MEMORY SPECTRUM
Product Information 2004
Never stop thinking.
www.infineon.com/memory
www.infineon.com/memory/flash
2
APRIL 2004. This edition of Memory Spectrum has been developed
to enable you to easily view the entire range of Infineon’s memory products.
For more related product information and the latest datasheets, please visit
our websites: www.infineon.com/memory and www.infineon.com/memory/flash.
DDR400 Components and DIMMs (PC3200)
2 GB DDR2 Unbuffered DIMM
4 GB DDR2 Registered DIMM
16 Mb and 32 Mb CellularRAM
512 Mb Mobile-RAM
“Green**”, DRAM Components and Modules
512 Mb and 1 Gb TwinNAND Components
SD Cards / MultiMediaCards
Introduction
64 MB 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB
Unbuffered DDR ++++
Registered DDR ++++
Registered DDR Reduced Height +++++
SO-DIMM DDR ++++
Unbuffered DDR2 ++++
Registered DDR2 + ++++
SO-DIMM DDR2 ++++
** Lead & Halogen-Free
RLDRAM™ and CellularRAM™ are registered trademarks of Infineon Technologies AG. TwinFlash™is
a trademark of Infineon Technologies AG, based on Saifun NROM technology.
64 MB 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB
Unbuffered SDR + + +
Registered SDR ++++
SO-DIMM SDR + + +
Technology and Trends
As a leading memory products
supplier, Infineon continues to
expand its portfolio with the
recent introduction of:
DRAM Components
Double Data Rate (DDR / DDR2)
and Single Data Rate (SDR).
Synchronous Dynamic Random
Access Memory.
DRAM Modules
Double Data Rate (DDR / DDR2),
Dual Inline Memory Modules
(DIMMs).
Single Data Rate (SDR), Dual Inline
Memory Modules (DIMMs).
Flash Components
Thin Small Outline Package (TSOP).
Flash Cards
MultiMediaCards and SD Cards.
16 Mb 32 Mb 128 Mb 256 Mb 512 Mb 1 Gb
DDR DRAMs + + +
DDR2 DRAMs + + +
SDR DRAMs + + +
Reduced Latency (RLDRAM™)+
Graphics RAM + +
Mobile-RAM + + +
CellularRAM™++
64 MB 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB
MultiMediaCards + + +
SD Cards + + +
64 Mb 128 Mb 256 Mb 512 Mb 1 Gb 2 Gb 4 Gb
TwinFlash™++
DRAM Components
DDR Components
DDR2 Components
SDR Components
DRAM Modules
DDR Modules
DDR2 Modules
SDR Modules
Specialty DRAMs
Flash
4–8
5–6
7
8
9–20
10–14
15–17
18–20
21 – 24
25 – 26
Content
3
DRAM Components
Speed/Performance 3 = DDR2-667 4-4-4 (DDR2)
3.7 = DDR2-533 4-4-4 (DDR2)
5 = DDR2-400 3-3-3 /DDR400B 3-3-3 (DDR2/DDR)
6 = DDR333 2.5-3-3 /PC166 3-3-3 (DDR/SDR)
7 = DDR266A 2-3-3/PC133 2-2-2 (DDR/SDR)
7F = DDR266 2-2-2 (DDR)
7.5 = DDR266B 2.5-3-3 /PC133 3-3-3 (DDR/SDR)
8 = DDR200 2-2-2 /PC100 2-2-2 (DDR/SDR)
Power none = Standard Power
L = Low-Power Product
Package C = FBGA Contains Lead
T = TSOP 400 mil Contains Lead
E = TSOP 400 mil Lead and Halogen-Free (ROHS*-compliant)
F = FBGA Lead and Halogen-Free (ROHS*-compliant)
G = TSOP stack Lead and Halogen-Free (ROHS*-compliant)
Product Revision Die Revision
Product Variation 0 = Standard Product
Organization 40 = x 4
80 = x 8
16 = x 16
Memory Density 128 = 128 Mb
256 = 256 Mb
512 = 512 Mb
1G = 1024 Mb
Memory Type S = SDR Single Data Rate SDRAM
D = DDR Double Data Rate SDRAM
T = DDR2 Double Data Rate 2 SDRAM
Supply Voltage 39 = 3.3 V
25 = 2.5 V
18 = 1.8 V
Prefix HYB = Memory Components
* ROHS = Restriction Of Hazardous Substances
HYB 25 D 128 80 0 C T - 6 (Example)
4
DRAM Modules Specialty DRAMs Flash
4
Nomenclature DRAM Components
DRAM Components
DRAM Modules
Specialty DRAMsFlash DRAM Components
5
DDR Components
Generation Organization Package Speed Latency Sales Description Speed No. Ordering Code Prod. Green
128 Mb DDR266A 2-3-3 HYB25D128400AT- 7 Q67100 Q4309 Now
32 M x 4 TSOP-66 (400 mil) DDR333 2.5-3-3 HYB25D128400CE- 6 Q67100 Q1455 2Q04 XX
DDR266A 2-3-3 HYB25D128800AT- 7 Q67100 Q4311 Now
16 M x 8 TSOP-66 (400 mil) DDR333 2.5-3-3 HYB25D128800CE- 6 Q67100 Q1459 2Q04 XX
DDR266A 2-3-3 7 Q67100 Q4313
8 M x 16 TSOP-66 (400 mil) DDR333 2.5-3-3
HYB25D128160AT- 6Q67100 Q5044
Now
DDR333 2.5-3-3 HYB25D128160CE- 6 Q67100 Q1458 2Q04 XX
256 Mb DDR266A 2-3-3 7 Q67100 Q4587
64 M x 4 TSOP-66 (400 mil) DDR266 2-2-2
HYB25D256400BT-
7F Q67100 Q4880
Now
DDR266A 2-3-3 HYB25D256400CE- 7 Q67100 Q5049 Now XX
DDR333 2.5-3-3 6 Q67100 Q4589 Now
DDR400 3-3-3
HYB25D256800BT- 5 Q67100 Q4275
32 M x 8 TSOP-66 (400 mil) DDR333 2.5-3-3 HYB25D256800CE- 6 Q67100 Q5051 Now XX
DDR333 2.5-3-3 HYB25D256800CEL- 6 Q67100 Q1753 Now XX
DDR400 3-3-3 HYB25D256800CE- 5 Q67100 Q5180 Now XX
DDR266A 2-3-3 7 Q67100 Q4593
DDR333 2.5-3-3 HYB25D256160BT- 6 Q67100 Q4592 Now
16 M x 16 TSOP-66 (400 mil) DDR400 3-3-3 5 Q67100 Q4277
DDR333 2.5-3-3 6 Q67100 Q5045 Now XX
DDR400 3-3-3 HYB25D256160CE- 5 Q67100 Q5182 Now XX
256 Mb DDR266A 2-3-3 7 Q67100 Q4615
FBGA DDR333 2.5-3-3 HYB25D256400BC- 6 Q67100 Q4614 Now
64 M x 4 FBGA 60 (8 x 12 mm) DDR400 3-3-3 5 Q67100 Q1071
DDR333 2.5-3-3 6 Q67100 Q4764
DDR400 3-3-3 HYB25D256400CC- 5 Q67100 Q1418 2Q04
DDR266A 2-3-3 7 Q67100 Q4596
Now
DDR333 2.5-3-3 HYB25D256800BC- 6 Q67100 Q4595
32 M x 8 FBGA 60 (8 x 12 mm) DDR333 2.5-3-3 HYB25D256800CF- 6 Q67100 Q4443 2Q04 XX
DDR333 2.5-3-3 6 Q67100 Q4767
DDR400 3-3-3 HYB25D256800CC- 5 Q67100 Q1419
2Q04
DDR266A 2-3-3 7 Q67100 Q4599 Now
16 M x 16 FBGA 60 (8 x 12 mm) DDR333 2.5-3-3 HYB25D256160BC- 6 Q67100 Q4598
