
      
 ±  
SLLS348M − JUNE 1999 − REVISED MARCH 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DRS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
DMeets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
DOperates With 3-V to 5.5-V VCC Supply
DOperates Up To 250 kbit/s
DOne Driver and One Receiver
DLow Standby Current...1 µA Typical
DExternal Capacitors ...4 × 0.1 µF
DAccepts 5-V Logic Input With 3.3-V Supply
DAlternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3221
DAuto-Powerdown Feature Automatically
Disables Drivers for Power Savings
DApplications
− Battery-Powered, Hand-Held, and
Portable Equipment
− PDAs and Palmtop PCs
− Notebooks, Subnotebooks, and Laptops
− Digital Cameras
− Mobile Phones and Wireless Devices
description/ordering information
The MAX3221 consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector . The charge pump and four small external capacitors allow operation from a single 3-V
to 5.5-V supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver
output slew rate.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
SSOP (DB)
Tube of 80 MAX3221CDB
MA3221C
−0°C to 70°C
SSOP (DB) Reel of 2000 MAX3221CDBR MA3221C
−0°C to 70°C
TSSOP (PW)
Tube of 90 MAX3221CPW
MA3221C
TSSOP (PW) Reel of 2000 MAX3221CPWR MA3221C
SSOP (DB)
Tube of 80 MAX3221IDB
MB3221I
−40°C to 85°C
SSOP (DB) Reel of 2000 MAX3221IDBR MB3221I
−40°C to 85°C
TSSOP (PW)
Tube of 90 MAX3221IPW
MB3221I
TSSOP (PW)
Reel of 2000 MAX3221IPWR
MB3221I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
  !"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DB OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
EN
C1+
V+
C1−
C2+
C2−
V−
RIN
FORCEOFF
VCC
GND
DOUT
FORCEON
DIN
INVALID
ROUT

      
 ±  
SLLS348M JUNE 1999 − REVISED MARCH 2004
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled.
If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is
reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown
condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With
auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver
input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high
(valid data) if the receiver input voltage is greater than 2.7 V or less than −2.7 V, or has been between −0.3 V
and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between −0.3 V and
0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DIN FORCEON FORCEOFF VALID RIN
RS-232 LEVEL
OUTPUT
DOUT DRIVER STATUS
X X L X Z Powered off
L H H X H
Normal operation with
HHH XL
Normal operation with
auto-powerdown disabled
L L H Yes H
Normal operation with
HLHYesL
Normal operation with
auto-powerdown enabled
L L H No Z
Powered off by
H L H No Z
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUT
RIN EN VALID RIN
RS-232 LEVEL
OUTPUT
ROUT
L L X H
HLX L
XHX Z
Open L No H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = disconnected
input or connected driver off

      
 ±  
SLLS348M − JUNE 1999 − REVISED MARCH 2004
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
DIN DOUT
Auto-powerdown INVALID
RIN
FORCEOFF
FORCEON
ROUT
EN
11
16
9
13
10
8
1
12
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive output supply voltage range, V+ (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative output supply voltage range, V− (see Note 1) 0.3 V to −7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage difference, V+ V− (see Note 1) 13 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver (FORCEOFF, FORCEON, EN) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver −25 V to 25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO: Driver −13.2 V to 13.2 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver (INVALID) −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
MIN NOM MAX UNIT
Supply voltage
VCC = 3.3 V 3 3.3 3.6
V
Supply voltage VCC = 5 V 4.5 5 5.5 V
VIH
Driver and control high-level input voltage
VCC = 3.3 V 2
V
VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN VCC = 5 V 2.4 V
VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON, EN 0.8 V
VIDriver and control input voltage DIN, FORCEOFF, FORCEON 0 5.5 V
VIReceiver input voltage −25 25 V
TA
Operating free-air temperature
MAX3221C 0 70
°C
T
A
Operating free-air temperature
MAX3221I −40 85 °
C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.

      
 ±  
SLLS348M JUNE 1999 − REVISED MARCH 2004
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
IIInput leakage
current FORCEOFF,
FORCEON, EN ±0.01 ±1µA
Auto-powerdown
disabled
VCC = 3.3 V or 5 V,
No load,
FORCEOFF and
FORCEON at VCC 0.3 1 mA
I
CC
Supply current Powered off VCC = 3.3 V or 5 V,
TA = 25
°
C
No load, FORCEOFF at GND 1 10
ICC
Supply current
Auto-powerdown
enabled
TA = 25°C
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded 1 10 µA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VOH High-level output voltage DOUT at RL = 3 kto
GND, DIN = GND 5 5.4 V
VOL Low-level output voltage DOUT at RL = 3 kto
GND, DIN = VCC −5 −5.4 V
IIH High-level input current VI = VCC ±0.01 ±1µA
IIL Low-level input current VI at GND ±0.01 ±1µA
IOS
Short-circuit output current
VCC = 3.6 V, VO = 0 V ±35 ±60
mA
IOS Short-circuit output current
VCC = 5.5 V, VO = 0 V ±35 ±60 mA
roOutput resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M
Ioff
Output leakage current
FORCEOFF = GND
VO = ±12 V, VCC = 3 V to 3.6 V ±25
µA
I
off
Output leakage current
FORCEOFF = GND
VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 µ
A
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
Maximum data rate CL = 1000 pF, RL = 3 kΩ, See Figure 1 150 250 kbit/s
tsk(p) Pulse skew§CL = 150 pF to 2500 pF, RL = 3 k to 7 kΩ, See Figure 2 100 ns
SR(tr)
Slew rate, transition region
VCC = 3.3 V
,CL = 150 pF to 1000 pF 6 30
V/µs
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V
,
RL = 3 k to 7 kCL = 150 pF to 2500 pF 4 30
V/
µ
s
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.

