10 320 MHz
×8 10 370 10 320 MHz
×7 10 370 10 320 MHz
×4 10 370 10 320 MHz
×2 10 370 10 320 MHz
×1 10 402.5 10 402.5 MHz
HSIODR
×10 100 740 100 640 Mbps
×8 80 740 80 640 Mbps
×7 70 740 70 640 Mbps
×4 40 740 40 640 Mbps
×2 20 740 20 640 Mbps
×1 10 402.5 10 402.5 Mbps
tDUTY — 45554555%
TCCS — — 200 — 200 ps
Output jitter
(peak to peak) — — 500 — 550 ps
tLOCK (2) ——1—1ms
Notes to Ta ble 2– 29 :
(1) True LVDS transmitter is only supported at the output pin of the Row I/O (Banks 1, 2, 5, and 6).
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Chapter 2: Cyclone III LS Device Data Sheet 2–21
Switching Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 2–30. Cyclone III LS Devices Emulated LVDS with Three-Resistor Network Transmitter Timing
Specifications (Note 1) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
MinMaxMinMax
fHSCLK (input clock
frequency)
×10 10 320 10 275 MHz
×8 10 320 10 275 MHz
×7 10 320 10 275 MHz
×4 10 320 10 275 MHz
×2 10 320 10 275 MHz
×1 10 402.5 10 402.5 MHz
HSIODR
×10 100 640 100 550 Mbps
×8 80 640 80 550 Mbps
×7 70 640 70 550 Mbps
×4 40 640 40 550 Mbps
×2 20 640 20 550 Mbps
×1 10 402.5 10 402.5 Mbps
tDUTY — 45554555%
TCCS — — 200 — 200 ps
Output jitter
(peak to peak) ——500—550ps
tLOCK (2) ——1—1ms
Notes to Ta ble 2– 30 :
(1) Emulated LVDS with three-resistor network transmitter is supported at the output pin of all I/O banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 2–31. Cyclone III LS Devices LVDS Receiver Timing Specifications (Note 1)
(Part 1 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Max Min Max
fHSCLK (input clock
frequency)
×10 10 370 10 320 MHz
×8 10 370 10 320 MHz
×7 10 370 10 320 MHz
×4 10 370 10 320 MHz
×2 10 370 10 320 MHz
×1 10 402.5 10 402.5 MHz
HSIODR
×10 100 740 100 640 Mbps
×8 80 740 80 640 Mbps
×7 70 740 70 640 Mbps
×4 40 740 40 640 Mbps
×2 20 740 20 640 Mbps
×1 10 402.5 10 402.5 Mbps
SW — — 400 — 400 %
2–22 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
External Memory Interface Specifications
Cyclone III LS devices support external memory interfaces up to 200 MHz. The
external memory interfaces for Cyclone III LS devices are auto-calibrating and easy to
implement.
Table 2–32 and Table 2–33 list the external memory interface specifications for
Cyclone III LS devices and are useful when performing memory interface timing
analysis.
fFor more information about external memory system specifications, refer to the
External Memory Interface Handbook.
Input jitter
tolerance ——500—550ps
tLOCK (2) ——1—1ps
Notes to Ta ble 2– 31 :
(1) True LVDS receiver is supported at all banks.
(2) tLOCK is the time required for the PLL to lock from the end of device configuration.
Table 2–31. Cyclone III LS Devices LVDS Receiver Timing Specifications (Note 1)
(Part 2 of 2) (Preliminary)
Symbol Modes
C7 and I7 C8
Unit
Min Max Min Max
Table 2–32. FPGA Sampling Window (SW) Requirement—Read Side (Note 1) (Preliminary)
Memory Standard
Column I/Os (ps) Row I/Os (ps) Wraparound Mode (ps)
Setup Hold Setup Hold Setup Hold
C7
DDR2 SDRAM 705 650 770 715 985 930
DDR SDRAM 675 620 795 740 970 915
QDRII SRAM 900 845 910 855 1085 1030
C8
DDR2 SDRAM 785 720 930 870 1115 1055
DDR SDRAM 800 740 915 855 1185 1125
QDRII SRAM 1050 990 1065 1005 1210 1150
I7
DDR2 SDRAM 765 710 855 800 1040 985
DDR SDRAM 745 690 880 825 1000 945
QDRII SRAM 945 890 955 900 1130 1075
Note to Tabl e 2 –3 2:
(1) Column I/Os refer to top and bottom I/Os. Row I/Os refer to right and left I/Os. Wraparound mode refers to the combination of column and row
I/Os.