DDR333 2.5-3-3 HYB25D256160CC- 6 Q67100 Q4770 2Q04
XX = Lead and Halogen-Free
DRAM Modules Specialty DRAMsDRAM Components
XX = Lead and Halogen-Free
6
DDR Components
Generation Organization Package Speed Latency Sales Description Speed No. Ordering Code Prod. Green
512 Mb DDR266A 2-3-3 HYB25D512400AT- 7 Q67100 Q4413 Now
128 M x 4 TSOP-66 (400 mil) HYB25D512400BE- 7 Q67100 Q5202
256 M x 4 TSOP stack (400 mil) DDR266A 2-3-3 HYB25D1G400BG- 7 On request Now XX
DDR266A 2-3-3 7 Q67100 Q4412
64 M x 8 TSOP-66 (400 mil) DDR333 2.5-3-3
HYB25D512800AT-
6 Q67100 Q4415 Now
DDR333 2.5-3-3 6 Q67100 Q5205
DDR400 3-3-3
HYB25D512800BE-
5 Q67100 Q5204 Now XX
DDR266A 2-3-3 HYB25D512160AT- 7 Q67100 Q4411 Now
DDR333 2.5-3-3 HYB25D512160AT- 6 Q67100 Q4416 Now
32 M x 16 TSOP-66 (400 mil)
DDR333 2.5-3-3 6 Q67100 Q5209
DDR400 3-3-3
HYB25D512160BE-
5 Q67100 Q5208
Now XX
512 Mb DDR333 2.5-3-3 6 Q67100 Q1661
FBGA
128 M x 4 FBGA 60 (10 x 12 mm)
DDR400 3-3-3
HYB25D512400BC-
5 Q67100 Q1693
Now
DDR333 2.5-3-3 HYB25D512800BC- 6 Q67100 Q1663 Now
64 M x 8 FBGA 60 (10 x 12 mm) DDR333 2.5-3-3 HYB25D512800BF- 6 Q67100 Q5215 Now XX
DDR400 3-3-3 HYB25D512800BC- 5 Q67100 Q1451 Now
DDR400 3-3-3 HYB25D512800BF- 5 Q67100 Q1452 Now XX
DDR333 2.5-3-3 6 Q67100 Q1453
32 M x 16 FBGA 60 (10 x 12 mm)
DDR400 3-3-3
HYB25D512160BC-
5 Q67100 Q1454
Now
Flash
DRAM Modules
Specialty DRAMsFlash DRAM Components
7
Generation Organization Package Speed Latency Sales Description Speed No. Ordering Code Production Green
256 Mb DDR2 400 3-3-3 5 Q67100 Q1314
64 M x 4 PTFBGA-60
DDR2 533 4-4-4
HYB18T256400AC-
3.7 Q67100 Q1311
DDR2 400 3-3-3 5 Q67100 Q1322
32 M x 8 PTFBGA-60
DDR2 533 4-4-4
HYB18T256800AC-
3.7 Q67100 Q1320
3Q04
DDR2 400 3-3-3 5 Q67100 Q1301
16 M x 16 PTFBGA-84
DDR2 533 4-4-4
HYB18T256160AC-
3.7 Q67100 Q1293
512 Mb DDR2 400 3-3-3 5 Q67100 Q1350
128 M x 4 PTFBGA-60
DDR2 533 4-4-4
HYB18T512400AC-
3.7 Q67100 Q1349
DDR2 400 3-3-3 5 Q67100 Q1354
64 M x 8 PTFBGA-60
DDR2 533 4-4-4
HYB18T512800AC-
3.7 Q67100 Q1352
2Q04
DDR2 400 3-3-3 5 Q67100 Q1347
32 M x 16 PTFBGA-84
DDR2 533 4-4-4
HYB18T512160AC-
3.7 Q67100 Q1346
1Gb DDR2 400 3-3-3 5 Q67100 Q1619
256 M x 4 PTFBGA-68
DDR2 533 4-4-4
HYB18T1G400AC-
3.7 Q67100 Q1618
DDR2 400 3-3-3 5 Q67100 Q1622
128 M x 8 PTFBGA-68
DDR2 533 4-4-4
HYB18T1G800AC-
3.7 Q67100 Q1621
3Q04
DDR2 400 3-3-3 5 Q67100 Q1625
64 M x 16 PTFBGA-92
DDR2 533 4-4-4
HYB18T1G160AC-
3.7 Q67100 Q1624
DDR2 Components
DRAM Modules Specialty DRAMs FlashDRAM Components
8
Generation Organization Package Speed Latency Sales Description Speed No. Ordering Code Production Green