      
 ±  
SLLS348M − JUNE 1999 − REVISED MARCH 2004
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
ESD protection
TERMINAL
TEST CONDITIONS
TYP
UNIT
NAME NO.
TEST CONDITIONS
TYP
UNIT
DOUT 13 HBM ±15 kV
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VOH High-level output voltage IOH = −1 mA VCC−0.6 VCC−0.1 V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+
Positive-going input threshold voltage
VCC = 3.3 V 1.6 2.4
V
VIT+ Positive-going input threshold voltage VCC = 5 V 1.9 2.4 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V 0.6 1.1
V
VIT− Negative-going input threshold voltage VCC = 5 V 0.8 1.4 V
Vhys Input hysteresis (VIT+ − VIT−) 0.5 V
Ioff Output leakage current FORCEOFF = 0 V ±0.05 ±10 µA
riInput resistance VI = ±3 V to ±25 V 3 5 7 k
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 ns
tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns
ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns
tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns
tsk(p) Pulse skewSee Figure 3 50 ns
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
ESD protection
TERMINAL
TEST CONDITIONS
TYP
UNIT
NAME NO.
TEST CONDITIONS
TYP
UNIT
RIN 8 HBM ±15 kV

      
 ±  
SLLS348M JUNE 1999 − REVISED MARCH 2004
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN MAX UNIT
VT+(valid) Receiver input threshold
for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC 2.7 V
VT−(valid) Receiver input threshold
for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC −2.7 V
VT(invalid) Receiver input threshold
for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC −0.3 0.3 V
VOH INVALID high-level output voltage IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC VCC−0.6 V
VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC 0.4 V
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER MIN TYPMAX UNIT
tvalid Propagation delay time, low- to high-level output 1µs
tinvalid Propagation delay time, high- to low-level output 30 µs
ten Supply enable time 100 µs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

      
 ±  
SLLS348M − JUNE 1999 − REVISED MARCH 2004
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 , 50% duty cycle, t
r
10 ns, t
f
10 ns.
Figure 1. Driver Slew Rate
50
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 , 50% duty cycle, t
r
10 ns, t
f
10 ns.
50% 50%
1.5 V 1.5 V
Figure 2. Driver Pulse Skew
TEST CIRCUIT VOLTAGE WAVEFORMS
50
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
FORCEON
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
3 V
FORCEOFF
1.5 V 1.5 V
50% 50%
Figure 3. Receiver Propagation Delay Times

      
 ±  
SLLS348M JUNE 1999 − REVISED MARCH 2004
8POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
50
Generator
(see Note B)
3 V or 0 V Output
VOL
VOH
tPZH
(S1 at GND)
3 V
0 V
0.3 V
Output
Input
0.3 V
3 V or 0 V
FORCEON
EN
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.
1.5 V 1.5 V
50%
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
50%
tPZL
(S1 at VCC)
RL
S1
VCC GND
CL
(see Note A)
Output
Figure 4. Receiver Enable and Disable Times

      
 ±  
SLLS348M − JUNE 1999 − REVISED MARCH 2004
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT
50
Generator
(see Note B)
FORCEOFF
ROUT
FORCEON
Auto-
powerdown INVALID
DOUTDIN
CL = 30 pF
(see Note A)
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
Valid RS-232 Level, INVALID High
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z
O
= 50 , 50% duty cycle, t
r
10 ns, t
f
10 ns.
VOLTAGE WAVEFORMS
3 V
2.7 V
−2.7 V
INVALID
Output
Receiver
Input
tvalid
0 V
0 V
−3 V
VCC
0 V
V+
0 V
V−
V+
VCC
ten
V−
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
tinvalid
Supply
Voltages
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time

      
 ±  
SLLS348M JUNE 1999 − REVISED MARCH 2004
10 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
CBYPASS = 0.1 µF
Auto-
powerdown
VCC C1 C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
VCC vs CAPACITOR VALUES
FORCEOFF
+
+
+
+
+
1
8
2
3
5
6
7
4
16
13
12
11
10
9
15
14
VCC
GND
C1+
V+
C2+
C1−
C2−
V−
DOUT
FORCEON
DIN
INVALID
ROUT
EN
RIN
C1
C2
C4
5 k
C3
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 6. Typical Operating Circuit and Capacitor Values
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3221CDB ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CDBE4 ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
MAX3221CPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IDB ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IDBE4 ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3221IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005
Addendum-Page 1
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’ s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of T I products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated