T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 1 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
Availa ble on
commercial
versions
Silicon MELF 500 mW Zener Diodes
Qualified per MIL-PRF-19500/127
Qualified Levels:
JAN, JANTX, and
JANTXV
DESCRIPTION
This popular series of 500 mW Zener voltage regulators provides a selection from 2.4 to 12
volts in a standard 5% tolerance as wel l as available tighter 2% and 1% tolerances. These
glass, surface mount DO-213AA Zeners feature an int ernal m etal lurgical bond and are military
qualified to the JAN, JANTX, and JANTXV level. A RoHS compliant commercial grade only
version is also avai lab le.
DO-213AA MELF
Package
Also available in:
DO-35 (DO-204AH)
package
(axial-leaded)
1N746A-1 –
1N759A-1 and 1N4370A-1 –
1N4372A-1
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• JEDEC registered 1N746 through 1N759A and 1N4370 through 1N4372A series.
• Standard voltage tolerance is ± 5% with optional tighter tolerances of ± 2% or 1%.
• Interna l meta llurg ic al bond.
• JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/127.
(See part nomenclature for all available options.)
• RoHS compliant versions available (comme rci al gr ade only) .
• These commercial surface mount equivalents were also previously identified with a CDLL or MLL
prefix instead of the "1N" prefix.
APPLICATIONS / BENEFITS
• Regulates voltage over a broad range of temperature and current.
• Regulated voltage range fro m 2.4 to 12 V.
• Small size for high density mounting using the surface mount method (see package illustration).
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Minimal capacitance.
• Inherently radiation hard as described in Micros emi MicroNote 050.
MAXIMUM RATINGS
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Operating and Storage Temperature
TJ and TSTG
-65 to +175
ºC
Thermal Resi stan ce Jun cti on-to-End Cap
RӨJEC
100
ºC/W
Thermal Resi stan ce Jun cti on-to-Ambient when
mounted on PCB
(1)
R
ӨJA
300
ºC/W
Average Rated Power Dissipation
@ TEC = +125°C (2)
@ TA = 55°C mounted on PCB
PM(AV)
0.5
0.4
W
Forward Voltage @ IF = 200 mA
VF
1.1
V
Solder Temperature @ 10 s
260
oC
NOTES: 1. See Figure 1 for derating curves. TA = +7 5 °C on an FR4 PC board with 1 oz copper metalizati on.
2. The 0.5 W linearly derates starting at TEC = 125 °C and goes to zero at 175 °C. For ambient TA
conditi on on a typical PC board, it linearly derates from 400 mW starting at 55 °C and goes to zero at
175 °C (see Figure2).
T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 2 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
MECHANICAL and PACKAGING
• CASE: Hermetically sealed glass case package.
• TERMINALS: Tin/lead plated or RoHS compliant matte-tin (on commercial grade only) over copper clad steel. Solderable per
MIL-STD-750, method 2026.
• POLARITY: Cathode end is banded.
• MOUNTING: The axial coefficient of expansion (COE) of this device is approximately +6PPM/°C. The COE of the mounting
surface system should be selected to provide a suitable match with this device.
• MARKING: Part number.
• TAPE & REEL option: Standard per EIA-296. Consult factory for quantities.
• WEIGHT: Approximately 0.04 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
JAN 1N746 A UR -1 (e3)
JAN = JAN leve l
JANTX = JANTX level
JANTXV = JANTXV level
Blank = Commercial
JEDEC type number
(see Electrical Characteristics
table)
Zener Voltage Tolerance
A = 5%
C = 2%
RoHS Compli ance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
Metallurgically Bonded
Surface Mount Package type
SYMBOLS & DEFINITIONS
Symbol
Definition
IR
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
I
Z
, I
ZT
, I
ZK
Regulator Current: The dc regulator current (I
Z
), at a specified test point (I
ZT
), near breakdown knee (I
ZK
).
IZM
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
IZSM
Maximum Zener Surge Current: The non-repetitive peak value of Zener surge current at a specified wave form.
VF
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
VR
Reverse Voltage: The reverse voltage dc value, no alternating component.