128 Mb 32 M x 4 TSOP-54 (400 mil) PC133 2-2-2 HYB39S128400CT- 7 Q67100 Q4101
16 M x 8 TSOP-54 (400 mil) PC133 2-2-2 HYB39S128800CT- 7 Q67100 Q4107 Now
8 M x 16 TSOP-54 (400 mil) PC133 2-2-2 HYB39S128160CT- 7 Q67100 Q4113
256 Mb 64 M x 4 TSOP-54 (400 mil) PC133 2-2-2 HYB39S256400DT- 7 Q67100 Q4330
32 M x 8 TSOP-54 (400 mil) PC133 2-2-2 HYB39S256800DT- 7 Q67100 Q4332 Now
16 M x 16 TSOP-54 (400 mil) PC133 2-2-2 HYB39S256160DT- 7 Q67100 Q4334
256 Mb 64 M x 4 FBGA-54 (8 x 12 mm) PC133 2-2-2 HYB39S256400DC- 7 Q67100 Q4772
FBGA 32 M x 8 FBGA-54 (8 x 12 mm) PC133 2-2-2 HYB39S256800DC- 7 Q67100 Q4774 Now
16 M x 16 FBGA-54 (8 x 12 mm) PC133 2-2-2 HYB39S256160DC- 7 Q67100 Q4808
512 Mb 128 M x 4 TSOP-54 (400 mil) PC133 3-3-3 HYB39S512400AT- 7.5 Q67100 Q4404
64 M x 8 TSOP-54 (400 mil) PC133 3-3-3 HYB39S512800AT- 7.5 Q67100 Q4403 Now
32 M x 16 TSOP-54 (400 mil) PC133 3-3-3 HYB39S512160AT- 7.5 Q67100 Q4402
SDR Components
DRAM Modules
Specialty DRAMs
Flash DRAM Components
9
Nomenclature DDR / DDR2 Modules
Unbuffered DIMM, Registered DIMM (184-pin) and SO-DIMM (200-pin)
DRAM Modules
Part Number Component Die Revision Indicator
Extension
Speed 8 = PC1600 2-2-2 DDR200
7.5 = PC2100 2.5-3-3 DDR266B
7 = PC2100 2-3-3 DDR266A
7F = PC2100 2-2-2 DDR266
6 = PC2700 2.5-3-3 DDR333
5 = PC3200 3-3-3 / PC2-3200 3-3-3 DDR400 / DDR2-400
3.7 = PC2-4300 4-4-4 DDR2-533
3 = PC2-5300 4-4-4 DDR2-667
Power L = Low Power
none = Standard Power
Module Family U = Unbuffered DIMM TSOP-based for DDR / FBGA-based for DDR2
R = Registered DIMM TSOP-based for DDR / FBGA-based for DDR2
D = SO-DIMM TSOP-based for DDR / FBGA-based for DDR2
BD = SO-DIMM FBGA-based
BR = Registered DIMM FBGA-based
Package Type G = Contains Lead
H = Lead-Free (ROHS*-compliant)
E = Lead and Halogen-Free available on request (ROHS*-compliant)
Designator Product Variations
Number of 0 = One Memory Module Rank
Memory Ranks 2 = Two Memory Module Ranks
Designator Data Sheet Defined
Memory Density 16 = 16 Mb
per DQ 32 = 32 Mb
64 = 64 Mb
128 = 128 Mb
256 = 256 Mb
Power Supply D = 2.5 V (DDR Modules)
T = 1.8 V (DDR2 Modules)
Data Width 64 = x 64 (Non-ECC)
72 = x 72 (ECC)
Prefix HYS = Standard Prefix for SDRAM-based Memory Modules
* ROHS = Restriction Of Hazardous Substances
HYS 64 D 32 2 2 0 G D L - 6 - A (Example)
DRAM Modules Specialty DRAMs Flash
10
Unbuffered DDR DIMM – 184-pin
Module
Density
Organi-
zation
Genera-
tion
Compo.
Organization
Compo.
Package
#of Ranks
on Module
Module
Height
Module
Speed
Sales
Description
Speed
No.
