Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 4
1Publication Order Number:
NCP59300/D
NCP59300, NCV59300 Series
3.0 A, Very Low-Dropout
(VLDO) Fast Transient
Response Regulator series
The NCP59300 series are high precision, very low dropout
(VLDO), low ground current positive voltage regulators that are
capable of providing an output current in excess of 3.0 A with a typical
dropout voltage lower than 300 mV at 3.0 A load current. The devices
are stable with ceramic output capacitors. This series consists of fixed
voltage versions.
The NCP59300 series can withstand up to 18 V max input voltage.
Internal protection features consist of output current limiting,
built−in thermal shutdown and reverse output current protection.
Logic level enable and error flag pins are available on the 5−pin
version.
The NCP59300 series fixed voltage devices are available in
D2PAK−5 package, with devices in D2PAK−3 package planned in the
future.
Features
Output Current in Excess of 3.0 A
300 mV Typical Dropout Voltage at 3.0 A
Fixed Output Voltage Options
Low Ground Current
Fast Transient Response
Stable with Ceramic Output Capacitor
Logic Compatible Enable and Error Flag Pins
Current Limit, Reverse Current and Thermal Shutdown Protection
Operation up to 13.5 V Input Voltage
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
Applications
Consumer and Industrial Equipment Point of Regulation
Servers and Networking Equipment
FPGA, DSP and Logic Power supplies
Switching Power Supply Post Regulation
Battery Chargers
Functional Replacement for Industry Standard MIC29300,
MIC39300, MIC37300 Fixed Voltage Devices
MARKING DIAGRAMS
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
D2PAK 5
CASE 936A
59301−xx
AWLYWWG
y
D2PAK
CASE 936
59300−xx
AWLYWWG
y
TAB
TAB
EN
VIN
GND
VOUT
FLG
VIN
GND
VOUT
1
1
xx = Voltage Version
y = P (NCP), V (NCV)
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
D2PAK
D2PAK3
NCP59300, NCV59300 Series
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2
TYPICAL APPLICATIONS
Figure 1. Fixed 2.5 V Regulator with Error Flag
++
COUT
47 mF, Ceramic
100k
VIN
EN
VOUT
FLG
GND
VOUT = 2.5 V
CIN
VIN = 3.0 V NCP59301
Figure 2. Fixed 2.5 V Regulator in D2PAK−3 Package
++
COUT
47 mF, Ceramic
VIN VOUT
GND
VOUT = 2.5 V
CIN
VIN = 3.0 V NCP59300
PIN FUNCTION DESCRIPTION
Pin Number
D2PAK−5
Pin Number
D2PAK−3Pin Name Pin Function
1−EN Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low =
shutdown.
2 1 VIN Input voltage which supplies both the internal circuitry and the current to the output
load
3 2 GND Ground
TAB TAB TAB TAB is connected to ground.
4 3 VOUT Linear Regulator Output.
5−FLG Error Flag Open collector output.
Active−low indicates an output fault condition.
ABSOLUTE MAXIMUM RATINGS
Symbol Rating Value Unit
VIN Supply Voltage 0 to 18 V
VEN Enable Input Voltage 0 to 18 V
VFLG Error Flag Open Collector Output Maximum Voltage 0 to 18 V
VOUT – VIN Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1) 0 to 6.5 V
PDPower Dissipation (Notes 2 and 3) Internally Limited
TJJunction Temperature –40 v TJ v +125 C
TSStorage Temperature –65 v TJ v +150 C
ESD Rating (Notes 4 and 5) Human Body Model
Machine Model
2000
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: All voltages are referenced to GND pin unless otherwise noted.
1. The ENABLE pin input voltage must be 0.8 V or VIN must be connected to ground potential.
2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout.
3. This protection is not guaranteed outside the Recommended Operating Conditions.
4. Devices are ESD sensitive. Handling precautions recommended..
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C)
ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C)
This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78.
NCP59300, NCV59300 Series
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3
RECOMMENDED OPERATING CONDITIONS (Note 6)
Symbol Rating Value Unit
VIN Supply Voltage 2.24 to 13.5 V
VEN Enable Input Voltage 0 to 13.5 V
VFLG Error Flag Open Collector Voltage 0 to 13.5 V
TJJunction Temperature –40 v TJ v +125 C
6. The device is not guaranteed to function outside it’s Recommended operating conditions.
ELECTRICAL CHARACTERISTICS
(TJ = 25C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted.)
