HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 1/3
HTIP105 HSMC Product Specification
HTIP105
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP105 is designed for monolithic construction with built in base-
emitter shunt resistors industrial.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature.......................................................................................................... -55 ~ +150 °C
Junction Temperature .................................................................................................. +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ................................................................................................... 80 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................................... -60 V
BVCEO Collector to Emitter Voltage................................................................................................. -60 V
BVEBO Emitter to Base Voltage......................................................................................................... -5 V
IC Collector Current............................................................................................................................ -8 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -60 - - V IC=-1mA
BVCEO -60 - - V IC=-30mA
BVEBO -5 - - V IE=-0.1mA
ICEO - - -50 uA VCE=-30V
ICBO - - -50 uA VCB=-60V
IEBO - - -8 mA VEB=-5V
*VCE(sat)1 - - -2 V IC=-3A, IB=-6mA
*VCE(sat)2 - - -2.5 V IC=-8A, IB=-80mA
*VBE(on) - - -2.8 V IC=-8A, VCE=-4V
*hFE1 1000 - 20000 IC=-3A, VCE=-4V
*hFE2 200 - - IC=-8A, VCE=-4V
Cob - - 300 pF VCE=-10V, f=100KHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Darlington Schematic
R2R1
C
E
B
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 2/3
HTIP105 HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1
10
100
1000
10000
1 10 100 1000 10000
Collector Current (mA)
hFE
hFE @ V
CE
=4V
Satura tion Voltage & Collector Current
100
1000
10000
10 100 1000 10000
Coll e c to r Cur re nt (mA )
Sat ura t ion Vol tag e ( mV)
V
CE(sat)
@ I
C
=100I
B
V
BE(sat)
@ I
C
=100I
B
On Voltage & Collector Current
100
1000
10000
1 10 100 1000 10000
Colle c tor Cur re nt (mA)
On Volt age ( m V)
V
BE (on)
@ V
CE
=4V
Switching Time & Collector C urren t
0.1
1
10
110
Coll ec tor Current (mA)
Switchin g Times ( us)
Tstg
Tf
Ton
VCC=30V, IC=250IB1=-250IB2
Capa citan ce & R ever se-B iased Voltag e
10
100
1000
0.1 1 10 100
Reverse-Biased Volt age (V)
Cap ac itance (p F)
Cob
Safe Op erating Ar ea
1
10
100
1000
10000
100000
1 10 100 1000
Forw ar d Volt age- V
CE
(V)
Coll e c to r Cur re nt -I
C
(mA)
PT=1ms
PT=100 ms
PT=1 s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 3/3
HTIP105 HSMC Product Specification
TO-220AB Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Of fice And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
A B
E
G
IK
M
O
P
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
Marking:
Date Code Control Code
HTIP
105
