Order this document by MBRS140LT3/D SEMICONDUCTOR TECHNICAL DATA SMB Power Surface Mount Package . . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. * * * * SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES 40 VOLTS Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Mechanical Characteristics: * Case: Molded Epoxy * Epoxy Meets UL94, VO at 1/8 * Weight: 95 mg (approximately) * Polarity: Notch in Plastic Body Indicates Cathode Lead * Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds * Available in 12 mm Tape, 2500 Units per 13 Reel, Add "T3" Suffix to Part Number * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable * Marking: B14L CASE 403A-03 SMB MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 40 Volts IO 1.0 Amps Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 110C) IFRM 2.0 Amps Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 40 Amps Tstg, TC - 55 to +150 C Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 110C) Storage / Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) TJ - 55 to +125 C dv/dt 10,000 V/ms RJL RJA 24 80 C/W THERMAL CHARACTERISTICS Thermal Resistance -- Junction-to-Lead (2) Thermal Resistance -- Junction-to-Ambient (2) ELECTRICAL CHARACTERISTICS VF Maximum Instantaneous Forward Voltage (1) see Figure 2 (IF = 1.0 A) (IF = 2.0 A) IR Maximum Instantaneous Reverse Current see Figure 4 (VR = 40 V) (VR = 20 V) TJ = 25C TJ = 125C 0.5 0.6 0.425 0.58 TJ = 25C TJ = 100C 0.4 0.02 10 5.0 Volts mA This document contains information on a new product. Specifications and information herein are subject to change without notice. (1) Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%. (2) Mounted with minimum recommended pad size, PC Board FR4. Device Rectifier Motorola, Inc. 1997 Data 1 100 10 1.0 TJ = 125C 25C 100C - 40C 0.1 0.3 0.1 0.5 0.7 0.9 TJ = 125C 1.0 100C 25C 0.1 0.3 0.1 0.5 0.9 0.7 Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E-3 IR , MAXIMUM REVERSE CURRENT (AMPS) IR , REVERSE CURRENT (AMPS) 10 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 10E-3 TJ = 125C 100C 1.0E-3 TJ = 125C 10E-3 100C 1.0E-3 25C 100E-6 100E-6 10E-6 25C 1.0E-6 10 0 20 30 1.0E-6 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current PFO , AVERAGE POWER DISSIPATION (WATTS) dc FREQ = 20 kHz 1.4 1.2 SQUARE WAVE 1.0 Ipk/Io = p 0.8 Ipk/Io = 5.0 0.6 Ipk/Io = 10 0.4 Ipk/Io = 20 0.2 0 25 10E-6 40 1.6 IO , AVERAGE FORWARD CURRENT (AMPS) 100 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E-3 2 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) MBRS140LT3 45 65 85 105 125 0.9 0.8 SQUARE WAVE 0.7 dc Ipk/Io = p 0.6 Ipk/Io = 5.0 0.5 Ipk/Io = 10 0.4 0.3 Ipk/Io = 20 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 TL, LEAD TEMPERATURE (C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation 1.6 Rectifier Device Data MBRS140LT3 TJ , DERATED OPERATING TEMPERATURE (C) 1000 C, CAPACITANCE (pF) TJ = 25C 100 10 R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED) 0 5.0 10 15 20 25 30 35 125 24C/W 115 44C/W 63C/W 80C/W 105 Rtja = 94C/W 95 85 75 65 40 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating* * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax - r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 1.0E+00 50% 1.0E-01 20% 10% 5.0% 2.0% 1.0E-02 1.0% 1.0E-03 Rtjl(t) = Rtjl*r(t) 1.0E-04 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 t, TIME (s) R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 9. Thermal Response -- Junction to Lead 1.0E+00 50% 20% 1.0E-01 1.0E-02 10% 5.0% 2.0% 1.0% 1.0E-03 Rtjl(t) = Rtjl*r(t) 1.0E-04 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 t, TIME (s) Figure 10. Thermal Response -- Junction to Ambient Rectifier Device Data 3 MBRS140LT3 0.089 2.261 0.108 2.743 0.085 2.159 inches mm SMB PACKAGE DIMENSIONS S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. A D B C K J P INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 H CASE 403A-03 ISSUE B Motorola reserves the right to make changes without further notice to any products herein. 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