NUR460/L03,112 - NXP Semiconductors

1. Product profile

1.1 General description

Ultrafast epitaxial power diode in a SOD141 (DO-201AD) axial lead plastic package.

1.2 Features and benefits

Axial leaded plastic package

Fast switching

High voltage capability

Low forward voltage drop

Low thermal resistance

Soft recovery characteristic

1.3 Applications

Discontinuous Current Mode (DCM)

Power Factor Correction (PFC)

High frequency switched-mode power

supplies

1.4 Quick reference data

NUR460

Ultrafast power diode

Rev. 2 — 20 July 2011 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VRRM repetitive peak reverse

voltage - - 600 V

IF(AV) average forward

current square-wave pulse; δ= 0.5;

see Figure 1; see Figure 2 --4A

Static characteristics

VFforward voltage IF=4A; T

j=25°C;

see Figure 4 --1.28V

Dynamic characteristics

trr reverse recovery time IF=1A; V

R=30V;

dIF/dt = 50 A/µs; Tj25 °C;

Ramp Recovery;

see Figure 5

-3365ns

IR=1A; I

F=0.5A;

IR(meas) = 0.25 A; Tj=25°C;

Step Recovery; see Figure 6

-2550ns

Product data sheet Rev. 2 — 20 July 2011 2 of 10

NXP Semiconductors NUR460

Ultrafast power diode

2. Pinning information

3. Ordering information

4. Limiting values

Tabl e 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 K cathode

SOD141 (DO-201AD)

2 A anode

001aaa020

Table 3. Ordering informatio n

Type number Package

Name Description Version

NUR460 DO-201AD Hermetically sealed plastic package; axial leaded; 2 leads SOD141

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse voltage - 600 V

VRWM crest working reverse voltage - 600 V

VRreverse voltage DC - 600 V

IF(AV) average forw ard current square-wa ve pu l se; δ=0.5;

see Figure 1 ;

see Figure 2

-4A

IFRM repetitive peak forward current square-wave pulse; δ=0.5 - 8 A

IFSM non-repetitive peak forward

current tp= 8.3 ms; sine-wave pulse;

Tj(init) = 25 °C; see Figure 3 -110A

tp= 10 ms; sine-wave pulse;

Tj(init) = 25 °C; see Figure 3 - 100 A

Tstg storage temperature -40 150 °C

Tjjunction temperature - 150 °C

Product data sheet Rev. 2 — 20 July 2011 3 of 10

NXP Semiconductors NUR460

Ultrafast power diode

Fig 1. Forward power dissipation as a function of

average forward current; square waveform;

maximum values

Fig 2. Forward powe r dissipation as a function of

average forward current; sinusoidal waveform;

maximum values

Fig 3. Non-repetitive peak for ward current as a function of pulse width; square waveform; maximum values

IF(AV) (A)

08624

003aag297

Ptot

(W)

δ = 1

0.5

0.2

0.1

IF(AV) (A)

054231

003aag298

Ptot

(W)

a = 1.57

1.9

2.2

2.8

4.0

003aag299

tp (s)

10-5 10-2

10-3

10-4

102

103

IFSM

(A)

101

Product data sheet Rev. 2 — 20 July 2011 4 of 10

NXP Semiconductors NUR460

Ultrafast power diode

5. Thermal characteristics

6. Characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air - 55 - K/W

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

VFforward voltage IF=4A; T

j= 25 °C; see Figure 4 --1.28V

IF=4A; T

j= 150 °C; see Figure 4 - 0.88 1.05 V

IRreverse current VR=600V; T

j=25°C --50µA

Dynamic characteristics

trr reverse recovery time IF=1A; V

R=30V; dI

F/dt = 50 A/µs;

Ramp Recovery; Tj25 °C; see Figure 5 - 3365ns

IF= 0.5 A; IR= 1 A; Step Recovery;

IR(meas) = 0.25 A; Tj= 25 °C; see Figure 6 - 2550ns

Fig 4. Forward current as a function of forward

voltage Fig 5. Reverse recovery definitions; ramp recovery

003aag296

VF (V)

0321

(A)

(2)

(1) (3)

003aac562

trr

time

100 %

25 %

IFdlF

IRIRM

Product data sheet Rev. 2 — 20 July 2011 5 of 10

NXP Semiconductors NUR460

Ultrafast power diode

Fig 6. Reverse recovery definitions; step recovery

003aac563

trr

time

0.25 x IR

Product data sheet Rev. 2 — 20 July 2011 6 of 10

NXP Semiconductors NUR460

Ultrafast power diode

7. Package outline

Fig 7. Package outline SOD141 (DO-201AD)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOD141 DO-201AD

sod141_po

10-05-18

11-06-22

Unit

max

nom

min

1.30

1.18

5.3

4.8 25.4

Dimensions

Note

1. The marking band indicates the cathode.

Hermetically sealed plastic package; axial leaded; 2 leads SOD141

9.6

7.2

inches

max

nom

min

0.052

0.046

0.21

0.19 1.00

0.375

0.285

0 2.5 5 mm

scale

(1)

GL L

Product data sheet Rev. 2 — 20 July 2011 7 of 10

NXP Semiconductors NUR460

Ultrafast power diode

8. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

NUR460 v.2 20110720 Product data sheet - NUR460 v.1

Modifications: •Various changes to conte nt.

NUR460 v.1 20110704 Product data sheet - -

Product data sheet Rev. 2 — 20 July 2011 8 of 10

NXP Semiconductors NUR460

Ultrafast power diode

9. Legal information

9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in this document may ha ve changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

9.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modificati ons or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of informati on included herein and shall have

no liability for the consequences of use of such info rmation.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specifica t io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

9.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersed es an d r eplaces all inf ormation supplied pri or

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessa ry

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Document status [1] [2] Product status [3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 20 July 2011 9 of 10

NXP Semiconductors NUR460

Ultrafast power diode

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individua l

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization fro m national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and st andards, customer

(a) shall use the product without NXP Semicond uctors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

9.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

10. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors NUR460

Ultrafast power diode

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 July 2011

Document identifier: NUR460

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .4

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .6

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .7

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .8

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .8

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

10 Contact information. . . . . . . . . . . . . . . . . . . . . . .9

Mouser Electronics

Authorized Distributor

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