Chapter 2: Cyclone III LS Device Data Sheet 2–23
Switching Characteristics
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Table 2–34 lists the Cyclone III LS devices memory ouput clock jitter specifications.
Table 2–33. Cyclone III LS Devices Transmitter Channel-to-Channel Skew (TCCS)—Write Side (Note 1)
Memory Standard I/O Standard
Column I/Os (ps) Row I/Os (ps) Wraparound Mode (ps)
Lead Lag Lead Lag Lead Lag
C7
DDR2 SDRAM SSTL-18 Class I 915 410 915 410 1015 510
SSTL-18 Class II 1025 545 1025 545 1125 645
DDR SDRAM SSTL-2 Class I 880 340 880 340 980 440
SSTL-2 Class II 1010 380 1010 380 1010 480
QDRII SRAM 1.8-V HSTL Class I 910 450 910 450 1010 550
1.8-V HSTL Class II 1010 570 1010 570 1110 670
C8
DDR2 SDRAM SSTL-18 Class I 1040 440 1040 440 1140 540
SSTL-18 Class II 1180 600 1180 600 1280 700
DDR SDRAM SSTL-2 Class I 1010 360 1010 360 1110 460
SSTL-2 Class II 1160 410 1160 410 1260 510
QDRII SRAM 1.8-V HSTL Class I 1040 490 1040 490 1140 590
1.8-V HSTL Class II 1190 630 1190 630 1290 730
I7
DDR2 SDRAM SSTL-18 Class I 961 431 961 431 1061 531
SSTL-18 Class II 1076 572 1076 572 1176 672
DDR SDRAM SSTL-2 Class I 924 357 924 357 1024 457
SSTL-2 Class II 1061 399 1061 399 1161 499
QDRII SRAM 1.8-V HSTL Class I 956 473 956 473 1056 573
1.8-V HSTL Class II 1061 599 1061 599 1161 699
Note to Tabl e 2 –3 3:
(1) Column I/O banks refer to top and bottom I/Os. Row I/O banks refer to right and left I/Os. Wraparound mode refers to the combination of column
and row I/Os.
Table 2–34. Cyclone III LS Devices Memory Output Clock Jitter Specifications (Note 1), (2)
Parameter Symbol Min Max Unit
Clock period jitter tJIT
(per) –125 125 ps
Cycle-to-cycle period jitter tJIT
(cc) –200 200 ps
Duty cycle jitter tJIT
(duty) –150 150 ps
Notes to Ta ble 2– 34 :
(1) The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC DDR2 standard.
(2) The clock jitter specification applies to memory output clock pins generated using DDIO circuits clocked by a PLL output routed on a global
clock network.
2–24 Chapter 2: Cyclone III LS Device Data Sheet
Switching Characteristics
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Duty Cycle Distortion Specification
Table 2–35 lists the worst case duty cycle distortion for Cyclone III LS devices.
OCT Calibration Timing Specification
Table 2–36 lists the duration of calibration for series OCT with calibration at device
power-up for Cyclone III LS devices.
IOE Programmable Delay
Table 2–37 and Table 2–38 list the IOE programmable delay for Cyclone III LS devices.
Table 2–35. Duty Cycle Distortion on Cyclone III LS Devices I/O Pins (Note 1), (2) (Preliminary)
Symbol
C7, I7 C8
Unit
Min Max Min Max
Output Duty Cycle 45 55 45 55 %
Notes to Ta ble 2– 35 :
(1) The duty cycle distortion specification applies to clock outputs from the PLLs, global clock tree, and I/O element
(IOE) driving the dedicated and general purpose I/O pins.
