4V Drive Nch + Nch MOSFET QS8K21 Structure Silicon N-channel MOSFET Dimensions (Unit : mm) TSMT8 (8) Features 1) Low on-resistance. 2) High power package(TSMT8). 3) Low voltage drive(4V drive). (7) (6) (5) (1) (2) (3) (4) Abbreviated symbol : K21 Application Switching Inner circuit Packaging specifications Type Package Code Basic ordering unit (pieces) QS8K21 Taping TR 3000 (8) (7) (6) 2 2 1 1 Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage VDSS Gate-source voltage VGSS Continuous ID Drain current Pulsed IDP *1 Continuous Is Source current (Body Diode) Pulsed Isp *1 Power dissipation Channel temperature Range of storage temperature PD *2 Tch Tstg Limits 45 20 4 12 1 12 Unit V V A A A A (5) (1) (2) (3) (4) 1 ESD PROTECTION DIODE 2 BODY DIODE (1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain 1.5 W / TOTAL 1.25 W / ELEMENT 150 C 55 to +150 C *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board. Thermal resistance Parameter Channel to Ambient Symbol * Rth (ch-a) Limits Unit 83.3 100 C / W /TOTAL C / W /ELEMENT *Mounted on a ceramic board. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 1/5 2010.02 - Rev.A QS8K21 Data Sheet Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Symbol Gate threshold voltage Typ. Max. Unit Conditions - - 10 A VGS=20V, VDS=0V 45 - - V ID=1mA, VGS=0V IDSS - - 1 A VDS=45V, VGS=0V VGS (th) 1.0 - 2.5 V - 38 53 ID=4A, VGS=10V m ID=4A, VGS=4.5V IGSS Drain-source breakdown voltage V (BR)DSS Zero gate voltage drain current Min. VDS=10V, ID=1mA Static drain-source on-state resistance * RDS (on) - 48 67 - 53 75 Forward transfer admittance l Yfs l* 2 - - S ID=4A, VDS=10V Input capacitance Ciss - 460 - pF VDS=10V ID=4A, VGS=4.0V Output capacitance Coss - 110 - pF VGS=0V Reverse transfer capacitance Crss - 55 - pF f=1MHz Turn-on delay time td(on) * - 9 - ns ID=2A, VDD 25V Rise time Turn-off delay time tr * - 25 - ns VGS=10V td(off) * - 30 - ns RL 12.5 tf * - 7 - ns RG=10 Total gate charge Qg * - 5.4 - nC ID=4A, VDD 25V Gate-source charge Qgs * - 2.0 - nC VGS=5V RL 6.3 Gate-drain charge Qgd * - 1.6 - nC RG=10 Fall time *Pulsed Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage Symbol VSD * Min. Typ. Max. - - 1.2 Unit V Conditions Is=4A, VGS=0V *Pulsed www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 2/5 2010.02 - Rev.A QS8K21 Data Sheet Electrical characteristics curves 3 VGS= 3.4V VGS= 3.2V VGS= 3.0V 2 VGS= 2.8V 1 0 Ta=25C Pulsed 3 VGS= 2.8V VGS= 10.0V VGS= 4.5V VGS= 4.0V VGS= 3.4V VGS= 3.2V VGS= 3.0V 2 1 0.4 0.6 0.8 1 0 0.1 0.01 2 4 6 8 1 10 1.5 2 2.5 3 Fig.1 Typical Output Characteristics() Fig.2 Typical Output Characteristics() Fig.3 Typical Transfer Characteristics Ta= 25C Pulsed VGS= 4.0V VGS= 4.5V VGS= 10V 1 1 VGS= 10V Pulsed 100 Ta=125C Ta=75C Ta=25C Ta= -25C 10 1 10 0.1 DRAIN-CURRENT : ID[A] 100 Ta=125C Ta=75C Ta=25C Ta= -25C 1 1 VGS= 4.5V Pulsed 100 Ta=125C Ta=75C Ta=25C Ta= -25C 10 1 0.1 10 DRAIN-CURRENT : ID[A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current() www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 10 10 Fig.6 Static Drain-Source On-State Resistance vs. Drain Current() 10 VDS= 10V Pulsed 1 Ta= -25C Ta=25C Ta=75C Ta=125C 0.1 0.01 1 DRAIN-CURRENT : ID[A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current() FORWARD TRANSFER ADMITTANCE : |Yfs| [S] VGS= 4.0V Pulsed 0.1 10 1000 DRAIN-CURRENT : ID[A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current() 10 1 SOURCE CURRENT : Is [A] 10 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m] GATE-SOURCE VOLTAGE : VGS[V] 0.1 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m] Ta= 125C Ta= 75C Ta= 25C Ta= - 25C DRAIN-SOURCE VOLTAGE : VDS[V] 100 1000 1 DRAIN-SOURCE VOLTAGE : VDS[V] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m] 1000 0.2 VDS= 10V Pulsed 0.001 0 0 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[m] 10 4 Ta=25C Pulsed DRAIN CURRENT : ID[A] VGS= 10V VGS= 4.5V VGS= 4.0V DRAIN CURRENT : ID[A] DRAIN CURRENT : ID[A] 4 VGS=0V Pulsed 1 Ta=125C Ta=75C Ta=25C Ta=-25C 0.1 0.01 0.1 1 10 0 0.5 1 1.5 DRAIN-CURRENT : ID[A] SOURCE-DRAIN VOLTAGE : VSD [V] Fig.8 Forward Transfer Admittance vs. Drain Current Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage 3/5 2010.02 - Rev.A 10000 150 Ta=25C Pulsed 100 ID= 2.0A ID= 4.0A 50 Ta=25C VDD= 25V VGS=10V RG=10 Pulsed td(off) 1000 tf 100 td(on) 10 tr 0 1 0 5 10 15 GATE-SOURCE VOLTAGE : VGS[V] Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage GATE-SOURCE VOLTAGE : VGS [V] Data Sheet SWITCHING TIME : t [ns] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m] QS8K21 10 8 6 Ta=25C VDD= 25V ID= 4.0A RG=10 Pulsed 4 2 0 0.01 0.1 1 10 DRAIN-CURRENT : ID[A] Fig.11 Switching Characteristics 0 1 2 3 4 5 6 7 8 9 10 TOTAL GATE CHARGE : Qg [nC] Fig.12 Dynamic Input Characteristics CAPACITANCE : C [pF] 1000 Ciss 100 Crss Ta=25C f=1MHz VGS=0V Coss 10 0.01 0.1 1 10 100 DRAIN-SOURCE VOLTAGE : VDS[V] Fig.13 Typical Capacitance vs. Drain-Source Voltage www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 4/5 2010.02 - Rev.A QS8K21 Data Sheet Measurement circuits Pulse width VGS ID VDS 90% 50% 10% VGS VDS RL 50% 10% D.U.T. VDD RG 10% 90% td(on) 90% td(off) tr ton tf toff Fig.1-2 Switching waveforms Fig.1-1 Switching time measurement circuit VG VGS ID VDS Qg RL VGS D.U.T. IG(Const.) RG Qgs Qgd VDD Charge Fig.2-2 Gate charge waveform Fig.2-1 Gate charge measurement circuit www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 5/5 2010.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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