Product Name Chip Beads
Series MPZ Series
Type 2012 Type
Part Number MPZ2012S300AT000
Product Lifecycle Stage PROD
Specification
Mounting Method Flag Yes
Processing MULTI-LAYER
Shape Chip
Number of Circuits Nom 1
Material Code S
Size Code 2012
Body Length(L) Nom 2 m m
Body Breadth(W) Nom 1.25 m m
Body Height(T) Nom 0.85 m m
Impedance Min 20 Ohm
Impedance Nom 30 Ohm
Impedance Tolerance Min -33 %
Max 33 %
Frequency of Impedance Nom 100 M Hz
Rated Current Max
5
A
DC Resistance Max 0.01 Ohm
Soldering Method Reflow,Iron Soldering
Category Temperature
Range
Min -55 Cel
Max 125 Cel
Storage Temperature Range Min -55 Cel
Max 125 Cel
Weight Nom 0.008 g
Summary/Applications/Feature
Summary
The MPZ series provide effective EMC
suppression in signal lines through simple in-
series implementation. It is applicable for lead
free soldering.
Applications PC,DVD,CDMA,LCD,Video game
Feature
The MPZ series provide effective EMC
suppression in signal lines through simple in-
series implementation.
It is applicable for lead free soldering.
Packaging
Packing Punched (Paper)Taping
[180mm Reel]
Minumum Package Qty Nom 4000 Pcs
Minimum Order Qty Nom 4000 Pcs
[ Caution ]
Specifications which provide more details for the proper
and safe use of the described product are available upon request.
[ Notice of Revision and Improve ]
Copyright(c) 1996-2008 All rights reserved.
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