Parameter Conditions Min Typ Max Unit
Output Voltage Accuracy IL = 10 mA −1.5 +1.5 %
10 mA < IOUT < 3 A , VOUT nominal + 1 v VIN v 13.5 V −2.5 +2.5 %
Output Voltage Line Regulation VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA 0.02 0.5 %
Output Voltage Load Regulation IL = 10 mA to 3 A 0.2 1 %
VIN – VOUT Dropout Voltage
(Note 7)
IL = 1.5 A 175 350 mV
IL = 3 A 300 500 mV
Ground Pin Current (Note 8) IL = 3 A 60 90
120
mA
Ground Pin Current in Shutdown VEN v 0.5 V 1.0 5 mA
Overload Protection Current Limit VOUT = 0 V 3.5 5A
Output Voltage Start−up Slope VEN = VIN, IOUT = 10 mA, COUT = 47 mF (Note 9) 40 200 ms/V
ENABLE INPUT
Enable Input Signal Levels Regulator enable 1.8 V
Regulator shutdown 0.8 V
Enable pin Input Current VEN v 0.8 V (Regulator shutdown) 2
4
mA
6.5 V > VEN w 1.8 V (Regulator enable) 1 15 30
40
mA
FLAG OUTPUT
Iflg(leak) Voh = 6 V 1
2
mA
VFLG(LO)VIN = 2.24 V, IFLG = 250 mA210 400
500
mV
VFLG Low Threshold, % of VOUT 93 95 %
Hysteresis 2 %
High Threshold, % of VOUT 97 99.2 %
7. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. For output voltages below 1.74 V, dropout
voltage specification does not apply due to a minimum input operating voltage of 2.24 V.
8. IIN = IGND + IOUT
.
9. Fixed Voltage Device Start−up Time = Output Voltage Start−up Slope x VOUT Nominal.
Package Conditions / PCB Footprint Thermal Resistance
D2PAK–3, Junction−to−Case RqJC = 2.1C/W
D2PAK–5, Junction−to−Case RqJC = 2.1C/W
D2PAK–3, Junction−to−Air PCB with 100 mm2 2.0 oz Copper Heat Spreading Area RqJA = 52C/W
D2PAK–5, Junction−to−Air PCB with 100 mm2 2.0 oz Copper Heat Spreading Area RqJA = 52C/W
NCP59300, NCV59300 Series
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4
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
PSRR (dB)
FREQUENCY (Hz)
Figure 3. Power Supply Rejection Ratio
COUT = 100 mF
Ceramic
COUT = 47 mF
Ceramic
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 3 A,
CIN = 0 0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10k 100k 1M
PSRR (dB)
FREQUENCY (Hz)
Figure 4. Power Supply Rejection Ratio
COUT = 100 mF
Ceramic
COUT = 47 mF
Ceramic
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 1 A,
CIN = 0
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10k 100k 1M
DROPOUT (
m
V)
OUTPUT CURRENT (A)
0
50
100
150
200
250
300
350
400
450
500
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Figure 5. Dropout Voltage vs. Output Current
VOUTnom = 2.5 V
0
50
100
150
200
250
300
350
400
450
−50 −30 −10 10 30 50 70 90 110 13
0
DROPOUT (mV)
Figure 6. Dropout Voltage vs. Temperature
VOUTnom = 2.5 V
IOUT = 3 A
OUTPUT VOLTAGE (V)
SUPPLY VOLTAGE (V)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
Figure 7. Dropout Characteristics (2.5 V)
10 mA
3 A
1 A
2 A
TEMPERATURE (C)
2.5
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
00.511.522.533.544.55
Figure 8. Ground Current vs. Supply Voltage
(2.5 V)
10 mA
2
1.5
1
0.5
0
NCP59300, NCV59300 Series
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5
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
0
20
40
60
80
100
120
140
012345
Figure 9. Ground Current vs. Supply Voltage
(2.5 V)
3 A
1 A
2 A
GROUND CURRENT (mA)
Figure 10. Ground Current vs. Temperature
1.4
1.2
1
0.8
0.6
0.4
0.2
0
−50 −30 −10 10 30 50 70 90 110 130
TEMPERATURE (C)
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 10 mA
GROUND CURRENT (mA)
0
5
10
15
20
25
30
35
40
Figure 11. Ground Current vs. Temperature
−50 −30 −10 10 30 50 70 90 110 130
TEMPERATURE (C)
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 1.5 A
GROUND CURRENT (mA)
0
10
20
30
40
50
60
70
80
90
−50 −30 −10 10 30 50 70 90 110 130
Figure 12. Ground Current vs. Temperature
TEMPERATURE (C)
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 3 A
OUTPUT VOLTAGE (V)
2.6
−50 −30 −10 10 30 50 70 90 110 130
2.55
2.5
2.45
2.4
Figure 13. Output Voltage vs. Temperature
TEMPERATURE (C)
VOUTNOM = 2.5 V
IOUT = 10 mA
0
2
4
6
8
10
12
14
16
18
20
22
Figure 14. Enable Pin Input Current vs.