Ordering
Code
Prod. Green
X = Lead-Free
128 MB PC2700 6-B Q67100 Q4940
PC3200 5-B Q67100 Q5136
PC2700
HYS64D16301GU-
6-C Q67100 Q1448
Now
16 M x 64 256 M 16 M x 16 TSOP 1 1.25"
PC3200 5-C Q67100 Q1754
PC2700 6-C Q67100 Q4995
PC3200 HYS64D16301HU- 5-C Q67100 Q5188 Now X
128 MB ECC 16 M x 72 128 M 16 M x 8 TSOP 1 1.25" PC2100 HYS72D16000GU- 7-A Q67100 Q4367 Now
256 MB PC2100 HYS64D32000GU- 7-B Q67100 Q4517 Now
PC2700 6-B Q67100 Q4944
PC3200 HYS64D32300GU- 5-B Q67100 Q5081
32 M x 64 256 M 32 M x 8 TSOP 1 1.25" PC2700 6-C Q67100 Q5184
Now
PC3200 5-C Q67100 Q1755
PC2700 6-C Q67100 Q4996
PC3200
HYS64D32300HU-
5-C Q67100 Q5189
Now X
256 MB ECC PC2100 7-B Q67100 Q4519
PC2100-222
HYS72D32000GU-
7F-B Q67100 Q5029
Now
PC2700 6-B Q67100 Q4946
PC3200 HYS72D32300GU- 5-B Q67100 Q4957
32 M x 72 256 M 32 M x 8 TSOP 1 1.25"
PC2700 6-C Q67100 Q1768
Now
PC3200 5-C Q67100 Q1756
PC2700 6-C Q67100 Q4998
PC3200
HYS72D32300HU-
5-C Q67100 Q5191
Now X
512 MB PC2100 HYS64D64020GU- 7-B Q67100 Q4521 Now
PC2700 6-B Q67100 Q4948
PC3200 HYS64D64320GU- 5-B Q67100 Q5084
64 M x 64 256 M 32 M x 8 TSOP 2 1.25" PC2700 6-C Q67100 Q1449
Now
PC3200 5-C Q67100 Q1761
PC2700 6-C Q67100 Q5001
PC3200
HYS64D64320HU-
5-C Q67100 Q5190
Now X
512 MB ECC PC2100 7-B Q67100 Q4525
PC2100-222 HYS72D64020GU- 7F-B Q67100 Q5030 Now
PC2700 6-B Q67100 Q4950
PC3200 5-B Q67100 Q4958
64 M x 72 256 M 32 M x 8 TSOP 2 1.25"
PC2700
HYS72D64320GU-
6-C Q67100 Q1757
Now
PC3200 5-C Q67100 Q1762
PC2700 6-C Q67100 Q4997
PC3200
HYS72D64320HU-
5-C Q67100 Q5192
Now X
DDR Modules
DRAM Components
DRAM Modules
Specialty DRAMsFlash DRAM Components
Unbuffered DDR DIMM – 184-pin
11
1GB PC2100 HYS64D128020GU- 7-A Q67100 Q4656 Now
PC2700 6-A Q67100 Q4823
PC2700 HYS64D128320GU- 6-B Q67100 Q1779 Now
128 M x 64 512 M 64 M x 8 TSOP 2 1.25"
PC3200 5-B Q67100 Q1780
PC2700 6-B Q67100 Q1426
PC3200 HYS64D128320HU- 5-B Q67100 Q1427
Now X
1 GB ECC PC2100 HYS72D128020GU- 7-A Q67100 Q4658 Now
PC2700 6-A Q67100 Q4935
PC2700 HYS72D128320GU- 6-B Q67100 Q1781 Now
128 M x 72 512 M 64 M x 8 TSOP 2 1.25"
PC3200 5-B Q67100 Q1782
PC2700 6-B Q67100 Q1065
PC3200 HYS72D128320HU- 5-B Q67100 Q1064
Now X
Module
Density
Compo.
Organization
Compo.
Package
#of Ranks
on Module
Module
Height
Module
Speed
Prod. Green
X = Lead-Free
Organi-
zation
Genera-
tion
Sales
Description
Speed
No.
