
2007-08-30
Rev. 3.0 Page 2
SPP20N65C3, SPA20N65C3
SPI20N65C3
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope
VDS = 480 V, ID = 20.7 A, Tj = 125 °C
dv/dt50 V/ns
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 0.6 K/W
Thermal resistance, junction - case, FullPAK RthJC
FP - - 3.6
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA
FP - - 80
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 3)
RthJA
-
-
-
35
62
-
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s
Tsold - - 260 °C
Electrical Characteristics, at T
=25°C unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 650 - - V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=7A - 730 -
Gate threshold voltage VGS
th
ID=1000µA, VGS=VD
2.1 3 3.9
Zero gate voltage drain current IDSS VDS=600V, VGS=0V,
Tj=25°C
Tj=150°C
-
-
0.1
-
1
100
µA
Gate-source leakage current IGSS VGS=20V, VDS=0V - - 100 nA
Drain-source on-state resistance RDS(on) VGS=10V, ID=13.1A
Tj=25°C
Tj=150°C
-
-
0.16
0.43
0.19
-
Ω
Gate input resistance RGf=1MHz, open drain - 0.54 -
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