BC856AW - BC858CW
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Ideally Suited for Automated Insertion
• Complementary NPN Types Available (BC846W-BC848W)
• For Switching and AF Amplifier Applications
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Pin Connections: See Diagram
• Marking Code: See Table Below & Diagram on Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.006 grams (approximate)
Marking Code (Note 2)
Type Marking Type Marking
BC856AW K3A BC857CW K3G
BC856BW K3B BC858AW K3J, K3A, K3V
BC857AW K3V, K3A BC858BW K3K, K3B, K3W
BC857BW K3W, K3B BC858CW K3L, K3G
SOT-323
Dim Min Max
A 0.25 0.40
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
E 0.30 0.40
G 1.20 1.40
H 1.80 2.20
J 0.0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.18
α 0° 8°
All Dimens ons in mm i
A
M
JL
FD
BC
H
K
G
BE
C
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage BC856
BC857
BC858
VCBO -80
-50
-30 V
Collector-Emitter Voltage BC856
BC857
BC858
VCEO -65
-45
-30 V
Emitter-Base Voltage VEBO -5.0 V
Collector Current IC-100 mA
Peak Collector Current ICM -200 mA
Peak Emitter Current IEM -200 mA
Power Dissipation (Note 1) Pd200 mW
Thermal Resistance, Junction to Ambient (Note 1) RθJA 625 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Current gain subgroup “C” is not available for BC856W.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30251 Rev. 8 - 2 1 of 3
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BC856AW - BC858CW
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