1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
VCC+
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND/VCC−
3IN+
3IN−
3OUT
LMV824. . . D, DGV, OR PW PACKAGE
(TOP VIEW)
LMV822. . . D OR DGK PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND/VCC−
VCC+
2OUT
2IN−
2IN+
LMV821. . . DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
IN+
GND/VCC−
IN−
VCC+
OUT
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
Check for Samples: LMV821 SINGLE,LMV822 DUAL,LMV824 QUAD
The LMV8xx devices are characterized for operation
1FEATURES from –40°C to 85°C. The LMV8xxI devices are
• 2.5-V, 2.7-V, and 5-V Performance characterized for operation from –40°C to 125°C.
• –40°C to 125°C Operation
• No Crossover Distortion
• Low Supply Current at VCC+ = 5 V:
– LMV821…0.3 mA Typ
– LMV822…0.5 mA Typ
– LMV824…1 mA Typ
• Rail-to-Rail Output Swing
• Gain Bandwidth of 5.5 MHz Typ at 5 V
• Slew Rate of 1.9 V/μs Typ at 5 V
DESCRIPTION/
ORDERING INFORMATION
The LMV821 single, LMV822 dual, and LMV824 quad
devices are low-voltage (2.5 V to 5.5 V), low-power
commodity operational amplifiers. Electrical
characteristics are very similar to the LMV3xx
operational amplifiers (low supply current, rail-to-rail
outputs, input common-mode range that includes
ground). However, the LMV8xx devices offer a higher
bandwidth (5.5 MHz typical) and faster slew rate
(1.9 V/μs typical).
The LMV8xx devices are cost-effective solutions for
applications requiring low-voltage/low-power
operation and space-saving considerations. The
LMV821 is available in the ultra-small DCK package,
which is approximately half the size of SOT-23-5. The
DCK package saves space on printed circuit boards
and enables the design of small portable electronic
devices (cordless and cellular phones, laptops, PDAs,
PCMIA). It also allows the designer to place the
device closer to the signal source to reduce noise
pickup and increase signal integrity.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
ORDERING INFORMATION
TAPACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
Reel of 3000 LMV821DCKR
SC-70 – DCK RY_
Reel of 250 LMV821DCKT
Single Reel of 3000 LMV821DBVR
SOT-23 – DBV RB8_
Reel of 250 LMV821DBVT
Tube of 75 LMV822D
SOIC – D MV822
Reel of 2500 LMV822DR
Dual
–40°C to 85°C Tube of 100 LMV822DGK
MSOP/VSSOP – DGK RA_
Reel of 2500 LMV822DGKR
Tube of 50 LMV824D
SOIC – D LMV824
Reel of 2500 LMV824DR
Quad Tube of 90 LMV824PW
TSSOP – PW MV824
Reel of 2000 LMV824PWR
TVSOP – DGV Reel of 2000 LMV824DGVR MV824
Reel of 3000 LMV821IDCKR
SC-70 – DCK RZ_
Reel of 250 LMV821IDCKT
Single Reel of 3000 LMV821IDBVR
SOT-23 – DBV RB1_
Reel of 250 LMV821IDBVT
Tube of 75 LMV822ID
SOIC – D MV822I
Reel of 2500 LMV822IDR
Dual
–40°C to 125°C Tube of 100 LMV822IDGK
MSOP/VSSOP – DGK R8_
Reel of 2500 LMV822IDGKR
Tube of 50 LMV824ID
SOIC – D LMV824I
Reel of 2500 LMV824IDR
Quad Tube of 90 LMV824IPW
TSSOP – PW MV824I
Reel of 2000 LMV824IPWR
TVSOP – DGV Reel of 2000 LMV824IDGVR MV824I
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.
2Copyright © 2004–2006, Texas Instruments Incorporated
VBIAS4
−
+
−
+
IN+
IN−
VBIAS1
VBIAS2
VBIAS3
−
+−
+
Output
VCC
VCC
VCC
VCC
−
+
VBIAS5
+
−
IN −
IN +
OUT
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
Figure 1. SYMBOL (EACH AMPLIFIER)
Figure 2. LMV824 SIMPLIFIED SCHEMATIC
Copyright © 2004–2006, Texas Instruments Incorporated 3
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage(2) 5.5 V
VID Differential input voltage(3) ±VCC V
VIInput voltage range (either input) VCC– VCC+ V
Duration of output short circuit (one amplifier) to ground(4) At or below TA= 25°C, VCC ≤5.5 V Unlimited
8 pin 97
D package 14 pin 86
DBV package 206
θJA Package thermal impedance(5) (6) DCK package 252 °C/W
DGK package 172
DGV package 127
PW package 113
TJOperating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions MIN MAX UNIT
VCC Supply voltage (single-supply operation) 2.5 5 V
LMV8xxI –40 125
TAOperating free-air temperature °C
LMV8xx –40 85
4Copyright © 2004–2006, Texas Instruments Incorporated
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LMV8xx 2.5-V Electrical Characteristics
VCC+ = 2.5 V, VCC– = 0 V, VIC = 1 V, VO= 1.25 V, and RL> 1 MΩ(unless otherwise noted) LMV8xx
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 85°C 4
25°C 2.3 2.37
High level –40°C to 85°C 2.2
VCC+ = 2.5 V, RL= 600 Ωto 1.25 V 25°C 0.13 0.2
Low level –40°C to 85°C 0.3
VOOutput swing V
25°C 2.4 2.46
High level –40°C to 85°C 2.3
VCC+ = 2.5 V, RL= 2 kΩto 1.25 V 25°C 0.08 0.12
Low level –40°C to 85°C 0.2
LMV8xxI 2.5-V Electrical Characteristics
VCC+ = 2.5 V, VCC– = 0 V, VIC = 1 V, VO= 1.25 V, and RL> 1 MΩ(unless otherwise noted) LMV8xxI
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 125°C 5.5
25°C 2.28 2.37
High level –40°C to 125°C 2.18
VCC+ = 2.5 V, RL= 600 Ωto 1.25 V 25°C 0.13 0.22
Low level –40°C to 125°C 0.32
VOOutput swing V
25°C 2.38 2.46
High level –40°C to 125°C 2.28
VCC+ = 2.5 V, RL= 2 kΩto 1.25 V 25°C 0.08 0.14
Low level –40°C to 125°C 0.22
Copyright © 2004–2006, Texas Instruments Incorporated 5
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
LMV8xx 2.7-V Electrical Characteristics
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO= 1.35 V, and RL> 1 MΩ(unless otherwise noted) LMV8xx
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 85°C 4
Average temperature coefficient
αVIO 25°C 1 μV/°C
of input offset voltage 25°C 30 90
IIB Input bias current nA
–40°C to 85°C 140
25°C 0.5 30
IIO Input offset current nA
–40°C to 85°C 50
25°C 70 85
CMRR Common-mode rejection ratio VIC = 0 to 1.7 V dB
–40°C to 85°C 68
25°C 75 85
Positive supply-voltage VCC+ = 1.7 V to 4 V, VCC– = –1 V,
+kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 85°C 70
25°C 73 85
Negative supply-voltage VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
–kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 85°C 70
Common-mode input –0.2 –0.3
VICR CMRR ≥50 dB 25°C V
voltage range to 1.9 to 2
25°C 90 100
RL= 600 Ωto 1.35 V, Sourcing
VO= 1.35 V to 2.2 V –40°C to 85°C 85
25°C 85 90
RL= 600 Ωto 1.35 V, Sinking
VO= 1.35 V to 0.5 V –40°C to 85°C 80
Large-signal voltage
AVdB
amplification 25°C 95 100
RL= 2 kΩto 1.35 V, Sourcing
VO= 1.35 V to 2.2 V –40°C to 85°C 90
25°C 90 95
RL= 2 kΩto 1.35 V, Sinking
VO= 1.35 V to 0.5 V –40°C to 85°C 85
25°C 2.5 2.58
High level –40°C to 85°C 2.4
VCC+ = 2.7 V,
RL= 600 Ωto 1.35 V 25°C 0.13 0.2
Low level –40°C to 85°C 0.3
VOOutput swing V
25°C 2.6 2.66
High level –40°C to 85°C 2.5
VCC+ = 2.7 V,
RL= 2 kΩto 1.35 V 25°C 0.08 0.12
Low level –40°C to 85°C 0.2
VO= 0 V Sourcing 25°C 12 16
IOOutput current mA
VO= 2.7 V Sinking 25°C 12 26
25°C 0.22 0.3
LMV821 –40°C to 85°C 0.5
25°C 0.45 0.6
ICC Supply current LMV822 (both amplifiers) mA
–40°C to 85°C 0.8
25°C 0.72 1
LMV824 (all four amplifiers) –40°C to 85°C 1.2
6Copyright © 2004–2006, Texas Instruments Incorporated
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LMV8xx 2.7-V Electrical Characteristics (continued)
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO= 1.35 V, and RL> 1 MΩ(unless otherwise noted) LMV8xx
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
SR Slew rate(1) 25°C 1.7 V/μs
GBW Gain bandwidth product (2) 25°C 5 MHz
ΦmPhase margin (2) 25°C 60 deg
Gain margin (2) 25°C 8.6 dB
Amplifier-to-amplifier isolation VCC+ = 5 V, RL= 100 kΩto 2.5 V(3) 25°C 135 dB
VnEquivalent input noise voltage f = 1 kHz, VIC = 1 V 25°C 45 nV/√Hz
InEquivalent input noise current f = 1 kHz 25°C 0.18 pA/√Hz
f = 1 kHz, AV= –2, RL= 10 kΩ,
THD Total harmonic distortion 25°C 0.01 %
VO= 4.1 Vp-p
(1) Connected as voltage follower with 1-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL= 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO= 3 Vp-p
Copyright © 2004–2006, Texas Instruments Incorporated 7
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
LMV8xxI 2.7-V Electrical Characteristics
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO= 1.35 V, and RL> 1 MΩ(unless otherwise noted) LMV8xxI
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 125°C 5.5
Average temperature coefficient
αVIO 25°C 1 μV/°C
of input offset voltage 25°C 30 90
IIB Input bias current nA
–40°C to 125°C 140
25°C 0.5 30
IIO Input offset current nA
–40°C to 125°C 50
25°C 70 85
CMRR Common-mode rejection ratio VIC = 0 to 1.7 V dB
–40°C to 125°C 68
25°C 75 85
Positive supply-voltage VCC+ = 1.7 V to 4 V, VCC– = –1 V,
+kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 125°C 70
25°C 73 85
Negative supply-voltage VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
–kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 125°C 70
Common-mode input –0.2 –0.3
VICR CMRR ≥50 dB 25°C V
voltage range to 1.9 to 2
25°C 90 100
RL= 600 Ωto 1.35 V, Sourcing
VO= 1.35 V to 2.2 V –40°C to 125°C 85
25°C 85 90
RL= 600 Ωto 1.35 V, Sinking
VO= 1.35 V to 0.5 V –40°C to 125°C 80
Large-signal voltage
AVdB
amplification 25°C 95 100
RL= 2 kΩto 1.35 V, Sourcing
VO= 1.35 V to 2.2 V –40°C to 125°C 90
25°C 90 95
RL= 2 kΩto 1.35 V, Sinking
VO= 1.35 V to 0.5 V –40°C to 125°C 85
25°C 2.5 2.58
High level –40°C to 125°C 2.4
VCC+ = 2.7 V,
RL= 600 Ωto 1.35 V 25°C 0.13 0.2
Low level –40°C to 125°C 0.3
VOOutput swing V
25°C 2.6 2.66
High level –40°C to 125°C 2.5
VCC+ = 2.7 V,
RL= 2 kΩto 1.35 V 25°C 0.08 0.12
Low level –40°C to 125°C 0.2
VO= 0 V Sourcing 25°C 12 16
IOOutput current mA
VO= 2.7 V Sinking 25°C 12 26
25°C 0.22 0.3
LMV821 –40°C to 125°C 0.5
25°C 0.45 0.6
ICC Supply current LMV822 (both amplifiers) mA
–40°C to 125°C 0.8
25°C 0.72 1
LMV824 (all four amplifiers) –40°C to 125°C 1.2
8Copyright © 2004–2006, Texas Instruments Incorporated
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 2.7-V Electrical Characteristics (continued)
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO= 1.35 V, and RL> 1 MΩ(unless otherwise noted) LMV8xxI
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
SR Slew rate(1) 25°C 1.7 V/μs
GBW Gain bandwidth product (2) 25°C 5 MHz
ΦmPhase margin (2) 25°C 60 deg
Gain margin (2) 25°C 8.6 dB
Amplifier-to-amplifier isolation VCC+ = 5 V, RL= 100 kΩto 2.5 V(3) 25°C 135 dB
VnEquivalent input noise voltage f = 1 kHz, VIC = 1 V 25°C 45 nV/√Hz
InEquivalent input noise current f = 1 kHz 25°C 0.18 pA/√Hz
f = 1 kHz, AV= –2, RL= 10 kΩ,
THD Total harmonic distortion 25°C 0.01 %
VO= 4.1 Vp-p
(1) Connected as voltage follower with 1-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL= 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO= 3 Vp-p
Copyright © 2004–2006, Texas Instruments Incorporated 9
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
LMV8xx 5-V Electrical Characteristics
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO= 2.5 V, and RL> 1 MΩ(unless otherwise noted) LMV8xx
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 85°C 4
Average temperature coefficient
αVIO 25°C 1 μV/°C
of input offset voltage 25°C 40 100
IIB Input bias current nA
–40°C to 85°C 150
25°C 0.5 30
IIO Input offset current nA
–40°C to 85°C 50
25°C 72 90
CMRR Common-mode rejection ratio VIC = 0 to 4 V dB
–40°C to 85°C 70
25°C 75 85
Positive supply-voltage VCC+ = 1.7 V to 4 V, VCC– = –1 V,
+kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 85°C 70
25°C 73 85
Negative supply-voltage VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
–kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 85°C 70
Common-mode input –0.2 –0.3
VICR CMRR ≥50 dB 25°C V
voltage range to 4.2 to 4.3
25°C 95 105
RL= 600 Ωto 2.5 V, Sourcing
VO= 2.5 V to 4.5 V –40°C to 85°C 90
25°C 95 105
RL= 600 Ωto 2.5 V, Sinking
VO= 2.5 V to 0.5 V –40°C to 85°C 90
Large-signal voltage
AVdB
amplification 25°C 95 105
RL= 2 kΩto 2.5 V, Sourcing
VO= 2.5 V to 4.5 V –40°C to 85°C 90
25°C 95 105
RL= 2 kΩto 2.5 V, Sinking
VO= 2.5 V to 0.5 V –40°C to 85°C 90
25°C 4.75 4.84
High level –40°C to 85°C 4.7
VCC+ = 5 V,
RL= 600 Ωto 2.5 V 25°C 0.17 0.25
Low level –40°C to 85°C 0.3
VOOutput swing V
25°C 4.85 4.9
High level –40°C to 85°C 4.8
VCC+ = 5 V,
RL= 2 kΩto 2.5 V 25°C 0.1 0.15
Low level –40°C to 85°C 0.2
25°C 20 45
VO= 0 V Sourcing –40°C to 85°C 15
IOOutput current mA
25°C 20 40
VO= 5 V Sinking –40°C to 85°C 15
25°C 0.3 0.4
LMV821 –40°C to 85°C 0.6
25°C 0.5 0.7
ICC Supply current LMV822 (both amplifiers) mA
–40°C to 85°C 0.9
25°C 1 1.3
LMV824 (all four amplifiers) –40°C to 85°C 1.5
10 Copyright © 2004–2006, Texas Instruments Incorporated
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LMV8xx 5-V Electrical Characteristics (continued)
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO= 2.5 V, and RL> 1 MΩ(unless otherwise noted) LMV8xx
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
SR Slew rate VCC+ = 5 V(1) 25°C 1.4 1.9 V/μs
GBW Gain bandwidth product (2) 25°C 5.5 MHz
ΦmPhase margin (2) 25°C 64.2 deg
Gain margin (2) 25°C 8.7 dB
Amplifier-to-amplifier isolation VCC+ = 5 V, RL= 100 kΩto 2.5 V(3) 25°C 135 dB
VnEquivalent input noise voltage f = 1 kHz, VIC = 1 V 25°C 42 nV/√Hz
InEquivalent input noise current f = 1 kHz 25°C 0.2 pA/√Hz
f = 1 kHz, AV= –2, RL= 10 kΩ,
THD Total harmonic distortion 25°C 0.01 %
VO= 4.1 Vp-p
(1) Connected as voltage follower with 3-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL= 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO= 3 Vp-p
Copyright © 2004–2006, Texas Instruments Incorporated 11
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
LMV8xxI 5-V Electrical Characteristics
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO= 2.5 V, and RL> 1 MΩ(unless otherwise noted) LMV8xxI
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
25°C 1 3.5
VIO Input offset voltage mV
–40°C to 125°C 5.5
Average temperature coefficient
αVIO 25°C 1 μV/°C
of input offset voltage 25°C 40 100
IIB Input bias current nA
–40°C to 125°C 150
25°C 0.5 30
IIO Input offset current nA
–40°C to 125°C 50
25°C 72 90
CMRR Common-mode rejection ratio VIC = 0 to 4 V dB
–40°C to 125°C 70
25°C 75 85
Positive supply-voltage VCC+ = 1.7 V to 4 V, VCC– = –1 V,
+kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 125°C 70
25°C 73 85
Negative supply-voltage VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
–kSVR dB
rejection ratio VO= 0, VIC = 0 –40°C to 125°C 70
Common-mode input –0.2 –0.3
VICR CMRR ≥50 dB 25°C V
voltage range to 4.2 to 4.3
25°C 95 105
RL= 600 Ωto 2.5 V, Sourcing
VO= 2.5 V to 4.5 V –40°C to 125°C 90
25°C 95 105
RL= 600 Ωto 2.5 V, Sinking
VO= 2.5 V to 0.5 V –40°C to 125°C 90
Large-signal voltage
AVdB
amplification 25°C 95 105
RL= 2 kΩto 2.5 V, Sourcing
VO= 2.5 V to 4.5 V –40°C to 125°C 90
25°C 95 105
RL= 2 kΩto 2.5 V, Sinking
VO= 2.5 V to 0.5 V –40°C to 125°C 90
25°C 4.75 4.84
High level –40°C to 125°C 4.6
VCC+ = 5 V,
RL= 600 Ωto 2.5 V 25°C 0.17 0.25
Low level –40°C to 125°C 0.3
VOOutput swing V
25°C 4.85 4.9
High level –40°C to 125°C 4.8
VCC+ = 5 V,
RL= 2 kΩto 2.5 V 25°C 0.1 0.15
Low level –40°C to 125°C 0.2
25°C 20 45
VO= 0 V Sourcing –40°C to 125°C 15
IOOutput current mA
25°C 20 40
VO= 5 V Sinking –40°C to 125°C 15
25°C 0.3 0.4
LMV821 –40°C to 125°C 0.6
25°C 0.5 0.7
ICC Supply current LMV822 (both amplifiers) mA
–40°C to 125°C 0.9
25°C 1 1.3
LMV824 (all four amplifiers) –40°C to 125°C 1.5
12 Copyright © 2004–2006, Texas Instruments Incorporated
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 5-V Electrical Characteristics (continued)
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO= 2.5 V, and RL> 1 MΩ(unless otherwise noted) LMV8xxI
PARAMETER TEST CONDITIONS TAUNIT
MIN TYP MAX
SR Slew rate VCC+ = 5 V(1) 25°C 1.4 1.9 V/μs
GBW Gain bandwidth product (2) 25°C 5.5 MHz
ΦmPhase margin (2) 25°C 64.2 deg
Gain margin (2) 25°C 8.7 dB
Amplifier-to-amplifier isolation VCC+ = 5 V, RL= 100 kΩto 2.5 V(3) 25°C 135 dB
VnEquivalent input noise voltage f = 1 kHz, VIC = 1 V 25°C 42 nV/√Hz
InEquivalent input noise current f = 1 kHz 25°C 0.2 pA/√Hz
f = 1 kHz, AV= –2, RL= 10 kΩ,
THD Total harmonic distortion 25°C 0.01 %
VO= 4.1 Vp-p
(1) Connected as voltage follower with 3-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL= 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO= 3 Vp-p
Copyright © 2004–2006, Texas Instruments Incorporated 13
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to V+ − (V)
IO − Source Current − mA
0.01
VCC+ = 2.7 V
0.01
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to V+ − (V)
IO − Source Current − mA
VCC+ = 5 V
TA = −405C
0
200
400
600
800
1000
1200
0 1 2 3 4 5 6
ICC − Supply Current − µA
TA = 855C
TA = 255C
VCC+ − Supply Voltage − V
LMV824
All Channels
−70
−60
−50
−40
−30
−40 −20 0 20 40 60 80 100
II − Input Current − nA
TA − Temperature − °C
VCC+ = 5 V
Vin = VCC+/2
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
TYPICAL CHARACTERISTICS
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
SUPPLY CURRENT INPUT CURRENT
vs vs
SUPPLY VOLTAGE TEMPERATURE
Figure 3. Figure 4.
SOURCING CURRENT SOURCING CURRENT
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
Figure 5. Figure 6.
14 Copyright © 2004–2006, Texas Instruments Incorporated
0
10
20
30
40
50
2.6 3 3.4 3.8 4.2 4.6 5
Output Voltage From Supply Voltage − mV
Negative Swing
Positive Swing
RL = 10 kΩ to Mid Rail
VCC+ − Supply Voltage − V
0.01
0.1
1
10
100
0.01 0.1 1 10
Output Voltage Referenced to GND − V
IO − Sink Current − mA
VCC+ = 5 V
0.01
0.1
1
10
100
0.01 0.1 1 10
Output Voltage Referenced to GND − V
IO − Sink Current − mA
VCC+ = 2.7 V
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
SINKING CURRENT SINKING CURRENT
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
Figure 7. Figure 8.
OUTPUT VOLTAGE SWING OUTPUT VOLTAGE SWING
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
Figure 9. Figure 10.
Copyright © 2004–2006, Texas Instruments Incorporated 15
90
100
110
120
130
140
100 1k 10k 100k
Frequency − Hz
Crosstalk Rejection − dB
VCC+ = ±2.5 V
VI = 3 VPP
RL = 5 kΩ
AV = 1
150
160
Frequency − Hz
PSRR − dB
VCC+ = +1.35 V
VCC+ = +2.5 V
0
10
20
30
40
50
60
70
80
90
100
100 1k 10k 100k 1M
60
80
100
120
140
160
2.6 3 3.4 3.8 4.2 4.6 5
Output Voltage From Supply Voltage − mV
RL = 600 Ω to Mid Rail
VCC+ − Supply Voltage − V
70
90
110
130
150
Negative Swing
Positive Swing
20
40
60
80
100
120
140
160
0100 1000 100k
Output Voltage From Supply Voltage − mV
Resistive Load − Ω
10k
RlL = 5 kΩ to Mid Rail
VCC+ = 5 V
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
OUTPUT VOLTAGE SWING OUTPUT VOLTAGE SWING
vs vs
SUPPLY VOLTAGE LOAD RESISTANCE
Figure 11. Figure 12.
CROSSTALK REJECTION +PSRR
vs vs
FREQUENCY FREQUENCY
Figure 13. Figure 14.
16 Copyright © 2004–2006, Texas Instruments Incorporated
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
−60
−20
0
20
40
60
80
100
120
140
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
VCC+ = 2.7 V
600 Ω
2 kΩ
100 kΩ−40
Frequency − Hz
PSRR − dB
VCC+ = +1.35 V
VCC+ = +2.5 V
0
10
20
30
40
50
60
70
80
90
100
100 1k 10k 100k 1M
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
–PSRR
vs
FREQUENCY
Figure 15.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL= 600 Ω, 2 kΩ, 100 kΩ)
Figure 16.
