SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Members of the Texas Instruments
Widebus
Family
D
State-of-the-Art
EPIC-
ΙΙ
B
BiCMOS Design
Significantly Reduces Power Dissipation
D
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Latch-Up Performance Exceeds 500 mA
Per JESD 17
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’ABT16241A devices are 16-bit buffers and
line drivers designed specifically to improve both
the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters.
These devices can be used as four 4-bit buffers, two 8-bit buf fers, or one 16-bit buf fer. These devices provide
true outputs and complementary output-enable (OE and OE) inputs.
T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE
should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the
current-sourcing capability of the driver.
The SN54ABT16241A is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT16241A is characterized for operation from –40°C to 85°C.
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
SN54ABT16241A . . . WD PACKAGE
SN74ABT16241A . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLES
INPUTS OUTPUTS
1OE, 4OE 1A, 4A 1Y, 4Y
L H H
LLL
HXZ
INPUTS OUTPUTS
2OE, 3OE 2A, 3A 2Y, 3Y
H H H
HLL
LXZ
logic symbol†
47
1A1 46
1A2 44
1A3 43
1A4
1Y1
2
1Y2
3
1Y3
5
1Y4
6
41
2A1 40
2A2 38
2A3 37
2A4
2Y1
8
2Y2
9
2Y3
11
2Y4
12
36
3A1 35
3A2 33
3A3 32
3A4
3Y1
13
3Y2
14
3Y3
16
3Y4
17
30
4A1 29
4A2 27
4A3 26
4A4
4Y1
19
4Y2
20
4Y3
22
4Y4
23
EN1
1
EN2
48
2OE
EN3
25
3OE
EN4
24
1OE
4OE
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
1
1
1
1
1
2
3
4
SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
1
47
46
44
43
2
3
5
6
2OE
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
48
41
40
38
37
8
9
11
12
3OE
3A1
3A2
3A3
3A4
3Y1
3Y2
3Y3
3Y4
25
36
35
33
32
13
14
16
17
4OE
4A1
4A2
4A3
4A4
4Y1
4Y2
4Y3
4Y4
24
30
29
27
26
19
20
22
23
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or power-off state, VO –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54ABT16241A 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABT16241A 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –18 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DGG package 89°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 93°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 94°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54ABT16241A SN74ABT16241A
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
IOH High-level output current –24 –32 mA
IOL Low-level output current 48 64 mA
∆t/∆vInput transition rise or fall rate Outputs enabled 10 10 ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C SN54ABT16241A SN74ABT16241A
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN MAX MIN MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 –1.2 V
VCC = 4.5 V, IOH = –3 mA 2.5 2.5 2.5
VOH
VCC = 5 V, IOH = –3 mA 3 3 3
V
V
OH
VCC =45V
IOH = –24 mA 2 2
V
V
CC =
4
.
5
V
IOH = –32 mA 2* 2
VOL
VCC =45V
IOL = 48 mA 0.55 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.55* 0.55
V
Vhys 100 mV
IIVCC = 5.5 V, VI = VCC or GND ±1±1±1µA
IOZH VCC = 5.5 V, VO = 2.7 V 10 10 10 µA
IOZL VCC = 5.5 V, VO = 0.5 V –10 –10 –10 µA
Ioff VCC = 0, VI or VO ≤ 4.5 V ±100 ±100 µA
ICEX VCC = 5.5 V,
VO = 5.5 V Outputs high 50 50 50 µA
IO‡VCC = 5.5 V, VO = 2.5 V –50 –100 –180 –50 –180 –50 –180 mA
VCC
=
5.5 V,
Outputs high 3 3 3
ICC
VCC
=
5
.
5
V
,
IO = 0, Outputs low 34 34 34 mA
VI = VCC or GND Outputs disabled 3 3 3
§
Data VCC = 5.5 V,
One input at 3.4 V, Outputs enabled 1 1.5 1
∆ICC
§
inputs
,
Other inputs at
VCC or GND Outputs disabled 0.05 1 0.05 mA
Control
inputs VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND 1.5 1.5 1.5
CiVI = 2.5 V or 0.5 V 3.5 pF
CoVO = 2.5 V or 0.5 V 7.5 pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
†All typical values are at VCC = 5 V.
‡Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT16241A
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
A
Y
0.9 2.7 3.4 0.9 3.8
ns
tPHL
A
Y
0.9 2.7 3.9 0.9 4.6
ns
tPZH
OE or OE
Y
1.2 3.3 4.2 1.2 5.1
ns
tPZL
OE
or
OE
Y
1.3 3.4 5.9 1.3 7
ns
tPHZ
OE or OE
Y
1.5 4.1 5.5 1.5 7
ns
tPLZ
OE
or
OE
Y
1.7 3.6 5.1 1.7 5.7
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT16241A
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
A
Y
12.7 3.4 1 3.7
ns
tPHL
A
Y
1 2.7 3.9 1 4.5
ns
tPZH
OE or OE
Y
1.2 3.3 4.2 1.2 5
ns
tPZL
OE
or
OE
Y
1.3 3.4 5.9 1.3 6.9
ns
tPHZ
OE or OE
Y
1.5 4.1 5.2 1.5 6.2
ns
tPLZ
OE
or
OE
Y
1.7 3.6 5.1 1.7 5.6
ns
SN54ABT16241A, SN74ABT16241A
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS096G – FEBRUAR Y 1991 – REVISED OCT OBER 1998
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
Data Input
Timing Input 1.5 V 3 V
0 V
1.5 V 1.5 V
3 V
0 V
3 V
0 V
1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0 V
1.5 V1.5 V
Input
1.5 V
Output
Control
Output
W aveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
3.5 V
0 V
1.5 V VOL + 0.3 V
1.5 V VOH – 0.3 V
≈ 0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
Output
Control
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2. 5 ns , t f≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9450101QXA ACTIVE CFP WD 48 1 TBD Call TI Call TI
74ABT16241ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ABT16241ADGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ABT16241ADGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ABT16241ADGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADL ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADLR ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT16241ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54ABT16241AWD ACTIVE CFP WD 48 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ABT16241A, SN74ABT16241A :
•Catalog: SN74ABT16241A
•Military: SN54ABT16241A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ABT16241ADGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
SN74ABT16241ADGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1
SN74ABT16241ADLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ABT16241ADGGR TSSOP DGG 48 2000 367.0 367.0 45.0
SN74ABT16241ADGVR TVSOP DGV 48 2000 367.0 367.0 38.0
SN74ABT16241ADLR SSOP DL 48 1000 367.0 367.0 55.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
WD (R-GDFP-F**) CERAMIC DUAL FLATPACK
4040176/D 10/97
48 LEADS SHOWN
48
48
25
56
0.610
(18,80)
0.710
(18,03)
0.7400.640
0.390 (9,91)
0.370 (9,40)
0.870 (22,10)
1.130 (28,70)
1
A
0.120 (3,05)
0.075 (1,91)
LEADS**
24
NO. OF
A MIN
A MAX (16,26)
(15,49)
0.025 (0,635)
0.009 (0,23)
0.004 (0,10)
0.370 (9,40)
0.250 (6,35)
0.370 (9,40)
0.250 (6,35)
0.014 (0,36)
0.008 (0,20)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA
GDFP1-F56 and JEDEC MO-146AB
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated