BAS316WS
200mW, High-speed switching SMD Diode
Small Signal Diode
Fast switching device(Trr<4.0nS)
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish
Pb free version, RoHS compliant
Min Max Min Max
Case : Flat lead SOD-323F small outline plastic package 1.15 1.40 0.045 0.055
2.30 2.80 0.091 0.106
0.25 0.40 0.010 0.016
1.60 1.80 0.063 0.071
0.80 1.10 0.031 0.043
0.05 0.15 0.002 0.006
Package
SOD-323F
SOD-323F
Maximum Ratings and Electrical Characteristics
Maximum Ratings
1 usec
1 msec
Operating Junction Temperature TJ150 °C
Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Ordering Information
Part No. Packing
TSTG
200
E
C
A
F
D
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
Unit (mm) Unit (inch)
Dimensions
B
SOD-323F
Features
Mechanical Data
A
Power Dissipation 250
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
High temperature soldering guaranteed: 260°C/10s
BAS316WS RR 3Kpcs / 7" Reel
Polarity : Indicated by cathode band
Weight : 4.6±0.5 mg
Marking Code : W2
Pin Configuration
Non-Repetitive Peak Forward Surge Current
Pulse Width= 4.0
BAS316WS RRG 3Kpcs / 7" Reel
IFSM 1.0
Suggested PAD Layout
UnitsValueSymbol
Rating at 25°C ambient temperature unless otherwise specified.
Type Number
Dimensions Unit (mm)
X 0.710
Storage Temperature Range
Average Forward Current mW
IO
PD
Pulse Width=
°C
-65 to + 150
mA
X12.900
Y 0.403
1
Y(2X)
(2X)
Version : A10