Ordering
Code
DRAM Modules Specialty DRAMs Flash
12
128 MB 16 M x 72 128 M 16 M x 8 TSOP 1 1.2" PC2100 HYS72D16500GR- 7-A Q67100 Q4446 Now
256 MB HYS72D32501GR- 7-A Q67100 Q4377
128M 32 M x 4 TSOP 1 1.2" PC2100
HYS72D32501HR- 7-C Q67100 Q1471 3Q04 X
256 M 32 M x 8 TSOP 1 1.2" PC2100 HYS72D32500GR- 7-B Q67100 Q4457
32 M x 72
PC2100 7-B Q67100 Q4533
PC2700 6-B Q67100 Q4671
Now
256 M 32 M x 8 FBGA 1 1.125" PC3200 HYS72D32300GBR- 5-B Q67100 Q1461
PC2700 6-C Q67100 Q1413 2Q04
PC3200 5-C Q67100 Q1673 3Q04
512 MB 1.2" PC2100 HYS72D64500GR- 7-B Q67100 Q4463
TSOP 1
PC2100-222 7F-B Q67100 Q5007
PC2100 7-B Q67100 Q4673 Now
64 M x 4
1.125"
PC2700 6-B Q67100 Q4686
FBGA 1 PC3200 HYS72D64300GBR- 5-B Q67100 Q1462
PC2700 6-C Q67100 Q1415 2Q04
64 M x 72 256 M
PC3200 5-C Q67100 Q1685 3Q04
PC2100 7-B Q67100 Q4687
PC2700 6-B Q67100 Q4693 Now
32 M x 8 FBGA 2 1.125" PC3200 HYS72D64320GBR- 5-B Q67100 Q1463
PC2700 6-C Q67100 Q1414 2Q04
PC3200 5-C Q67100 Q1684 3Q04
1GB TSOP PC2100 7-B Q67100 Q4752
128 M x 4 stack 2 1.2"
PC2100-222
HYS72D128521GR-
7F-B Q67100 Q5008
256 M PC2100 7-B Q67100 Q4674
Now
64 M x 4 FBGA 2 1.2" PC2700 HYS72D128320GBR- 6-B Q67100 Q4668
PC2700 6-C Q67100 Q1412 2Q04
128 M x 72 TSOP 1 1.2" PC2100 HYS72D128500GR- 7-A Q67100 Q4990 Now
128 M x 4 PC2100 7-B Q67100 Q1429
FBGA 1 1.125" PC2700 HYS72D128300GBR- 6-B Q67100 Q1032 Now
512 M
PC3200 5-B Q67100 Q1687
PC2100 7-B Q67100 Q1422
64 M x 8 FBGA 2 1.125" PC2700 HYS72D128321GBR- 6-B Q67100 Q1043 Now
PC3200 5-B Q67100 Q1686
2GB 256 M x 4 TSOP 2 1.2" PC2100 HYS72D256520GR- 7-A Q67100 Q4661 Now
stack
256 M x 72 512 M PC2100 7-B Q67100 Q1031
128 M x 4 FBGA 2 1.2" PC2700 HYS72D256320GBR- 6-B Q67100 Q1030 Now
PC3200 5-B Q67100 Q1689
Registered DDR DIMM (Reduced Height) – 184-pin
X = Lead-Free
Module
Density
Compo.
Organization
Compo.
Package
#of Ranks
on Module
Module
Height
Module
Speed
Prod. GreenOrgani-
zation
Genera-
tion
Sales
Description
Speed
No.