Copyright © 2004–2006, Texas Instruments Incorporated 17
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
−100
−80
−60
−40
−20
0
20
40
60
80
100
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
VCC+ = 2.7 V
RL = 10 kΩ
22 pF
100 pF
200 pF
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
−60
−40
−20
0
20
40
60
80
100
120
140
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
VCC+ = 5 V
600 Ω
2 kΩ
100 kΩ
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL= 600 Ω, 2 kΩ, 100 kΩ)
Figure 17.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL= 10 kΩ, CL= 22 pF, 100 pF, 200 pF)
Figure 18.
18 Copyright © 2004–2006, Texas Instruments Incorporated
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
−60
−40
−20
0
20
40
60
80
100
120
140
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
22 pF
100 pF
200 pF
VCC+ = 2.7 V
RL = 600 Ω
−100
−80
−60
−40
−20
0
20
40
60
80
100
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
VCC+ = 5 V
RL = 10 kΩ
22 pF
100 pF
200 pF
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
www.ti.com
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL= 10 kΩ, CL= 22 pF, 100 pF, 200 pF)
Figure 19.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL= 600 Ω, CL= 22 pF, 100 pF, 200 pF)
Figure 20.
Copyright © 2004–2006, Texas Instruments Incorporated 19
Gain − dB
−20
0
20
40
60
80
1k 10k 100k 1M 10M
Frequency − Hz
−60
−40
−20
0
20
40
60
80
100
120
140
Phase Margin − Deg
Gain
Phase
−10
10
30
50
70
22 pF
100 pF
200 pF
VCC+ = 5 V
RL = 600 Ω
Not Recommended for New Designs
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
SLOS434I –FEBRUARY 2004–REVISED JULY 2006
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL= 600 Ω, CL= 22 pF, 100 pF, 200 pF)
Figure 21.
20 Copyright © 2004–2006, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV821DBVR NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DBVRE4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DBVRG4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DBVT NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DBVTE4 NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DBVTG4 NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKR NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKRE4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKRG4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKT NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKTE4 NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821DCKTG4 NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDBVR NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDBVRE4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDBVRG4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDBVT NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDBVTE4 NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV821IDBVTG4 NRND SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKR NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKRE4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKRG4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKT NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKTE4 NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV821IDCKTG4 NRND SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822D NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DE4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DG4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DGKR NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DGKRG4 NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DR NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DRE4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822DRG4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822ID NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDE4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDG4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV822IDGKR NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDGKRG4 NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDR NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDRE4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV822IDRG4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824D NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DE4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DG4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DGVR NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DGVRE4 NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DGVRG4 NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DR NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DRE4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824DRG4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824ID NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDE4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDG4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDGVR NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV824IDGVRE4 NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDGVRG4 NRND TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDR NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDRE4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IDRG4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPW NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPWE4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPWG4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPWR NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPWRE4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824IPWRG4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PW NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PWE4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PWG4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PWR NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PWRE4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV824PWRG4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
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Addendum-Page 5
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV821, LMV822, LMV824 :
•Automotive: LMV821-Q1, LMV822-Q1, LMV824-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV821DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV821DBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
LMV821DBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
LMV821DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV821DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
LMV821DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV821IDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMV821IDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMV821IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV822DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV822DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LMV822IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV822IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LMV824DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
LMV824DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LMV824IDGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
LMV824IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LMV824IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV824PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV821DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
LMV821DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
LMV821DBVT SOT-23 DBV 5 250 205.0 200.0 33.0
LMV821DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
LMV821DCKR SC70 DCK 5 3000 205.0 200.0 33.0
LMV821DCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV821IDBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
LMV821IDBVT SOT-23 DBV 5 250 203.0 203.0 35.0
LMV821IDCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV822DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LMV822DR SOIC D 8 2500 340.5 338.1 20.6
LMV822IDGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LMV822IDR SOIC D 8 2500 340.5 338.1 20.6
LMV824DGVR TVSOP DGV 14 2000 367.0 367.0 35.0
LMV824DR SOIC D 14 2500 367.0 367.0 38.0
LMV824IDGVR TVSOP DGV 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV824IDR SOIC D 14 2500 367.0 367.0 38.0
LMV824IPWR TSSOP PW 14 2000 367.0 367.0 35.0
LMV824PWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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