VZ
Zener Voltage: The Zener voltage the device will exhibit at a specified current (IZ) in its breakdown region.
ZZT or ZZK Dynamic Impedance: The small signal impedance of the diode when biased to operate in its breakdown region at a
specified rms curre nt modulation (ty pi cally 10% of IZT or IZK) and superim pos ed on IZT or IZK respectively.
T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 3 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
ELECTRICAL CHARACTERISTICS @ 25 ºC
JEDEC
TYPE NO.
(NOTE 1)
NOMINAL
ZENER
VOLTAGE
VZ @ IZT
(NOTE 2)
MAXIMUM
ZENER
IMPEDANCE
ZZT @ IZT
(NOTE 3)
REVERSE
VOLTAGE
VR
MAXIMUM REVERSE
CURRENT
IR @ VR
MAXIMUM
ZENER
CURRENT
IZM
(NOTE 4)
TEMPERATURE
COEFFICIENT
OF ZENER
VOLTAGE
αVZ
@ 25 °C
@ +150 °C
Volts
Ohms
Volts
µA
µA
mA
% / °C
1N4370A-1
1N4371A-1
1N4372A-1
2.4
2.7
3.0
30
30
29
1.0
1.0
1.0
100
60
30
200
150
100
155
140
125
-0.085
-0.080
-0.075
1N746A-1
1N747A-1
1N748A-1
3.3
3.6
3.9
24
22
20
1.0
1.0
1.0
5
3
2
30
30
30
120
110
100
-0.070
-0.065
-0.060
1N749A-1
1N750A-1
1N751A-1
1N752A-1
4.3
4.7
5.1
5.6
18
15
14
8
1.0
1.5
2.0
2.5
2
5
5
5
50
50
50
50
90
85
75
70
-0.055 / +.020
-0.043 / +.025
-0.030 / +.030
-0.028 / +.036
1N753A-1
1N754A-1
1N755A-1
1N756A-1
6.2
6.8
7.5
8.2
3
3
4
5
3.5
4.0
5.0
6.0
5
2
2
1
50
50
50
50
65
60
55
50
+0.045
+0.050
+0.058
+0.062
1N757A-1
1N758A-1
1N759A-1
9.1
10.0
12.0
6
7
10
7.0
8.0
9.0
1
1
1
50
50
50
45
40
35
+0.068
+0.076
+0.080
NOTES:
1 The JEDEC type numbers shown (A suffix) have a ± 5% tolerance on nominal Zener voltage.
2. Volt age meas urem ents to be performed 20 seconds after applicat i on of dc test current.
3. Zener impedance derived by superimposing on IZT, a 60 cps, rms current equal to 10% IZT (20 mA). See Mic roNot e 202 for t ypical Zener
Impedance variation with different operating currents.
4. Allowance has been made for the increase i n VZ due to ZZ and for the increase in junction temperature as t he uni t approaches t herm al
equilibrium at t he power dissipation of 400mW.
T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 4 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
GRAPHS
TEC (ºC) (End Cap)
FIGURE 1
Temperature-Power Derating Curve
T(PCB) (ºC) (PCB)
FIGURE 2
Temperature-Power Derating Curve
DC Operations Maximum Rating (mW)
DC Operations Maximum Rating (mW)
T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 5 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
GRAPHS (continued)
Time (s)
FIGURE 3
Thermal Impedance To End Cap
Theta (°C/W)
T4-LDS-0288-1, Rev. 1 (5/23/13) ©2013 Microsemi Corporation Page 6 of 6
1N746AUR-1 – 1N759AUR-1,
1N4370AUR-1 – 1N4372AUR-1
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches. Mill imeters are given for information only.
2. Dimensions are pre-solder dip.
3. Referencing to dimension S, minimum clearance of glass body to mounting surface on all orientations.
4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
PAD LAYOUT
DIM
INCH
MILLIMETERS
MIN
MAX
MIN
MAX
BD
0.063
0.067
1.60
1.70
BL
0.130
0.146
3.30
3.71
ECT
0.016
0.022
0.41
0.56
S
0.001 min
0.03 min
INCH
mm
A
0.200
5.08
B
0.055
1.40
C
0.080
2.03