Temperature
TEMPERATURE (C)
−50 −30 −10 10 30 50 70 90 110 130
ENABLE CURRENT (mA)
VEN = 6.5 V
VEN = 1.8 V
NCP59300, NCV59300 Series
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6
FUNCTIONAL CHARACTERISTICS
Figure 15. Load Transient Response
Figure 16. Line Transient Response
Figure 17. Enable Transient Response
NCP59300, NCV59300 Series
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7
APPLICATIONS INFORMATION
Output Capacitor and Stability
The NCP59300 series requires an output capacitor for
stable operation. The NCP59300 series is designed to
operate with ceramic output capacitors. The recommended
output capacitance value is 47 mF or greater. Such capacitors
help to improve transient response and noise reduction at
high frequency.
Input Capacitor
An input capacitor of 1.0 mF or greater is recommended
when the device is more than 4 inches away from the bulk
supply capacitance, or when the supply is a battery. Small,
surface−mount chip capacitors can be used for the
bypassing. The capacitor should be place within 1 inch of
the device for optimal performance. Larger values will help
to improve ripple rejection by bypassing the input of the
regulator, further improving the integrity of the output
voltage.
Minimum Load Current
The NCP59300 regulator is specified between finite
loads. A 10 mA minimum load current is necessary for
proper operation.
Error Flag
Some NCP59300 series members feature an error flag
circuit that monitors the output voltage and signals an error
condition when the voltage is 5% below the nominal output
voltage. The error flag is an open−collector output that can
sink up to 5 mA typically during a VOUT fault condition.
The FLG output is overload protected when a short circuit
of the pullup load resistor occurs in the application. This is
guaranteed in the full range of FLG output voltage Max
ratings (see Max Ratings table). Please be aware operation in
this mode is not recommended, power dissipated in the device
can impact on output voltage precision and other device
characteristics.
Enable Input
Some NCP59300 series members also feature an enable
input for on/off control of the device. It’s shutdown state
draws “zero” current from input voltage supply (only
microamperes of leakage). The enable input is TTL/CMOS
compatible for simple logic interface, but can be connected
up to VIN.
Overcurrent and Reverse Output Current Protection
The NCP59300 regulator is fully protected from damage
due to output current overload conditions. When NCP59300
output is overloaded, Output Current limiting is provided.
This limiting is linear; output current during overload
conditions is constant. These features are advantageous for
powering FPGAs and other ICs having current consumption
higher than nominal during their startup.
Thermal shutdown disables the NCP59300 device when
the die temperature exceeds the maximum safe operating
temperature.
When NCP59300 is disabled and (VOUT – VIN) voltage
difference is less than 6.5 V in the application, the output
structure of these regulators is able to withstand output
voltage (backup battery as example) to be applied without
reverse current flow. Of course the additional current
flowing through the Feedback resistor divider inside the
NCP59300 Fixed voltage devices (30 mA typically at
nominal output voltage) needs to be included in the backup
battery discharging calculations.
Thermal Considerations
The power handling capability of the device is limited by
the maximum rated junction temperature (125C). The PD
total power dissipated by the device has two components,
Input to output voltage differential multiplied by Output
current and Input voltage multiplied by GND pin current.
PD+ǒVIN *VOUTǓ@IOUT )VIN @IGND (eq. 1)
The GND pin current value can be found in Electrical
Characteristics table and in Typical Characteristics graphs.
The Junction temperature TJ is
TJ+TA)PD@RqJA (eq. 2)
where TA is ambient temperature and RqJA is the Junction to
Ambient Thermal Resistance of the NCP/NCV59300
device mounted on the specific PCB.
To maximize efficiency of the application and minimize
thermal power dissipation of the device it is convenient to
use the Input to output voltage differential as low as possible.