(2) Cyclone III LS devices meet the DCD specifications at the maximum output toggle rate for each combination of
the I/O standard and current strength.
Table 2–36. Cyclone III LS Devices Timing Specification for Series OCT with Calibration at Device
Power-Up (Note 1) (Preliminary)
Symbol Description Maximum Unit
tOCTCAL
Duration of series OCT with
calibration at device power-up 20 µs
Note to Tab le 2–3 6 :
(1) OCT calibration takes place after device configuration, before entering user mode.
Table 2–37. Cyclone III LS Devices IOE Programmable Delay on the Column Pins (Note 1), (2)
Parameter Paths Affected
Number
of
setting
Min
Offset
Max Offset
UnitFast Corner Slow Corner
I7 C7 C7 C8 I7
Input delay from the pin to the
internal cells
Pad to I/O
dataout to core 7 0 1.211 1.314 2.339 2.416 2.397 ns
Input delay from the pin to the
input register
Pad to I/O input
register 8 0 1.203 1.307 2.387 2.540 2.430 ns
Delay from the output register to
the output pin
I/O output
register to pad 2 0 0.518 0.559 1.065 1.151 1.082 ns
Input delay from the
dual-purpose clock pin to the
fan-out destinations
Pad to global
clock network 12 0 0.533 0.56 1.077 1.182 1.087 ns
Notes to Ta ble 2– 37 :
(1) The incremental values for the settings are generally linear. For the exact values of each setting, use the latest version of the Quartus II software.
(2) The minimum and maximum offset timing numbers refer to the 0 setting available in the Quartus II software.
Chapter 2: Cyclone III LS Device Data Sheet 2–25
I/O Timing
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
I/O Timing
DirectDrive technology and MultiTrack interconnect ensure predictable performance,
accurate simulation, and accurate timing analysis across all Cyclone III LS device
densities and speed grades.
Use the following methods to determine I/O timing:
■The Excel-based I/O timing
■The Quartus II Timing Analyzer
Excel-based I/O timing provides pin timing performance for each device density and
speed grade. The data is typically used before designing the FPGA to get a timing
budget estimation as part of the link timing analysis. The Quartus II Timing Analyzer
provides a more accurate and precise I/O timing data based on the specifics of the
design after place-and-route is complete.
fFor more information about the Excel-based I/O timing spreadsheet, refer to the
Cyclone III Devices Literature page on the Altera website.
All specifications are representative of worst-case supply voltage and junction
temperature conditions. Altera characterizes timing delays at the worst-case process,
minimum voltage, and maximum temperature for input register setup time (tSU) and
hold time (tH).
fFor more information about timing delay from the FPGA output to the receiving
device for system-timing analysis, refer to AN 366: Understanding I/O Output Timing
for Altera Devices.
Table 2–38. Cyclone III LS Devices IOE Programmable Delay on Row Pins (Note 1), (2)
Parameter Paths Affected
Number
of
setting
Min
Offset
Max Offset
UnitFast Corner Slow Corner
I7 C7 C7 C8 I7
Input delay from the pin to the
internal cells
Pad to I/O
dataout to core 7 0 1.209 1.314 2.352 2.514 2.432 ns
Input delay from the pin to the
input register
Pad to I/O input
register 8 0 1.207 1.312 2.402 2.558 2.447 ns
Delay from the output register to
the output pin
I/O output
register to pad 2 0 0.549 0.595 1.135 1.226 1.151 ns
Input delay from the
dual-purpose clock pin to the
fan-out destinations
Pad to global
clock network 12 0 0.52 0.54 1.052 1.16 1.061 ns
Notes to Ta ble 2– 38 :
(1) The incremental values for the settings are generally linear. For the exact values of each setting, use the latest version of the Quartus II software.
(2) The minimum and maximum offset timing numbers refer to the 0 setting available in the Quartus II software.
2–26 Chapter 2: Cyclone III LS Device Data Sheet
Glossary
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
Glossary
Table 2–39 lists the glossary for this chapter.
