Page 1 of 1 Product Name Series Type Part Number Chip Beads MPZ Series 2012 Type MPZ2012S300AT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip Number of Circuits Nom Summary 1 Material Code S Size Code 2012 Nom 2m m Body Breadth(W) Nom 1.25 m m Body Height(T) Nom 0.85 m m Impedance Min Impedance 20 Ohm Nom 30 Ohm Min -33 % Max 33 % Frequency of Impedance Nom 100 M Hz Rated Current Max 5 A DC Resistance Max 0.01 Ohm Impedance Tolerance Soldering Method Category Temperature Range Storage Temperature Range Weight Applications PC,DVD,CDMA,LCD,Video game Feature Body Length(L) The MPZ series provide effective EMC suppression in signal lines through simple inseries implementation. It is applicable for lead free soldering. The MPZ series provide effective EMC suppression in signal lines through simple inseries implementation. It is applicable for lead free soldering. Packaging Punched (Paper)Taping [180mm Reel] Packing Minumum Package Qty Nom 4000 Pcs Minimum Order Qty 4000 Pcs Nom Reflow,Iron Soldering Min -55 Cel Max 125 Cel Min -55 Cel Max 125 Cel Nom 0.008 g [ Caution ] Specifications which provide more details for the proper and safe use of the described product are available upon request. [ Notice of Revision and Improve ] All specifications are subject to change without notice. Copyright(c) 1996-2008 All rights reserved. http://roots.tdk.co.jp/rootsme.asp?ID=TJA102&NO=MPZ2012S300AT000262... 3/27/2009