The static typical dropout characteristics for various
output voltage and output current can be found in the Typical
Characteristics graphs.
NCP59300, NCV59300 Series
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8
ORDERING INFORMATION
Device
Output
Current
Output
Voltage Junction Temp. Range Package Shipping†
NCP59300DS18R4G 3.0 A 1.8 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS25R4G 3.0 A 2.5 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS28R4G 3.0 A 2.8 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS30R4G 3.0 A 3.0 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS33R4G 3.0 A 3.3 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS50R4G 3.0 A 5.0 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS18R4G* 3.0 A 1.8 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS25R4G* 3.0 A 2.5 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS28R4G* 3.0 A 2.8 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS30R4G* 3.0 A 3.0 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS33R4G* 3.0 A 3.3 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS50R4G* 3.0 A 5.0 V −40C to +125C D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59301DS18R4G 3.0 A 1.8 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS25R4G 3.0 A 2.5 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS28R4G 3.0 A 2.8 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS30R4G 3.0 A 3.0 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS33R4G 3.0 A 3.3 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS50R4G 3.0 A 5.0 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS18R4G* 3.0 A 1.8 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS25R4G* 3.0 A 2.5 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS28R4G* 3.0 A 2.8 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS30R4G* 3.0 A 3.0 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS33R4G* 3.0 A 3.3 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS50R4G* 3.0 A 5.0 V −40C to +125C D2PAK−5
(Pb−Free)
800 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
NCP59300, NCV59300 Series
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9
PACKAGE DIMENSIONS
D2PAK
CASE 936−03
ISSUE D
5 REF5 REF
V
U
TERMINAL 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B0.356 0.368 9.042 9.347
C0.170 0.180 4.318 4.572
D0.026 0.036 0.660 0.914
E0.045 0.055 1.143 1.397
F0.051 REF 1.295 REF
G0.100 BSC 2.540 BSC
H0.539 0.579 13.691 14.707
J0.125 MAX 3.175 MAX
K0.050 REF 1.270 REF
L0.000 0.010 0.000 0.254
M0.088 0.102 2.235 2.591
N0.018 0.026 0.457 0.660
P0.058 0.078 1.473 1.981
R
S0.116 REF 2.946 REF
U0.200 MIN 5.080 MIN
V0.250 MIN 6.350 MIN
__
A
12 3
K
F
B
J
S
H
D
M
0.010 (0.254) T
E
OPTIONAL
CHAMFER
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.380
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.490
3.504
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
TOP VIEW
SIDE VIEW
DUAL GAUGE
BOTTOM VIEW
L
T
P
RDETAIL C
SEATING
PLANE
2X
G
NM
CONSTRUCTION
D
C
DETAIL C
E
OPTIONAL
CHAMFER
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
S
C
DETAIL C
TT
D
E0.018 0.026 0.457 0.660
S
NCP59300, NCV59300 Series
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10
PACKAGE DIMENSIONS
5 REF
A
123
K
B
S
H
D
G
C
E
ML
P
N
R
V
U
TERMINAL 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B0.356 0.368 9.042 9.347
C0.170 0.180 4.318 4.572
D0.026 0.036 0.660 0.914
E0.045 0.055 1.143 1.397
G0.067 BSC 1.702 BSC
H0.539 0.579 13.691 14.707
K0.050 REF 1.270 REF
L0.000 0.010 0.000 0.254
M0.088 0.102 2.235 2.591
N0.018 0.026 0.457 0.660
P0.058 0.078 1.473 1.981
R5 REF
S0.116 REF 2.946 REF
U0.200 MIN 5.080 MIN
V0.250 MIN 6.350 MIN
__
45
M
0.010 (0.254) T
−T−
OPTIONAL
CHAMFER
8.38
0.33
1.016
0.04
16.02
0.63
10.66
0.42
3.05
0.12
1.702
0.067
5−LEAD D2PAK
SCALE 3:1 ǒmm
inchesǓ
D2PAK 5
CASE 936A−02
ISSUE C
SOLDERING FOOTPRINT
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Phone: 81−3−5817−1050
NCP59300/D
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Mouser Electronics
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ON Semiconductor:
NCP59301DS50R4G NCV59301DS25R4G NCP59301DS18R4G NCV59301DS28R4G NCP59301DS33R4G
NCP59301DS30R4G NCP59301DS25R4G NCP59301DS28R4G NCV59301DS18R4G NCV59301DS50R4G
NCV59301DS30R4G NCV59301DS33R4G