Ordering
Code
DRAM Components
DRAM Modules
Specialty DRAMsFlash DRAM Components
23
Graphics RAM
Mobile-RAM
Density Organization Power Supply Speed Sales Description Speed No. Ordering Code Package Prod. Green
128 Mb 333 MHz 3.0 Q67100 Q4866
300 MHz HYB25D128323C- 3.3 Q67100 Q4121
3.6 Q67100 Q4348
4 M x 32 2.5 V 275 MHz
HYB25D128323CL- 3.6 Q67100 Q4930
FBGA-144 EOL
HYB25D128323C- 4.5 Q67100 Q4123
222 MHz
HYB25D128323CL- 4.5 Q67100 Q4786
256 Mb 166 MHz 6.0 Q67100 Q4592
200 MHz
HYB25D256160BT-
5.0 Q67100 Q4277
Now
16
M
x 16 2.5 V
200 MHz 5.0 Q67100 Q1408
TSOP-66
250 MHz
HYB25D256161CE-
4.0 Q67100 Q1409 Now XX
500 MHz 20 Q67100 Q4868
8 M x 32 1.8 V 450 MHz HYB18T256321F- 22 Q67100 Q4869 FBGA-144 3Q04 X
400 MHz 25 Q67100 Q4870
XX = Lead and Halogen-Free X = Lead-Free EOL = End of Life
Density Organization Power Supply Power Supply Speed Latency Sales Description Speed No. Ordering Code Package Prod. Green
Core I/O
128 Mb HYB25L128160AC- 7.5 Q67100 Q4542 FBGA-54
2.5 V 2.5 V / 1.8 V HYE25L128160AC- 7.5 ETR Q67100 Q4544 FBGA-54
HYB39L128160AT- 7.5 Q67100 Q4624 TSOP-54
Now
8Mx16 3.3 V 3.3 V 133 MHz 3-3-3
HYB39L128160AC- 7.5 Q67100 Q4546 FBGA-54
HYB18L128160BF- 7.5 Q67100 Q1581 FBGA-54 2Q04 XX
1.8 V 1.8 V HYB18L128160BC- 7.5 Q67100 Q1588 FBGA-54 2Q04
256 Mb HYB25L256160AC- 7.5 Q67100 Q5145 FBGA-54
2.5 V 2.5 V / 1.8 V
HYE25L256160AC- 7.5 ETR Q67100 Q5148 FBGA-54
HYB39L256160AC- 7.5 Q67100 Q5144 FBGA-54
Now
16 M x 16 3.3 V 3.3 V 133 MHz 3-3-3 HYB39L256160AT- 7.5 Q67100 Q4627 TSOP-54
HYB18L256160BF- 7.5 Q67100 Q1295 FBGA-54 2Q04 XX
1.8 V 1.8 V HYB18L256160BC- 7.5 Q67100 Q1577 FBGA-54 2Q04
512 Mb Dual 3.3 V or HYB25L512160AC- 7.5 Q67100 Q4921 FBGA-54
16 M x 16 3.3 V or 2.5 V 2.5 V / 1.8 V 133 MHz 3-3-3 HYE25L512160AC- 7.5 ETR Q67100 Q4923 FBGA-54 Now
= Halogen-Free XX = Lead and Halogen-Free ETR = Extended Temperature
DRAM Modules Specialty DRAMs FlashDRAM Components
24
Speed
Package C = Chip-size Package
W = Wafer / Known Good Die
Product Revision Die Revision
Interface 0 = Sync / Async / Page
1 = Async / Page only
Organization 16 = x 16
Memory Density 16 = 16 Mb
32 = 32 Mb
Memory Type P = CellularRAM (PSRAM)
Supply Voltage 18 = 1.8 V VDD / 1.8 – 3.0 V VDDQ
Prefix HYE = Extended Temperature
HYE 18 P 16 16 1 A C -60 (Example)
CellularRAM™
X = Lead-Free
Nomenclature CellularRAM™
Density Organization Interface Speed Sales Description Speed No. Ordering Code Package Prod. Green
16 Mb 85 ns 85 Q67100 Q5098 VFBGA-48
Async 1 M x 16 SRAM 70 ns
HYE18P16161AC-
70 Q67100 Q5099 VFBGA-48 2Q04 X
70 ns HYE18P16161AW- 70 Q67100 Q5101 Wafer / KGD
32 Mb 85 ns 85 Q67100 Q5103 VFBGA-48
Async 2 M x 16 SRAM 70 ns
HYE18P32161AC-
70 Q67100 Q5104 VFBGA-48 2Q04 X
70 ns HYE18P32161AW- 70 Q67100 Q5106 Wafer / KGD
32 Mb 80 MHz / 70 ns 12.5 Q67100 Q1802 VFBGA-54
Sync 2Mx16 SRAM 66 MHz / 85 ns
HYE18P32160AC-
15 Q67100 Q5108 VFBGA-54 2Q04 X
/ Flash
66 MHz / 85 ns HYE18P32160AW- 15 Q67100 Q5110 Wafer / KGD
DRAM Modules
Specialty DRAMsFlash DRAM Components
25
Nomenclature TwinFlash™Components
Flash
Temperature Range C = Commercial (0 °C – + 70 °C)
Package T = TSOP I 48-P-1220-0.5
Process Technology A = 170 nm Process Technology
B = 170 nm Process Technology (Enhanced Write Speed)
Product Variation 0 = Standard Product (Tape & Reel Packing)
2 = Stacked Die (Tape & Reel Packing)
Organization 80 = x 8
Memory Density 512 = 512 Mb
1G = 1024 Mb
Memory Type DS = Data SLC: TwinFlash Single-Level Cell (2 bit / cell)
Supply and 33 = 3.3 V core and 3 V I/O
I/O Voltage 31 = 3.3 V core and 1.8 V I/O
Prefix HYF = Flash Memory Components
HYF 33 DS 512 80 0 A T C (Example)
TwinFlash™Components
Density Organization Page Size Block Size Core I/O Write Sales Ordering Code Package
Voltage Voltage Speed Description
512 Mb 3 V Normal HYF33DS512800ATC
64 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V 3 V Enhanced HYF33DS512800BTC On request P-TSOPI-48
1.8 V Enhanced HYF31DS512800BTC
1Gb 3 V Normal HYF33DS1G802ATC
128 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V 3 V Enhanced HYF33DS1G802BTC On request P-TSOPI-48
1.8 V Enhanced HYF31DS1G802BTC
DRAM Modules Specialty DRAMs FlashDRAM Components
26
TwinFlash™Cards
Card Density Operating Voltage Sales Description Ordering Code
Multi 64 MB HYC3N0640NO00AA1AB
Media 128 MB 2.7 V – 3.6 V HYC3N1280NO00AA1AB On request
Cards
256 MB HYC3N2560NO00AA1AB
SD 64 MB HYC3N0640NO00AA1AA
Cards 128 MB 2.7 V – 3.6 V HYC3N1280NO00AA1AA On request
256 MB HYC3N2560NO00AA1AA
Nomenclature TwinFlash™Cards
Package A = SD (commercial)
B = MMC (commercial)
C = miniSD (commercial)
D = mini MMC (commercial)
Memory Revision A = 170 nm Process Technology
B = 110 nm Process Technology
Controller Generation 1 = 1st generation
2 = 2nd generation
Firmware AA = 1st firmware
AB = 2nd firmware
Content 0 = No content
1 = Content 1 rev. label
Label Size 0 = No label
1 = 16 MB
2 = 32 MB
3 = 64 MB
4 = 128 MB
5 = 256 MB
6 = 512 MB
7= 1 GB
Label Shortcut NO = No label
IF = IFX label
Speed 0 = Standard
1 = Future use
Memory Capacity 64 = 64 MB
128 = 128 MB
256 = 256 MB
512 = 512 MB
01G = 1024 MB
Technology N = TWIN-NAND
Supply Voltage 3 = 3.3 V Core
1 = 1.8 V Core (Dual-Voltage)
Type C = Flash Card
HYC 3 N 256 0 NO 5 0 AA 1 A A (Example)
27
On our Internet websites:
www.infineon.com/memory and www.infineon.com/memory/flash
CDatasheets
CSimulation models
CMemory Spectrum (PDF version)
CBrochures (PDF version)
More detailed Information on
Memory Products is available:
Edition 2004 April
Published by
Infineon Technologies AG,
St.-Martin-Straße 53,
D-81669 München
© Infineon Technologies AG 2004.
All Rights Reserved.
Please note
The information in this document is subject to change
without notice. The information herein describes certain
components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but
not limited to warranties of non-infringement regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and
conditions and prices, please contact your nearest
Infineon Technologies office in Germany or our Infineon
Technologies representatives worldwide.
(www.infineon.com).
Warnings
Due to technical requirements, components may contain
dangerous substances. For information on the types
in question, please contact your nearest Infineon
Technologies office.
Infineon Technologies components may only be used in
life-support devices or systems with the express written
approval of Infineon Technologies if a failure of such
components can reasonably be expected to cause the
failure of that life-support device or system, or to affect
the safety or effectiveness of that device or system.
Life-support devices or systems are intended to be
implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they
fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
Ordering No. B166-H8399-X-X-7600
Printed in Germany
WS 04045.
Z&P 2003091
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