Table 2–39. Glossary (Part 1 of 5)
Letter Term Definitions
A——
B——
C——
D——
E——
FfHSCLK High-speed I/O Block: High-speed receiver and transmitter input and output clock frequency.
GGCLK Input pin directly to the global clock network.
GCLK PLL Input pin to the global clock network through the PLL.
HHSIODR High-speed I/O Block: Maximum and minimum LVDS data transfer rate (HSIODR = 1/TUI).
I
Input Waveforms
for the SSTL
Differential I/O
Standard
JJTAG Waveform
K——
L——
M——
N——
O——
VIL
VREF
VIH
VSWING
TDO
TCK
tJPZX tJPCO
tJSCO tJSXZ
tJPH
tJSH
tJPXZ
tJCP tJPSU_TMS
tJCL
tJCH
TDI
TMS
Signal
to be
Captured
Signal
to be
Driven
tJPSU_TDI
tJSZX
tJSSU
Chapter 2: Cyclone III LS Device Data Sheet 2–27
Glossary
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
PPLL Block
The following block diagram highlights the PLL specification parameters.
Q——
R
RLReceiver differential input discrete resistor (external to the Cyclone III LS device)
Receiver Input
Waveform
Receiver Input Waveform for LVDS and LVPECL Differential Standards
RSKM (Receiver
input skew
margin)
High-speed I/O Block: The total margin left after accounting for the sampling window and
TCCS. RSKM = (TUI – SW – TCCS) / 2
Table 2–39. Glossary (Part 2 of 5)
Letter Term Definitions
Core Clock
Phase tap
Reconfigurable in User Mode
Key
CLK
N
M
PFD VCOCP LF
CLKOUT Pins
GCLK
fINPFD
fINfVCO fOUT
fOUT_EXT
Switchover
Counters
C0..C4
Single-EndedWaveform
Differential Input Waveform
Positive Channel (p) = VIH
Negative Channel (n) = VIL
Ground
0 V
VCM
p - n
VID
VID
VID
2–28 Chapter 2: Cyclone III LS Device Data Sheet
Glossary
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
S
Single-ended
Voltage
referenced I/O
Standard
The JEDEC standard for SSTl and HSTL I/O standards defines both the AC and DC input signal
values.
■The AC values indicate the voltage levels at which the receiver must meet its timing
specifications.
■The DC values indicate the voltage levels at which the final logic state of the receiver is
unambiguously defined.
After the receiver input crosses the AC value, the receiver changes to the new logic state. The
new logic state is then maintained as long as the input stays beyond the DC threshold. This
approach is intended to provide predictable receiver timing in the presence of input waveform
ringing.
SW (Sampling
Window)
High-speed I/O Block: The period of time during which the data must be valid to capture it
correctly. The setup and hold times determine the ideal strobe position in the sampling
window.
T
tCHigh-speed receiver and transmitter input and output clock period.
TCCS (Channel-
to-channel-skew)
High-speed I/O Block: The timing difference between the fastest and slowest output edges,
including tCO variation and clock skew. The clock is included in the TCCS measurement.
tcin Delay from the clock pad to the I/O input register.
tCO Delay from the clock pad to the I/O output.
tcout Delay from the clock pad to the I/O output register.
tDUTY High-speed I/O Block: Duty cycle on the high-speed transmitter output clock.
tFALL Signal high-to-low transition time (80 to 20%).
tHInput register hold time.
Timing Unit
Interval (TUI)
High-speed I/O block: The timing budget allowed for skew, propagation delays, and the data
sampling window. (TUI = 1/(Receiver Input Clock Frequency Multiplication Factor) = tC/w).
tINJITTER Period jitter on the PLL clock input.
tOUTJITTER_DEDCLK Period jitter on the dedicated clock output driven by a PLL.
tOUTJITTER_IO Period jitter on the general purpose I/O driven by a PLL.
tpllcin Delay from the PLL inclk pad to the I/O input register.
tpllcout Delay from the PLL inclk pad to the I/O output register.
Table 2–39. Glossary (Part 3 of 5)
Letter Term Definitions
V
IH(AC)
V
IH(DC)
V
REF
V
IL(DC)
V
IL(AC)
V
OH
V
OL
V
CCIO
V
SS
Chapter 2: Cyclone III LS Device Data Sheet 2–29
Glossary
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Transmitter
Output Waveform
Transmitter output waveforms for the LVDS, mini-LVDS, PPDS, and RSDS differential I/O
standards
tRISE Signal low-to-high transition time (20–80%).
tSU Input register setup time.
U——
Table 2–39. Glossary (Part 4 of 5)
Letter Term Definitions
Single-Ended Waveform
Differential Waveform (Mathematical Function of Positive & Negative Channel)
Positive Channel (p) = VOH
Negative Channel (n) = VOL
Ground
VOD
VOD
VOD
0 V
Vos
p − n (1)
2–30 Chapter 2: Cyclone III LS Device Data Sheet
Glossary
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
V
VCM(DC) DC common mode input voltage.
VDIF(AC)
AC differential Input Voltage—The minimum AC input differential voltage required for
switching.
VDIF(DC)
DC differential Input Voltage—The minimum DC input differential voltage required for
switching.
VICM Input Common Mode Voltage—The common mode of the differential signal at the receiver.
VID
Input differential Voltage Swing—The difference in voltage between the positive and
complementary conductors of a differential transmission at the receiver.
VIH
Voltage Input High—The minimum positive voltage applied to the input that is accepted by
the device as a logic high.
VIH(AC) High-level AC input voltage.
VIH(DC) High-level DC input voltage.
VIL
Voltage Input Low—The maximum positive voltage applied to the input that is accepted by
the device as a logic low.
VIL (AC) Low-level AC input voltage.
VIL (DC) Low-level DC input voltage.
VIN DC input voltage.
VOCM
Output Common Mode Voltage—The common mode of the differential signal at the
transmitter.
VOD
Output differential Voltage Swing—The difference in voltage between the positive and
complementary conductors of a differential transmission at the transmitter. VOD = VOH – VOL.
VOH
Voltage Output High—The maximum positive voltage from an output that the device
considers will be accepted as the minimum positive high level.
VOL
Voltage Output Low—The maximum positive voltage from an output that the device considers
will be accepted as the maximum positive low level.
VOS Output offset voltage—VOS = (VOH + VOL) / 2.
VOX ( AC)
AC differential Output cross point voltage—The voltage at which the differential output signals
must cross.
VREF Reference voltage for the SSTL and HSTL I/O standards.
VREF (AC)
AC input reference voltage for the SSTL and HSTL I/O standards. VREF(AC)
= VREF(DC) + noise. The
peak-to-peak AC noise on VREF must not exceed 2% of VREF(DC).
VREF (DC) DC input reference voltage for the SSTL and HSTL I/O standards.
VSWING (AC)
AC differential Input Voltage—AC Input differential voltage required for switching. Refer to
Input Waveforms for the SSTL Differential I/O Standard.
VSWING (DC)
DC differential Input Voltage—DC Input differential voltage required for switching. Refer to
Input Waveforms for the SSTL Differential I/O Standard.
VTT Termination voltage for the SSTL and HSTL I/O standards.
VX ( AC)
AC differential Input cross point Voltage—The voltage at which the differential input signals
must cross.
W——
X——
Y——
Z——
Table 2–39. Glossary (Part 5 of 5)
Letter Term Definitions
Chapter 2: Cyclone III LS Device Data Sheet 2–31
Document Revision History
© December 2009 Altera Corporation Cyclone III Device Handbook, Volume 2
Document Revision History
Table 2–40 lists the revision history for this chapter.
Table 2–40. Document Revision History
Date Version Changes Made
December 2009 1.2
■Updated Ta ble 2– 19 through Table 2–34, Table 2–37, and Table 2–38.
■Updated the “Periphery Performance” on page 2–17 section.
■Minor changes to the text.
July 2009 1.1 Minor edit to the hyperlinks.
June 2009 1.0 Initial release.
2–32 Chapter 2: Cyclone III LS Device Data Sheet
Document Revision History
Cyclone III Device Handbook, Volume 2 © December 2009 Altera Corporation
